KR100917126B1 - Method of manufacturing a carrier and coreless substrate manufactured thereof - Google Patents

Abstract

The present invention relates to a carrier fabrication for coreless substrate processing and a method for fabricating a coreless substrate using the same, and provides a method of separating a carrier using only a copper foil and an uncured resin, that is, a prepreg and a release film. do. The present invention, unlike the prior art, instead of cutting the CCL and prepreg cut only the release film has the advantage of using the substrate efficiently, and furthermore can be expected to simplify the process and lower the manufacturing cost.

Coreless Board, Release Film, Carrier, Ultra Thin Board, Printed Circuit Board.

Description

Carrier manufacturing method for coreless substrate processing and coreless substrate using the same {METHOD OF MANUFACTURING A CARRIER AND CORELESS SUBSTRATE MANUFACTURED THEREOF}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a carrier for processing a coreless substrate and a coreless substrate using the same, wherein a substrate in the form of a coreless substrate (referred to as a “coreless substrate”) is manufactured. The present invention relates to a technology for manufacturing and processing a carrier.

In recent years, as electronic products are downsized, the thickness of the board | substrate which mounts a semiconductor chip at the wafer level has become ultra-thin at 100 micrometers or less. However, if the thickness of the substrate is thinned, the substrate may be bent in the manufacturing process of the printed circuit board or may be inserted into the equipment, thereby causing a defect. Therefore, in the process of laminating, etching and plating the substrate, the substrate is processed on the carrier to maintain the thickness of the substrate at an appropriate level. After the substrate processing process is completed, the carrier is removed to make the substrate thin. The way of taking it is used.

1A to 1D are diagrams illustrating a carrier manufacturing method according to the prior art. Referring to FIG. 1A, the prior art cuts a hardened copper cladded layer (CCL) 10 and cuts an uncured resin 20 of the same thickness, for example, a prepreg into a window, to form a copper foil 30 and a lay. Carrier is produced by laminating up as shown in FIG. Subsequently, after the substrate 50 is formed by the lamination and substrate processing processes on the upper and lower surfaces of the carrier, the substrate is cured by cutting the substrate with the cutting surface 40 as shown in FIG. 1D. As the vacuum is released, the substrate is peeled up and down.

However, in the case of the prior art, as shown in FIG. 1D, a loss that is cut off at both edges during the trim cutting process occurs, so that the process efficiency is not good. In fact, the substrate size is about 480 mm x 377 mm after trimming when the disc size is 510 mm x 407 mm. In addition, the prior art has a problem that the process cost is increased and the process time is long because the CCL layer to be cut in addition to the prepreg.

Accordingly, a first object of the present invention is to provide a method for manufacturing a carrier for coreless substrate processing.

It is a second object of the present invention to provide a carrier fabrication method which improves an array multiplication ratio of a substrate by minimizing a loss in which a substrate is cut due to a trimming process in addition to the first object.

In order to achieve the above object, the present invention is to cut the release film into a rectangle (horizontal a-2Δ, longitudinal b-2Δ) so as to be smaller than the area of the rectangular (horizontal a, longitudinal b) prepreg, the release film is a metal foil By inserting between the (metal foil) and the prepreg (PREPREG) by compression bonding, the release film is produced a carrier (carrier) sealed by the compression-laminated prepreg and the metal foil. After forming a substrate by performing general printed circuit unit processes such as lamination, etching, photo, plating, and the like on the upper and lower surfaces of the carrier, the substrate is processed and the cut surface is cut at least from each side of the rectangular prepreg. Δ + δ (δ> 0) of a rectangular (lateral a-2Δ-2δ, vertical b-2Δ-2δ) length inward, thereby cutting the release film to release the sealing state of the release film A peeling-off peeling of said release film while vacuum is released provides a process characterized in that said carrier is peeled off.

Instead of cutting CCL and prepreg as in the prior art, the present invention uses only copper foil and prepreg to cut the release film, thus simplifying the process with the advantage of using the substrate efficiently. Can be. In addition, since the present invention utilizes low-cost materials, cost reduction and time reduction can be expected along with process shortening. Moreover, the present invention solves the substrate loss problem cut by trim, thereby improving the array multiplication factor and increasing process efficiency.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, FIGS. 2A to 2D.

Referring to FIG. 2A, the present invention cuts and stacks the release film 120 on both surfaces of an uncured resin 110, such as prepreg, and stacks the metal foil 100 to fabricate a carrier. It is characterized by. As a preferred embodiment of the present invention, prepreg (PREPREG) may be used as the uncured resin 110, and as an embodiment of the metal foil 100, a copper (Cu) disc or a CAC (Cu-Al-Cu) may be used. Can be used.

As shown in Figure 2b, the release film 120 is pressed on both sides of the uncured resin 110, such as prepreg, and the release film when the air is supplied to the release film 120 is compressed later Peeling 120 allows the carrier to be separated from the substrate.

For reference, when the width of the uncured resin 110 is a and the length of the rectangle is b, the width of the release film 120 is smaller than the area of the uncured resin 110. Cut to 2Δ and longitudinal b-2Δ, inserting the release film 120 between the metal foil 100 and the prepreg to compress the laminate so that the release film 120 is pressed. The carrier sealed by the laminated prepreg and the metal foil can be manufactured.

 The substrate 130 is completed by laminating an outer layer substrate on both surfaces of the crimped carrier shown in Fig. 2B, and performing a photo work, pattern formation, hole processing, plating process, and etching process. Since various types of substrates, for example, package substrates, may be formed in the carrier manufactured according to the present invention, a specific structure is not illustrated in FIG. 2C, and simply a layer is illustrated as a substrate 130.

Then, as shown in Fig. 2c, a rectangular cut plane for cutting the release film (Fig. 2c is a cross-sectional view is shown by a straight one-dot chain line, and it is easy to understand with reference to the plan view of Fig. 2d; 140). trim) to release the vacuum sealing state of the release film 120 and supply atmospheric pressure.

Thereafter, as shown in FIG. 2D, the substrate is cut for each array along the cutting surface 140, and the carrier is separated from the substrate by peeling off the release film 120. For reference, the cut surface may be a cut surface of a rectangular shape (lateral a-2Δ-2δ, vertical b-2Δ-2δ) having a length of at least Δ + δ (δ> 0) inward from each side of the rectangular prepreg. A cut surface can be made to cut the release film.

The foregoing has somewhat broadly improved the features and technical advantages of the present invention to better understand the claims that follow. It should be appreciated by those skilled in the art that the conception and specific embodiments of the invention disclosed may be readily used as a basis for designing or modifying other structures for carrying out similar purposes to the invention.

In addition, the inventive concepts and embodiments disclosed herein may be used by those skilled in the art as a basis for modifying or designing other structures for carrying out the same purposes of the present invention. In addition, such modifications or altered equivalent structures by those skilled in the art may be variously evolved, substituted and changed without departing from the spirit or scope of the invention described in the claims.

The present invention is characterized by cutting the release film instead of cutting the CCL or prepreg as in the prior art, as a result can be expected to simplify the process and lower the manufacturing cost when applied to the coreless substrate manufacturing process have.

1A to 1D illustrate a carrier fabrication method according to the prior art.

2A-2D illustrate a coreless substrate manufacturing method in accordance with a preferred embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

     10: cured resin

20, 110: uncured resin

     30: copper foil

40, 140: cutting plane

50, 130: substrate

    100: metal foil

    110: resin

    120: release film

Claims (3)

delete In the method of manufacturing a coreless substrate, (a) On both sides of the rectangular uncured resin of length a and length b, the widths a − 2Δ and length b − are aligned so that there is a margin inward from each of the four rectangular sides of the uncured resin by a width Δ, respectively. Cutting and laminating a rectangular release film of 2Δ size; (b) laminating a rectangular metal foil of horizontal a and vertical b lengths on the laminated rectangular release film so as to align with the uncured resin, and pressing and laminating to seal it; (c) forming a substrate by performing a printed circuit board processing process of repeatedly performing any one of lamination, photo, etching, plating, or a combination thereof on both surfaces of the carrier; And (d) the cut transverse length (a-2Δ-2δ) and the longitudinal length by cutting with a margin inward from the four sides of the rectangle on the carrier by the width (Δ + δ) (δ> 0), respectively; allowing a rectangular cut plane of (b-2Δ-2δ) to cut the release film; And (e) peeling off the release film cut by the rectangular cut plane to separate the carrier from the substrate. Coreless substrate manufacturing method comprising a. delete

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