JP2003095211A - Manufacturing method and manufacturing apparatus for embossed carrier tape - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method and a manufacturing apparatus for an embossed carrier tape, by which embossed patterns are formed in such a way that the pitches between embossed patterns are sufficiently precise and the relative position between the embossed patterns and sprocket holes are sufficiently precise. SOLUTION: According to the manufacturing method for the embossed carrier tape, a heated long resin sheet 12 is intermittently send to molding dies 22a, 22b, by which the embossed patterns for housing components are consecutively formed on the resin sheet, and a plurality of consecutive sprocket holes are formed near at least either of both side ends of the sheet. The temperature of the molding dies is held at a desired temperature between 15 to 80 deg.C to form the embossed patterns on the resin sheet. Then, the temperature of the resin sheet with the formed embossed patterns is held at a desired temperature between 25 deg.C and 35 deg.C to form the sprocket holes.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an embossed carrier tape used for supplying or transporting electronic parts to a mounting device,
For example, a QFP (Qua
d Flat Package), BGA (Ball
The present invention relates to a method and an apparatus for manufacturing an embossed carrier tape suitable for housing electronic components such as a Grid Array).

[0002]

2. Description of the Related Art An embossed carrier tape is an embossed plastic resin sheet (hereinafter referred to as a long sheet) for storing electronic parts, a sprocket hole near both end portions of the long sheet, and a necessary embossed carrier tape. Accordingly, an inspection hole is formed on the bottom surface of the emboss, and is used for supplying or transporting the electronic component to the mounting device. For example, a QFP (Quad Flat Pack) including a mold portion and leads.
e), there is an embossed carrier tape suitable for storing BGA (Ball Grid Array) and the like.

In the conventional embossing carrier tape manufacturing apparatus for manufacturing the embossing carrier tape, a hard or semi-rigid thermoplastic resin having a thickness of 0.15 to 0.15 is used.
A long sheet of about 0.6 mm is pulled out from the original roll and is intermittently or continuously run on the tape running guide, and the long sheet sent is contact or non-contact heating means, for example, a heating plate. After that, the embossing is formed by pressure-softening, vacuum-forming, vacuum-pressure forming or press-forming by sequentially heating and softening to a predetermined temperature, and then a plurality of continuous sprocket holes and / or inspection holes are formed in a press punch die. To produce an embossed carrier tape.

In the above embossing carrier tape manufacturing apparatus, the molding die is cooled with a medium having a constant temperature, or the plate portion in contact with the molding die of the molding apparatus on which the molding die is mounted is cooled. The molding die is indirectly cooled or simply cooled to remove heat from the molding die, and is not controlled to keep the temperature of the molding die itself constant. In addition, the long sheet after molding was cooled by natural cooling or a cooling fan until the sprocket holes were punched out by a press punch die.

[0005]

However, in the conventional embossing carrier tape manufacturing apparatus, when the molding die is cooled and kept at a constant temperature, for example, 40 ° C.,
The embossing pitch between embosses in the embossing carrier tape is the pitch between recesses of the recesses for forming embossing of the molding die at 40 ° C., the shrinkage rate of the long sheet, the heating temperature of the long sheet before forming, and the long sheet during forming. There is a problem that it is difficult to determine the pitch between the recesses in the molding die, that is, to design the molding die depending on the temperature of the sheet and the like, taking all of these conditions into consideration.

The cause of the problems is a factor that determines the pitch between the embosses of the embossed carrier tape as a product, the pitch between the recesses of the molding die, the temperature of the molding die during operation, and the shrinkage rate of the long sheet. The heating temperature of the long sheet before molding, and the temperature of the long sheet when releasing the molding die.

Therefore, in order to determine the pitch between embosses, that is, to determine the pitch, it is necessary that the factors (1) to (3) are already known or can be accurately predicted.
However, normally, these factors are not known at the design stage of the molding die, and thus it is difficult to accurately predict the factors.

With respect to the factor (1), conventionally, the molding die is simply cooled by using, for example, circulating water at 20 ° C. Therefore, the molding temperature of the long sheet before the molding causes The temperature changes, and the temperature of the molding die also changes depending on the thickness of the long sheet and the shape of the emboss.

Further, the factor (1) cannot be determined at the design stage of the molding die.

Further, in the conventional manufacturing technique for manufacturing the embossed carrier tape, it is not possible to absorb a subtle difference in shrinkage ratio between the raw rolls for each lot, and long sheets of different materials are formed by the same mold. I can't.

In addition, when the long sheet after molding is naturally cooled or air-cooled by a cooling fan until the sprocket holes are punched by a press punch die, the heating temperature, the embossed shape, the thickness of the long sheet and the long sheet length. Due to the difference in the material of the sheet, it is difficult to always keep the sheet temperature constant when punching the sprocket holes, and the pitch of the sprocket holes fluctuates.

Further, since the pitch between embosses and the pitch of the sprocket holes are independently determined, and the shrinkage is different in each part, a plurality of embosses are simultaneously formed in the molding die, that is, one shot. In the press, the positional relationship between the embossing and the sprocket hole that is subsequently punched is displaced.

In particular, in consideration of productivity, it is necessary to increase the amount of intermittent feed, that is, the number of embosses taken for each shot. In this case, an error in the pitch between embosses is accumulated and the positional relationship is increased. The deviation becomes even more noticeable.

The present invention has been made in order to solve the above-mentioned conventional problems. It is possible to form an emboss with a pitch between embosses having a sufficiently high accuracy, and a relative position between the emboss and the sprocket hole is sufficiently high. An object of the present invention is to provide a method and an apparatus for manufacturing an embossed carrier tape which is formed with high accuracy.

[0015]

According to the present invention, a heated long resin sheet is intermittently sent to a molding die, and an emboss for storing parts is continuously formed on the resin sheet in the molding die. In the method for producing an embossed carrier tape in which a plurality of continuous sprocket holes are formed in the vicinity of at least one of both side end portions of the sheet, the molding die is kept constant at a desired temperature between 15 ° C and 80 ° C. After holding and forming the embossing, the resin sheet on which the embossing is formed is kept constant at a desired temperature between 25 ° C. and 35 ° C., and then sprocket holes are formed.

Further, according to the present invention, a conveying means for intermittently feeding a heated long resin sheet to a molding die and the molding die are provided, and the resin sheet is continuously provided with an emboss for storing parts. In an apparatus for manufacturing an embossed carrier tape, which comprises a forming means for forming and a perforating means for forming a plurality of continuous sprocket holes in the vicinity of at least one of both side end portions of the resin sheet, the forming means comprises: A temperature control mechanism for keeping the mold constant at a desired temperature between 15 ° C. and 80 ° C. is provided, and between the molding means and the punching means,
The resin sheet on which the emboss is formed is heated at 25 ° C to 35 ° C.
The temperature control means is provided to keep the temperature constant at a desired temperature during the period.

[0017]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of a method for manufacturing an embossed carrier tape according to the present invention will be described below with reference to the drawings. FIG. 1 is a diagram for explaining a method for manufacturing an embossed carrier tape according to an embodiment of the present invention.
FIG. 2 is a plan view of the molding die shown in FIG.

As shown in FIG. 1, an embossed carrier tape manufacturing method according to an embodiment of the present invention uses a long resin sheet (hereinafter referred to as a long sheet) slit into a predetermined width dimension as a raw material. The long sheet 11 pulled out from the original roll 10 is supplied to the heating means 20 to be preheated, and the heated long sheet 12 is intermittently formed by the conveying means 21 with the forming dies 22a and 22b. Means 22
Then, the embossing 15 shown in FIG. 4 is formed by the molding dies 22a and 22b. As shown in FIGS. 2 and 3, a recess 22c for forming the emboss 15 is formed in the molding die 22a.

As the material of the molding dies 22a and 22b,
Materials such as brass, beryllium copper, and aluminum that have a large coefficient of thermal expansion and exhibit a remarkable temperature control effect, and materials that have good thermal conductivity and are easy to control temperature are preferable. That is, the molding dies 22a, 22b
Since the pitch between the recesses of the recesses 22c is adjusted by changing the temperature of the above, it is easier to adjust the pitch between the recesses when the molding dies 22a and 22b are made of a material having a large thermal expansion coefficient.

Here, as an example, as a product, an embossed carrier tape having a width of 56 mm, a pitch between embosses of 16 mm, a length of embossing × width of 40 mm × 12 mm, and a depth of 10 mm of embossing is manufactured by pressure molding. This will be described with reference to FIGS. 2 and 3. The pitch P1 between the recesses in the recess 22c of the molding die 22a is 16.024 mm.
(Measured at room temperature of 25 ° C.), assuming that one shot, that is, the number of pieces formed by one press, is 6, 1
Recessed portion cumulative pitch P2 from the sixth to sixth recessed portions 22c
Is 16.024 × 5 = 80.12 mm (measured at room temperature 25 ° C.).

Accordingly, the embossed cumulative pitches of the first to sixth embosses 15 thus formed are contracted after being released from the mold because the long sheet is not cooled to room temperature in the mold. Molding die recessed cumulative pitch (8
Smaller than 0.12 mm (for example, 80.01-
80.02 mm). Next, in the case of using a long sheet having a large shrinkage ratio, the concave mold cumulative pitch is expanded by adjusting the temperature of the molding die to a high temperature side and thermally expanding the molding die, and the embossed cumulative pitch after shrinkage is set to 80. Keep around 0.00mm.
On the other hand, when a long sheet having a small shrinkage is used, the temperature of the mold is adjusted to the low temperature side, the recessed portion cumulative pitch is kept small, and the embossed cumulative pitch after shrinkage is kept near 80.00 mm. In addition, here, the temperature control water is formed by the cold / hot water machine in the molding die 2
2a and 22b are circulated to form the molding die 22.
The temperature of a and 22b can be controlled to be constant at a predetermined temperature, and the pitch between embosses 15 is controlled. Therefore, in the molding dies 22a and 22b, the pitch between the recesses of the recesses 22c is adjusted by temperature control, so that the molding dies 22a,
Since it is not necessary to drive the dimension of 22b, the molding die 22
It is easy to manufacture a and 22b. Also, a temperature sensor such as a thermocouple is appropriately embedded in the surface of the molding die,
The temperature or flow rate of the cooling water is controlled so as to keep the temperature of the molding die constant.

The temperature that can be adjusted is 15 to 80 ° C.
The desired temperature between. This is because when the temperature of the molding die is adjusted to 15 ° C or lower, the temperature of the circulating water is 15 ° C or lower (5 ° C to 1 ° C).
This is because it is necessary to set the temperature to about 0 ° C.) and dew condensation on the cooling pipe and dew condensation on the molding die during the operation stop are not preferable. Moreover, since the temperature of the long sheet at the time of releasing from the molding die needs to be equal to or lower than the softening point temperature of the long sheet, the temperature of the molding die should be set to 80 ° C. as an upper limit. is there.

Next, the long sheet 13 on which the emboss 15 is formed is supplied to the temperature adjusting means 23 of the long sheet 13. The device for controlling the temperature of the long sheet 13 which is the temperature adjusting means 23 is installed as a cooling BOX between the forming means 22 and the press punch die which is the punching means 24. For example, air having a temperature of 20 ° C. and a flow rate of 500 Nl / min is blown from above and below the long sheet 12, and the cooling BOX itself is also circulating water of 20 ° C., so that the sheet temperature becomes a certain set temperature, for example, 25 ° C. To adjust the temperature. Since the temperature of the sheet after molding is high, the temperatures of the air and the circulating water are set lower than the set temperature of the sheet.

In the temperature adjusting means 23, the temperature of the sheet is adjusted to 2
The temperature can be adjusted to a desired constant temperature between 5 ° C. and 35 ° C., so that the air and / or the circulating water can be adjusted in temperature. The temperature of air and / or circulating water is selected according to the sheet material and the like. Further, the temperature adjusting means 23 may be one that does not include the cooling fan, but makes the sheet contact the cooling BOX and adjusts the temperature only by circulating water.

The reason for controlling the temperature of the sheet from 25 ° C. to 35 ° C. is that the temperature of the long sheet during punching is 35 ° C.
If it exceeds, shrinkage of the long sheet after punching cannot be ignored, and if it is below 25 ° C, it will be cooled to room temperature or lower, and the cooling medium will be at a lower temperature, and dew condensation will occur. This is because it is not preferable. Furthermore,
When the temperature of the long sheet at the time of punching is lower than 25 ° C., the long sheet naturally rises to room temperature and expands after punching, and the sprocket hole cumulative pitch becomes large, which is not preferable.

The long sheet 13 cooled by the temperature adjusting means 23 and kept at a constant temperature is supplied to the sprocket hole 16 and the punching means 24 for punching out the inspection hole 17 as required, and the press metal provided therein. The die is punched. When punching with the press die,
The temperature of the long sheet 13 is almost constant. The sprocket holes are formed in the vicinity of both side end portions of the long sheet 13 or in the vicinity of either one of the side end portions. Although the inspection hole 17 is formed on the bottom surface of the emboss, there is also a long sheet 14 without the inspection hole 17, that is, an embossed carrier tape.

Further, here, the sprocket hole 16 is
For each intermittent feed of each shot, 24 piercing punches are punched at the same time in the press die at regular intervals, and one piercing punch pitch is 4.00.
Since it is set to 2 mm, the piercing punch cumulative pitch of the piercing punch in the one shot is 4.002 × 23 = 9.
2.046 mm (measured at room temperature 25 ° C.). The piercing punch interval corresponding to the S dimension, which is the widthwise distance of the sprocket holes 16 formed at both ends of the long sheet 14 in the widthwise direction, was set to 52.45 mm.

In this case, in forming the emboss 15,
The embossed cumulative pitch in one shot of molding is 25 ° C.
Since it is formed with the molding die of No. 1 and is cooled with a cooling medium of 20 ° C. and then perforated, in consideration of the thermal expansion coefficient of the long sheet 14, it is formed to 80.01 mm with respect to the design value of 80 mm, and the sprocket hole is formed. The 16 sprocket hole cumulative pitches are also molded with high precision of 92.03 mm with respect to the design value of 92 mm. The long sheet 14 is an embossed carrier tape which is a product.

As described above, in the method for manufacturing the embossed carrier tape according to the embodiment of the present invention, the molding die 22a is used.
The size of the concave portion 22c is set in accordance with the molding die temperature in accordance with the processing temperature and the shrinkage rate of the long sheet 12, and the molding die 22a,
22b is controlled to have a constant temperature, the long sheet 13 on which the emboss 15 is formed is temperature-controlled to a constant temperature, and then the inspection hole 17 is punched on the sprocket hole 16 and the bottom surface of the emboss as necessary. It is possible to manufacture an embossed carrier tape having good dimensional accuracy with almost no dimensional deviation of the sprocket holes. Therefore, the amount of intermittent feed, that is, the number of embosses taken for each shot can be increased, so that the productivity is improved.

That is, by controlling the temperature of the molding dies 22a and 22b to a constant temperature, the molding dies 22a and 22b are thermally expanded and held at a constant length or size. The emboss pitch and the emboss cumulative pitch in the long sheet 13 can be maintained with high precision even under conditions such as the manufacturing lot of the original roll, the heating temperature, and the like where the contraction of the long sheet 13 is different.

Further, the material of the molding dies 22a, 22b is
The thermal expansion coefficient of brass is about 20 x 10 ^-6Therefore, 1
When the temperature of the mold 22a is raised from 5 ° C to 80 ° C,
The amount of change in the recessed portion cumulative pitch 80.12 is about 0.104 mm
Becomes However, the amount of change in the vertical and horizontal dimensions of the recess 22c is
It is about 0.05 mm and the width is about 0.01 mm.
Sufficient for general product standard of embossed carrier tape
small. That is, it almost affects the vertical and horizontal dimensions of the embossing 15.
You can control the embossed cumulative pitch without giving
It In this way, the temperature of the long sheet 13 during punching
By controlling to near room temperature, the long sheet 1 after punching
4 can be controlled, so the sprocket hole 16
And the S dimension is stable.

Even for long sheet materials having different shrinkage rates, the forming temperature is controlled to control the temperature of the long sheet having the embossing formed therein, and the sprocket holes and, if necessary, the inspection holes are punched out. Therefore, even if the same molding die is used for different long sheet materials, an embossed carrier tape with high dimensional accuracy can be manufactured. Further, the same effect can be obtained when punching the inspection hole of the electronic component to be housed in the center of the bottom surface of the embossing simultaneously with punching the sprocket hole.

[0033]

EXAMPLE Next, an example of a method for manufacturing the embossed carrier tape according to the embodiment of the present invention will be described. When forming the embossing and the sprocket hole, there are two types of materials, A and B, which have different shrinkage rates as the raw material of the long sheet, and the heating temperature of the long sheet before molding is 200 ° C and 250 ° C, respectively. Table 1 shows dimensional data and, as a comparative example, dimensional data in the case where no cooling is performed between molding and punching.

[0034]

[Table 1]

Here, the difference between Example 1 and Example 2 is the heating temperature of the long sheet, and when the heating temperature of the long sheet becomes high, when the temperature of the long sheet is maintained at the temperature of the temperature adjusting means. Shrinkage is large, and the pitch between the embosses of the long sheet is small. Therefore, the mold temperature should be 25
By changing the temperature from 65 ° C. to 65 ° C., the pitch between the concave portions of the molding die is increased, and when the long sheet contracts, the pitch between the embosses of the long sheet is kept constant. Since the temperature of the long sheet is controlled, the temperature of the long sheet during punching does not change and the pitch of the sprocket holes does not change.
Strictly speaking, temperature change and pitch change are sufficiently small,
It can be regarded as constant.

The difference between Example 1 and Example 3 lies in the material of the long sheet, and the material B has a larger shrinkage ratio than the material A. Since B has a large shrinkage ratio, the pitch between embosses becomes small under the same conditions as in Example 1. Therefore, the temperature of the molding die is adjusted to a temperature higher than that of Example 1, the pitch between the recesses of the molding die is increased, and the pitch between the embosses of the long sheet is kept constant.

The comparative example is the case where the temperature of the long sheet was not adjusted in Example 1, and the temperature of the long sheet at the time of releasing from the mold was 25 ° C., and the sprocket was kept at a high temperature. Since the holes are punched out, when the long sheet is brought to room temperature thereafter, the long sheet shrinks and the sprocket hole cumulative pitch becomes smaller.

Next, an embodiment of an embossing carrier tape manufacturing apparatus according to the present invention will be described with reference to FIGS. 1 and 4. The embossing carrier tape manufacturing apparatus 30 according to the embodiment of the present invention includes a conveying means 21 for intermittently feeding the heated long sheet 12 which is a long resin sheet to the molding dies 22a and 22b, and the molding die 22a. , 22b for continuously forming the embossing 14 for storing components on the long sheet 12, a plurality of continuous sprocket holes 16 near both side ends of the long sheet 13, and embossing if necessary. Drilling means 2 for forming inspection hole 17 on the bottom surface of 15
4, and the molding means 22 includes molding dies 22a and 22b.
Is provided at a desired temperature between 15 ° C. and 80 ° C., and the long sheet 13 having the embossment 15 formed between the forming means 22 and the perforating means 24 is kept at 15 ° C.
The temperature control means 23 is provided to keep the temperature constant at a desired temperature between 1 and 80 ° C.

Therefore, the embossing carrier tape manufacturing apparatus 30 uses the molding means in the conventional embossing carrier tape manufacturing apparatus as the temperature of the molding dies 22a and 22b.
The forming means is provided with a temperature adjusting mechanism capable of maintaining a desired constant temperature between 5 ° C. and 80 ° C., and the temperature adjusting means 23 is provided between the forming means 22 and the perforating means 24.

By using the embossing carrier tape manufacturing apparatus 30, even if the material of the long sheet or the heating temperature of the long sheet changes, as shown in the method for manufacturing the embossing carrier tape of the embodiment of the present invention. By adjusting the temperatures of the molding dies 22a and 22b, it is possible to form embossings with a sufficiently high precision between the embossing pitches and the relative positions of the embossing 15 and the sprocket holes 16 with a sufficiently high precision. The length sheet 14, that is, the embossed carrier tape can be manufactured.

[0041]

According to the present invention, it is possible to freely control the pitch between embosses formed on a long resin sheet drawn from a raw roll which is a raw material for an embossed carrier tape. Since it is not necessary to strictly follow the design value of the pitch between recesses for forming embosses, it is easier to manufacture a molding die than in the past.
Further, it is possible to absorb a subtle difference in the shrinkage ratio of the long resin sheet due to the difference in the lot of the original roll,
Further, the long resin sheets made of different materials can be molded by the same molding die. Furthermore, the pitch of the sprocket holes can be stably kept constant by always keeping the temperature at the time of punching the long resin sheet after molding with a press punch die. Therefore, the deviation of the positional relationship between the embossing and the sprocket hole in one shot in the molding press can be reduced to a negligible amount, so that the feeding amount of intermittent feed, that is, the number of embossings taken per shot can be increased. It is possible and productivity is improved.

[Brief description of drawings]

FIG. 1 is a diagram illustrating a method for manufacturing an embossed carrier tape according to an embodiment of the present invention.

2 is a plan view of the molding die shown in FIG. 1. FIG.

FIG. 3 is a sectional view taken along the line AA of the molding die shown in FIG.

FIG. 4 is a plan view of an embossed carrier tape.

[Explanation of symbols]

10 Raw roll 11, 12, 13, 14 Long sheet 15 Emboss 16 sprocket holes 17 Inspection hole 20 Heating means 21 Transporting means 22 Forming means 22a, 22b Mold 22c recess 23 Temperature control means 24 Perforating means

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Claims (2)

[Claims] 1. A heated long resin sheet is intermittently sent to a molding die, and in the molding die, embosses for storing parts are continuously formed in the resin sheet, and both side ends of the resin sheet are formed. In a method for manufacturing an embossed carrier tape having a plurality of continuous sprocket holes in the vicinity of at least one of the parts, the molding die is held constant at a desired temperature between 15 ° C and 80 ° C to form the embossment. After that, the resin sheet on which the emboss is formed is held at a desired temperature between 25 ° C. and 35 ° C. at a constant temperature, and then a sprocket hole is formed, which is a method for producing an embossed carrier tape. 2. A molding means comprising: a conveying means for intermittently feeding a heated long resin sheet to a molding die; and the molding die, wherein the resin sheet continuously forms an emboss for storing a component. And a punching means for forming a plurality of continuous sprocket holes in the vicinity of at least one of both end portions of the resin sheet, wherein the shaping means is configured to move the molding die at 15 ° C. To 80 ° C., a temperature control mechanism for keeping the temperature constant at a desired temperature is provided, and the resin sheet on which the emboss is formed is preferably between 25 ° C. and 35 ° C. between the molding means and the punching means. An apparatus for manufacturing an embossed carrier tape, which is provided with a temperature control means for holding the temperature at a constant temperature.