JP3793500B2 - Embossed carrier tape manufacturing method and embossed carrier tape manufacturing apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an embossed carrier tape manufacturing apparatus for storing electronic components and protecting them from impact, static electricity, etc. during transportation.
[0002]
[Prior art]
The embossed carrier tape is a tape having an embossed portion that accommodates a relatively small electronic component, and is usually formed from a thermoplastic resin (polystyrene or the like) to which a conductive additive such as carbon black is added.
[0003]
Here, an example of the embossed carrier tape is shown in FIGS. 1 (a) and 1 (b). FIG. 1A shows an example in which a plurality of embosses are formed in one row, and FIG. 1B shows an example in which five embosses are formed in one row.
[0004]
The embossed carrier tape shown in FIG. 1 (a) may be manufactured as it is from the beginning, and the width of the carrier tape having a plurality of embossed rows made of a plurality of embosses as shown in FIG. 1 (b). It can also be obtained by slitting in the direction.
[0005]
Electronic components housed in such an embossed carrier tape are mounted on a target board or the like by an automated component mounting apparatus or the like. At this time, the plurality of embossed portions provided on the embossed carrier tape cannot be handled by an automated component mounting apparatus or the like unless they are formed at equal intervals with high accuracy. In addition, the shape and dimensions of the embossed part itself are required to have high accuracy for protecting the electronic components to be stored or for handling the mounting apparatus.
[0006]
As a method for producing such an embossed carrier tape, a vacuum forming method has been used. In general, heat softened base resin tape is brought into close contact with the recess provided in the mold by vacuum suction, and then the product is obtained by releasing the molded product from the mold. For a long time, the “reciprocating die method” in which the die reciprocates in the direction perpendicular to the tape flow direction has been known.
[0007]
As an application of this reciprocating mold method, in order to improve the adhesion of the resin to the concave portion of the mold, a convex portion arranged so as to face the concave portion of the mold is used to partially apply the base resin tape during vacuum suction. High dimensional accuracy and sufficient performance by plug assist method that assists in moving to the concave mold cavity and vacuum / pneumatic method that blows high-pressure air from the opposite side of the mold side of the base resin tape at the same time as vacuum suction An embossed carrier tape having strength could be obtained.
[0008]
However, in order to further increase the productivity, embossed carrier tape production using a rotary mold known recently in JP-A-11-207811 (Patent Document 1), JP-A-11-151749 (Patent Document 2), etc. Devices have come into use.
Here, an embossed carrier tape manufacturing apparatus using such a rotary mold will be described with reference to FIG. 2 which is a model diagram.
[0009]
In FIG. 2, the base resin tape 1 ′ made of thermoplastic resin is adjusted in tension by a roller (not shown), and has a rotary mold (made of metal) 3 having a plurality of concave molding die portions 3a ′ on a cylindrical side surface. Supplied to '.
[0010]
The rotary mold 3 ′ is driven by a motor (not shown) and rotates in the clockwise direction in the drawing.
The base resin tape 1 'in contact with the rotary mold 3' is heated by the heater 4 'and softens. Next, the vacuum suction part 5 ′ sucks the air from a small suction hole (not shown) provided in the concave molding part 3a ′ and sucks it into the concave molding part 3a ′ which is in a decompressed state, and embosses it. Part 1a ′ is formed.
[0011]
The base resin tape 1 ′ having the plurality of embossed portions 1a ′ thus formed is released from the rotary mold 3 ′, then cooled by a cooler (not shown) or the like, and then wound up as necessary. It is done.
[0012]
However, with recent improvements in mounting technology, it is possible to automatically mount tall components on an electronic board, and accordingly, a deep-drawn embossed carrier with a large embossed portion depth ("D" in FIG. 1B). Tape has come to be demanded.
[0013]
However, in the embossed carrier tape manufacturing method using a rotary mold, so-called deep drawing is performed, that is, when the depth D of the embossed portion is increased, the model cross-sectional view of the embossed carrier tape of FIG. It was found that the thickness of the bottom surface of the embossed portion indicated by an arrow is reduced, and the strength and dimensional accuracy required for the embossed portion of the embossed carrier tape cannot be obtained.
[0014]
[Patent Document 1]
JP 11-207811 A (page 1-3)
[Patent Document 2]
JP 11-151749 A (page 1-3)
[0015]
[Problems to be solved by the invention]
The present invention improves the above-described conventional problems, that is, in the production of an embossed carrier tape using a rotary mold with good productivity, even if the depth of the embossed portion to be formed is increased, the embossed carrier tape It is an object to provide an embossed carrier tape manufacturing apparatus that can satisfy the required strength and accuracy.
[0016]
[Means for Solving the Problems]
In order to solve the above-mentioned problems, the present inventors have attempted a combination of a rotary mold and a plug assist method. An example is shown in FIG.
[0017]
In this method, the reciprocating assist plug 6 ′ is inserted into the concave mold portion 3 a ′ on the side surface of the rotary mold 3 ′ by reciprocating in the direction indicated by a double arrow in the drawing, thereby using the reciprocating mold. Good moldability similar to the plug assist method can be obtained.
[0018]
However, while the assist plug 6 'is inserted into the concave mold portion 3a', it is necessary to stop the rotation of the rotary mold against a predetermined position very accurately, against its inertia. The rotary mold 3 'cannot be driven continuously, and high-speed driving is difficult, making the most of its effects impossible. It has been found that there is always a risk of breakage, and further improvements have been made to the present invention.
[0019]
That is, the manufacturing method of the embossed carrier tape of the present invention solves the above-mentioned problem. As described in claim 1, the substrate resin tape made of a thermoplastic resin is substantially cylindrical and has an embossed carrier on its side surface. The embossed part is continuously vacuum formed by contacting the side surface of a rotating rotary mold having one or more concave mold part rows composed of a plurality of concave mold parts for forming an embossed part of the tape. In the manufacturing method of the embossed carrier tape, the rotary mold is rotated using a rotatable auxiliary mold that is smaller than the concave mold part of the rotary mold and has a plurality of convex parts that mesh with the concave mold part. The part of the base resin tape located on the concave mold part on the side of the rotary mold from the side opposite to the rotary mold of the base resin tape that contacts the side of the rotary mold An emboss carrier that forms an embossed portion on the base resin tape by reducing the pressure inside the concave molding die while the convex portion of the auxiliary mold moves to the inside of the concave molding die on the side surface of the rotary mold It is a manufacturing method of a tape.
With such a configuration, it is possible to produce an embossed carrier tape with good productivity and excellent dimensional accuracy and strength.
[0020]
Moreover, the embossing carrier tape manufacturing apparatus of this invention is the substantially cylindrical shape, and the embossing part of an embossing carrier tape is formed in the side surface as the base resin tape consisting of a thermoplastic resin as described in Claim 2. In an embossed carrier tape manufacturing apparatus for continuously vacuum forming an embossed part by contacting one side of a rotating rotary mold having at least one recessed mold part row composed of a plurality of concave mold parts. An auxiliary mold that is smaller than the concave mold part of the rotary mold and has a substantially cylindrical shape and has a convex part that meshes with the concave mold part, and the auxiliary mold The convex portion of the base plate resin moves to the inside of the concave molding die portion generated in the portion of the base resin tape located in the concave molding die portion by decompression in the concave molding die portion on the side surface of the rotary mold. Of tape 1 In a position to aid from the opposite side to the Rotary Shikikin type, characterized in that an auxiliary mold.
With such a configuration, it is possible to produce an embossed carrier tape with good productivity and excellent dimensional accuracy and strength.
[0021]
DETAILED DESCRIPTION OF THE INVENTION
The embossed carrier tape manufacturing apparatus of this invention is demonstrated using figures.
FIG. 4 is a model diagram showing an example of an embossed carrier tape manufacturing apparatus according to the present invention.
[0022]
This apparatus has a base resin tape 1 made of a thermoplastic resin, which is substantially cylindrical and has a concave molding die portion comprising a plurality of concave molding die portions 3a for forming an embossed portion of an embossed carrier tape on its side surface. An embossed carrier tape manufacturing apparatus for continuously forming an embossed portion 1a in contact with a side surface of a rotating rotary mold 3 having one or more rows, for forming a concave shape of the rotary mold 3 An auxiliary mold 6 that is smaller than the mold part 3a and has a convex part 6a that meshes with the concave mold part 3a and is rotatable in the direction opposite to the rotation of the rotary mold; and The convex portion 6a of the auxiliary mold 6 is formed in a concave shape generated in the portion of the base resin tape 1 located in the concave mold portion 3a due to the reduced pressure in the concave mold portion 3a on the side surface of the rotary mold 3. Inside the mold part 3a And the rotary Shikikin type 3 of the base resin tape 1 in a position to assist the opposite face, an embossed carrier tape manufacturing apparatus having an auxiliary die 6.
[0023]
In the figure, the base resin tape 1 is supplied to the side surface of the rotary mold 3 through a space between the preheating roller 2a and the preheating roller 2b. At this time, the preheating roller 2 a and the preheating roller 2 b prevent uneven tension in the supply of the base resin tape 1 to the rotary mold 3.
[0024]
The substantially cylindrical rotary mold 3 rotates clockwise in the figure. A plurality of concave mold portions 3a for forming an embossed portion of the embossed carrier tape is formed on the side surface. It should be noted that one or more concave molding die rows composed of a plurality of concave molding die portions can be provided (only one concave molding die row is shown in the figure).
[0025]
The base resin tape 1 supplied to the surface of the rotary mold 3 is heated to a moldable temperature by the hot air supplied from the heater 4, but the rotary mold 3 is cooled by the cold air supplied by the cooler 7. Therefore, the base resin tape 1 is not fused to the mold surface.
[0026]
The portion of the base resin tape 1 that is sufficiently heated and reaches the position where the inside of the concave molding die 3a is vacuum-sucked by the vacuum suction portion 5 through a communication hole (not shown) is sucked into the concave molding die 3a. .
[0027]
At this time, since the auxiliary mold 6 is provided so that the convex part 6a of the auxiliary mold 6 is engaged with the concave molding part 3a of the rotary mold 3, the concave molding mold on the side surface of the rotary mold 3 is provided. The portion of the base resin tape 1 located in the portion 3a is formed on the side surface of the rotary mold 3 from the surface opposite to the rotary mold with respect to the base resin tape 1. The auxiliary operation of moving to the inside of the concave molding die 3a is simultaneously performed by the convex portion 6a.
[0028]
Here, both the rotary mold 3 and the auxiliary mold 6 can rotate smoothly while engaging the concave molding part 3a of the rotary mold 3 through the base resin tape 1 as described above. In addition, the shape of the concave mold part 3a on the side surface of the rotary mold 3 (the concave mold part 3a of the rotary mold 3) so that the embossed part 1a can be formed with a uniform thickness and good mold shape reproducibility. It is necessary to determine the shape of the convex portion 6a of the auxiliary mold 6 in consideration of the rotational speed of the mold, the flexibility of the resin used, and the like.
[0029]
In the operation of the above apparatus, the rotation speed of the auxiliary mold 6 and the rotation direction of the auxiliary mold 6 are opposite to each other, and those speeds are strictly controlled so that the concave mold portion 3a It is necessary to always keep the occlusion synchronized with the convex portion 6a. If the synchronization between them is not normal, not only an embossed carrier tape with high accuracy and sufficient strength can be obtained, but also the expensive rotary die 3 and auxiliary die 6 are scratched or damaged. May occur.
[0030]
Since the temperature of the rotary mold 3 is set lower than the temperature of the heated base resin tape 1 as described above, the portion of the base resin tape 1 in contact with the rotary mold 3 is The temperature is relatively lower than the portion of the rotary mold 3 located in the concave mold portion 3a.
[0031]
For this reason, conventionally, only the relatively high temperature portion of the base resin tape 1 that is located in the concave mold portion 3a of the rotary die 3 is stretched mainly by suction. It was.
[0032]
However, the present invention is a molding method using an auxiliary mold, and the auxiliary mold is not actively heated, and the distance from the high-temperature supply source is large. It is lower than the part of the material resin tape 1 that is located in the concave mold part 3 a of the rotary mold 3.
[0033]
For this reason, the convex portion 6a of the auxiliary die 6 and the base resin tape 1 are brought into contact with the portion located in the concave molding die portion 3a of the rotary die 3, particularly the central portion thereof, at the time of molding. The partial temperature difference of the base resin tape 1 can be reduced, local stretching is prevented, and the strength of the resulting embossed portion 1a can be maintained. At this time, a temperature control of the auxiliary mold 6 may be performed by providing a cooler or the like as necessary.
[0034]
As described above, the portion of the base resin tape 1 on which the embossed portion 1a is formed is cooled and fixed in shape by heat transfer to the mold 3 and cold air from the cooler 8.
Although the tape 1 after cooling is easily removed from the rotary die 3 inadvertently, there is a risk that a failure such as deformation of the embossed portion 1a may occur. The mold release assists A and B (reference numerals 9a and 9b) are supplied while preventing the mold.
[0035]
Here, a model exploded perspective view of the rotary mold 3 and the mold release assists A and B is shown in FIG.
FIG. 5A is an exploded perspective view of the model as viewed from the mold release assists A and B, and FIG. 5B is an exploded perspective view of the model as viewed from the rotary mold 3 side.
[0036]
On the side surface of the rotary mold 3, five rows of concave mold portions are formed of a plurality of concave mold portions 3 a for forming an embossed portion of the embossed carrier tape.
[0037]
The release assist B9b is provided with a guide surface 9b1 with respect to the cylindrical rotary mold 3. The mold release assist A is provided with a comb-shaped guide portion 9a1 so as to have a curved surface corresponding to the guide surface 9b1 of the mold release assist B9b. The concave portion of the comb-shaped guide portion 9a1 is formed by the embossed section 1a of the base resin tape 1. It is provided with dimensions that allow it to pass.
[0038]
These one set of mold release assists A and B are assembled as shown in FIG.
6A is a model perspective view seen from the mold release assist A and B side, and FIG. 6B is a model perspective view seen from the rotary mold 3 side.
[0039]
The end of the guide surface 9b1 on the rotary mold 3 side coincides with the tangential surface with respect to the cylinder of the rotary mold 3, and thereafter, the surface is closer to the rotary mold 3 side than the tangential surface. For this reason, the base resin tape on which the embossed portion 1a released from the rotary mold 3 by the mold release assists A and B is formed along the tangential surface with respect to the cylinder of the rotary mold 3 immediately after the mold release. move on. Then, the guide surface 9b1 advances closer to the rotary die 3 side than the tangent to the rotary die 3 (this state is schematically shown in FIG. 7).
[0040]
By pulling the embossed portion 1a away from the concave mold portion 3a of the rotary mold 3 by such a set of mold release assists A and B, that is, the tangent line of the rotary mold 3 having the cylindrical embossed portion 1a. After being released in the direction, even by manufacturing an embossed carrier tape having a deep drawing embossed part using a rotary die by being separated at an angle smaller than the tangential angle (tangential direction), It is possible to eliminate or significantly reduce the occurrence of deformation and scratches caused by pressing the corner of the embossed portion against the wall surface of the concave molding die 3a.
[0041]
In addition, the mold release assist can achieve its intended purpose only with the mold release assist A on the rotary mold 3 side, but by using the mold release assist B as described above, the tape immediately after the mold release. As a result, high-speed operation is possible and productivity is improved.
[0042]
As described above, the base resin tape that is released from the rotary mold 3 and on which the embossed portion 1a is formed becomes an embossed carrier tape of the product.
Thereafter, post-processing such as drilling, cutting, and dimension adjustment may be further performed by pressing, slitting, or the like.
[0043]
Further, when it is desired to further cool the tape released from the rotary mold 3, for example, as shown in FIG. 8A and FIG. This can be achieved effectively by providing pores (reference numerals 9a2 ′ and 9b2 ′) and flowing cooled air or the like from these vent holes toward the guide surface.
[0044]
In the embossed carrier tape manufacturing apparatus of the present invention, it is desirable that the above-mentioned occlusion can be released in consideration of the start of operation, maintenance of the apparatus (such as disassembly and cleaning of the rotary mold 3), and the like.
[0045]
In that case, it is desirable that the auxiliary mold in FIG. 4 can be retracted in a position where the convex part does not engage with the concave mold part on the side surface of the rotary mold, for example, in the right direction in the figure.
[0046]
At this time, when the retraction is released and the convex portion is returned to the position where the convex portion is engaged with the concave mold portion on the side surface of the rotary mold, it is necessary to strictly set the occlusion to be normal. If this setting is insufficient, not only an embossed carrier tape with high accuracy and sufficient strength can be obtained, but also the expensive rotary die 3 and auxiliary die 6 are scratched or damaged. There is a fear.
[0047]
However, if the rotational drive of the rotary mold and the rotational drive of the auxiliary mold are performed by a single motor, the adjustment of the occlusion may be difficult or insufficient. Therefore, it is desirable that the auxiliary mold and the rotary mold are rotationally driven independently.
[0048]
【Example】
An embossed carrier tape was actually produced using the embossed carrier tape manufacturing apparatus according to the present invention shown in model form in FIG.
[0049]
That is, using a base resin tape made of polystyrene having a thickness of 0.4 mm and a width of 12 mm, using the same rotary mold, the mold peripheral speed was 10 m / min, the pitch was 8 mm, and the size was 5 mm × 5 mm. An embossed portion having a depth of 5.5 m was continuously formed.
When the thickness of each part of the embossed part obtained at this time was measured, the thickness was in the range of 80 to 140 μm, the mold reproducibility was good, and sufficient molding accuracy was obtained.
[0050]
At this time, as a comparative example according to the prior art, under the same conditions, however, the auxiliary mold 6 is in the right direction in FIG. 4, that is, in a position where the convex portion does not mesh with the concave mold portion on the side surface of the rotary mold. Retracted to obtain an embossed carrier tape. When the thickness of the embossed part obtained at this time was measured, there was an extremely thin part with a thickness of 40 μm, which did not satisfy the performance required as an embossed carrier tape in terms of strength. The molding accuracy was low and unsatisfactory.
[0051]
【The invention's effect】
The method for producing an embossed carrier tape of the present invention comprises a base resin tape made of a thermoplastic resin having a substantially cylindrical shape, and a plurality of concave molds for forming an embossed portion of the embossed carrier tape on its side surface. In the method of manufacturing an embossed carrier tape, wherein the embossed part is continuously vacuum-molded by bringing it into contact with the side surface of a rotating rotary mold having at least one concave mold part row, and the concave shape of the rotary mold Using a substantially cylindrical auxiliary mold having a convex part that meshes with the molding die part, the part of the base resin tape located in the concave molding part on the side surface of the rotary mold is replaced with the convex part of the auxiliary mold. However, it is embossed on the base resin tape by depressurizing the inside of the concave mold part while moving it from the opposite side of the rotary mold to the inside of the concave mold part on the side of the rotary mold. An embossed carrier tape having a strength as designed and high mold reproducibility can be produced with good productivity, so that an embossed carrier tape having a deep embossed portion can be manufactured. It is a manufacturing method.
[0052]
The embossed carrier tape manufacturing apparatus of the present invention is a substantially cylindrical shape of a base resin tape made of a thermoplastic resin, and includes a plurality of concave molding dies for forming an embossed portion of the embossed carrier tape on its side surface. In an embossed carrier tape manufacturing apparatus for continuously forming an embossed portion in contact with the side surface of a rotating rotary die having one or more rows of concave mold portions, for forming the concave shape of the rotary die. A substantially cylindrical auxiliary mold having a convex portion that meshes with the mold portion, and the convex portion is formed by reducing the pressure in the concave molding portion on the side surface of the rotary mold. Since it has a configuration with an auxiliary die at a position that assists the movement inside the concave molding die that occurs in the portion of the base resin tape located at the surface from the surface opposite to the rotary die, And strength as designed Some manufactures embossed carrier tape having a section, embossed carrier tape having a high mold reproducibility is a good productivity good embossed carrier tape manufacturing apparatus to be obtained.
[Brief description of the drawings]
FIG. 1 shows an example of an embossed carrier tape.
(A) Example in which a plurality of embosses are formed in one row (b) Example in which a plurality of rows made of a plurality of embosses are formed (c) A model diagram showing a cross section of an embossed carrier tape.
FIG. 2 is a model diagram showing a method for manufacturing an embossed carrier tape according to the prior art.
FIG. 3 is a model diagram showing an example in which a combination of a rotary mold and a plug assist method is attempted.
FIG. 4 is a model diagram showing an embossed carrier tape manufacturing apparatus according to the present invention.
FIG. 5 is an exploded perspective view of a model of a rotary mold 3 and mold release assists A and B.
(A) It is the model disassembled perspective view seen from the mold release assist A and B side.
(B) It is the model disassembled perspective view seen from the rotary type | mold 3 side.
FIG. 6 is a perspective view showing a state where the rotary mold 3 and mold release assists A and B are assembled.
(A) It is the model perspective view seen from the mold release assistance A and B side.
(B) It is the model perspective view seen from the rotary type | mold 3 side.
FIG. 7 is a model explanatory view showing a state where a tape on which an embossed portion is formed by mold release assist is released from a rotary mold 3;
FIG. 8 is a view showing a state in which vent holes are provided in the mold release assists A and B.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Base-material resin tape 1a Embossing part 2a, 2b Preheating roller 3 Rotary type | mold 3a Concave mold part 4 Heater 5 Vacuum suction part 6 Auxiliary mold 6a Convex part 7, 8 Cooler 9a Mold release assist A
9a1 Comb guides 9a2 ', 9b2' Vent hole 9b Mold release assist B
9b1 Guide surface 10 Auxiliary roller

Claims (2)

A base resin tape made of a thermoplastic resin is substantially cylindrical, and has at least one row of concave molding die rows comprising a plurality of concave molding die portions for forming an embossed portion of an embossed carrier tape on its side surface. In the method for producing an embossed carrier tape, wherein the embossed portion is continuously vacuum formed by contacting the side surface of a rotating rotary mold.
Using a rotatable auxiliary mold that is smaller than the concave mold part of the rotary mold and has a plurality of convex parts that mesh with the concave mold part,
The part of the base resin tape located on the concave mold part on the side of the rotary mold from the side opposite to the rotary mold of the base resin tape in contact with the side of the rotating rotary mold is the above auxiliary Embossing characterized in that an embossed portion is formed on a base resin tape by reducing the pressure inside the concave molding die while the convex portion of the die is moved into the concave molding die on the side surface of the rotary mold Manufacturing method of carrier tape. A base resin tape made of a thermoplastic resin is substantially cylindrical, and has at least one row of concave molding die rows comprising a plurality of concave molding die portions for forming an embossed portion of an embossed carrier tape on its side surface. In an embossed carrier tape manufacturing apparatus for continuously vacuum forming an embossed part in contact with a side surface of a rotating rotary mold,
The auxiliary mold has a substantially cylindrical and rotatable auxiliary mold that is smaller than the concave mold part of the rotary mold and has a convex part that meshes with the concave mold part. The convex portion moves to the inside of the concave mold portion generated in the portion of the base resin tape located in the concave mold portion by pressure reduction in the concave mold portion on the side surface of the rotary mold. An embossed carrier tape manufacturing apparatus having an auxiliary die at a position where the auxiliary die is supported from a surface opposite to the rotary die.

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