JP2002520132A - Method and apparatus for cleaning a substrate - Google Patents

Abstract

  (57) [Summary] In the method and apparatus for cleaning wafers (8), each wafer (8) is individually wet pre-cleaned in at least one coarse cleaning device (10, 11) and then filled with the processing liquid in the wet state. The finishing cleaning device (35) is conveyed into the collecting tank (30), collected in the collecting tank (30) and wetted together as a batch when a certain number is reached in the collecting tank (30). ). In the finish cleaning device (35), the batch of substrates (8) is finish cleaned wet and then dried.

Description

DETAILED DESCRIPTION OF THE INVENTION

The present invention relates to a method and an apparatus for cleaning substrates, wherein the substrates are each individually pre-wet cleaned with at least one coarse cleaning device.

In the semiconductor industry, semiconductor wafers are, for example, coated, masked,
It undergoes various method steps, such as an etching step, a doping step, a polishing step and the like. During that time, it may be necessary to clean the substrate. It is necessary to clean the polished substrate, especially after the polishing step. This is because polishing powder and polishing liquid for the substrate are generally attached to the substrate.

Conventional methods for cleaning a substrate after a polishing process include, for example, EP-A-
As is known from US Pat. No. 5,547,515, JP-A-7 066 161, US Pat. No. 5,47,515 or JP-A-1 289 122, the substrate is transported from the polishing device to the brush cleaning facility after the polishing process. . In these known brush cleaning installations, the substrate is cleaned by individually rotating brushes and a cleaning liquid. The substrate is then generally dried and collected as a batch, for example, as described in US-A-5 547 515.

[0004] Because the brushing device is generally not sufficient, the dried and collected substrate is later used, for example, in DE-A-44 13 077, DE-A-195 46 990 or DE-A-196 of the applicant.
37 875, it is inserted into a finishing cleaning device. In this finish cleaning apparatus, the substrates in a batch are immersed together in a processing liquid and finish cleaned in the finish cleaning apparatus, for example, by creating a flow in a processing tank. The substrate is then removed from the finishing cleaning device and allowed to dry, the drying being effected by slowly lifting the substrate from the processing liquid. By the fluid introduced above the processing liquid,
The drying process is accelerated by the "Marangoni effect" described in EP-A-0 385 536.

The method steps described above require that each substrate be dried between individual cleaning of the substrates in a brush cleaning facility and batch cleaning in a finish cleaning device, such as by centrifugal dehydration of the wafer. Alternatively, the heat treatment is performed. This drying is necessary because the processing liquid used in brush cleaning would otherwise adhere to the wafer and produce streaks that would be difficult to remove in subsequent cleaning. The dried wafers must then be interim stored and collected, and inserted as a batch into the finishing cleaning equipment.

The drying step between brush cleaning and finish cleaning is expensive and carries the risk that the wafer will be damaged by centrifugal dewatering or heat treatment.

It is therefore an object underlying the present invention to provide a simplified and improved method and apparatus for cleaning a substrate, which method or apparatus accelerates the processing of a substrate. And thus increase productivity.

According to the invention, this object is achieved in a method of the type initially described by: That is, the substrate is transported in a wet state after the rough cleaning into a collecting tank filled with a processing fluid, the substrates are collected in the collecting tank, and when a specific number is reached in the collecting container, the substrates are put together by one. The batches are transported wet in a finish cleaning apparatus, the substrates are wet finish cleaned in the finish cleaning apparatus, and the batch is then dried.

Conveying the substrate, without intermediate drying, into a collection tank filled with processing liquid before the substrate is transported as a batch into the finish cleaning device when the specific number is reached. This eliminates the need for drying the substrate after the rough cleaning. This is because storing the substrate in the liquid prevents drying of the liquid and the formation of streaks associated therewith. This eliminates the risk of damage to the substrate during intermediate drying and further increases the processing speed and thus the efficiency of the device.

For simple and effective pre-cleaning, the substrate is advantageously pre-cleaned with a rotating brush and processing liquid.

Preferably, the substrate is rotated during pre-cleaning for a uniform pre-clean.

In order to enhance the pre-cleaning action, the substrate is, according to an advantageous embodiment, irradiated with ultrasound or megasonics.

According to one preferred embodiment of the invention, the substrate is pre-cleaned in two different coarse cleaning devices and transported wet from the first coarse cleaning device to the second coarse cleaning device. The use of two coarse cleaning devices enhances the pre-cleaning action.

In one particularly preferred embodiment of the invention, the substrate is substantially the same during the method steps,
Keep in vertical orientation. This makes it possible in particular to simplify the transfer device for the substrate. This is because the transport device does not need to rotate the substrate between the various cleaning stages.

In order to achieve a good finish cleaning action, the substrate is completely immersed in the cleaning liquid and / or the cleaning liquid and washed with the cleaning liquid and / or the cleaning liquid. Advantageously, the substrate is irradiated with ultrasonic waves in order to increase the cleaning action.

According to a preferred embodiment of the invention, the substrate is moved out of the cleaning liquid and / or the cleaning liquid for drying, introduced into a dry transfer hood and locked therein. To accelerate the drying process, a fluid is advantageously introduced into the drying range before moving the substrate out of the cleaning liquid and / or the cleaning liquid via a dry transfer hood. The fluid introduced in this case is a gas mixture of nitrogen and isopropyl alcohol, which reduces the surface tension of the cleaning liquid and / or the cleaning liquid and thereby reduces the surface tension of the cleaning liquid and / or the cleaning liquid when leaving the substrate. Produces a good spill.

The problem set is an apparatus for performing wet cleaning of a substrate, which has at least one individual substrate rough cleaning apparatus including a liquid supply unit and a processing container, and is solved by the following. Is done. That is, at least one collection tank capable of being filled with a processing liquid for receiving a plurality of substrates, one batch-type finish cleaning device having a fluid container, and a substrate between an individual substrate coarse cleaning device and a collection tank and a collection tank. At least one transfer device for transferring between the and the batch type finish cleaning device is provided.

By providing at least one collection tank that can be filled with a processing liquid for receiving a plurality of substrates, the substrates are stored intermediately in the collection tanks after individual substrate rough cleaning and then batch-finished in the finish cleaning apparatus. Can be transported. By intermediate storage in the processing liquid, there is no danger of the liquid adhering to the substrate drying out after rough cleaning and forming streaks. This eliminates the previously required drying step between individual coarse cleaning and batch-type finishing cleaning, which involves the risk of substrate damage. Furthermore, the processing speed of the device and thus the efficiency are increased.

For good coarse cleaning action, the individual substrate coarse cleaning device has at least one rotatable brush. According to one embodiment of the present invention, the individual substrate coarse cleaning device has a rotatable pressure roller with a small number of paths and a single path to rotate the substrate during the coarse cleaning and thereby obtain a uniform cleaning action. Can be.

In order to enhance the cleaning action, at least one individual substrate rough cleaning device is provided.
It has two ultrasonic transmitters. According to a preferred embodiment of the present invention, the coarse individual substrate cleaning apparatus has two processing tanks each having at least one liquid supply and at least one brush. Thereby, a good two-stage pre-cleaning of the substrate can be achieved.

According to one preferred embodiment of the invention, the individual substrate coarse cleaning device, the collecting tank, the batch finishing cleaning device and the transport device are arranged to keep the substrates in substantially the same, preferably vertical orientation. , Each having holding means. This simplifies the transport device in particular. This is because the transfer device does not need to turn the substrate in another direction during transfer. Advantageously, the substrate is held substantially vertically,
This achieves compatibility with known batch finish cleaning devices.

Preferably, the batch finishing cleaning device has at least one inlet for the cleaning liquid and / or the cleaning liquid and at least one ultrasonic transmitter, so that a good finish cleaning action is achieved. .

To facilitate the insertion and removal of substrates into and out of the batch finish cleaning device, the batch finish cleaning device includes a lifting device for the substrate.

According to a preferred embodiment of the invention, the transport device has a dry transfer hood with holding means for the substrate. The holding means in the dry transfer hood make it possible to receive and transport the substrate alone, in other words without a corresponding substrate support, which reduces the risk of the substrate being soiled by the substrate support. Let it.

In order to accelerate the drying process when lifting the substrate from the liquid in the fluid container of the batch-type finishing cleaning device, a dry transfer hood introduces a fluid into the drying range above the surface of the liquid. Means.

Advantageously, the transfer device has a wet transfer hood for collecting batches of substrates and transferring the batches from the tank to a batch finish cleaning device. The use of a wet transfer hood in addition to a dry transfer hood ensures that the dry transfer hood is always dry and that the received substrate is not soiled.

For a simple and space-saving configuration, the individual substrate coarse cleaning devices, the receiving and collecting tanks and the batch finishing cleaning devices are arranged in a single row. This also simplifies the transport device. This is because the transport device need only perform a linear motion.

According to a preferred embodiment of the invention, the device has a dosing area with a receiving part and an inlet tank which can be filled with liquid. The dosing area with the receptacle has the advantage that an external handler can supply the substrate to the device without precise time coordination with the coarse cleaning device for individual substrates. The liquid-fillable inlet tank prevents any liquid adhering to the substrate from drying before the coarse cleaning.

In order to save the space of the entire apparatus and to simplify the transfer apparatus, a rough cleaning device for individual substrates, a collecting tank, a batch-type finishing cleaning device, an inlet area and an inlet tank are arranged in one line.

The present invention is described below by way of preferred embodiments with reference to the drawings.

FIGS. 1 and 2 show a cleaning device 1 according to the invention, which generally comprises
It comprises two modules 2 and 3 and a transport device 4 for operating the two modules. The first module 2 forms a loading and pre-cleaning station, while the second module 3 forms a collecting and finishing cleaning and transfer station.

The module 2 has a wafer input area 5 with a receiving and holding element 7 for a wafer 8. The receiving and holding elements 7 are arranged such that the wafer 8 is held in a vertical position.

The wafer 8 is removed from the polishing station via an external, not shown, handling device, optionally turned into a vertical position and inserted into the receiving and holding element 7.

Adjacent to the receiving area 5 is a receiving tank 9 which is filled with a fluid, for example DI water, and for receiving a plurality of wafers, for example five wafers. Can be.

The module 2 further comprises first and second brush cleaning devices 10 and 11, which are arranged adjacent to the receiving area 5 on the side opposite to the receiving tank 9. The first brush cleaning device 10 has a cover 14 and a processing tank 15 with overflow, as best seen in FIGS. 3a and 3b, which process liquid 16 from below. It is filled. Inside the tank 15 a wafer receiving element 17 is arranged in the form of a three-point support for holding the wafer 8 contained in the tank 15, wherein the wafer 8 is immersed in the half-treatment liquid 16 and vertically Will be retained. The brush cleaning device 10 further has two brush rollers 20, 21 which are respectively arranged on opposite sides of the wafer inserted into the tank 15, and which have two pressure rollers 22.
, 24, and the pressure roller contacts the edge of the wafer 8 during cleaning and rotates the wafer. The brush rollers 20, 21 extend in the longitudinal direction of the tank 15 and are arranged above the tank 15, and at least partially
5 extends within the processing liquid 16. The brush rollers 20 and 21 are rotatable for cleaning one wafer 8 inserted into the tank 15. Further, the brush roller has one fluid passage therein, through which the processing fluid is guided from the inside to the outside of the brush roller.

At least one ultrasonic transmitter is provided in the first brush cleaning device 10 and emits ultrasonic waves for better cleaning of the wafer.

The second brush cleaning device 11 is constructed in much the same way as the first brush tank, but without the ultrasonic transmitter.

The charging area 5, the storage and collection tank 9, and the brush tanks 10 and 11 are arranged in a single row in the module 2.

The module 3 is directly connected laterally to the module 2, which is also adjacent to the second brush cleaning device 11. Adjacent to the brush cleaning device 11, the module 3 has a storage and collecting tank 30, which is suitable for receiving a larger number of semiconductor wafers 8, for example 25 semiconductor wafers. . For this purpose, the collecting tank 30 has a receiving device for the semiconductor wafer 8, which is not shown in detail, as well as a lifting device. The collecting tank 30 is filled with a processing fluid such as DI water, and the semiconductor wafer 8 received in the collecting container 30 is completely immersed in the fluid. Tank 30 can be an overflow tank, but this is not shown.

Adjacent to the collecting tank 30 is a finishing cleaning device 35, which can best be seen in FIG.

The structure of the finish cleaning device 35 is, for example, the structure of the applicant's DE-A-44 1
3 077, DE-A-195 46 990 or DE-A-196 37 875, the contents of which are the subject of this application to avoid repetition. As a basic element, the finishing cleaning device 35 has a processing tank 36, which is optionally simultaneously and / or alternately filled with a processing fluid, for example a corrosive liquid, a chemical cleaning liquid and / or a cleaning liquid. Furthermore, a lifting device 3 in the form of a knife is provided in the tank.
7 is provided for a semiconductor wafer 8. The finishing cleaning device 35 further includes at least one ultrasonic transmitter (not shown) for emitting ultrasonic waves to the processing tank 36 and the wafers in the processing fluid. An inlet nozzle 38 for the processing fluid and an outlet 39 in the form of a quick dump valve are provided in the area below the processing tank 36, through which the processing fluid is discharged.

A transfer station 40 is provided adjacent to the finishing cleaning device 35, on which the cleaned and dried wafers are placed and from which the wafers are unloaded.

The transfer device 4 that operates both the modules 2 and 3 transfers the wafer 8 to the input range 5
The first brush cleaning device 10 from the receiving tank 9 into the receiving tank 9
A first horizontally and vertically movable handler 50 for transport to
The handling device 50 has, in a known manner, a gripper device 51 for the wafer 8, which gripper device is configured as a so-called edge gripper. The gripper device is connected to the first vertical stay 55 of the transport device 4 via a coupling element 52 at a distance and vertically movable with the transport device. Vertical stay 5
5 is mounted on horizontal stays 56, 57 of the transport device so that it can move horizontally. The vertical movement of the gripper device is thereby effected along the stay 55, whereas the horizontal movement is effected by the movement of the stay 55 along the stays 56,57.

The transport device 4 further comprises a second handler 80, which is largely similar to the first handler 50 and also moves vertically and horizontally along vertical and horizontal stays. It is possible. The handler 60 transports the individual webs 8 from the first brush cleaning device 10 into the second brush cleaning device 11 and from the second brush cleaning device 11 into the storage and collection tank 30 of the second module 3. Help.

The transport device 4 further has a wet transfer hood 65 for collecting batches of wafers and transporting them from the tank 30 into the finish cleaning device 35. Such a wet transfer hood 65 is known, for example, from the applicant's DRE-A-196 52 526, which is subject to this application in order to avoid repetition.

The transport device 4 further has a dry transfer hood 70, for example, of the present applicant.
DE-A-196 52 526. In order to avoid repetition, the contents of the prior application shall be subject to the present application insofar. A dry transfer hood 70, shown schematically in FIG. 4, serves to receive the wafer lifted out of the processing tank 36 and transport it to the transfer station 40. The dry transfer hood has lateral guides 71 for receiving and guiding the wafer 8 and locking elements 72 for holding the received wafer. In addition, the cover 70 has a gas supply 75 through which a gas mixture (N2 / IPA), for example, of nitrogen and isopropyl alcohol can be introduced.

The collecting tank 30, the finishing cleaning device 35 and the transfer unit 40 are arranged in one line with the charging area 5, the receiving and collecting tank 9, and the first and second brush cleaning devices 10 and 11.

In operation of the apparatus according to the invention, the wafer 8 is received by an external, wet robot, not shown, from a polishing output station, not shown, optionally turned into a vertical position and receiving the input area 5 And on the holding element 7.
The handler 50 then grips the wafer and transports it first into the receiving tank 9 which is filled with liquid and places it in the receiving tank. The receiving tank can receive, for example, up to five wafers.

The handler 50 then removes the wafer from the receiving tank 9 again and transports it above the first brush cleaning device 10 with the cover 14 open. The handler 50 places the wafer on the support 17 in the processing tank 15 and moves outward from the brush cleaning device. Pressure rollers 22, 24 and brush roller 20
, 21 are engaged with the wafer, and the processing tank 15 is filled with a liquid 16 such as DI water until it overflows, whereby the wafer 8 is half immersed. The brush rollers 20, 21 are rotated and thereby push the wafer 8 lightly upward against the pressure rollers 22, 24, whereby the wafer 8 is lifted from the receiving part 17 and rotated by the rotating pressure rollers 22, 24. I can be squeezed. The wafers are roughly cleaned by the brush rollers 20 and 21. During this brushing the ultrasonic transmitter is activated, which enhances the cleaning action. The rotation speed of the brush rollers 20, 21 and the pressure rollers 22, 24 is reduced at the end of cleaning, whereby the wafer 8 is lowered again into the receiving section 7. The brush rollers 20, 21 and the pressure rollers 22, 24 are moved away from the wafer 8, and the cover 14 of the brush cleaning device 10 is opened. A second handler 60 moves over the first brush cleaning device 10 and grasps the wafer 8 and transports it into the second brush cleaning device 11, where the wafer 8 is placed on a support. In the brush tank 11, the cleaning process of the first brush tank 10 is substantially repeated, this time without using ultrasonic waves and the water in the processing tank also does not overflow.

After the cleaning in the second brush cleaning device 11, the wafer
Is transported over the collection tank 30 and loaded into the receiving device therein. The preceding process is repeated each time with a new wafer until all the places in the collecting tank 30 are occupied.

When all the places in the collecting tank 30 are occupied, the wet transfer hood 65 is moved onto the collecting tank 30 and all the wafers 8 are lifted together from the collecting tank 30 into the wet transferring hood 65 and Locked. When the wafer 8 is locked in the wet transfer hood 65, the hood moves onto the finishing cleaning device 35. The lifting device 37 in the processing tank 36 is moved upward to receive the wafer 8 received in the wet transfer hood 65. Next, the wet transfer hood 65
Is unlocked and the wafer 8 is brought together via the lifting device 37, for example D
It is lowered into a processing tank 36 which is filled with a processing fluid such as I water.
A cleaning liquid is ejected between the wafers 8 from a nozzle 38 at the tank bottom. The DI water in the vessel is displaced upwards in this case and is discharged via an overflow. The ultrasonic transmitter is activated for a specific processing time. The cleaning liquid is then drained down by a quick dump valve (quick dump) 39 and the container is again filled with DI water from below. The dry transfer hood 70 is a processing tank 36
A gas mixture, such as, for example, N2 / IPA, is moved over and through a hood 70 is introduced as a layer onto the surface of the DI water. Next, the wafer 8 is moved together with the lifting device 37.
The dry transfer is performed from the DI water and lifted into the hood 70. When the wafer 8 is in the dry transfer hood 70, the hood locking mechanism 72 is operated, and the wafer 8 is held.

Next, the dry transfer hood 70 moves onto the transfer station 40 and places the wafer 8 on the wafer support of the transfer station 40 by opening the locking mechanism 72. From the transfer station, the wafer 8 is taken out by an external dry robot.

The invention has been described by way of a special embodiment. The invention is not, however, limited to this particular embodiment. For example, it would be conceivable to use only one brush cleaning device instead of the two brush cleaning devices 10, 11 and to perform single-stage or even multi-stage coarse cleaning in that case. It is also conceivable to remove the receiving tank 9 and to transport the wafers directly from the loading area 5 into the first brush tank 10 by the handling device 50.
This of course assumes extremely accurate timing. This is because the wafer must not stay in the acceptable range too long. Otherwise, the liquid on the wafer may dry out. Furthermore, it is also possible to load the wafer directly into the receiving tank 9 by an external robot and the handler 50 simply transports the wafer from the receiving and collecting tank 9 into the brush cleaning device 10.

[Brief description of the drawings]

FIG. 1 shows a perspective view of a cleaning device for a substrate according to the present invention.

FIG. 2 shows a plan view of the cleaning device according to FIG. 1;

FIGS. 3 (a) and (b) show a longitudinal section of a first module of the cleaning device according to FIG. 1 and a cross section of a brush cleaning device of the first module.

FIG. 4 shows a schematic sectional view of a finish cleaning device.

[Explanation of symbols]

1 cleaning device, 2 first module, 3 second module,
4 transfer device, 5 wafer input range, receiving range, 7 receiving and holding element, 8 wafer, semiconductor wafer, 9 receiving tank, storage and collection tank, 10 first brush cleaning device, 11 second brush cleaning device, brush Tank, 14 cover, 15 processing tank, 16 processing liquid, 17 wafer receiving element, support, 20 brush roller, 21
Brush roller, 22 pressure roller, 24 pressure roller, 30 storage and collection tank, 35 finish cleaning device, 36 processing tank, 37
Lifting device, 38 inlet nozzle, 39 outlet, 40 delivery station, delivery unit, 50 handling device, 51 gripper device, 52 coupling element, 55 vertical stay, 56 horizontal stay, 57 horizontal stay, 60 handling device, 65 wet transfer hood, 70 dry transfer hood, cover, 71 guide, 72 locking element, locking mechanism, 75 gas supply unit

──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 3B201 AA03 AB24 AB33 AB42 BA02 BA14 BB04 BB83 BB92 CA01 CC01 CC11 CC12

Claims (36)

[Claims] 1. A method for cleaning substrates (8), comprising: a) each of the substrates (8) individually having at least one coarse cleaning device (10);
, 11) wet pre-cleaning; b) the substrate (8) is then wetted with a collection tank (
C) collect the substrates (8) in a collecting tank (30); d) combine the substrates (8) together in one batch when a certain number is reached in the collecting container (30). E) wet-cleaning the batch of substrates (8) in the finish cleaning device (35), and f) drying the batch, and then drying the batch. How to clean. 2. The method according to claim 1, wherein the substrate is pre-cleaned with at least one brush and at least one processing liquid. 3. The method according to claim 2, wherein the at least one brush is rotated for pre-cleaning the substrate. 4. The method according to claim 1, wherein the substrate is rotated during pre-cleaning. 5. The method as claimed in claim 1, wherein the substrate is irradiated megasonically during the pre-cleaning. 6. The substrate (8) is cleaned by two different coarse cleaning devices (10, 1).
The first rough cleaning device (10) is pre-cleaned in 1) and wet in a wet state.
6. The method according to claim 1, wherein the first cleaning device is transported to a second coarse cleaning device. 7. The method according to claim 1, wherein the substrate is maintained in substantially the same orientation during the method steps. 8. The method according to claim 7, wherein the substrate is kept substantially vertical. 9. The method according to claim 1, wherein the substrate is exposed to at least one cleaning liquid and / or a cleaning liquid during the final cleaning. 10. The method according to claim 9, wherein the substrate is completely immersed in the cleaning liquid and / or the cleaning liquid. 11. The method according to claim 9, wherein the substrate is washed with a cleaning liquid and / or a cleaning liquid. 12. Emitting the substrate (8) megasonic.
A method according to any one of claims 9 to 11. 13. The method according to claim 9, wherein the substrate is moved out of the cleaning liquid and / or the cleaning liquid for drying after the final cleaning. 14. The method according to claim 13, wherein the substrate is introduced into a dry transfer hood and locked therein. 15. Introducing the fluid into the drying area before and / or during the movement of the substrate (8) out of the cleaning liquid and / or the cleaning liquid.
The method according to claim 13. 16. The method according to claim 15, wherein the fluid is introduced into a dry transfer hood (70). 17. The method according to claim 15, wherein the fluid is a gas mixture of nitrogen and isopropyl alcohol. 18. An apparatus for wet cleaning a substrate (8), comprising: at least one individual substrate rough cleaning apparatus (10, 11) with a liquid supply and a processing vessel (15); At least one collection tank (30) capable of being filled with a processing liquid for receiving a plurality of substrates (8); one batch finish cleaning device (35) with a fluid container (36); and the substrates (8). And a collecting tank (30).
) As well as the collecting tank (30) and the batch-type finishing cleaning device (35)
An apparatus for wet cleaning a substrate, the apparatus comprising at least one transport device (4) for transporting between substrates. 19. The apparatus according to claim 18, wherein the individual substrate coarse cleaning device has at least one brush. 20. The device according to claim 19, wherein the at least one brush is rotatable for cleaning the substrate. 21. An individual substrate rough cleaning device (10, 11) having at least one rotatable pressure roller (22, 24). Item. 22. Apparatus according to claim 18, wherein the individual substrate coarse cleaning device has at least one ultrasonic transmitter. 23. The apparatus according to claim 18, wherein the individual substrate coarse cleaning device has two processing tanks each having at least one liquid supply. An apparatus according to claim 1. 24. The apparatus according to claim 23, wherein at least one brush is provided in each of the tanks. 25. An individual substrate rough cleaning device (10, 11), a collecting tank (30), a batch type finish cleaning device (35), and a transfer device (4).
Device according to one of the claims 18 to 24, characterized in that it has holding means in each case for holding the substrates (8) in substantially the same orientation. 26. The device according to claim 25, wherein each holding device keeps the substrate (8) substantially vertical. 27. The batch finishing cleaning device (35) has at least one inlet (38) for cleaning liquid and / or cleaning liquid. An apparatus according to claim 1. 28. A batch finishing cleaning device (35) comprising at least one
28. The device according to claim 18, comprising two ultrasonic transmitters. 29. The method according to claim 18, wherein the batch-type cleaning device comprises a lifting device for the substrate. apparatus. 30. A transport device (4) comprising holding means (71, 7) for a substrate (8).
2. A dry transfer hood (70) provided with (2).
30. The apparatus according to any one of items 8 to 29. 31. A dry transfer hood (70) comprising means (75) for introducing a fluid into a dry area above a surface of a liquid in a fluid container (36). 31. The device of claim 30. 32. The transport device (4) has a wet transfer hood (65) for transporting a batch of substrates (8) from a collecting tank (30) to a batch finishing cleaning device (35). The device according to any one of claims 18 to 31, characterized in that: 33. The cleaning device according to claim 18, wherein the individual substrate rough cleaning devices (10, 11), the receiving and collecting tanks (30) and the batch finishing cleaning device (35) are arranged in a row. 33. The apparatus according to any one of the preceding claims. 34. Apparatus according to claim 18, characterized in that a dosing area (5) with a receiving part (7) is provided. 35. Apparatus according to claim 18, wherein an inlet tank (9) capable of being filled with a liquid is provided. 36. A rough cleaning device (10, 11) for individual substrates, a collecting tank (30), a batch type finishing cleaning device (35), an inlet area (5) and an inlet tank (9) are arranged in a line. 34. The method according to claim 34, wherein
An apparatus according to claim 5.