TWI415533B - Apparatus and method for wet process - Google Patents

Abstract

A wet process apparatus includes a first wet process unit, a second wet process unit, a washing unit, a receiving tank, and a board distributing unit. The washing unit includes a guiding transport and a washing liquid spray mechanism opposite to the guiding transport. The guiding transport is configured for transporting a substrate processed by the first wet process unit to the receiving tank. The washing liquid spray mechanism is used for spraying washing liquid to the substrate transported by the guiding transport. The receiving tank is filled with preservation solution, and is adapted for making the substrate transported by the guiding transport immerged in it. The board distributing unit is opposite to the receiving tank and is adapted for sucking the substrate immerged in the preservation solution and distributing it to the second wet process unit. A method for wet processing a substrate is also provided.

Description

Wet processing device and wet processing method

The present invention relates to the field of circuit board manufacturing technology, and in particular, to a wet processing apparatus and a wet processing method.

With the advancement of science and technology, printed circuit boards are widely used in the field of digital products. For application of the circuit board, please refer to the literature Takahashi, A.Ooki, N.Nagai, A.Akahoshi, H.Mukoh, A.Wajima,M.Res.Lab,High density multilayer printed circuit board for HITAC M-880,IEEE Trans .on Components, Packaging, and Manufacturing Technology, 1992, 15(4): 418-425.

Wet Process (Wet Process) is a commonly used circuit board manufacturing process. It is sprayed or sprayed on the surface of a circuit board by using a chemical solution such as various chemical liquids or water to plate through holes, copper plating, etching, and the like. Development, stripping, plating of organic protective film, surface modification or cleaning. During the production process, the circuit board is sequentially fed into a plurality of different wet process units for processing. For example, after the development process is completed on the development line, it is sent to the etching line for etching. In order to prevent the copper layer of the circuit board from being oxidized by air during the process of sending to the etching line, usually after the developing line is sprayed with the developer and pure water on the surface of the board, It is subjected to cold air, hot air and cold air in order to perform drying. The board is collected by the central positioning machine and the take-up machine, and then transported to the etching line. On the etching line, water washing was performed again. In this way, not only the process of washing, drying and re-washing will cause waste of resources, but the process of drying may also cause changes in the size of the circuit board, which is not conducive to improving product quality.

In view of this, it is necessary to provide a wet processing device and a wet processing method to save resources and improve the quality of circuit board products.

A wet processing apparatus for wet processing a substrate. The wet processing apparatus includes a first wet processing unit, a second wet processing unit, a cleaning unit, a take-up slot, and a board unit. The cleaning unit, the take-up slot and the release unit are both located between the first wet processing unit and the second wet processing unit. The first wet processing unit is configured to perform a first wet processing on the substrate, and has a first storage tank for storing the first wet processing liquid. The second wet processing unit is configured to perform a second wet processing on the substrate, and has a second storage tank for storing the second wet processing liquid. The cleaning unit is configured to clean the substrate, and includes a guiding conveying mechanism and a cleaning liquid spraying mechanism. The guiding conveyance mechanism is configured to transfer the substrate processed by the first wet processing unit to the take-up slot. The guiding and conveying mechanism includes an adjacent conveying portion and a lower plate portion, the conveying portion is opposite to the cleaning liquid spraying mechanism, the receiving groove is adjacent to the lower plate portion, and the conveying direction of the lower plate portion is The transmission direction of the transmission portion is at an acute angle, and is inclined toward a receiving slot so that the substrate transmitted from the transmitting portion to the lower plate portion falls into the receiving slot, and the transmitting portion and the lower portion each include a plurality of bearers. Transfer roller and a plurality of pressing transfer rollers, The plurality of carrier carrying rollers are disposed opposite to the plurality of pressing transport rollers for transporting the substrate between the plurality of carrying transport rollers and the plurality of pressing transport rollers. The cleaning liquid spray mechanism is opposite to the guide conveyance mechanism and is configured to spray the cleaning liquid onto the substrate conveyed by the guide conveyance mechanism. The receiving tank contains a preserving liquid for immersing the substrate conveyed by the guiding conveying mechanism. The release unit is opposite to the take-up slot for drawing a substrate from the storage solution of the take-up slot, and placing the substrate in the second wet processing unit for performing a second wet process.

A wet processing method using the wet processing apparatus as described above, comprising the steps of: providing a substrate; feeding the substrate to the first wet processing unit for performing a first wet processing; after being processed by the first wet processing unit The substrate is placed in the cleaning unit, and the cleaning liquid spraying mechanism sprays the cleaning liquid on the substrate conveyed by the guiding and conveying mechanism to clean the substrate, and the cleaned substrate falls into the receiving groove; The substrate is taken up from the storage solution of the take-up groove by the release unit, and the substrate is placed in the second wet processing unit to perform a second wet processing on the substrate.

The wet processing device of the technical solution temporarily stores the substrate cleaned by the cleaning unit by using a receiving tank containing the preservation liquid, thereby avoiding scratching of the substrate due to friction or collision, and avoiding the relationship between the plurality of substrates on the other hand. Adhesive and stick together. In addition, the drying process after cleaning can be omitted to avoid deformation of the substrate. The substrate in the tray is sent to the second wet processing unit for processing without being cleaned. The wet processing method using the wet processing apparatus as described above can reduce the number of processing steps, save a lot of resources, and contribute to improvement of product quality.

10‧‧‧ Wet treatment device

11‧‧‧First Wet Processing Unit

110‧‧‧First transmission agency

111‧‧‧First storage tank

112‧‧‧First sprinkler

113‧‧‧First carrying conveyor roller

114‧‧‧First press transfer roller

115‧‧‧First nozzle

12‧‧‧cleaning unit

120‧‧‧Guided transport agency

121‧‧‧cleaning fluid storage tank

122‧‧‧Clean liquid spraying mechanism

123‧‧‧ Carrying conveyor wheel

124‧‧‧Repression transfer roller

125‧‧‧Transportation Department

126‧‧‧ Lower Board

127‧‧‧cleaning liquid spray head

13‧‧‧Receiving slot

130‧‧‧Preservation solution

131‧‧‧ side wall

132‧‧‧ bottom wall

133‧‧‧ quick release

14‧‧‧Plate unit

140‧‧‧ moving arm

141‧‧‧mounting frame

142‧‧‧Sucker

143‧‧‧First mounting rod

144‧‧‧ Connecting rod

145‧‧‧Second mounting rod

15‧‧‧Second wet processing unit

150‧‧‧Second transport agency

151‧‧‧Second storage tank

152‧‧‧Second sprinkler

153‧‧‧Second load carrying roller

154‧‧‧Second press transfer roller

155‧‧‧second nozzle

100‧‧‧Substrate

FIG. 1 is a schematic structural view of a wet processing apparatus provided by an embodiment of the present technical solution.

2 is a schematic structural view of a receiving groove and a plate discharging unit of the wet processing device provided by the embodiment of the present technical solution.

FIG. 3 is a schematic structural view of a substrate processed by using the wet processing apparatus provided in the embodiment of the present technical solution.

FIG. 4 is a schematic structural view of a substrate for picking up a board of a wet processing apparatus according to an embodiment of the present technical solution.

The wet processing apparatus and the wet processing method provided by the present technical solution will be described in detail below with reference to the accompanying drawings and embodiments.

Referring to FIG. 1 and FIG. 2 together, the embodiment of the present invention provides a wet processing apparatus 10 for performing wet processing on a substrate. The wet processing apparatus 10 includes a first wet processing unit 11, a cleaning unit 12, a take-up tank 13, a decking unit 14, and a second wet processing unit 15. The cleaning unit 12, the receiving groove 13 and the placing plate unit 14 are both located between the first wet processing unit 11 and the second wet processing unit 15.

The first wet processing unit 11 is configured to perform a first wet processing on the substrate. The first wet processing unit 11 includes a first conveying mechanism 110, a first storage tank 111, and a first shower mechanism 112. The first conveying mechanism 110 is located between the first storage tank 111 and the first shower mechanism 112 and is used for conveying the substrate to the cleaning unit 12 . The first storage tank 111 is configured to store the first wet processing liquid. The first shower mechanism 112 is in communication with the first storage slot 111 for the first conveying mechanism 110 transmits the substrate to spray the first wet processing liquid. The first conveying mechanism 110 includes a plurality of first carrier conveying rollers 113 and a plurality of first pressing conveying rollers 114. The plurality of first carrier transfer rollers 113 are disposed side by side and are both adjacent to the first storage tank 111. The plurality of first pressing conveyance rollers 114 are disposed side by side and are both adjacent to the first shower mechanism 112. The plurality of first carrier conveying rollers 113 are all rotated about a central axis thereof in a first direction, and the plurality of first pressing conveying rollers 114 are all rotated about a central axis thereof in a second direction opposite to the first direction, thereby driving The substrate is moved between the plurality of first carrier transfer rollers 113 and the plurality of first pressure conveyance rollers 114. The first shower mechanism 112 includes a plurality of first showerheads 115. The plurality of first showerheads 115 are opposite to the plurality of first press transport rollers 114. Of course, the plurality of first showerheads 115 can also be distributed on both sides of the first transport mechanism 110, so that the two surfaces of the substrate can be simultaneously processed. In this embodiment, the first wet processing unit 11 is a developing unit, and the first storage tank 111 stores a developing solution. After the developing liquid is sprayed from the first spraying mechanism 112 to the substrate, the developing solution may flow back to the The first storage tank 111 is inside. Preferably, the first wet processing unit 11 further includes a first wet processing liquid regulator (not shown), and the first wet processing liquid regulator is configured to monitor the first wetness in the first storage tank 111. The concentration of the treatment liquid is adjusted and adjusted when the concentration is lower than a predetermined value.

Of course, the first wet processing unit 11 may also perform the first wet processing on the substrate by means of immersion. Thus, the first wet processing unit 11 may not have a shower mechanism, and only the substrate needs to be placed in the first storage tank. In the 111, the first wet processing liquid is immersed in the substrate to perform the first wet processing on the substrate.

The cleaning unit 12 is disposed adjacent to the first wet processing unit 11, and the cleaning unit 12 is configured to clean the substrate to remove the first wet processing liquid remaining on the substrate. The cleaning unit 12 includes a guiding conveying mechanism 120, a cleaning liquid storage tank 121, and a cleaning liquid spraying mechanism 122. The guiding and conveying mechanism 120 is connected to one end of the first conveying mechanism 110 and located between the cleaning liquid storage tank 121 and the cleaning liquid spraying mechanism 122. The guiding conveyance mechanism 120 is configured to transfer the substrate processed by the first wet processing unit 11 to the take-up slot 13 . The cleaning liquid storage tank 121 is used to store the first wet processing liquid. The cleaning liquid spray mechanism 122 is in communication with the cleaning liquid storage tank 121 for spraying the cleaning liquid onto the substrate conveyed by the guiding conveyance mechanism 120. The guide transport mechanism 120 includes a plurality of carrier transport rollers 123 and a plurality of press transport rollers 124. The plurality of load carrying rollers 123 are all adjacent to the cleaning liquid storage tank 121. The plurality of carrier carrying rollers 123 are disposed side by side and adjacent to the plurality of first carrier transport rollers 113 of the first transport mechanism 110. The plurality of pressing conveyance rollers 124 are all adjacent to the cleaning liquid spraying mechanism 122. The plurality of pressing conveyance rollers 124 are arranged side by side, and a plurality of first pressing conveyance rollers 114 of the first conveying mechanism 110 are adjacent to each other. The plurality of carrier carrying rollers 123 are all rotated about a central axis thereof in a first direction, and the plurality of pressing transport rollers 124 are all rotated about a central axis thereof in a second direction opposite to the first direction, thereby driving the plurality of The base carries the substrate movement between the transfer roller 123 and the plurality of press transfer rollers 124. The guide transport mechanism 120 includes an adjacent transport portion 125 and a lower plate portion 126. The transfer portion 125 is adjacent to the first transfer mechanism 110 of the first wet processing unit 11 and is opposed to the cleaning liquid shower mechanism 122. The substrate receives the shower of the cleaning liquid mainly at the transfer portion 125. The receiving slot 13 is close to the lower Plate portion 126. The conveying direction of the lower plate portion 126 is at an acute angle to the conveying direction of the conveying portion 125, and is inclined toward the closing groove 13, so that the substrate transferred from the conveying portion 125 to the lower plate portion 126 falls into the closing plate. Slot 13. In this embodiment, the included angle is about 30 degrees. The cleaning liquid spray mechanism 122 includes a plurality of cleaning liquid spray heads 127. The plurality of cleaning liquid spray heads 127 are opposite to the plurality of pressing transfer rollers 124. Of course, the plurality of cleaning liquid nozzles 127 can also be distributed on both sides of the guiding and conveying mechanism 120, so that the two surfaces of the substrate can be simultaneously processed. In this embodiment, the cleaning liquid stored in the cleaning liquid storage tank 121 is pure water.

The receiving groove 13 contains a holding liquid 130 for immersing the substrate transferred from the guiding and conveying mechanism 120. The take-up slot 13 is located at one end of the guide transport mechanism 120 such that the substrate transported by the guide transport mechanism 120 falls into the take-up slot 13. The take-up slot 13 is adjacent to the lower plate portion 126 of the guide transport mechanism 120. The receiving groove 13 is a rectangular parallelepiped groove whose one end is not sealed, and includes a connecting side wall 131 and a bottom wall 132. The closing groove 13 is provided with a quick release plug 133 at the side wall 131 near the bottom wall 132 for cleaning or replacing the preservation liquid. Of course, the receiving groove 13 is not limited to a rectangular parallelepiped shape, and may also be a cylindrical shape, a plurality of prisms or other irregular shapes. It only needs to have a cross section slightly larger than the cross section of the substrate. Preferably, the receiving groove 13 is made of a transparent material. In this embodiment, the preservation solution 130 is pure water.

The board unit 14 is opposite to the receiving slot 13 for taking in a substrate from the storage solution 130 of the receiving slot 13 and placing the substrate in the second wet processing unit 15 for performing a second wet processing. The board unit 14 is adjacent to the second wet processing Unit 15 is set. The board unit 14 includes a moving arm 140, a mounting bracket 141 and a plurality of suction cups 142. The mounting bracket 141 is coupled to the moving arm 140. The plurality of suction cups 142 are mounted to the mounting bracket 141. The moving arm 140 can be mechanically coupled to a driver (not shown) so as to be movable under the driving of the driver. The moving arm 140 is used to drive the mounting bracket 141 to move. The mounting bracket 141 includes a first mounting rod 143, a connecting rod 144 and a second mounting rod 145. The connecting rod 144 is coupled to the moving arm 140. The first mounting rod 143 and the second mounting rod 145 are respectively connected to opposite ends of the connecting rod 144. The plurality of suction cups 142 are mounted on the first mounting rod 143 and the second mounting rod 145 at a distance from each other for absorbing the substrate by the moving arm 140. The plurality of suction cups 142 can be connected to a pump (not shown) by a liquid pipe (not shown). The suction and release of the substrate is achieved by controlling the pump to control the action of extracting the holding solution of the suction cup 142 and releasing the preservation liquid. In this embodiment, the number of the suction cups 142 is four. Two suction cups 142 are respectively mounted on the first mounting rod 143 and the second mounting rod 145.

The second wet processing unit 15 includes a second conveying mechanism 150, a second storage tank 151, and a second shower mechanism 152. The second transport mechanism 150 is located between the second storage tank 151 and the second shower mechanism 152 and is configured to transport the substrate on which the board unit 14 is placed. The second storage tank 151 is configured to store the second processing liquid. The second shower mechanism 152 is connected to the second storage tank 151, opposite to the second transport mechanism 150, and the substrate for transporting to the second transport mechanism 150 sprays the second wet processing liquid. The second conveying mechanism 150 includes a plurality of second carrier conveying rollers 153 and a plurality of second pressing conveying rollers 154. The plurality of second bearers transmit The rollers 153 are arranged side by side and are both adjacent to the second storage tank 151. The plurality of second pressing conveyance rollers 154 are disposed side by side and are both adjacent to the second shower mechanism 152. The plurality of second carrier conveying rollers 153 are all rotated about a central axis thereof in a first direction, and the plurality of second pressing conveying rollers 154 are all rotated about a central axis thereof in a second direction opposite to the first direction, thereby driving The substrate is moved between the plurality of second carrier transport rollers 153 and the plurality of second press transport rollers 154. The second shower mechanism 152 includes a plurality of second showerheads 155. The plurality of second nozzles 155 are distributed on one side of the second conveying mechanism 150 near the plurality of second pressing conveying rollers 154, that is, opposite to the plurality of second pressing conveying rollers 154. Of course, the plurality of second nozzles 155 can also be distributed on both sides of the second conveying mechanism 150, so that the two surfaces of the substrate can be processed simultaneously. In this embodiment, the second wet processing unit 15 is an etching unit, and the second storage tank 151 stores an etching liquid. After the etching liquid is sprayed from the second spraying mechanism 152 to the substrate, the etching liquid may flow back to the The second storage tank 151 is inside. Preferably, the second wet processing unit 15 further includes a second treatment liquid regulator (not shown), so that the components of the second treatment liquid in the second storage tank 151 can be immediately supplementally adjusted.

Of course, the second wet processing unit 15 can also perform the first wet processing on the substrate by using the soaking method. Thus, the second wet processing unit 15 can have no spraying mechanism, and only the substrate needs to be placed in the second storage tank. In 151, the substrate is subjected to a second wet treatment by immersing the second wet processing liquid in the substrate.

It can be understood that, in the actual production process, the cleaning unit 12 and the second wet processing unit 15 may not be in end-to-end due to space constraints. At this time, A plurality of receiving slots 13 are provided to move the receiving tray 13 of the filled substrate to the second wet processing unit 15, and the substrate is fed to the second wet processing unit 15 for processing. On the lower plate portion 126 of the cleaning unit 12, a receiving groove 13 containing the holding liquid 130 and no substrate is placed to receive and immerse the substrate cleaned by the cleaning unit 12.

Referring to FIG. 1, FIG. 3 and FIG. 4 together, the wet processing method using the wet processing apparatus 10 as described above may include the following steps:

First, the substrate 100 is provided. In this embodiment, the substrate 100 is a square circuit board substrate. Before entering the wet processing device 10, a photoresist layer can be formed on the surface thereof and exposed.

Next, the substrate 100 is sent to the first wet processing unit 11 for the first wet processing. The substrate 100 is transported under the friction of the first transport mechanism 110. The plurality of first showerheads 115 of the first shower mechanism 112 spray the first wet processing liquid, that is, the developer liquid, toward the surface of the substrate 100 near the plurality of first pressing transport rollers 114. The photoresist layer on the surface of the substrate 100 is partially dissolved.

The substrate 100 processed by the first wet processing unit 11 is placed in the cleaning unit 12, and the cleaning liquid spraying mechanism 122 sprays the cleaning liquid on the substrate 100 conveyed by the guiding and conveying mechanism 120. The cleaning is performed, and the cleaned substrate 100 is dropped into the receiving groove 13. In this embodiment, since the guiding and conveying mechanism 120 is connected to one end of the first conveying mechanism 110, the substrate 100 processed by the first wet processing unit 11 is directly transferred to the guiding and conveying mechanism 120 of the cleaning unit 12. When the substrate 100 is transferred from the transport portion 125 to the lower plate portion After the 126, since the transmission direction of the lower plate portion 126 is at an acute angle to the transmission direction of the transmission portion 125 and is inclined toward the receiving groove 13, the substrate 100 is inclined to fall into the receiving groove 13, and gradually descends. sink. Substrate 100 that subsequently falls into the tray slot 13 is sequentially stacked above the previous substrate 100. Since the holding liquid 130 is contained in the receiving groove 13, the substrate 100 is not scratched by friction or collision, and the plurality of substrates 100 are not adhered by static electricity.

Finally, the substrate 100 is taken up from the storage solution 130 of the receiving slot 13 by the panel unit 14, and the substrate 100 is placed in the second wet processing unit 15 to perform second wet on the substrate 100. deal with. The moving arm 140 drives the mounting bracket 141 and the plurality of suction cups 142 into the receiving groove 13 . Each of the chucks 142 is opposed to a top corner of the substrate 100. The pump is activated, and the preservative solution 130 between each of the chucks 142 and the substrate 100 is sucked away, thereby forming a negative pressure on the surface of the substrate 100 near the chuck 142, so that the substrate 100 is attracted by the plurality of chucks 142. The plurality of suction cups 142 are separated from the receiving groove 13 by the moving arm 140, and after the substrate 100 is carried on the plurality of second carrying conveying rollers 153 of the second conveying mechanism 150, the substrate is adjusted by adjusting the pump. 100 is detached from the plurality of suction cups 142. When the substrate 100 is subjected to wet processing by the second wet processing unit 15, the plurality of second heads 155 spray a second processing liquid, that is, an etching liquid, onto the surface of the substrate 100. A portion of the conductive copper layer exposed to the photoresist layer of the substrate 100 is chemically reacted with the etching solution to be etched away.

It can be understood that if the distance between the second wet processing unit 15 and the cleaning unit 12 is large, before the step, the closing groove 13 can be moved to the vicinity of the second wet processing unit 15.

The wet processing apparatus 10 provided by the technical solution is immersed in the substrate 100 cleaned by the cleaning unit 12 by using the receiving tank 13 containing the preserving liquid 130, thereby preventing the substrate 100 from being scratched by friction or collision on the other hand. It is also possible to prevent the plurality of substrates 100 from sticking together due to electrostatic action. In addition, the drying process after cleaning can be omitted to avoid deformation of the substrate 100. The substrate 100 in the tray 13 can be sent to the second wet processing unit 15 for processing without being cleaned. The wet processing method using the wet processing apparatus 10 as described above can reduce the number of processing steps, save a lot of resources, and contribute to improvement in product quality.

In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

10‧‧‧ Wet treatment device

11‧‧‧First Wet Processing Unit

110‧‧‧First transmission agency

111‧‧‧First storage tank

112‧‧‧First sprinkler

113‧‧‧First carrying conveyor roller

114‧‧‧First press transfer roller

115‧‧‧First nozzle

12‧‧‧cleaning unit

120‧‧‧Guided transport agency

121‧‧‧cleaning fluid storage tank

122‧‧‧Clean liquid spraying mechanism

123‧‧‧ Carrying conveyor wheel

124‧‧‧Repression transfer roller

125‧‧‧Transportation Department

126‧‧‧ Lower Board

127‧‧‧cleaning liquid spray head

13‧‧‧Receiving slot

130‧‧‧Preservation solution

131‧‧‧ side wall

132‧‧‧ bottom wall

133‧‧‧ quick release

14‧‧‧Plate unit

140‧‧‧ moving arm

141‧‧‧mounting frame

142‧‧‧Sucker

15‧‧‧Second wet processing unit

150‧‧‧Second transport agency

151‧‧‧Second storage tank

152‧‧‧Second sprinkler

153‧‧‧Second load carrying roller

154‧‧‧Second press transfer roller

155‧‧‧second nozzle

Claims (9)

A wet processing apparatus for wet processing a substrate, the wet processing apparatus comprising a first wet processing unit, a second wet processing unit, a cleaning unit, a take-up slot and a board unit; the cleaning unit and the receiving slot And the board unit are located between the first wet processing unit and the second wet processing unit; the first wet processing unit is configured to perform a first wet processing on the substrate; and the second wet processing unit is used to the opposite substrate Performing a second wet processing; the cleaning unit is adjacent to the first wet processing unit for cleaning the substrate, the cleaning unit includes a guiding conveying mechanism and a cleaning liquid spraying mechanism, and the guiding conveying mechanism is configured to The substrate processed by the first wet processing unit is transferred to a take-up slot, and the guide transport mechanism includes an adjacent transport portion and a lower plate portion, the transport portion is opposite to the cleaning liquid spray mechanism, and the take-up slot is close to the In the lower plate portion, the conveying direction of the lower plate portion is at an acute angle to the conveying direction of the conveying portion, and is inclined toward the closing groove so that the substrate transferred from the conveying portion to the lower plate portion falls into the closing plate Slot The conveying portion and the lower plate portion each include a plurality of carrying conveying rollers and a plurality of pressing conveying rollers, and the plurality of carrying conveying rollers are disposed opposite to the plurality of pressing conveying rollers for conveying the plurality of carrying conveying rollers and the plurality of pressing conveyings a substrate between the rollers, the cleaning liquid spraying mechanism is opposite to the guiding conveying mechanism, and is used for spraying the cleaning liquid to the substrate conveyed by the guiding conveying mechanism; the receiving groove is located at the cleaning unit and the second wet processing Between the units, the receiving tank contains a holding liquid for immersing the substrate conveyed by the guiding conveying mechanism; the releasing unit is opposite to the receiving groove for sucking the substrate from the holding liquid of the receiving groove And The substrate is placed in the second wet processing unit for a second wet processing. The wet processing apparatus according to claim 1, wherein the cleaning unit further comprises a cleaning liquid storage tank for storing the cleaning liquid, and the cleaning liquid spraying mechanism is connected to the cleaning liquid storage tank, The guiding conveying mechanism is located between the cleaning liquid storage tank and the cleaning liquid spraying mechanism, the plurality of carrying conveying rollers are arranged side by side, and both are close to the cleaning liquid storage tank, and the plurality of pressing conveying rollers They are arranged side by side and are close to the cleaning liquid spraying mechanism. The wet processing apparatus of claim 1, wherein the first wet processing unit comprises a first conveying mechanism, a first spraying mechanism, and a first storage tank for storing the first wet processing liquid, a first conveying mechanism connected to one end of the guiding conveying mechanism for conveying the substrate to the guiding conveying mechanism, the first conveying mechanism being located between the first storage tank and the first spraying mechanism, the first A spraying mechanism is in communication with the first storage tank, and the substrate for conveying the first conveying mechanism ejects the first wet processing liquid. The wet processing apparatus of claim 3, wherein the first conveying mechanism comprises a plurality of first carrier conveying rollers and a plurality of first pressing conveying rollers, the plurality of first carrier conveying rollers being close to each other The first storage tank, the plurality of first carrier conveying rollers are arranged side by side, and adjacent to the plurality of carrier conveying rollers of the guiding conveying mechanism, the plurality of first pressing conveying rollers are all close to the first a spraying mechanism, the plurality of first pressing conveying rollers are arranged side by side, and adjacent to the plurality of pressing conveying rollers of the guiding conveying mechanism, the plurality of first carrying conveying rollers are opposite to the plurality of first pressing conveying rollers Setting for transmitting a plurality of first carrier transfer rollers and a plurality of first suppression passes The substrate between the rollers. The wet processing apparatus of claim 3, wherein the first wet processing unit further comprises a first wet processing liquid regulator, wherein the first wet processing liquid regulator is configured to monitor the first storage The concentration of the first wet treatment liquid in the tank, and the supplementary adjustment is performed when the concentration is lower than a predetermined value. The wet processing apparatus according to claim 1, wherein the second wet processing unit comprises a second conveying mechanism, a second spraying mechanism, and a second storage tank for storing the second wet processing liquid. The second conveying mechanism is located between the second storage tank and the second spraying mechanism, the second conveying mechanism is for conveying the substrate from the discharging unit, and the second spraying mechanism is connected to the second storage tank The second wet processing liquid is ejected from the substrate for conveying to the second conveying mechanism. The wet processing apparatus of claim 6, wherein the second conveying mechanism comprises a plurality of second carrier conveying rollers and a plurality of second pressing conveying rollers, and the plurality of second carrier conveying rollers are arranged side by side And both are adjacent to the second storage tank, the plurality of second pressing conveying rollers are arranged side by side, and both are adjacent to the second spraying mechanism, the plurality of second carrying conveying rollers and the plurality of second pressing conveyings The rollers are disposed oppositely for transporting the substrate between the plurality of second carrier transport rollers and the plurality of second press transport rollers. The wet processing apparatus according to claim 1, wherein the loading unit comprises a moving arm, a mounting bracket and a plurality of suction cups, the mounting bracket is coupled to the moving arm, and the moving arm is used for The mounting frame is moved, and the plurality of suction cups are mounted on the mounting frame at a distance from each other for absorbing the substrate by immersing the storage liquid under the driving of the moving arm. Wet treatment using a wet processing device as described in claim 1 The method includes the steps of: providing a substrate; feeding the substrate to the first wet processing unit to perform a first wet processing; and transferring the substrate processed by the first wet processing unit by using a guiding transport mechanism to cause the cleaning The liquid spraying mechanism sprays the cleaning liquid on the substrate conveyed by the guiding and conveying mechanism to clean the substrate, and causes the cleaned substrate to fall into the receiving groove; and the discharging unit is from the receiving groove The substrate is taken up in the preservation solution, and the substrate is placed in the second wet processing unit to perform a second wet treatment on the substrate.