JP2002226801A - Adhesive sheet, method for using the same, and semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an adhesive sheet capable of being used as a dicing tape in a dicing step and as an adhesive having excellent connection reliability in a step for joining a semiconductor element and a supporting member, having heat resistance and moisture resistance required when mounting the semiconductor element having a large difference in thermal expansion coefficient on the supporting member for mounting the semiconductor element, and capable of providing excellent operability. SOLUTION: This thermally polymerizable and radioactive ray-polymerizable adhesive sheet has a sticky adhesive layer comprising (A) an epoxy resin and a curing agent of the epoxy resin, (B) a high-molecular component containing a functional group and having >=100,000 weight average molecular weight, and (C) radioactive ray-polymerizable compounds comprising (a) diols, (b) an isocyanate compound represented by general formula (I) and (c) a compound represented by general formula (II).

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an adhesive sheet, a method for using the same, and a semiconductor device.

[0002]

2. Description of the Related Art Conventionally, silver paste has been mainly used for joining a semiconductor element and a support member. However, with the recent miniaturization and high performance of semiconductor elements, the size of the support member used has been reduced.・ Miniaturization is required. In response to the demand, the silver paste has problems such as a problem at the time of wire bonding due to protrusion or inclination of the semiconductor element, difficulty in controlling the thickness of the adhesive layer, and generation of voids in the adhesive layer. To solve these problems,
In recent years, film-like adhesives have been used. The film-like adhesive is used in an individual piece bonding method or a wafer backside bonding method.

In the individual piece sticking method, a reel-shaped adhesive film is cut into individual pieces by cutting or punching, and then bonded to a support member. The semiconductor element singulated by the dicing step is joined to the support member with the adhesive film to produce a support member with the semiconductor element, and then the semiconductor element is completed through a wire bonding step, a sealing step, and the like. However, the individual sticking method requires the introduction of a dedicated assembling apparatus for cutting out the adhesive film and adhering it to the supporting member, and has a problem that the assembling cost is higher than using silver paste.

[0004] On the other hand, in the wafer backside bonding system, an adhesive film is bonded to a semiconductor wafer, bonded to a dicing tape, and singulated by a dicing process. The singulated semiconductor element with the adhesive is bonded to the support member, and the semiconductor device is completed through subsequent steps such as curing after heating and wire bonding. Since the wafer backside bonding method joins the semiconductor element with the adhesive to the support member, it is not necessary to use a device that separates the adhesive film. Use the conventional assembly device for silver paste as it is, or add a hot plate, etc. Since it can be used by partially improving it, it has attracted attention as a method of assembling the film at a relatively low cost among the assembling methods using a film adhesive.

[0005] The individualization of the semiconductor element of the wafer backside bonding method is performed in a dicing step after a dicing tape is bonded to the film adhesive side. At that time, dicing tapes used are roughly classified into pressure-sensitive type and UV type. The pressure-sensitive type is generally obtained by applying a pressure-sensitive adhesive to a vinyl chloride or polyolefin base film. This dicing tape needs to have sufficient adhesive strength so that each element is not scattered by the rotation of the dicing saw when cutting, while satisfying conflicting requirements such as low adhesive strength that does not burden each element during pickup. is there. Therefore, in the case of pressure-sensitive dicing tapes, the tolerance of adhesive strength must be reduced, and various types of adhesives that match the element size and processing conditions must be available in a wide variety of types, and many types must be stocked in order to switch between processes. Inventory management is required, and a switching operation is required for each process. Recently U
A dicing tape called V-type, which has a high adhesive strength at the time of dicing and irradiates ultraviolet rays (UV) before picking up to have a low adhesive strength to meet conflicting demands, is also widely used.

In recent years, semiconductor devices, particularly CPUs and memories, have been increasing in capacity, and as a result, semiconductor devices tend to be larger. Further, in products such as IC cards and memory cards, the memory used is becoming thinner. As these semiconductor elements become larger and thinner, the pressure-sensitive type cannot satisfy the conflicting demands of fixing force (high adhesive force) during dicing and releasability (low adhesive force) during pickup. On the other hand, in the wafer backside sticking method using the UV type, there is a problem that the film sticking step up to the dicing step must be performed twice, and the work becomes complicated.

[0007]

The invention according to claim 1 can be used as a dicing tape in a dicing step, and as an adhesive having excellent connection reliability in a joining step between a semiconductor element and a support member. An object of the present invention is to provide an adhesive sheet having heat resistance and moisture resistance necessary for mounting a semiconductor element having a large difference in thermal expansion coefficient on a mounting support member, and excellent workability. The invention described in claim 2 provides the effect of the invention described in claim 1 and provides an adhesive sheet having more excellent heat resistance. The invention described in claim 3 has the effects of the invention described in claim 1 or 2, and provides an adhesive sheet having more excellent heat resistance and moisture resistance. The invention described in claim 4 provides the effects of the inventions described in claims 1 to 3, and further provides an adhesive sheet having excellent temperature cycle test resistance. The invention described in claim 5 provides the effects of the inventions described in claims 1 to 4, and provides an adhesive sheet that is more excellent in workability. Claim 6
The described invention provides a method of using an adhesive sheet that can simplify a manufacturing process of a semiconductor device. According to a seventh aspect of the present invention, there is provided a semiconductor device having heat resistance, moisture resistance, and workability necessary for mounting a semiconductor element having a large difference in thermal expansion coefficient on a semiconductor mounting support member.

[0008]

The present invention relates to the following. (1) (A) an epoxy resin and an epoxy resin curing agent,
(B) a high molecular weight component containing a functional group and having a weight average molecular weight of 100,000 or more, (C) (a) a diol, and (b) a general formula (I)

[0009]

Embedded image (In the formula, n is an integer of 0 to ¹ , and R ¹ is a divalent or trivalent organic group having 1 to 30 carbon atoms.)

An isocyanate compound represented by the general formula (II):

[0011]

Embedded image (Wherein R ² is hydrogen or a methyl group, and R ³ is an ethylene group or a propylene group)

A thermopolymerizable and radiation-polymerizable adhesive sheet comprising a pressure-sensitive adhesive layer containing a radiation-polymerizable compound comprising the compound represented by formula (1) and a base material layer. (2) 100 parts by mass of an epoxy resin and an epoxy resin curing agent, (B) 10 to 400 parts by mass of a high molecular weight component containing a functional group and having a weight average molecular weight of 100,000 or more, ) (A) diols and (b) general formula (I)
An isocyanate compound represented by the general formula (I)
Radiation-polymerizable compound 5 comprising the compound represented by I)
The adhesive sheet according to (1), comprising 400 parts by mass. (3) The adhesive sheet according to (1) or (2), wherein the high molecular weight component having a weight average molecular weight of 100,000 or more (B) is incompatible with the epoxy resin. (4) (B) a high molecular weight component having a functional group-containing weight average molecular weight of 100,000 or more contains 0.5 to 6% by mass of glycidyl acrylate or glycidyl methacrylate;
The adhesive sheet according to claim 1, wherein the adhesive sheet is an epoxy group-containing acrylic copolymer having a weight average molecular weight of 100,000 or more. (5) The storage elastic modulus measured using a dynamic viscoelasticity measuring device at a stage after the adhesive layer is heated and cured is 10 to 2000 MPa at 25 ° C and 3 to 50 MPa at 260 ° C. The adhesive sheet according to any one of (1) to (4). (6) The adhesive sheet according to any one of (1) to (5), wherein an adhesive force between the adhesive layer and the base material is controlled by irradiating radiation. (7) (I) the step of attaching the adhesive sheet according to any one of (1) to (6) to a semiconductor wafer via a line adhesive layer, and (II) either before dicing or after dicing. Irradiating the adhesive sheet with radiation to cure the adhesive layer and peel off the substrate; (III) dicing the semiconductor wafer to obtain a semiconductor element with an adhesive layer; (IV) adhesive adhesion A method for using an adhesive sheet, comprising a step of adhering a semiconductor element with a layer and a support member for mounting the semiconductor element via the adhesive sheet. (8) A semiconductor comprising a structure in which a semiconductor element and a support member are bonded using the adhesive sheet according to any one of (1) to (6) or by the method for using the adhesive sheet according to (7). apparatus.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION The adhesive sheet of the present invention comprises (A) 100 parts by mass of an epoxy resin and an epoxy resin curing agent.
10 to 400 parts by mass of a high molecular weight component having a weight average molecular weight of 100,000 or more containing a functional group (C) (a) diols and (b) general formula (1)

[0014]

Embedded image (In the formula, n is an integer of 0 to ¹ , and R ¹ is a divalent or trivalent organic group having 1 to 30 carbon atoms.)

An isocyanate compound represented by the general formula (2):

[0016]

Embedded image (Wherein R ² is hydrogen or a methyl group, and R ³ is an ethylene group or a propylene group)

And a base material layer containing 5 to 400 parts by mass of a radiation polymerizable compound composed of the compound represented by the following formula. The adhesive sheet has both polymerizable and radiation polymerizable properties. The adhesive sheet having the above configuration has a sufficient adhesive strength so that the semiconductor elements do not scatter during dicing, and satisfies conflicting requirements such as a low adhesive strength that does not impose a load on each element during pickup. Can be completed with one film.

The epoxy resin used in the present invention is not particularly limited as long as it cures and exhibits an adhesive action. For example, Epicoat 807, Epicoat 815, Epicoat 825, Epicoat 82 manufactured by Yuka Shell Epoxy Co., Ltd.
7, epicoat 828, epicoat 834, epicoat 1001, epicoat 1004, epicoat 1007,
Epicoat 1009, DER-33 manufactured by Dow Chemical Company
0, DER-301, DER-361, Toto Kasei Co., Ltd.
Bisphenol A such as YD8125 and YDF8170
Epoxy resin, Yuka Shell Epoxy Co., Ltd. Epicoat 152, Epicoat 154, Nippon Kayaku Co., Ltd. EPP
N-201, phenol novolak type epoxy resin such as DEN-438 manufactured by Dow Chemical Company, and E manufactured by Nippon Kayaku Co., Ltd.
OCN-102S, EOCN-103S, EOCN-1
04S, EOCN-1012, EOCN-1025, E
OCN-1027, YDCN701 manufactured by Toto Kasei Co., Ltd.
O-cresol novolak type epoxy resins such as YDCN702, YDCN703 and YDCN704, Epon 1031S manufactured by Yuka Shell Epoxy, Araldite 0163 manufactured by Ciba Specialty Chemicals, Denacol EX-611, EX-614 manufactured by Nagase Kasei Co., Ltd.
EX-614B, EX-622, EX-512, EX-
Polyfunctional epoxy resins such as 521, EX-421, EX-411, EX-321, Epicoat 604 manufactured by Yuka Shell Epoxy Co., Ltd., YH-434 manufactured by Toto Kasei Co., Ltd., and TETRAD- manufactured by Mitsubishi Gas Chemical Co., Ltd. X, TETRAD-
C, amine type epoxy resin such as ELM-120 manufactured by Sumitomo Chemical Co., Ltd., heterocyclic-containing epoxy resin such as Araldite PT810 manufactured by Ciba Specialty Chemicals, UCC
ERL4234, ERL4299, ERL422
1, alicyclic epoxy resins such as ERL4206 and the like, and these can be used alone or in combination of two or more.

As the curing agent for the epoxy resin, a commonly used curing agent can be used without any particular limitation. Examples thereof include amines, polyamides, acid anhydrides, polysulfides, boron trifluoride, and phenolic hydroxyl groups having one molecule. Bisphenol A, bisphenol F, bisphenol S and phenol novolak resin, which are compounds having two or more compounds therein, phenol resins such as bisphenol A novolak resin or cresol novolak resin, and the like,
In particular, a phenol resin such as a phenol novolak resin, a bisphenol A novolak resin, or a cresol novolak resin is preferable because of its excellent electric corrosion resistance during moisture absorption.

Examples of such preferred phenol resin curing agents include, for example, phenolite LF2882, phenolite LF2822, phenolite TD-2090 and phenolite TD-214 manufactured by Dainippon Ink and Chemicals, Inc.
9, phenolite VH4150, phenolite VH41
70 and the like.

(B) The weight average molecular weight containing a functional group is 10
The high molecular weight component having a molecular weight of 10,000 or more is preferably an epoxy group-containing acrylic copolymer containing a functional group monomer such as glycidyl acrylate or glycidyl methacrylate and having a weight average molecular weight of 100,000 or more. Preferably, they are compatible.

Examples of the epoxy group-containing acrylic copolymer containing a functional group monomer such as glycidyl acrylate or glycidyl methacrylate and having a weight average molecular weight of 100,000 or more include, for example, HT manufactured by Teikoku Chemical Industry Co., Ltd.
R-860P-3 and the like. The functional group monomer is
When carboxylic acid type acrylic acid or hydroxyl group type hydroxymethyl (meth) acrylate is used, a crosslinking reaction easily proceeds, gelation in a varnish state, a decrease in adhesive strength due to an increase in curing degree in a B stage state, and the like. Is not preferable because of the problem described above.

The content of the functional group monomer such as glycidyl acrylate or glycidyl methacrylate is 0.5 to
6.0 mass% is preferable, 0.5-5.0 mass% is more preferable, and 0.8-5.0 mass% is especially preferable. 0.
When it is 5% by mass or less, the adhesive strength tends to decrease,
If it is 6.0% by mass or more, it tends to gel.

Examples of the functional group monomer other than glycidyl acrylate and glycidyl methacrylate include ethyl (meth) acrylate and butyl (meth) acrylate, and these can be used alone or in combination of two or more. . In the present invention, for example, ethyl (meth) acrylate refers to both ethyl acrylate and ethyl methacrylate. The mixing ratio is the glass transition temperature of the copolymer (hereinafter referred to as Tg).
Tg is preferably -10 ° C or higher. If the Tg is lower than -10 ° C, the tackiness of the adhesive layer in the B-stage state tends to increase, and the handling property tends to deteriorate.

When the above monomer is polymerized to produce (B) a high molecular weight component containing a functional group and having a weight average molecular weight of 100,000 or more, the polymerization method is not particularly limited.
For example, methods such as pearl polymerization and solution polymerization can be used.

In the present invention, the weight average molecular weight of the high molecular weight component containing a functional group (B) is 100,000 or more, preferably 300,000 to 3,000,000, more preferably 500,000 to 2,000,000. . If the weight-average molecular weight is less than 100,000, problems such as a decrease in strength, a decrease in flexibility and an increase in tackiness in a sheet or film form occur, and
If it exceeds one million, the flowability tends to be small, and the circuit filling property of the wiring tends to be low. In the present invention, the weight average molecular weight refers to a value measured by gel permeation chromatography and converted using a standard polystyrene calibration curve.

The amount of the high molecular weight component (B) having a functional group and having a weight average molecular weight of 100,000 or more is from 10 to 400 mass% with respect to (A) the epoxy resin and 100 parts by weight of the epoxy resin curing agent. Part, but especially 15-350
Part by weight is preferable, and 20 to 300 parts by weight is more preferable. If the amount is less than 10 parts by mass, the effect of reducing the elastic modulus and suppressing the flow property at the time of molding cannot be obtained, and if it exceeds 400 parts by mass, the handleability at high temperatures is reduced.

The (A) diols constituting the radiation-polymerizable compound (C) are not particularly limited. Examples thereof include ethylene glycol, polyethylene glycol, propylene glycol, polypropylene glycol, tetramethylene glycol, and polytetramethylene glycol. , Ethylene glycol-propylene glycol block copolymer, ethylene glycol-tetramethylene glycol block copolymer, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, 1,7-heptanediol, 1, 8-octanediol, 1,9-nonanediol, 1,10-decanediol, poly1,2-butylene glycol, 2-methyl-1,8-octanediol, 2,2,4-trimethylhexanediol, Ethyl-1,3-hexanediol, alkylene diols and polyoxyalkylene diols such as 3-methyl-1,3-pentanediol, cyclopentane diol, cyclopentane dimethanol,
Cyclopentanediethanol, cyclohexanediol, cyclohexanedimethanol, cyclohexanediethanol, norbornanediol, norbornanedimethanol, norbornanediethanol, alicyclic diols such as hydrogenated bisphenol A, represented by the following general formula (III), for example, Daicel PLACC manufactured by Chemical Co., Ltd.
Carbonate diols such as EL CD-205, 210, 220;

[0029]

Embedded image (Wherein, R ⁴ and R ⁵ each independently represent an alkylene group having 1 to 12 carbon atoms, and m is an integer of 1 to 20)

2,2-bis (hydroxymethyl) propionic acid, 2,2-bis (2-hydroxyethyl) propionic acid, 2,2-bis (3-hydroxypropyl) propionic acid, 2,3-dihydroxy-2 -Meethylpropionic acid, 2,2-bis (hydroxymethyl) butanoic acid,
2,2-bis (2-hydroxyethyl) butanoic acid, 2,
2-bis (3-hydroxypropyl) butanoic acid, 2,3
-Dihydroxybutanoic acid, 2,4-dihydroxy-3,
3-dimethylbutanoic acid, 2,3-dihydroxyhexadecanoic acid, bis (hydroxymethyl) acetic acid, 4,4-bis (4-hydroxyphenyl) acetic acid, 4,4-bis (4-
(Hydroxyphenyl) pentanoic acid, carboxyl group-containing diols such as 3,5-dihydroxybenzoic acid and tartaric acid; polybasic acids such as maleic anhydride, phthalic anhydride and trimellitic anhydride; and polyols such as glycerin and pentaerythritol. And the like can be used. These compounds can be used alone or in combination of two or more.

The (C) isocyanate compound (b) constituting the radiation-polymerizable compound represented by the general formula (I) is not particularly limited. Examples thereof include 4,4'-diphenylmethane diisocyanate and tolylene diisocyanate. , Xylylene diisocyanate, 4,4'-diphenyl ether diisocyanate, aromatic isocyanate such as 4,4 '-[2,2-bis (4-phenoxyphenyl) propane] diisocyanate, hexamethylene diisocyanate, 2,2,4-trimethyl -Hexamethylene diisocyanate, isophorone diisocyanate,
4,4′-dicyclohexylmethane diisocyanate,
2,4′-dicyclohexylmethane diisocyanate,
Lysine diisocyanate, lysine triisocyanate and the like can be mentioned. These are used alone or in combination of two or more. Further, dimers or trimers of these diisocyanates may be used, and those stabilized with a suitable blocking agent may be used in order to avoid aging.

The (c) compound represented by the general formula (II) constituting the (C) radiation-polymerizable compound is not particularly limited, and examples thereof include 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl acrylate, 2-hydroxypropyl methacrylate, and the like can be used, and these can be used alone or in combination of two or more.

The radiation polymerizable compound (C) of the present invention can be synthesized in the presence of an organic solvent. As the solvent, methyl ethyl ketone, methyl isobutyl ketone, acetone, diethyl ketone, ketone solvents such as cyclohexanone, ethyl acetate, butyl acetate, ester solvents such as γ-butyrolactone, diethylene glycol dimethyl ether, triethylene glycol dimethyl ether, tetrahydrofuran, dioxane and the like Ether solvents, butyl cellosolve acetate, cellosolve solvents such as ethyl cellosolve acetate, methyl cellosolve acetate, aromatic hydrocarbon solvents such as toluene, xylene, p-cymene, N-methyl-2-pyrrolidone, N, N-dimethylformamide , N, N-dimethylacetamide,
N, N-dimethylsulfoxide and the like can be used.

The reaction temperature is preferably 0 to 150 ° C., more preferably 20 to 130 ° C., and more preferably 3 to 150 ° C.
It is particularly preferable that the temperature be 0 to 120 ° C. The reaction time is
It can be appropriately selected depending on the scale of the batch, the reaction conditions employed, and the like.

In the composition constituting the adhesive layer of the present invention, a polymerizable compound other than the radiation polymerizable compound (C) can be used in combination. The polymerizable compound is not particularly limited and includes, for example, methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, butyl acrylate, butyl methacrylate, 2-ethylhexyl acrylate, 2-ethylhexyl methacrylate, pentenyl acrylate , Tetrahydrofurfuryl acrylate, tetrahydrofurfuryl methacrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, tetraethylene glycol diacrylate, diethylene glycol dimethacrylate, triethylene glycol dimethacrylate, tetraethylene glycol dimethacrylate, trimethylolpropane diacrylate, tri Methylolpropane triacrylate, trimethylolpropane dimethacrylate , Trimethylolpropane trimethacrylate, 1,4-butanediol diacrylate, 1,6-hexanediol diacrylate, 1,4-butanediol dimethacrylate, 1,6-hexanediol dimethacrylate, pentaerythritol triacrylate, pentaerythritol Tetraacrylate, pentaerythritol trimethacrylate, pentaerythritol tetramethacrylate, styrene, divinylbenzene, 4-vinyltoluene, 4-vinylpyridine, N-vinylpyrrolidone, 2-
Hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, 1,3-acryloyloxy-2-hydroxypropane, 1,2-methacryloyloxy-2
-Hydroxypropane, methylenebisacrylamide,
N, N-dimethylacrylamide, N-methylolacrylamide, triacrylate of tris (β-hydroxyethyl) isocyanurate, the following general formula (IV)

[0036]

Embedded image (Wherein, R ⁶ represents hydrogen or a methyl group, and q and r represent 1
Is an integer greater than or equal to)

A compound represented by the formula: a reaction product of tolylene diisocyanate with 2-hydroxyethyl acrylate or 2-hydroxyethyl methacrylate or trimethylhexamethylene diisocyanatocyclohexanedimethanol with 2-hydroxyethyl acrylate or 2-hydroxyethyl methacrylate And urethane acrylates or urethane methacrylates. These can be used alone or in combination of two or more.

The amount of the polymerizable compound used is preferably 100% by mass or less, more preferably 90% by mass or less, and preferably 80% by mass or less of the radiation polymerizable compound (C).
It is particularly preferred that the content is not more than mass%. This usage is 1
If it exceeds 00% by mass, the heat resistance of the obtained adhesive sheet tends to be poor.

Further, a curing accelerator can be further added to the adhesive layer forming the adhesive sheet of the present invention.
The curing accelerator is not particularly limited, and includes, for example, imidazoles. Specifically, for example, 2-methylimidazole, 2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole,
-Cyanoethyl-2-phenylimidazolium trimellitate, etc., and these can be used alone or in combination of two or more.

The amount of the curing accelerator to be added is 0.1 to 5 parts per 100 parts by mass of the epoxy resin and the epoxy curing agent (A)
A mass part is preferable, and 0.2 to 3 mass parts is more preferable.
If the amount is less than 0.1 part by mass, the curability tends to be poor, and if it exceeds 5 parts by mass, the storage stability tends to decrease.

Further, a photopolymerization initiator which generates free radicals by irradiation with active light can be added to the adhesive layer forming the adhesive sheet of the present invention. Such photopolymerization initiators include, for example, benzophenone, N,
N'-tetramethyl-4,4'-diaminobenzophenone (Michler's ketone), N, N'-tetraethyl-4,
4'-diaminobenzophenone, 4-methoxy-4'-
Dimethylaminobenzophenone, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1,2,2-dimethoxy-1,2-diphenylethan-1-one, 1-hydroxy-cyclohexyl-phenyl -Ketone, 2-methyl-1- (4- (methylthio) phenyl) -2-morpholinopropanone-1,
Aromatic ketones such as 2,4-diethylthioxanthone, 2-ethylanthraquinone and phenanthrenequinone; benzoin ethers such as benzoin methyl ether, benzoin ethyl ether and benzoin phenyl ether; benzoin such as methyl benzoin and ethyl benzoin; Benzyl derivative, 2- (o
-Chlorophenyl) -4,5-diphenylimidazole dimer, 2- (o-chlorophenyl) -4,5-di (m
-Methoxyphenyl) imidazole dimer, 2- (o-
(Fluorophenyl) -4,5-phenylimidazole dimer, 2- (o-methoxyphenyl) -4,5-diphenylimidazole dimer, 2- (p-methoxyphenyl) -4,5-diphenylimidazole dimer Body, 2, 4
-Di (p-methoxyphenyl) -5-phenylimidazole dimer, 2- (2,4-dimethoxyphenyl)-
2,4,5 such as 4,5-diphenylimidazole dimer
-Triarylimidazole dimers, 9-phenylacridine, acridine derivatives such as 1,7-bis (9,9'-acridinyl) heptane, etc., and these may be used alone or in combination of two or more. Can be. The amount of the photopolymerization initiator used is not particularly limited, but is usually 0.01 to 30 parts by mass based on 100 parts by mass of the (C) radiation-polymerizable copolymer.

The adhesive layer forming the adhesive sheet of the present invention has a storage elastic modulus at 25 ° C. of 10
2,000 MPa, and preferably 3-50 MPa at 260 ° C. The elastic modulus at 25 ° C. is 20 to 190.
0 MPa is more preferable, and 50 to 1800 MPa is particularly preferable. The elastic modulus at 260 ° C. is 5 to 50 MPa.
Is more preferable, and 7 to 50 MPa is particularly preferable. 2000MPa at 25 ° C, 50MP at 260 ° C
If it exceeds a, the effect of relaxing the thermal stress generated due to the difference in the thermal expansion coefficient between the semiconductor element and the support member becomes small, and there is a tendency for peeling and cracking to occur. When the storage elastic modulus is less than 10 MPa at 25 ° C., the handleability of the adhesive and the thickness accuracy of the adhesive layer tend to be deteriorated.
If it is less than 3 MPa at 0 ° C., reflow cracks tend to occur easily.

The above storage elastic modulus can be measured, for example, by using a dynamic viscoelasticity measuring device (DVE-V4 manufactured by Rheology Co., Ltd.), applying a tensile load to the cured adhesive, applying a frequency of 10 Hz, and a temperature rising rate of 5 to 10 ° C. It can be measured by performing the measurement in a temperature dependence measurement mode in which the temperature is measured from −50 ° C. to 300 ° C./min.

A high molecular weight resin compatible with the epoxy resin can be added to the adhesive layer forming the adhesive sheet of the present invention for the purpose of improving flexibility and reflow crack resistance. Such high molecular weight resins are not particularly limited, and include, for example, phenoxy resins, high molecular weight epoxy resins, ultrahigh molecular weight epoxy resins, and the like, and these can be used alone or in combination of two or more. .

The amount of the high molecular weight resin compatible with the epoxy resin is 40 parts by mass with respect to 100 parts by mass of the epoxy resin.
It is preferable that the amount be not more than parts by mass. If it exceeds 40 parts by mass, the Tg of the epoxy resin layer tends to decrease.

The adhesive layer forming the adhesive sheet of the present invention may have a handleability, a thermal conductivity, an adjustment of a melt viscosity and a thixotropic property.
Inorganic fillers can also be added. The inorganic filler is not particularly limited, for example, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, aluminum nitride, aluminum borate whisker, Boron nitride,
Examples thereof include crystalline silica and amorphous silica, and the shape of the filler is not particularly limited. These fillers can be used alone or in combination of two or more.

Among them, aluminum oxide, aluminum nitride, boron nitride, crystalline silica, amorphous silica and the like are preferable for improving the thermal conductivity. In addition, for the purpose of adjusting the melt viscosity and imparting thixotropic properties, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, Silica and amorphous silica are preferred.

The amount of the inorganic filler used is 100
The volume is preferably 1 to 20 parts by volume. If the amount is less than 1 part by volume, the effect of addition tends not to be obtained. If the amount is more than 20 parts by volume, problems such as an increase in storage modulus of the adhesive layer, a decrease in adhesiveness, and a decrease in electrical properties due to voids remain. Tend.

Further, various adhesives can be added to the adhesive layer forming the adhesive sheet of the present invention in order to improve interfacial bonding between different kinds of materials. Examples of the coupling agent include silane-based, titanium-based, and aluminum-based coupling agents. Among them, a silane-based coupling agent is preferable because of its high effect.

The silane coupling agent is not particularly restricted but includes, for example, vinyltrichlorosilane, vinyltris (β-methoxyethoxy) silane, vinyltriethoxysilane, vinyltrimethoxysilane, γ-methacryloxypropyltrimethoxysilane. , Γ-methacryloxypropylmethyldimethoxysilane, β- (3,4
-Epoxycyclohexyl) ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ
-Glycidoxypropylmethyldimethoxysilane, γ-
Glycidoxypropylmethyldiethoxysilane, N-β
(Aminoethyl) γ-aminopropyltrimethoxysilane, N-β (aminoethyl) γ-aminopropylmethyldimethoxysilane, γ-aminopropyltriethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane, γ-mercapto Propyltrimethoxysilane,
γ-mercaptopropyltriethoxysilane, 3-aminopropylmethyldiethoxysilane, 3-ureidopropyltriethoxysilane, 3-ureidopropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyl-tris (2- Methoxy-ethoxy-ethoxy) silane, N-methyl-3-aminopropyltrimethoxysilane, triaminopropyltrimethoxysilane, 3-4,5-dihydroimidazole-1-
Yl-propyltrimethoxysilane, 3-methacryloxypropyl-trimethoxysilane, 3-mercaptopropylmethyldimethoxysilane, 3-chloropropylmethyldimethoxysilane, 3-chloropropyldimethoxysilane, 3-cyanopropyltriethoxysilane, hexamethyl Disilazane, N, O-bis (trimethylsilyl)
Acetamide, methyltrimethoxysilane, methyltriethoxysilane, ethyltrichlorosilane, n-propyltrimethoxysilane, isobutyltrimethoxysilane, amyltrichlorosilane, octyltriethoxysilane, phenyltrimethoxysilane, phenyltriethoxysilane, methyltri (methacryloyl) Oxyethoxy) silane, methyltri (glycidyloxy) silane,
N-β (N-vinylbenzylaminoethyl) -γ-aminopropyltrimethoxysilane, octadecyldimethyl [3- (trimethoxysilyl) propyl] ammonium chloride, γ-chloropropylmethyldichlorosilane, γ-chloropropylmethyldimethoxysilane , Γ-
Chloropropylmethyldiethoxysilane, trimethylsilyl isocyanate, dimethylsilyl isocyanate,
Examples include methylsilyl triisocyanate, vinylsilyl triisocyanate, phenylsilyl triisocyanate, tetraisocyanate silane, ethoxy silane isocyanate, and the like, and these can be used alone or in combination of two or more.

Further, as the titanium-based coupling agent,
For example, isopropyl trioctanoyl titanate, isopropyl dimethacryl isostearyl titanate,
Isopropyl tridodecyl benzene sulfonyl titanate, isopropyl isostearyl diacryl titanate, isopropyl tri (dioctyl phosphate) titanate, isopropyl tricumyl phenyl titanate,
Isopropyl tris (dioctyl pyrophosphate)
Titanate, isopropyl tris (n-aminoethyl)
Titanate, tetraisopropylbis (dioctylphosphite) titanate, tetraoctylbis (ditridecylphosphite) titanate, tetra (2,2-diallyloxymethyl-1-butyl) bis (ditridecyl)
Phosphite titanate, dicumylphenyloxyacetate titanate, bis (dioctylpyrophosphate) oxyacetate titanate, tetraisopropyl titanate, tetranormal butyl titanate, butyl titanate dimer, tetra (2-ethylhexyl) titanate, titanium acetylacetonate, polytitanium oxide Ethyl acetonate, titanium octylene glycolate,
Titanium lactate ammonium salt, titanium lactate,
Titanium lactate ethyl ester, titanium chiliethanol aminate, polyhydroxytitanium stearate, tetramethyl orthotitanate, tetraethyl orthotitanate, tetarapropyl orthotitanate, tetraisobutyl orthotitanate, stearyl titanate, cresyl titanate monomer, cresyl titanate polymer, di Isopropoxy-bis (2,4-pentadionate) titanium (IV), diisopropyl-bis-triethanolaminotitanate, octylene glycol titanate, tetra-n-butoxytitanium polymer, tri-n-butoxytitanium monostearate polymer , Tri-n-butoxytitanium monostearate and the like,
These can be used alone or in combination of two or more.

As the aluminum-based coupling agent,
For example, ethyl acetoacetate aluminum diisopropylate, aluminum toys (ethyl acetoacetate), alkyl acetoacetate aluminum diisopropylate, aluminum monoacetyl acetate bis (ethyl acetoacetate), aluminum tris (acetyl acetonate), aluminum monoisopropoxy Aluminum chelate compounds such as monooleoxyethyl acetoacetate, aluminum-di-n-butoxide monoethyl acetoacetate, aluminum-di-iso-propoxide-monoethyl acetoacetate, aluminum isopropylate, mono-sec-butoxyaluminum diisopropylate , Aluminum-sec-butylate, aluminum ethylate and other aluminum alcohols Such bets, and these may be used alone or in combinations of two or more.

The amount of the coupling agent used is 0.1 to 10 parts by weight based on 100 parts by mass of the epoxy resin (A) and the epoxy resin curing agent in view of the effect, heat resistance and cost.
It is preferable to use parts by mass.

The adhesive layer forming the adhesive sheet of the present invention may further contain an ion scavenger in order to adsorb ionic impurities and improve insulation reliability when absorbing moisture. Such ion scavengers are not particularly limited, for example, triazine thiol compounds, bisphenol-based reducing agents, and other compounds known as copper harm inhibitors to prevent copper from ionizing and dissolving, zirconium-based compounds And inorganic ion adsorbents such as antimony bismuth-based magnesium aluminum compounds.

The amount of the ion scavenger to be used is preferably 1 to 10 parts by mass with respect to 100 parts by mass of the epoxy resin (A) and the epoxy resin curing agent from the viewpoints of the effect of addition, heat resistance, cost and the like.

The adhesive sheet of the present invention is obtained by dissolving or dispersing the composition forming the adhesive sheet in a solvent to form a varnish,
It can be obtained by coating on a base film, heating and removing the solvent.

Examples of the substrate used for the adhesive sheet of the present invention include plastic films such as polytetrafluoroethylene film, polyethylene terephthalate film, polyethylene film, polypropylene film, polymethylpentene film, and polyimide film. These plastic films can be used after releasing the surface.

The solvent is not particularly limited, but may be, for example, methyl ethyl ketone, acetone, methyl isobutyl ketone, 2-ethoxyethanol, toluene, xylene, butyl cellosolve, methanol, It is preferable to use a solvent having a relatively low boiling point such as ethanol and 2-methoxyethanol.
For the purpose of improving the coating properties, for example, solvents having a relatively high boiling point, such as dimethylacetamide, dimethylformamide, N-methylpyrrolidone, and cyclohexanone, may be used. More than one type can be used in combination.

In the production of a varnish when an inorganic filler is added, a grinder is used in consideration of the dispersibility of the inorganic filler.
It is preferable to use a three-roll, ball mill, bead mill, or the like, and these can be used in combination. The mixing time can also be shortened by mixing the inorganic filler and the low molecular weight raw material in advance and then blending the high molecular weight raw material. Also,
After the varnish is formed, bubbles in the varnish can be removed by vacuum degassing or the like.

As a method of applying the varnish to the substrate film, known methods can be used, for example, knife coating, roll coating, spray coating, gravure coating, bar coating, curtain coating, etc. Is mentioned.

The thickness of the adhesive sheet is not particularly limited.
The thickness of both the adhesive layer and the substrate is preferably 5 to 250 μm. 5μ
When the thickness is smaller than m, the stress relaxation effect tends to be poor.
If the thickness is more than 50 μm, it is not economical and cannot meet the demand for miniaturization of the semiconductor device.

In the adhesive sheet of the present invention, in order to obtain a desired thickness, two or more adhesives separately prepared can be bonded to the adhesive layer side of the adhesive sheet. In this case, bonding conditions are required so that peeling of the adhesive layers does not occur.

When the adhesive sheet having the structure described above is irradiated with radiation, the adhesive strength of the substrate is greatly reduced after the irradiation, and the substrate of the adhesive sheet is easily retained while the adhesive layer is held on the semiconductor element. Can be picked up from film.

Hereinafter, a method for using the adhesive sheet according to the present invention will be described. A semiconductor wafer to be diced is pressure-bonded to the adhesive sheet at room temperature or with heating, and steps of dicing, washing, and drying are added. At this time, since the semiconductor element is sufficiently adhered and held on the adhesive sheet, the semiconductor element does not fall off during each of the above steps.

Next, an ultraviolet ray (UV) or an electron beam (E
The adhesive sheet is irradiated with radiation such as B), and the radiation-polymerizable adhesive sheet is polymerized and cured. As a result, the adhesive force between the adhesive sheet having radiation polymerizability and the base film of the adhesive sheet is reduced to such an extent that the semiconductor element can be picked up, and by further expanding the property, the desired semiconductor element can be easily obtained. Spacing is obtained and pickup becomes easy.

The radiation to the adhesive sheet is performed from the surface of the adhesive sheet having radiation polymerizability. When EB is used as the radiation, the base film of the adhesive sheet does not need to be light-transmitting, but when UV is used as the radiation, the base film of the adhesive sheet needs to be light-transmitting.

After the expanding step, the semiconductor element is picked up together with the radiation-cured adhesive sheet, and is pressed against a supporting member at room temperature or while being heated. By heating, the adhesive sheet develops an adhesive force that can withstand reliability, and the bonding between the semiconductor element and the support member is completed.

[0068]

The present invention will be described below in more detail with reference to examples, but the present invention is not limited to these examples.

(Synthesis Example 1) VE was added to a flask equipped with a stirrer, thermometer, dry air introduction tube, dropping funnel and cooling tube.
After charging 888 parts by mass of STANAT IPDI (trade name, isophorone diisocyanate, manufactured by Daicel Huls Co., Ltd.) and 789 parts by mass of ethyl acetate, the mixture was heated to 70 ° C., kept at 70 to 75 ° C., and 232 parts by mass of 2-hydroxyethyl acrylate. Parts, 1950 parts by mass of PTG650SN (trade name, manufactured by Hodogaya Chemical Co., Ltd., polyoxytetramethylene glycol, number average molecular weight: about 650), 1.53 parts by mass of hydroquinone monomethyl ether, L101
A liquid mixture of 1.53 parts by mass (trade name, dibutyltin laurate, manufactured by Tokyo Fine Chemical Co., Ltd.) and 526 parts by mass of ethyl acetate was uniformly dropped over 3 hours to carry out a reaction. After the completion of the dropwise addition, the reaction was carried out for about 5 hours. The disappearance of the isocyanate group was confirmed by IR measurement, and the reaction was terminated to obtain a radiation-polymerizable composition (A-1).

(Example 1) 42.3 parts by mass of YDCN-703 (trade name, manufactured by Toto Kasei Co., Ltd., o-cresol novolak type epoxy resin, epoxy equivalent 210), Plyofen LF2882 (Dainippon Ink & Chemicals, Inc.) ) Product name, bisphenol A novolak resin) 23.9 parts by mass, HTR-860P-3) trade name, manufactured by Teikoku Chemical Industry Co., Ltd., epoxy group-containing acrylic rubber, molecular weight 1,000,000,
Tg-7 ° C) 44.1 parts by mass, Cureazole 2PZ-C
N (trade name, manufactured by Shikoku Chemical Industry Co., Ltd., 1-cyanoethyl-
0.4 parts by mass of 2-phenylimidazole), NUC A
-187 (trade name, manufactured by Nippon Unicar Co., Ltd., γ-glycidoxypropyltrimethoxysilane) 0.7 parts by mass, radiation-polymerizable composition (A-1) 22.0 obtained in Synthesis Example 1
Methyl ethyl ketone was added to a composition consisting of 5 parts by mass and 0.5 part by mass of 1-hydroxycyclohexyl phenyl ketone, followed by stirring and mixing, followed by vacuum degassing. The adhesive varnish is applied on a polyethylene terephthalate film having a thickness of 50 μm and dried by heating at 140 ° C. for 5 minutes to form an adhesive sheet having a support film and having a thickness of 50 μm (an adhesive sheet excluding the support film). Has a thickness of 50 μm)
(Adhesive sheet 1) was produced.

The adhesive layer of the adhesive sheet 1 was heated at 170 ° C.
The storage elastic modulus after time curing is measured using a dynamic viscoelasticity measurement device (DVE-V4, manufactured by Rheology Co., Ltd.) (sample size: length 20 mm, width 4 mm, film thickness 80 μm, heating rate 5 ° C. / min, tensile mode, 10 Hz, automatic static load). As a result, 350 MPa at 25 ° C. and 2 MPa at 260 ° C.
MPa.

Using the obtained adhesive sheet 1, a semiconductor device sample (a solder ball is formed on one side) in which a semiconductor chip and a wiring substrate using a polyimide film having a thickness of 25 μm as a base material are bonded together with an adhesive sheet is produced. Then, heat resistance and moisture resistance were examined. As a method for evaluating heat resistance, a reflow crack resistance and a temperature cycle test were applied. The evaluation of the reflow crack resistance was such that the maximum temperature of the sample surface was 240
The temperature was set to maintain this temperature at 20 ° C for 20 seconds.
The sample was passed through an R reflow furnace and left at room temperature to be cooled by cooling twice. Cracks in the sample were visually observed and observed with an ultrasonic microscope.い な い indicates that no cracks occurred, and X indicates that cracks occurred.

The temperature cycling resistance was as follows:
Leave it in the atmosphere for 30 minutes, and then
The process in which the process was left for 0 minutes was defined as one cycle, and after 1000 cycles, an ultrasonic microscope was used.

The humidity resistance was evaluated at a temperature of 121 ° C. and a humidity of 100
%, An atmosphere of 2.03 × 10 ⁵ Pa (pressure cooker test: PCT treatment), followed by observing peeling after treatment for 72 hours. When no peeling was observed, it was evaluated as ○, and when peeled, it was evaluated as ×.

On the other hand, the adhesive sheet 1 was stuck on a silicon wafer having a thickness of 150 μm, and the silicon wafer with the adhesive sheet was placed on a dicing apparatus. Next, the semiconductor wafer was fixed on a dicing device, diced to 5 mm × 5 mm, and the diced chips were picked up by a pickup device. Table 1 shows the evaluation results of the dicing property and the pick-up property together with the evaluation results of the heat resistance and the moisture resistance.

(Example 2) Epicoat 828 (trade name, manufactured by Yuka Shell Epoxy Co., Ltd., bisphenol A type epoxy resin, epoxy equivalent: 190) 23.4 parts by mass, ESC
N195 (trade name of Sumitomo Chemical Co., Ltd., cresol novolak type epoxy resin, epoxy equivalent 195) 15 parts by mass, Plyofen LF2882 (trade name of Dainippon Ink and Chemicals, bisphenol A novolak resin) 23.9 mass Parts, HTR-860P-3) trade name, manufactured by Teikoku Chemical Industry Co., Ltd., epoxy group-containing acrylic rubber, molecular weight 1,000,000, Tg-7 ° C) 44.1 parts by mass, Cureazole 2PZ-CN (Shikoku Chemical Industry Co., Ltd.) Product name, 1-
0.4 parts by mass of cyanoethyl-2-phenylimidazole), NUC A-187 (trade name, manufactured by Nippon Unicar Co., Ltd., γ-glycidoxypropyltrimethoxysilane)
To a composition consisting of 0.7 parts by mass, 22.05 parts by mass of the radiation-polymerizable composition (A-1) obtained in Synthesis Example 1 and 0.5 part by mass of 1-hydroxycyclohexylphenyl ketone, methyl ethyl ketone was added. Stir and mix and degas in vacuo. This adhesive varnish was applied on a polyethylene terephthalate film having a thickness of 50 μm, and dried by heating at 140 ° C. for 5 minutes.
m (the thickness of the adhesive sheet excluding the support film is 50 μm) (adhesive sheet 2).

The adhesive layer of the adhesive sheet 1 was heated at 170 ° C.
The storage elastic modulus after time curing is measured using a dynamic viscoelasticity measurement device (DVE-V4, manufactured by Rheology Co., Ltd.) (sample size: length 20 mm, width 4 mm, film thickness 80 μm, heating rate 5 ° C. / min, tensile mode, 10 Hz, automatic static load). As a result, 330 MPa at 25 ° C. and 1 MPa at 260 ° C.
MPa. Table 1 shows the results of evaluating the obtained adhesive sheet under the same conditions as in Example 1.

(Comparative Example 1) The same operation as in Example 1 was carried out except that the radiation-polymerizable composition (A-1) and 1-hydroxycyclohexyl phenyl ketone were omitted, and the operation was carried out at 170 ° C for 1 hour. The storage elastic modulus when cured was 380 MPa at 25 ° C. and 5 MPa at 260 ° C. (adhesive sheet 3). Table 1 shows the results of evaluating the obtained adhesive sheet under the same conditions as in the examples.

(Comparative Example 2) Except that the radiation-polymerizable composition (A-1) 4G (trade name, manufactured by Shin-Nakamura Chemical Co., Ltd., tetraethylene glycol dimethacrylate) was used in Example 1, it was completely the same as Example 1. Perform the same operation at 170 ° C
Storage modulus when cured for 250 hours at 250C at 250C
(Adhesive sheet 4) having a pressure of 1 MPa at 260 ° C. and Pa was obtained. Table 1 shows the results of evaluating the obtained adhesive sheet under the same conditions as in the examples.

[0080]

[Table 1] Pickup property: The probability (% / 100 chips) that a chip after dicing could be picked up by a pick-up die bonder was shown.

From Table 1, it can be seen that the adhesive sheet of the present invention is excellent in heat resistance and moisture resistance, has no chip fly during dicing, and has good pickup properties.

[0082]

The adhesive sheet according to the present invention can be used as a dicing tape in the dicing step, and as an adhesive having excellent connection reliability in the joining step of the semiconductor element and the support member. It has heat resistance and moisture resistance required when a semiconductor element having a large difference in thermal expansion coefficient is mounted on a member, and is excellent in workability. The adhesive sheet according to claim 2 has the effect of the invention according to claim 1 and is more excellent in heat resistance. The adhesive sheet according to the third aspect has the effects of the invention according to the first or second aspect, and is more excellent in heat resistance and moisture resistance. The adhesive sheet according to the fourth aspect has the effects of the inventions according to the first to third aspects, and further has excellent temperature cycle resistance. The adhesive sheet according to the fifth aspect has the effects of the inventions according to the first to fourth aspects and is more excellent in workability. The method of using the adhesive sheet according to claim 6 can simplify the manufacturing process of the semiconductor device. The semiconductor device according to the seventh aspect has heat resistance, moisture resistance, and workability necessary for mounting a semiconductor element having a large difference in thermal expansion coefficient on the semiconductor mounting support member.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) C09J 175/04 C09J 175/04 H01L 21/52 H01L 21/52 E 21/301 21/78 MF term ( Reference) 4J004 AA02 AA10 AA13 AA17 AB01 AB04 AB06 FA05 4J034 BA02 CA04 CB03 CC01 CC11 DA08 DB03 DC01 DK05 DK06 DP03 DP18 FA01 FB01 FC01 FD01 FE02 HA01 HA07 HA08 HB11 HC01 HC11 HC46 JA02 JA14 LA23 LA0 RA01 AF01 DA04 FB03 FB10 JA08 4J040 EC001 EC232 EF052 EF282 FA132 JA09 JB02 JB07 JB09 KA16 LA01 NA20 5F047 BA34 BB03 BB05 BB19

Claims (8)

[Claims] 1. An epoxy resin and an epoxy resin curing agent, (B) a high molecular weight component containing a functional group and having a weight average molecular weight of 100,000 or more, (C) a diol, and (b) a general formula. (I) (Wherein n is an integer of 0 to ¹ and R ¹ is a divalent or trivalent organic group having 1 to 30 carbon atoms) and (c) a general formula ( II) (Wherein, R ² is hydrogen or a methyl group, and R ³ is an ethylene group or a propylene group), and an adhesive layer containing a radiation-polymerizable compound comprising a compound represented by the following formula: And a thermopolymerizable and radiation polymerizable adhesive sheet. 2. A high-molecular-weight component having a weight-average molecular weight of 100,000 or more containing (A) 100 parts by mass of an epoxy resin and an epoxy resin curing agent, and
Radiation-polymerizable compound 5 to 400 parts by mass of (C) (a) a diol, (b) an isocyanate compound represented by the general formula (I), and (c) a compound represented by the general formula (II). 2. The composition according to claim 1, which comprises parts by mass.
The adhesive sheet according to the above. (B) a weight average molecular weight containing a functional group of 1
3. The adhesive sheet according to claim 1, wherein the high molecular weight component having a molecular weight of at least 10,000 is incompatible with the epoxy resin. (B) a weight average molecular weight containing a functional group of 1
The high molecular weight component having a molecular weight of not less than 100,000 is an epoxy group-containing acrylic copolymer containing 0.5 to 6% by mass of glycidyl acrylate or glycidyl methacrylate and having a weight average molecular weight of 100,000 or more. 3. The adhesive sheet according to 3. 5. A step after the adhesive layer is cured by heating,
The storage elastic modulus measured using a dynamic viscoelasticity measuring device is 2
10 to 2000 MPa at 5 ° C and 3 to 50 M at 260 ° C
The adhesive sheet according to claim 1, wherein Pa is Pa. 6. The method according to claim 1, wherein the adhesive force between the adhesive layer and the substrate is controlled by irradiation with radiation.
The adhesive sheet according to any one of the above. 7. The method according to claim 1, wherein (I) attaching the adhesive sheet according to any one of claims 1 to 6 to a semiconductor wafer via a wire adhesive layer, and (II) either before or after dicing. Irradiating the adhesive sheet with radiation to cure the adhesive layer and remove the substrate; (III) dicing the semiconductor wafer to obtain a semiconductor element with an adhesive layer; (IV) adhesive bonding A method of using an adhesive sheet, comprising a step of adhering a semiconductor element with a layer and a support member for mounting the semiconductor element via the adhesive sheet. 8. A semiconductor comprising a structure in which a semiconductor element and a supporting member are adhered to each other by using the adhesive sheet according to claim 1 or by using the adhesive sheet according to claim 7. apparatus.