JP2002222994A - Led device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the overheating of an LED by a diffusion material in an LED device (LED lamp) in which the diffusion material is added to a synthetic resin used to seal the LED. SOLUTION: A BN additive 8 whose heat dissipating characteristic is superior as the diffusion material is added to a transparent sealing resin 6 for the LED 1. Light from the LED is diffused, and heat generated in the light emitting operation of the LED is dissipated.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an LED device using a diffusion resin in a transparent sealing resin, and more particularly to an LED device using a BN additive, such as an LED lamp and a chip LED.

[0002]

2. Description of the Related Art In a conventional LED device, for example, an LED lamp or a chip LED, an LED using a diffusion resin is used.
L having a function of diffusing light emitted by (light emitting element)
As the ED device, a device in which silica particles are added to a sealing resin as a light diffusion material is known. FIG. 1 is a view for explaining an LED lamp as an example of an LED device. An LED 1 has a recess (parabolic) 4 formed at an upper end of a lead frame 2 which is one terminal for supplying power to the LED. The bottom electrode is held in a connected state, and the top electrode of the LED 1 is connected to the other terminal, the lead frame 3, by a bonding wire 5.

[0003] L including LED 1 and bonding wire 5
The main part of the ED lamp is resin-sealed with a transparent acrylic resin 5 or the like as shown in the figure, and silica particles 7 are added to the transparent resin 6 as a light diffusing material. LED
The light having high directivity emitted from the light emitting layer is scattered by the silica particles 7 in the transparent resin, the directivity is reduced, and the light is diffused.

[0004]

The silica particles added to the transparent resin of the conventional LED lamp diffuse the light of the LED, but tend to accumulate the heat generated when the LED emits light. If the LED cannot be radiated efficiently and the LED continues to emit light, it may overheat, which may cause trouble such as deterioration of the LED.

[0005]

DISCLOSURE OF THE INVENTION The present invention has been made to solve the above-mentioned conventional problems, and the invention of claim 1 is that the LE in the transparent resin for sealing the LED of the LED device.
An LED device to which a BN (boron nitride) additive is added as a diffusing material for diffusing light from D.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An LED lamp which is an embodiment of the LED device according to the present invention will be described with reference to FIG. LED
Reference numeral 1 denotes a concave portion (parabola) 4 formed at the upper end of the lead frame 2 with its bottom electrode connected thereto, as in the conventional device, and the top electrode of the LED 1 is connected to the lead frame 3 by a gold wire. Are connected by a bonding wire 5 consisting of Power for causing the LED 1 to emit light is supplied from the lead frames 2 and 3. The main part of the LED lamp is sealed with a transparent resin 6 such as an acrylic resin as shown in the figure, and a BN additive is used in the sealing resin 6 as a diffusion material for diffusing light from the LED. 8 is used. Since the BN additive 8 added to the transparent resin 5 can diffuse light and radiate heat at the same time, heat generated by light emission of the LED 1 can be efficiently radiated through the sealing resin 6. By the way, although the BN additive has good heat dissipation properties, the viscosity increases when the content thereof is increased. Therefore, when adding the BN additive to the transparent resin, a solvent such as an ester-based solvent such as ethoxyethoxyacetate is used. The BN additive can be smoothly added to the resin by using or increasing the temperature of the additive, the solvent, and the resin to lower the viscosity.

[0007]

According to the present invention, in an LED device,
Since the BN additive is used as a light diffusing material in the transparent sealing resin, the heat generated by the LED can be efficiently dissipated, and problems such as deterioration of the LED due to overheating can be prevented as before. Can be.

[Brief description of the drawings]

FIG. 1 shows an LED device (L) in which a diffusion material is added to a sealing resin.
FIG.

[Explanation of symbols]

1 ... LED, 2, 3 ... Lead frame, 4 ...
・ Recess (parabola) 5 ... bonding wire, 6
... Transparent sealing resin, 7,8 ... Diffusion material

Claims (1)

[Claims] 1. An LED device, wherein a BN additive is added as a diffusing material for diffusing light from the LED into a transparent resin for sealing the LED of the LED device.