JP2002289764A - Flexible circuit board, display device using it and electronic equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To thin the whole liquid crystal display device. SOLUTION: A liquid crystal panel 10 and a peripheral circuit board 20 are mutually layered, and one side edge of each flexible circuit board 30 is connected respectively. Each flexible circuit board 30 is curved so that the other side edge part is connected to the lower face of the peripheral circuit board 20 respectively. Each flexible circuit board 30 provides a memory IC chip 33 and a power source IC chip 34 on both the faces of an insulation film having flexibility.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible circuit board suitably used in a display device mounted on an electronic device such as a portable telephone or an electronic organizer, and a display device and an electronic device using the same.

[0002]

2. Description of the Related Art FIGS. 13A and 13B show an example of a liquid crystal display device mounted on a portable telephone or the like. FIG. 13 (a)
Is a schematic plan view of a liquid crystal display device, and FIG. 13B is a schematic sectional view thereof. This liquid crystal display device 50 has a liquid crystal layer (not shown) on a data side glass substrate 51b.
Liquid crystal display panel 5 on which scanning-side glass substrate 51a is laminated
1, a peripheral circuit board 52 disposed in a stacked state below the liquid crystal display panel 51, and a pair of flexible circuit boards 53 for electrically connecting the liquid crystal display panel 52 and the peripheral circuit board 52. ing. Data side glass substrate 51
A polarizing plate 51c is provided on each of b and the scanning-side glass substrate 51a.

Each flexible circuit board 53 is usually provided with a wiring pattern formed of copper foil or the like on one surface of a rectangular insulating film such as a polyimide film having flexibility, and a scanning side is formed on the wiring pattern. And an IC chip 53a for driving the liquid crystal on the data side. Each IC chip 53a is equipped with a RAM, a power supply, and the like.

A terminal portion of a wiring pattern is provided on each side edge portion of both sides of the flexible circuit board 53 along each side edge portion, and one terminal portion is connected to one side of the liquid crystal display panel 51. Connected to the edge. The flexible circuit board 53 is bent in a U-shape so that the terminal on the other side edge is connected to the side edge on the lower surface of the peripheral circuit board 52.

[0005] I mounted on the flexible circuit board 53
The C chip has been increased in size due to the provision of a RAM, a power supply, and the like.
2 are arranged on the flexible circuit board 53 along the lower surface. Thereby, each IC chip 53a is
It is in a state of projecting downward from the peripheral circuit board 52.

In the liquid crystal display device 50 having such a configuration,
Each IC chip 5 provided on the flexible circuit board 53
Since 3a is projected downward from the peripheral circuit board 52, the entire liquid crystal display device 50 is thick. Moreover, there is a problem that the space formed below the peripheral circuit board 52 is narrowed by the respective IC chips 53a protruding downward from the peripheral circuit board 52. In particular, since each IC chip 53a has a RAM and a power supply mounted thereon, each of them becomes thicker, so that the entire liquid crystal display device 50 becomes further thicker and the space below the peripheral circuit board 52 becomes smaller. , Has been further narrowed.

Japanese Patent Application Laid-Open No. 10-50927 discloses a method of mounting a plurality of IC chips on one surface of a substrate. FIGS. 14A and 14B show an example in which such a mounting method is applied to the flexible circuit board shown in FIG. In the liquid crystal display device 50 shown in FIGS. 14A and 14B, each flexible circuit board 53 has
Each pair of IC chips 53b and 53c is mounted on the same surface. Then, one IC chip 53b mounted on each flexible circuit board 53 is disposed on the side of the scanning glass substrate 51a, and
The other IC chip 53c is arranged on the lower surface side of the peripheral circuit board 52.

[0008]

In such a liquid crystal display device 50, since each of the IC chips 53b and 53c is thinned, the IC chip 53c disposed below the peripheral circuit board 52 is formed. The thickness is getting smaller. However, also in this case, the IC chip 53c provided below the peripheral circuit board 52
2, and there is a limit in reducing the thickness of the entire liquid crystal display device 50.

An object of the present invention is to provide a flexible circuit board capable of easily reducing the thickness of a display device such as a liquid crystal display device.

Another object of the present invention is to provide a thin display device and electronic equipment.

[0011]

According to the flexible circuit board of the present invention, IC chips are provided on both sides of a flexible insulating film, and each IC chip is provided on one surface of the insulating film. Are electrically connected to the respective wiring patterns.

A cut-out concave portion is formed at a position corresponding to a position where at least one of the opposite side edge portions of the insulating film is bent.

The insulating film has a slit formed at a position corresponding to a bent portion.

[0014] Terminal portions of a wiring pattern are respectively formed along opposing side edges of the insulating film,
A side edge portion on which one terminal portion is formed is cut off on both sides.

In the display device of the present invention, the display panel and the peripheral circuit board are stacked on each other, and one side edge of the flexible circuit board is connected to the display panel.
A display device in which the flexible circuit board is bent so that the other side edge of the flexible circuit board is connected to the peripheral circuit board, wherein the flexible circuit board has a flexible insulating film. An IC chip is provided on each side.

In the flexible circuit board, each IC chip is electrically connected to a wiring pattern provided on one surface of the insulating film.

One of the IC chips of the flexible circuit board is disposed on a side of the display panel.

The other IC chip of the flexible circuit board is disposed so as to be located within the thickness of the peripheral circuit board.

The other IC chip of the flexible circuit board is arranged in an opening provided in the peripheral circuit board.

An electronic apparatus according to the present invention is provided with such a display device.

[0021] A peripheral substrate of the display device is arranged to face the control substrate.

[0022]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1A is a schematic plan view of a liquid crystal display device using the flexible circuit board of the present invention, and FIG.
Is a sectional view of the same. The liquid crystal display device 1 has a liquid crystal layer (not shown) formed on a data side glass substrate 12 through a liquid crystal layer (not shown).
Liquid crystal display panel 10 on which scanning-side glass substrate 11 is laminated
And a peripheral circuit board 20 arranged in a laminated state below the liquid crystal display panel 10, and a pair of flexible circuit boards 30 for electrically connecting the liquid crystal display panel 10 and the peripheral circuit board 20. I have.

The data side glass substrate 12 of the liquid crystal display panel 10 is formed in a rectangular shape, and a plurality of data signal lines to which data signals are applied are provided on the upper surface of the data side glass substrate 12 facing the liquid crystal layer. Each is provided in a parallel state. A polarizing plate 14 is provided on the lower surface (back surface) of the data-side glass substrate 12.

The scanning glass substrate 11 laminated on the data glass substrate 12 with the liquid crystal layer interposed therebetween has a rectangular shape having a longitudinal length slightly shorter than the longitudinal length of the data glass substrate 12. , Data side glass substrate 12
Are arranged at the center of the data-side glass substrate 12 such that the respective side edges in the longitudinal direction are exposed.

On the lower surface of the scanning side glass substrate 11 facing the liquid crystal layer, a plurality of scanning lines are mutually parallel so as to be orthogonal to the data signal lines arranged on the data side glass substrate 12. It is arranged in a state. A polarizing plate 13 is provided on the upper surface (front surface) of the scanning glass substrate 11.

One side edge of a flexible circuit board 30 having a rectangular shape is attached to each exposed side edge of the data-side glass substrate 12.

On the lower surface of the data side glass substrate 12 of the liquid crystal display panel 10, the peripheral circuit substrate 2
0 is provided. The peripheral circuit board 20 is formed of a hard printed wiring board, and its longitudinal length is slightly longer than the longitudinal length of the data-side glass substrate 12. The peripheral circuit board 20 is stacked on the data-side glass substrate 12 such that the side edges on both sides in the longitudinal direction are arranged on each side of the data-side glass substrate 12 in the longitudinal direction.

At the side edges of the peripheral circuit board 20 which are arranged on the respective sides of the data side glass substrate 12, there are provided chip accommodation openings 21 which extend long in the width direction of the peripheral circuit board 20. I have. Each chip accommodation opening 21 penetrates in the up-down direction, respectively.

FIG. 2A shows a flexible circuit board 30.
FIG. 2B is a schematic cross-sectional view of the configuration shown in FIG. The flexible circuit board 30 has an insulating film 31 formed of a flexible polyimide film or the like having a rectangular shape, and a wiring pattern 32 made of copper foil is provided on one surface of the insulating film 31. Have been. A terminal portion of the wiring pattern 32 is provided on each side edge portion along the width direction of the insulating film 31, and one side edge portion is attached to the side edge portion of the data side glass substrate 12, A terminal portion (not shown in FIG. 2) provided on the side edge portion is electrically connected to a terminal portion provided on the data-side glass substrate 12.

On one surface of the insulating film 31, RA
A memory IC chip 33 on which M is mounted is mounted, and a power supply IC chip 34 on which a power supply is mounted is mounted on the other back surface of the insulating film 31. The memory IC chip 33 is disposed on the surface close to one side edge of the insulating film 31 attached to the data-side glass substrate 12 and along the side edge. 31 is arranged on the back surface close to the other side edge along the side edge.

The memory IC chip 33 provided on one flexible circuit board 30 is mounted on the data-side glass substrate 12.
And a memory IC chip 3 provided on the other flexible circuit board 10 for driving data lines.
Reference numeral 3 is for driving a scanning line provided on the scanning-side glass substrate 11.

FIG. 3 is an enlarged sectional view showing a main part of the flexible circuit board 30. As shown in FIG. The wiring pattern 32 provided on the insulating film 31 is a memory IC chip 33
Excluding the area where the power supply IC chip 34 is provided and the peripheral area thereof, the area where the power supply IC chip 34 is provided and the peripheral area thereof, and the side edge close to the memory IC chip 33 and the side edge close to the power supply IC chip 34 And solder resist 3
5 is covered. In FIG. 2B, the memory IC
Solder resist 35 is also provided on the side edge near chip 33.
Although the terminal portion is shown to be covered by the solder resist 35, the terminal portion is not actually covered by the solder resist 35 because the terminal portion also exists at that portion.

Openings 31 are formed in the region of the insulating film 31 where the memory IC chip 33 is provided and in the periphery thereof to facilitate mounting of the memory IC chip 33.
a is formed. Then, a memory IC chip 33 is provided in a portion of the wiring pattern 32 located in the opening 31a.
Are die-bonded by gold bumps 37. The resin 36 is filled in the opening 31a and in the area where the solder resist 35 is not provided around the memory IC chip 33.

The power supply IC in the insulating film 31
An opening 31a is also formed in the region where the chip 34 is provided and in the periphery thereof, and the power supply IC chip 34 is disposed in the opening 31a, and the wiring pattern 32 exposed in the opening 31a has The power supply IC chip 34
Die bonding is performed by the gold bump 37.
Then, the inside of the opening 31a and the power supply IC chip 34
Resin 36 is filled in the area around the area where no solder resist 35 is provided.

As shown in FIG. 1, each flexible circuit board 30 has a side edge close to the memory IC chip 33,
The liquid crystal display panel 10 is disposed along each side edge of the upper surface of the data-side glass substrate 12. Each flexible circuit board 30 is attached to the upper surface of the data side glass substrate 12 with the insulating film 31 on which the memory IC chip 33 is mounted on the upper side and the wiring pattern 32 on the lower side, and is provided on the flexible circuit board 30. The terminal portion is electrically connected to a terminal portion provided on the data-side glass substrate 12.

The flexible circuit board 30 extends along the upper surface of the data-side glass substrate 12
Of each flexible circuit board 3
The memory IC chips 33 provided on the peripheral circuit board 20 are arranged on the side edges of the scanning glass substrate 11 on the respective side edges of the peripheral circuit board 20. As described above, since the memory IC chip 33 for driving the data line is arranged close to the liquid crystal display panel 10, the shape of the wiring pattern 32,
Routing can be simplified.

The flexible circuit board 30 is a memory IC
The part on which the chip 33 is mounted is the data-side glass substrate 1
In a state of being disposed on two sides, the portion is bent substantially at right angles downward, and a portion along the vertical direction is provided continuously. Then, it is bent substantially at right angles toward the peripheral circuit board 20 along the lower surface of the peripheral circuit board 20 so as to be continuous with the portion along the vertical direction, and has a U-shape. Memory I in each flexible circuit board 30
The power supply IC chips 34 provided on the back surface opposite to the surface on which the C chips 33 are provided are respectively disposed on portions along the lower surface of the peripheral circuit board 20, and each side edge of the peripheral circuit board 20 is provided. Each is accommodated in the chip accommodation opening 21 provided in the section.

As described above, the power supply IC chip 34 is disposed in the chip accommodation opening 21 of the peripheral circuit board 20,
The wiring and the like are simplified because they are close to the circuits and the like of the peripheral circuit board 20.

Power supply I in flexible circuit board 30
The solder resist is not provided on the side edge portion close to the C chip 34, and the terminal portion 38 of the wiring pattern 32 is exposed. The terminal portion 38 is disposed so as to face a terminal portion provided on the lower surface of the peripheral circuit board 20, and is connected to the terminal portion by, for example, the connection portion 22 formed of an ACF (anisotropic conductive film). ing.

The terminal portion 38 provided on the flexible circuit board 30 and the terminal portion provided on the peripheral circuit board 20 may be connected by the connection portion 22 formed by solder or the like.

In the liquid crystal display device 1 having such a configuration, the thickness of the data-side glass substrate 12 and the scanning-side glass substrate 11 of the liquid crystal display panel 10 is about 0.5 mm, respectively.
The thickness of the polarizing plate 13 provided on the scanning glass substrate 11 is about 0.39 mm, the thickness of the polarizing plate 14 provided on the data glass substrate 12 is about 0.30 mm, and the thickness of the peripheral circuit board 20 is 0 mm. 0.6 to 0.8 mm, the total thickness of each flexible circuit board 30 is about 0.075 mm (the thickness of the insulating film 31 is 0.05 mm), and the thickness of the memory IC chip 33 provided on the flexible circuit board 30 Is about 0.6 mm, and the thickness of the power supply IC chip 34 is 0.6 to
It is about 0.8 mm.

FIG. 4 shows a liquid crystal display device 1 having such a configuration.
FIG. 2 is a cross-sectional view of a main part of a mobile phone that is an electronic device on which is mounted. The peripheral circuit board 20 of the liquid crystal display device 10 is provided with a connection terminal portion 23 at the center of the lower surface thereof. The mold connector 42 is connected.

As described above, each flexible circuit board 30
The power supply IC chip 34 provided on the peripheral circuit board 20
Are accommodated in the chip accommodating openings 21 provided in each of them, so that a large space is formed between each flexible circuit board 30 and the control circuit board 41. Therefore, various components and the like can be mounted on the control board 41 so as to be arranged in the space, and the mounting area of the components on the control board 41 is expanded. As a result, the mobile phone can be further reduced in size and thickness. Further, since a large space for mounting components on the control board 41 is ensured, the degree of freedom in designing the control board 41 is increased, and it is easy to add functional circuits and the like.

Each of the flexible circuit boards 30 has only the wiring pattern 32 provided on only one surface of the insulating film 31. Therefore, each of the flexible circuit boards 30 is thin. This also makes the entire liquid crystal display device 1 thinner, and electronic devices such as mobile phones on which such a liquid crystal display device 1 is mounted are further thinned.

FIG. 5 shows a flexible circuit board 3 according to the present invention.
It is a top view which shows the other example of 0. In the flexible circuit board 30, a square or rectangular recess 30a is formed at a substantially central portion of each side edge along the longitudinal direction. Each of the recesses 30a is provided in the flexible circuit board 3
0 is bent from the state along the upper surface of the data-side glass substrate 12 along the respective side surfaces of the data-side glass substrate 12 and the peripheral circuit board 20 along the vertical direction; Along both sides of the peripheral circuit board 20 along a bending line L2 when being bent along the lower surface of the peripheral circuit board 20 from both sides along the vertical direction, both side portions of the bending lines L1 and L2 Each is formed by being cut out in a rectangular shape.

With such a configuration, the flexible circuit board 30 can be easily bent along the bending lines L1 and L2. Therefore, each flexible circuit board 30 attached to the liquid crystal display panel 10 can be easily connected to the lower surface of the peripheral circuit board 20.

Each of the recesses 30a of the flexible circuit board 30 has, for example, a width dimension of an opening along the longitudinal direction of the flexible circuit board 30 of about 1.4 to 1.6 mm and a depth of 1.4 to 1.6. The depth is about 1.6 mm, but the depth is not particularly limited, and is appropriately set in consideration of the influence of springback when the flexible circuit board 30 is bent.

FIG. 6A is a bottom view showing still another example of the flexible circuit board 30 of the present invention, and FIG.
It is sectional drawing in the AA of FIG. 6 (a). In the flexible circuit board 30, similarly to the flexible circuit board 30 shown in FIG. 5, a square or rectangular concave portion 31 a is formed substantially at the center of each side edge along the longitudinal direction. 31 each recess 30
The portion located between the lines a is removed to form the slits 31c along the bending lines L1 and L2. Each end of the slit 31c is close to each recess 30a, and the wiring pattern 32 is exposed in the slit 31c. The width of the opening of the slit 31c is equal to the width of the opening of each recess 30a, for example, 1.4 to 1.6 mm.

In a slit 31c formed by removing a part of the insulating film 31, a coating agent 39 for covering the wiring pattern 32 exposed in the slit 31c is provided. The coating agent 39 is thick enough to cover the wiring pattern 32 and is thinner than the insulating film 31.

With such a configuration, the portion between the bending lines L1 and L2 in the flexible circuit board 30 is
It is thin over almost the entire area, and the flexible circuit board 30 can be easily bent. Therefore, each flexible circuit board 30 attached to the liquid crystal display panel 10 can be easily connected to the lower surface of the peripheral circuit board 20.

FIG. 7 shows a flexible circuit board 3 according to the present invention.
It is a bottom view which shows another example of 0. In this flexible circuit board 30, a power supply IC on which a terminal portion 38 is formed
Notches 30b are respectively formed by cutting out both sides of one side edge close to the chip 34. Each notch 30b extends from the side edge to the vicinity of the power supply IC chip 34, and the terminal portion 38 Is formed. Other configurations are the same as those of the flexible circuit board 30 shown in FIG. In addition, a concave portion or a slit may be provided corresponding to each bending line. This applies not only to the flexible circuit board 30 shown in FIG. 7, but also to the flexible circuit board 30 shown in FIGS.

FIG. 8 is a sectional view of a main part of the liquid crystal display device 1 on which such a flexible circuit board 10 is mounted. A contact type connector 24 is provided on the lower surface of the peripheral circuit board 20.
A terminal portion 38 provided between the notches 30b of the flexible circuit board 30 is inserted into the contact type connector 24, and is electrically connected to the contact type connector 24. I have.

With this configuration, the terminal portions 38 of each flexible circuit board 30 are simply inserted into the contact type connectors 24 provided on the peripheral circuit board 20, and each terminal portion 38 is connected to each contact type connector 24. , The connection between each flexible circuit board 30 and the peripheral circuit board 20 is facilitated. In addition, since each terminal portion 38 can be easily detached from each contact type connector 24, the liquid crystal display panel 10 and the peripheral circuit board 20 can be easily separated when the liquid crystal display device 1 is repaired or the like. can do.

As shown in FIG. 9, the peripheral circuit board 2
0 is almost the same size as the data-side glass substrate 12 of the liquid crystal display panel 10, the power supply IC chip is not provided on the side edge of the peripheral circuit board 20 without providing the chip housing opening 21. 34 may be arranged on each side of the peripheral circuit board 20, and may be arranged within the thickness of the peripheral circuit board 20. The power supply IC chip 34
The configuration of the flexible circuit board 30 is not limited to the configuration arranged within the thickness of the peripheral circuit board 20, and may be arranged at a portion along the vertical direction of the flexible circuit board 30 as shown by a dashed line in FIG. As shown by a two-dot chain line, a configuration may be adopted in which the memory IC chip 33 is disposed on the back side of the flexible circuit board 30 below.

FIG. 10 is a sectional view showing still another example of the liquid crystal display device 1. In the liquid crystal display device 1, a light guide plate 26 is provided between the liquid crystal panel 10 and the peripheral circuit board 20, and a plurality of light guide plates 26 are provided on the peripheral circuit board 20 so as to face one side surface of the light guide plate 26. An LED 25 is provided. Each LED 25 and the light guide plate 26 constitute a backlight of the liquid crystal display panel 10, and light emitted from each LED 25 is supplied to the inside of the light guide plate 26. The light guide plate 26 has an upper surface and each L so that light supplied to the inside is emitted from an upper surface facing the liquid crystal panel 10.
The ED 25 is shielded from light except for the side portion facing the ED 25.
Other configurations are the same as those of the liquid crystal display device 1 shown in FIG.

The liquid crystal display device 1 having the above-described structure can be used for each L
Light emitted from the ED 25 is emitted from the upper surface of the light guide plate 26 and is emitted to the liquid crystal display panel 10. Therefore,
The visibility of the image displayed on the liquid crystal display panel 10 is improved. In addition, the liquid crystal display device 1 also includes the power supply IC chip 3
4 is accommodated in the chip accommodation opening 21 of the peripheral circuit board 20, so that a large space is formed below each flexible circuit board 30.

FIG. 11 is a sectional view showing still another example of the liquid crystal display device 1. In the liquid crystal display device 1, the data side glass substrate 12 of the liquid crystal display panel 10 is disposed above the scanning side glass substrate 11 via a liquid crystal layer.
One side edge of the flexible circuit board 30 is attached to the lower surface of each side edge of the upper data side glass substrate 11.

FIG. 12 is a sectional view of a main part of the flexible circuit board 30 used in the liquid crystal display device 1 shown in FIG. In this flexible circuit board 30, a memory IC
The chip 33 is provided in the opening 3 provided in the insulating film 31.
The power supply IC chip 34 is disposed in the opening 31 a provided in the insulating film 31 and is die-bonded to the wiring pattern 32.

Notches 30b are provided on both sides of the side edge of the flexible circuit board 30 close to the power supply IC chip 34, and an insertion terminal 38 is provided along the side edge. I have. Other configurations are the same as those of the flexible circuit board 30 shown in FIG.

Such a flexible circuit board 30 is
A terminal portion on a side edge close to the memory IC chip 33 faces the lower surface of the data-side glass substrate 12 and is connected to a terminal portion provided on the lower surface. The other side edge of the flexible circuit board 30 is disposed along the lower surface of the peripheral circuit board 20, and the terminal 38 for insertion is inserted into the contact type connector 24 provided on the lower surface of the peripheral circuit board 20. Is done. In this case, since the terminal portion 38 is disposed downward, the contact connector 24 provided on the lower surface of the peripheral circuit board 20 faces the terminal portion 38 disposed downward. Is provided with a connection portion.

As described above, also in the liquid crystal display device 1 in which the data side glass substrate 12 is arranged on the upper side, a large space can be secured below the peripheral circuit substrate 20.

In the above embodiment, a liquid crystal display device has been described as a display device using a flexible circuit board. However, the flexible circuit board of the present invention is applicable to other display devices such as organic EL and inorganic EL. can do.

[0064]

As described above, according to the flexible circuit board of the present invention, the IC chips are provided on both sides of the insulating film, and the respective IC chips are respectively connected to the wiring patterns provided on one side of the insulating film. Therefore, despite the IC chips provided on both sides, the overall thickness is reduced. In addition, by using the display device to connect the display panel to the peripheral circuit board, the thickness of the display device can be reduced.

The display device and the electronic apparatus of the present invention are easily thinned because a flexible circuit board having IC chips provided on both sides is used.

[Brief description of the drawings]

FIG. 1A is a plan view illustrating an example of an embodiment of a liquid crystal display device using a flexible circuit board according to the present invention;
(B) is a sectional view thereof.

FIG. 2A is a plan view of a flexible circuit board used for the liquid crystal display device, and FIG. 2B is a schematic side view thereof.

FIG. 3 is a sectional view of a main part of the flexible circuit board.

FIG. 4 is a cross-sectional view of a main part of a mobile phone as an electronic device on which the liquid crystal display device shown in FIG. 1 is mounted.

FIG. 5 is a plan view showing another example of the flexible circuit board of the present invention.

FIG. 6A is a bottom view showing still another example of the flexible circuit board of the present invention, and FIG. 6B is a cross-sectional view taken along line AA of FIG.

FIG. 7 is a bottom view showing still another example of the flexible circuit board of the present invention.

8 is a sectional view of a main part of a liquid crystal display device to which the flexible circuit board shown in FIG. 7 is mounted.

FIG. 9 is a sectional view showing still another example of the liquid crystal display device.

FIG. 10 is a sectional view showing still another example of the liquid crystal display device.

FIG. 11 is a sectional view showing still another example of the liquid crystal display device.

12 is a sectional view of a main part of a flexible circuit board used in the liquid crystal display device shown in FIG.

FIG. 13A is a schematic plan view showing an example of a conventional liquid crystal display device, and FIG. 13B is a cross-sectional view thereof.

14A is a schematic plan view showing another example of a conventional liquid crystal display device, and FIG. 14B is a cross-sectional view thereof.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Liquid crystal display device 10 Liquid crystal display panel 11 Scanning glass substrate 12 Data side glass substrate 13, 14 Polarizer 20 Peripheral circuit board 21 Chip accommodation opening 22 Connection part 23 Connection terminal part 24 Contact type connector 25 LED 26 Light guide plate 30 Flexible Circuit board 30a Recess 30b Notch 31 Insulating film 31a Opening 31c Slit 32 Wiring pattern 33 Memory IC chip 34 Power supply IC chip 35 Solder resist 36 Resin 37 Gold bump 38 Terminal 39 Coating agent 41 Control board 42 Contact type connector 43 Case 50 Liquid crystal display device 51 Liquid crystal display panel 51a Scanning side glass substrate 51b Data side glass substrate 51c Polarizer 52 Peripheral circuit board 53 Flexible circuit board 53a IC chip 53b IC chip 53c IC -Up

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) G09F 9/00 348 H01L 25/04 Z H01L 21/60 311 F term (Reference) 2H092 GA48 GA50 GA51 GA60 HA25 MA32 MA35 MA37 PA06 RA10 5F044 MM07 MM50 RR18 5G435 AA17 AA18 BB12 EE04 EE32 EE33 EE36 EE37 EE40 EE42 EE47 KK02 KK05 KK09 LL07

Claims (11)

[Claims] 1. The method according to claim 1, wherein both sides of the flexible insulating film have
C chips are provided, and each IC chip is
A flexible circuit board, which is electrically connected to a wiring pattern provided on one surface of the insulating film. 2. The flexible circuit board according to claim 1, wherein a notched concave portion is formed at a position corresponding to a bent portion of at least one of the opposite side edge portions of the insulating film. 3. The flexible circuit board according to claim 1, wherein the insulating film has a slit formed at a position corresponding to a bent portion. 4. A terminal portion of the wiring pattern is formed along each of the opposite side edges of the insulating film, and the side edge on which one terminal is formed is cut off on both sides. The flexible circuit board according to claim 1, wherein 5. A display panel and a peripheral circuit board are stacked on each other, and one side edge of a flexible circuit board is connected to the display panel, and the other side edge of the flexible circuit board is connected to the display panel. Is a display device in which the flexible circuit board is in a bent state such that the flexible circuit board is connected to a peripheral circuit board, wherein the flexible circuit board is provided with IC chips on both surfaces of a flexible insulating film, respectively. A display device characterized by the above-mentioned. 6. The display device according to claim 5, wherein each IC chip of the flexible circuit board is electrically connected to a wiring pattern provided on one surface of the insulating film. 7. One IC of the flexible circuit board
The chip is arranged on a side of the display panel.
The display device according to claim 1. 8. The other IC of the flexible circuit board
The display device according to claim 7, wherein the chip is arranged so as to be located within a thickness of the peripheral circuit board. 9. The other IC of the flexible circuit board
9. The display device according to claim 8, wherein the chip is arranged in an opening provided in the peripheral circuit board. 10. An electronic apparatus, comprising the display device according to claim 8. 11. The electronic apparatus according to claim 10, wherein a peripheral substrate of the display device is disposed so as to face a control substrate.