JP2002026111A - Method of manufacturing semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To transfer a wafer without damaging it. SOLUTION: In the semiconductor device manufacturing method a wafer 42, mounted and held on a support 28 at the arm top end of a transfer robot 20, is transferred between a cassette 3 for housing a plurality of wafers laminated and mutually separated, and a process jig 30 for housing plurality of wafers laminated and mutually separated. The method comprises a step of detecting the positional of a wafer to be transferred and the positional relation of units around it, using a shape recognizer, a step of controlling the transfer robot 20, based on the detected information to hold the wafer to be transferred on the support, a step of detecting the position for housing the wafer to be transferred and the positional relation of units around it, using a shape recognizer, and a step of controlling the transfer robot to house the wafer to be transferred at a prescribed position.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a semiconductor device, for example, a technique for manufacturing a semiconductor device by processing a semiconductor substrate with a heat treatment apparatus such as a diffusion apparatus or a chemical vapor deposition apparatus (CVD apparatus). In particular, the present invention relates to a technique which is effective when applied to a technique for stably transferring a semiconductor substrate (also referred to as a wafer) between a cassette and a processing jig.

[0002]

2. Description of the Related Art In the manufacture of a semiconductor device, there are steps of growing a single crystal on a surface of a semiconductor substrate, forming various films, and diffusing impurities. A heat treatment apparatus such as an apparatus is used. Further, as one of the heat treatment apparatuses, a vertical heat treatment apparatus that performs processing in a state in which a semiconductor substrate as an object to be processed is accommodated in a processing jig at a predetermined interval in a vertical direction is known.

A vertical heat treatment apparatus is described in, for example, "Electronic Materials", March 1998, P35 to P39, issued by the Industrial Research Council. This document discloses a vertical diffusion / CVD apparatus. In this vertical diffusion / CVD apparatus, wafer transfer between a cassette for accommodating a plurality of wafers spaced apart from each other and a processing jig for accommodating a plurality of wafers spaced apart from each other is performed. We are using a transfer robot.

That is, in this vertical diffusion / CVD apparatus, a cassette containing wafers is supplied to a cassette stage from outside the apparatus. The cassette on the cassette stage is transferred to a lower cassette shelf by a cassette loader mechanism. The transfer of wafers between the cassette on the lower cassette shelf and the boat (processing jig) is performed by a wafer transfer mechanism (transfer robot). In the transfer robot, the wafer is placed and held on a support plate at the tip of the arm, and is transported in this state, and the wafer is stored in a predetermined position.

[0005]

SUMMARY OF THE INVENTION In a vertical heat treatment apparatus,
The transfer robot transfers the wafers stored in the cassette to a processing jig (heat treatment jig) (loading) and transfers the wafers stored in the processing jig to the cassette (unloading). Is going. When holding the wafer with the transfer robot, the arm of the transfer robot is controlled to move, the support at the tip of the arm is inserted into a cassette or processing jig, and then moved up and down. Hold.

When the wafer is accommodated in the processing jig, the movement of the arm of the transfer robot is controlled, and the support at the tip of the arm is inserted into the cassette or the processing jig, and then moved down by a small amount to perform the processing jig. The wafer is accommodated in the groove of the tool or cassette.

At this time, bringing the support into contact with an undesired wafer or with a cassette or processing jig causes breakage of wafers and foreign matters, which leads to a decrease in yield and a decrease in quality. The left and right outer peripheral edges of the wafer are accommodated by being inserted into grooves provided in a cassette or a heat treatment jig. For example, the groove has a width of 3.5 mm and accommodates a wafer having a thickness of 0.7 mm.

In a conventional vertical heat treatment apparatus of this kind,
The initial height setting of the arm with respect to the cassette of the cassette stage and the heat treatment jig, that is, the initial height setting of the support at the tip of the arm is performed manually. At this time, the position and height of the support are set so as not to come into contact with a wafer other than the wafer to be transferred, a cassette, or a jig for heat treatment. After this initial setting, the position information including the set height is input to the controller as numerical parameters. Usually, the transfer robot is controlled by an open loop control that determines an operation position according to a preset numerical parameter.

However, in such initial setting by manual operation, a difference in position occurs due to an individual difference of a coordinator.
Variations in the margin for displacement occur.

Since the heat treatment jig is gradually deformed under the influence of heat, the heat treatment jig is exchanged for a fixed period of time. If the wafer is deformed quickly, the support may come into contact with the wafer or the heat treatment jig, causing a damage accident. Also,
If the cassette or the heat treatment jig is displaced, it cannot be handled.

An object of the present invention is to provide a method for manufacturing a semiconductor device in which a wafer is transferred between a cassette and a processing jig by a transfer robot. The object of the present invention is to improve the quality and the yield of the semiconductor device by preventing it.

[0012] The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0013]

The following is a brief description of an outline of typical inventions disclosed in the present application.

(1) The transfer of wafers between a cassette for accommodating a plurality of wafers spaced apart from each other so as to be stacked and a processing jig for accommodating a plurality of wafers spaced apart from each other so as to be overlapped is performed. A method of manufacturing a semiconductor device in which a wafer is placed on a support at the tip of a robot arm, and held and transported, wherein a shape recognizing device detects a position of a wafer to be transferred and a positional relationship between components around the wafer. Controlling the transfer robot on the basis of the detection information to hold the wafer to be transferred on the support, and using the shape recognition device to determine the position of accommodating the wafer to be transferred and the positional relationship between the surrounding parts with the shape recognition device. Detecting, and controlling the transfer robot to accommodate the wafer to be transferred in a predetermined position.

According to the means (1), (a) when holding a wafer stored in a cassette or a heat treatment jig, a shape recognition device determines the position of the wafer to be transferred and the positional relationship between the surrounding parts. After the detection, the transfer robot is controlled based on the detection information, so that the wafer can be held without bringing the support at the tip of the arm of the transfer robot into an unnecessary (unwanted) position. When accommodating wafers in a cassette or heat treatment jig, the shape recognition device detects the accommodating position and the positional relationship between the surrounding parts, and then controls the transfer robot based on the detected information. The wafer can be accommodated in the wafer accommodating location without bringing the support at the tip of the arm of the loading robot into contact with an unnecessary (unwanted) location. Therefore, since the support and the arm do not contact unnecessary parts, the generation of foreign matter due to the contact does not occur,
It is possible to prevent the deterioration of the product quality due to the adhesion of foreign matter.

(B) The heat treatment jig is gradually deformed as it is repeatedly used. For example, the height of the groove for accommodating the wafer decreases, but the dimension of the groove itself does not change. Therefore, the wafer can be accommodated in the accommodation groove of the heat treatment jig with high precision, and the wafer can be unloaded with high accuracy from the accommodation groove of the heat treatment jig. It becomes longer, and reduction in heat treatment cost can be achieved.

(C) According to the above (a) and (b), it is possible to achieve an improvement in the yield and a reduction in the heat treatment cost and a reduction in the manufacturing cost of the semiconductor device.

[0018]

Embodiments of the present invention will be described below in detail with reference to the drawings. In all the drawings for describing the embodiments of the present invention, components having the same functions are denoted by the same reference numerals, and their repeated description will be omitted.

(Embodiment 1) FIGS. 1 to 8 relate to a method of manufacturing a semiconductor device according to an embodiment (Embodiment 1) of the present invention.

Before describing the method of manufacturing the semiconductor device according to the first embodiment, a vertical heat treatment apparatus, which is a heat treatment apparatus, will be described with reference to FIGS. FIG. 3 is a schematic perspective view showing an outline of a vertical heat treatment apparatus, FIG. 4 is a schematic view showing a loading / unloading state of a wafer in the vertical heat treatment apparatus, and FIG. 5 is a processing jig (heat treatment jig). FIG. 6 is a perspective view showing a portion, and FIG. 6 is a cross-sectional view along AA ′ in FIG.

As shown in FIG. 3, the vertical heat treatment apparatus 1
The whole is covered with a cover 2, and on one side thereof, a cassette stage 4 on which the cassette 3 is mounted is provided so as to be exposed. As shown in FIG. 4, the cassette stage 4 is configured to be turned 90 degrees inside the apparatus. In the first embodiment, the cassette stages 4 are
A table is provided.

Although not particularly limited, cassette shelves 15 are provided in two rows and three stages inside the cassette stage 4, and a heat treatment jig 3
0 is arranged. A cassette loader mechanism 5 is provided between the cassette shelf 15 and the cassette stage 4, and is configured to transfer the cassette 3 between the cassette stage 4 and the cassette shelf 15. In addition, cassette shelf 1
A transfer robot 20 is disposed between the heat treatment jig 30 and the heat treatment jig 30 to transfer the wafer (semiconductor substrate) 40 between the cassette 3 on the cassette shelf 15 and the heat treatment jig 30. Has become.

In this transfer state, the cassette 3 is in a posture for accommodating a plurality of wafers separated from each other so as to be stacked, and the heat treatment jig has a structure for accommodating a plurality of wafers separated from each other so as to be overlapped. ing.

The cassette loader mechanism 5 has an elevating body 6 that moves in the vertical direction, a support arm 7 protruding from a side surface of the elevating body 6, and a cassette loader 8 mounted on the support arm 7. Two elevating bodies 6 are provided with two guide shafts 9 and one screw shaft 10 so as to penetrate vertically. Screw shaft 10 rotates (forward or reverse)
Then, the elevating body 6 is guided by the guide shaft 9 and moves up or down.

A transfer rod 11 is provided on the cassette loader 8. The transfer rod 11 is provided on the upper surface of the cassette loader 8 so as to be able to move in and out, and makes a rectangular movement (tact movement) between the cassette stage 4 and the cassette shelf 15. At the same time, the cassette 3 is moved from the cassette shelf 15 to the cassette stage 4 turned inside out.

For this reason, in the cassette stage 4, the moving area in which the transfer rod 11 moves is a space, so that the movement of the transfer rod 11 is not hindered.

Heat treatment jig (also called boat) 30
Is mounted on a cap 33 which is mounted on a lifting arm 32 of a boat elevator 31. Cap 3
Reference numeral 3 denotes a flange 35 made of stainless steel for closing a vertically long chamber 34 having an opening at the bottom, a seal 36 attached to the flange 35 to keep the chamber airtight when the chamber 34 is closed by the flange 35, and an upper surface of the flange 35. A pedestal 37 made of quartz is mounted at the center.

The heat treatment jig 30 is, as shown in FIG.
Each of them is composed of a disc-shaped lower plate 38 and an upper plate 39, and four support shafts 40 connecting the lower plate 38 and the upper plate 39. Housing grooves 41 are provided inside these four at a predetermined pitch in the height direction. One wafer (semiconductor substrate) 42 is held in each accommodation groove 41 located on the same surface. That is, the wafer is held by being inserted into the respective accommodating grooves 41 in which the peripheral edge of the wafer is located on the same plane. For this reason, as shown by the arrow in FIG. 6, the support shaft 4 performs loading and unloading only from one direction.
0 is arranged.

The heat treatment jig 30 is made of, for example, quartz. FIG. 5 is a perspective view showing a part of the jig 30 for heat treatment, and the lower part of FIG. 5 is a schematic view showing a dimensional relationship between the accommodation groove 41 and the wafer 42. This example is an example,
The width of the accommodation groove 41 is 3.5 mm, and the thickness of the wafer 42 is 0.7 mm. Even if the width of the accommodating groove 41 is made sufficiently large with respect to the thickness of the wafer 42, the pedestal 37 is deformed by the repeated heat treatment, so that the loading and unloading of the wafer cannot be performed accurately.

The elevating arm 32 has a cassette loader mechanism 5
Similarly to the above, it is attached to two guide shafts 45 and one screw shaft 46, and is fixed to an elevating body 47 which moves up and down by rotation of the screw shaft 46.

At the time of loading, the heat treatment jig 30 is raised by rotating the screw shaft 46 in the normal direction, and is accommodated in the chamber 34. This enables heat treatment. Also, at the time of unloading, the heat treatment jig 30 is lowered by reversing the screw shaft 46 so that the chamber 34 is not rotated.
Can be moved downward.

The transfer robot 20 is mounted on two guide shafts 21 and one screw shaft 22 in the same manner as the cassette loader mechanism 5, and is moved up and down by rotation of the screw shaft 22. A support arm 24 extending laterally from 23, a main body 25 fixed to the top surface of the support arm 24 so as to be freely rotatable in a planar direction, and an arm mounted on the main body 25 and operating to expand and contract in the planar direction 26 has a head 27 arranged thereon. The arm 26
A support 2 for simultaneously mounting and holding a plurality of wafers 42 accommodated in the cassette 3 and the heat treatment jig 30
8 is attached. The use of a plurality (two or more) of the supports 28 instead of one (one) is for improving the processing efficiency.

Since the main body 25 can be controlled to move up and down and control the rotation, and the arm 26 can move forward and backward, the wafer 42 in the cassette 3 at a predetermined position on the cassette shelf 15 is held by the support 28. Thereafter, the wafer 42 can be supplied (loaded) into the accommodation groove 41 of the heat treatment jig 30. The reverse operation, that is, the wafer 42 can be taken out from the heat treatment jig 30 and collected (unloaded) into the cassette 3 of the cassette shelf 15.

In the vertical heat treatment apparatus 1 according to the first embodiment, a shape recognition device 29 is provided in front of both sides of the head 27. The shape recognition device 29 can recognize the shape of the cassette 3 on the cassette shelf 15 and the desired position of the heat treatment jig 30.

FIG. 1 is a schematic view showing a shape recognition mechanism at the time of transferring a wafer, and FIG. 2 is a schematic perspective view showing a wafer held on a support of a transfer robot. In these figures, one support member 28 is used, and a state in which one wafer 42 is transferred is schematically shown.

The transfer of the wafer 42 between the cassette 3 on the cassette shelf 15 and the heat treatment jig 30 is performed by the transfer robot 20. In FIG. 1, the cassette 3 on the cassette shelf 15 is shown.
FIG. 4 is a diagram illustrating a state in which a wafer 42 is taken out of FIG.

When the wafer 42 is taken out of the cassette 3 and when the wafer 42 is inserted into the heat treatment jig 30, it is necessary for the shape recognition device 29 attached to both sides of the head 27 of the transfer robot 20 before the operation starts. Recognize the shape of a location. That is, the shape recognition device 29 detects the position of the wafer to be transferred to the cassette 3 and the positional relationship between the surrounding parts. Further, with respect to the heat treatment jig 30, the shape recognizing device 29 detects the position for accommodating the wafer to be transferred and the positional relationship between the surrounding parts.

The transfer robot 20 is controlled based on the detected information, and all the wafers 42 stored in the cassette 3 are sequentially transferred to the heat treatment jig 30. FIG. 2 is a schematic diagram showing a state where the wafer 42 is placed and held on the support 28. Further, as the shape recognition device 29, a non-contact method is used, and although not particularly limited, a laser position sensor is used.

FIG. 7 is a block diagram showing a control system of the transfer robot 20. The transfer controller 6 includes a main controller 60 having an arithmetic processing unit 61 and a storage device 62.
The transfer robot 20 is controlled by the transfer controller 63.
And the shape recognition device 29 is controlled.

When the main controller 60 is started and supported, basic data is sent from the storage device 62 to the transfer controller 63. In addition, the transfer controller 6
The transfer robot 20 operates under the control of 3, and shifts to the shape recognition mode. At this stage, the transfer controller 63
, The shape recognition device 29 operates to perform shape recognition. This shape recognition data is sent to the transfer controller 63. The shape recognition data is sent to the arithmetic processing unit 61 of the main controller 60. The arithmetic processing unit 61 performs arithmetic processing based on the transmitted shape recognition data and basic data, and the control data is transferred to the transfer controller 6.
Sent to 3. The transfer controller 63 controls the transfer robot 20 based on the control data.

In the vertical heat treatment apparatus 1 having such a structure, heat treatment is performed in the manufacture of a semiconductor device. In addition, loading of the wafer during the heat treatment and unloading of the wafer after the completion of the heat treatment are performed. FIG. 8 is a flowchart showing a transfer operation for transferring a wafer from a cassette to a heat treatment jig.

At the start (step 101: S101), the transfer robot 20 operates to reach the basic position for taking out the wafer 42 from the cassette 3, and is ready for shape recognition (S102). When the transfer robot 20 is ready for shape recognition, the laser position sensor, which is the shape recognition device 29, operates (S103), and detects the position of the cassette 3 on the cassette shelf 15 to which the wafer is to be transferred (S104). The cassette position data, which is the shape recognition data, is sent to the main controller 60.

Next, the shape recognition device 29 operates again (S
106) Then, the cassette 3 to be transferred is
The position of the wafer 42 to be relocated is detected (S107). This shape recognition data is also sent to the main controller 60.

The main controller 60 having received the shape recognition data causes the calculation processing section 61 to perform a calculation process using the shape recognition data, sends a signal based on the calculation process to the transfer controller 63, and controls the transfer robot 20. It is operated (S108), and the wafer is taken out (S10).
9).

By the arm 26 whose positioning is controlled with high precision, the support 28 at the tip of the arm 26 is placed and held at an accurate position without contacting an undesired portion without damaging the wafer 42 to be transferred. Can be.

Next, the transfer robot 20 is operated again by the transfer controller 63 to operate the heat treatment jig (boat).
30 and reaches the basic position, ready for shape recognition (S
110). Thereafter, the laser position sensor operates (S1).
11), the position of the place where the wafers are accommodated is detected (S112). This shape recognition data is sent to the main controller 60.

The main controller 60 having received the shape recognition data causes the calculation processing section 61 to perform a calculation process using the shape recognition data, sends a signal based on the calculation process to the transfer controller 63, and controls the transfer robot 20. It is operated (S113), and the wafer 42 is housed in the predetermined housing groove 41 of the heat treatment jig 30 (S114). This allows
The transfer of one wafer 42 is completed.

Next, the transfer robot 20 operates under the control of the transfer controller 63, takes the basic position again with respect to the cassette 3, and takes a posture for shape recognition (S115).

Next, the shape recognition device 29 is operated,
It is detected whether or not the wafer 42 exists in the predetermined cassette 3 (S116). If the wafer 42 exists in the cassette 3 (YES), the process returns to S106, and the transfer operation is continued. If the wafer 42 does not exist in the cassette 3 (NO), the transfer robot 20 proceeds to the next basic position and takes a posture for shape recognition. At the next basic position, it is detected whether or not the cassette 3 is present on the cassette shelf 15 (S117), and if the cassette 3 is present (YE).
S) returns to S102 to continue the wafer transfer operation. When the cassette 3 does not exist (NO),
The wafer transfer operation ends (S118).

According to the first embodiment, the following effects are obtained.

(1) According to the method of manufacturing a semiconductor device of the first embodiment, the cassette 3 and the heat treatment jig (boat) 30
When holding the wafer 42 accommodated in the shape recognition device 29, the position of the wafer to be transferred and the positional relationship between the surrounding parts are detected by the shape recognition device 29, and then the transfer robot 20 is controlled based on the detected information. In addition, the wafer 42 can be held without bringing the support 28 at the tip of the arm 26 of the transfer robot 20 into an unnecessary (unwanted) place, and the wafer 42 is stored in the cassette 3 or the heat treatment jig 30. At this time, since the transfer robot 20 is controlled based on the detected information after detecting the position of the accommodation and the positional relationship between the surrounding parts by the shape recognition device, the support at the tip of the arm 26 of the transfer robot 20 is used. 28
The wafer 42 can be accommodated in the accommodating portion of the wafer without contacting the wafer 42 with an unnecessary (unwanted) portion.

As described above, since the transfer of the wafer 42 is performed while controlling in a closed loop, the support 28 and the arm 26 are controlled with high precision, and the support 28 and the arm 26 come into contact with unnecessary parts. Therefore, the generation of foreign matter due to contact does not occur, and the deterioration of product quality due to the adhesion of foreign matter can be prevented.

(2) The heat treatment jig 30 is gradually deformed as it is repeatedly used.
Although the height of the accommodation groove 41 decreases, the dimensions of the accommodation groove itself do not change.
Since the wafer 42 can be accommodated in the accommodating groove 41 of the heat treatment jig 30 with high accuracy, and the wafer 42 can be unloaded from the accommodating groove 41 of the heat treatment jig 30 with high accuracy.
The service period of the heat treatment jig 30 is lengthened, and the heat treatment cost can be reduced.

(3) Since the arm 26, the support 28 and the wafer 42 come into contact with an undesired portion, and the arm 26 and the support 28 do not come into contact with the wafer 42, the operation rate is reduced due to a trouble in the apparatus. And an improvement in the operation rate can be achieved.

(4) According to the above (1) to (3), it is possible to achieve a reduction in the manufacturing cost of the semiconductor device due to an improvement in the yield, a reduction in the heat treatment cost, and an improvement in the operation rate.

(5) Since a contact accident can be suppressed, the generation of foreign matters due to the contact is reduced, and the quality can be improved.

(Embodiment 2) FIG. 9 is a schematic view showing a wafer transfer mechanism of a vertical heat treatment apparatus according to another embodiment (Embodiment 2) of the present invention. In the second embodiment, the shape recognition device 29 is not provided on the head 27, but is fixedly arranged at a non-operating portion to perform shape recognition of the cassette 3, the support 28, and the heat treatment jig 30.

In the second embodiment, the same effects as in the first embodiment can be obtained.

Although the invention made by the inventor has been specifically described based on the embodiments, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the gist of the invention. Needless to say.

[0060]

The effects obtained by the representative ones of the inventions disclosed in the present application will be briefly described as follows.

(1) In the vertical heat treatment apparatus of the present invention, when the transfer robot performs the transfer of the wafer between the cassette and the heat treatment jig, the position of the wafer to be transferred and the positional relationship of each part around it. After the wafer is detected by the shape recognition device, the transfer robot is controlled based on the detection information to hold the wafer to be transferred, and when the wafer is accommodated in the heat treatment jig, the position for accommodating the wafer and its surroundings. Since the positional relationship of each part is detected by the shape recognition device and the transfer robot is controlled based on this detection information, it is possible to transfer wafers with high accuracy, prevent contact accidents, and suppress foreign matter generation due to contact. As a result, a high quality semiconductor device can be manufactured at low cost.

(2) Since the shape of the receiving groove of the heat treatment jig is recognized and the transfer robot is controlled based on the recognition, the deformation of the heat treatment jig can be well followed.
A long life of the heat treatment jig can be achieved, and a reduction in the manufacturing cost of the semiconductor device can be achieved.

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing a shape recognition mechanism when a wafer is transferred in a vertical heat treatment apparatus according to an embodiment (Embodiment 1) of the present invention.

FIG. 2 is a schematic perspective view showing a wafer held on a support of the transfer robot.

FIG. 3 is a schematic perspective view showing an outline of the vertical heat treatment apparatus of the first embodiment.

FIG. 4 is a schematic diagram showing a loading / unloading state of a wafer in the vertical heat treatment apparatus of the first embodiment.

FIG. 5 is a perspective view showing a part of a processing jig in the vertical heat treatment apparatus of the first embodiment.

FIG. 6 is a cross-sectional view of the processing jig along AA ′ in FIG. 4;

FIG. 7 is a block diagram illustrating a control system of a transfer robot in the vertical heat treatment apparatus according to the first embodiment.

FIG. 8 is a flowchart illustrating a method for manufacturing a semiconductor device by the vertical heat treatment apparatus of the first embodiment.

FIG. 9 is a schematic view showing a wafer transfer mechanism of a vertical heat treatment apparatus according to another embodiment (Embodiment 2) of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Vertical heat processing apparatus, 2 ... Cover, 3 ... Cassette, 4 ...
Cassette stage, 5: cassette loader mechanism, 6: elevating body, 7: support arm, 8: cassette loader, 9: guide shaft, 10: screw shaft, 11: transfer rod, 15: cassette shelf,
20: transfer robot, 21: guide shaft, 22: screw shaft,
23 ... elevator, 24 ... support arm, 25 ... body, 26 ...
Arm, 27 head, 28 support, 29 shape recognition device, 30 heat treatment jig, 31 boat elevator,
32: lifting arm, 33: cap, 34: chamber,
35 ... flange, 36 ... seal, 37 ... pedestal, 38 ... lower plate, 39 ... upper plate, 40 ... support shaft, 41 ... accommodation groove, 42 ... semiconductor substrate (wafer), 45 ... guide shaft, 46 ... screw shaft, 47 ... elevator, 60 ... main controller, 61 ...
Arithmetic processing unit, 62: storage device, 63: transfer controller.

 ──────────────────────────────────────────────────続 き Continued on front page F term (reference) 3F059 AA01 AA14 AA16 BA04 BA08 DA02 DC07 DD11 DE04 FB12 5F031 CA02 DA01 FA01 FA03 FA07 FA11 FA12 GA02 GA36 GA49 HA62 HA67 JA01 JA22 JA51 KA10 KA15 LA12 MA28 MA30 PA20 PA26 5F194505 EM08 EN04 EN05 EN06 GB15

Claims (1)

[Claims] 1. A transfer robot for transferring a wafer between a cassette accommodating a plurality of wafers spaced apart from each other so as to overlap and a processing jig accommodating a plurality of wafers spaced apart from each other so as to overlap. A method for manufacturing a semiconductor device in which a wafer is placed on a support at the tip of an arm and held and transported, and a step of detecting the position of the wafer to be transferred and the positional relationship of each part around the wafer with a shape recognition device, A step of controlling the transfer robot on the basis of the detection information to hold a wafer to be transferred on the support, and detecting the position of accommodating the wafer to be transferred and the positional relationship between the surrounding parts with the shape recognition device. And controlling the transfer robot to accommodate the wafer to be transferred at a predetermined position.