JP2002009265A - Solid-state image pickup device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a solid-state image pickup device in which a solid-state image pickup element and a protective transparent component are bonded together by encapsulating resin around the periphery of the device leaving a space so that the sealing resin via not infiltrate into the interior and contaminate the image pickup surface. SOLUTION: A solid-state image pickup device 1 has a structure that an image pickup surface 12 of a solid-state image pickup element 11 is bonded facedown to a glass substrate 14. A bump 13 formed on solid-state image pickup element 11 and a wiring circuit 15 for med on a glass substrate 14 are connected, and the periphery of the element is sealed with an ultraviolet curing encapsulating resin 19. A recess 16, which has a larger area than the image pickup surface 12, is formed inside the glass substrate 14. Since the distance between the solid-state image pickup element 11 and the glass substrate 14 becomes longer due to the recess 16, which interrupts the capillary phenomenon, contamination of the image pickup surface 12 due to sufiltration of the encapsulating resin 19 is prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid-state imaging device, and more particularly, to a solid-state imaging device in which a sealing resin for sealing a peripheral portion between an imaging surface of a solid-state imaging device and a transparent component for protecting the imaging surface is sealed. The present invention relates to a solid-state imaging device that does not sometimes enter an imaging surface.

[0002]

2. Description of the Related Art Conventionally, a solid-state imaging device is manufactured by accommodating a solid-state imaging device in a package and covering it with a protective glass plate. FIG. 10 shows such a solid-state imaging device 10.
0 is a longitudinal sectional view showing a ceramic package 1;
08 and the solid-state imaging device 101 with the imaging surface 102 facing up.
Is electrically bonded to the wiring circuit (not shown) by, for example, wire bonding with a gold wire 106, and a glass plate 104 for containing and protecting gas is sealed with a sealing resin 109. It is made by attaching. The sealing resin 109 also serves as an adhesive, and some of the package 108 is made of plastics.

However, as solid-state imaging devices are widely used in digital cameras, endoscopes, etc., including 8 mm video cameras, thinning, miniaturization, and low cost are required. Instead of a bonding method, a flip-chip method in which a solid-state image sensor is connected face-down to a glass substrate that also serves as a protective transparent component with a wiring circuit, and a transparent transparent board with a solid-state image sensor connected face-down It is manufactured by a tape carrier system that is attached to parts.

FIG. 6 is a perspective view showing components of a solid-state imaging device 200 in which a solid-state imaging device is connected face-down to a glass substrate by a flip-chip method. FIG. 6A shows the solid-state imaging device 201 and the protective transparent component 204 before connection. That is, the connection pump 2 is connected to the protection transparent component 204 provided with the wiring circuit 205.
The solid-state image sensor 201 provided with the image sensor 03 is superposed with the image pickup surface 202 facing down, and the bump 203 and the wiring circuit 205 are connected by heating and pressing. Subsequently, in order to protect the imaging surface 202 and prevent deterioration of optical sensitivity, the peripheral portion of the superimposed solid-state imaging device 201 and the protective transparent component 204 is sealed with a sealing resin 209, thereby obtaining the image shown in FIG. Is obtained. FIG. 7 is a longitudinal sectional view of the solid-state imaging device 200 shown in FIG. 6B. In general, a semi-convex lens for condensing light is formed on each pixel of the imaging surface 202 in order to improve the light sensitivity of the solid-state imaging device 201.

As the sealing resin 209, an ultraviolet curable resin or a thermosetting resin is used. The sealing resin is applied in a state before curing and is immediately cured, as shown in FIG. Referring also to FIG. 6A, the gap g ₀ of the space 207 between the solid-state imaging device 201 and the protective transparent component 204 determined by the bump 203 and the wiring circuit 205 is 0.0
Since it is as small as 3 to 0.1 mm, the uncured low-viscosity sealing resin 209 easily enters the interior due to a capillary phenomenon during the curing process, reaches the imaging surface 202 of the solid-state imaging device 201, and easily contaminates it. In other words, if the penetrating sealing resin 209 is an opaque product, it does not transmit light, and
2 has a substantially reduced area, and the effect of the semi-convex lens on the imaging surface 2 is impaired even if the product is transparent. Therefore, the application process of the sealing resin requires strict control of the application amount.

On the other hand, Japanese Patent Application Laid-Open No. Hei 6-37143 exemplifies a solid-state imaging device in which a solid-state imaging device is provided with a frame-like structure so as to surround an imaging surface to stop the flow of a sealing resin. Have been. FIG. 8 shows such a solid-state imaging device 3.
It is an expanded sectional view of the end of 00. A solid-state imaging device 301 is connected face-down via a bump 303 to a glass substrate 304 provided with a wiring 305, and a height 5
Frame-shaped structure 3 made of a gold plating film having a thickness of 0 μm and a width of 80 μm
06 so as to surround the imaging surface 302.
It is fixed to both the surface and the surface of the glass substrate 304. Then, the outside thereof is filled with a sealing resin 309. Such a solid-state imaging device 300 includes a sealing resin 3
Even if 09 has a relatively low viscosity, the frame-shaped structure 306 stops the flow of the sealing resin 309 and thus does not enter the imaging surface 302.

[0007] A solid-state imaging device in which a raised portion is provided around an opening provided in a flexible substrate as a carrier tape of the solid-state imaging device to stop the flow of the sealing resin is also conceivable. FIG. 9 shows such a solid-state imaging device 400.
It is an expanded sectional view of the end part. That is, the solid-state imaging device 4
00, the bumps 403 provided on the electrodes 403e of the solid-state imaging device 401 are pressed or soldered to the wiring circuit pattern 405 on the flexible substrate 407, and the solid-state imaging device 401 is connected face-down. , The solid-state imaging device 401, the flexible substrate 407, and the transparent substrate 40.
The sealing resin 409 made of an ultraviolet curable resin or a thermosetting resin is applied to the periphery of No. 4 and cured.
A raised portion 406 lower than the bump 403 is provided around the opening 407h of the flexible substrate 407 corresponding to the imaging surface 402 of the solid-state imaging device 401 by, for example, a photoresist film or a plating film. Such a solid-state imaging device 400 blocks the sealing resin 409 into which the raised portion 406 enters, and the imaging surface 40 of the solid-state imaging device 401.
2, it is said that good imaging quality can be obtained.

[0008]

In the solid-state imaging device 200 shown in FIG. 7, it is difficult to strictly control the application amount of the sealing resin in mass production. Also, a solid-state imaging device 300 provided with a frame-shaped structure 306 around an imaging surface 302 of a solid-state imaging device 301 according to JP-A-6-37143, and a solid-state imaging device provided with a raised portion 406 around an opening 407h of a flexible substrate 407. The imaging device 400 is an effective method for preventing the sealing resin from invading the imaging surface, but in any case, a solid-state imaging device or a plating film or a flexible substrate by a high-precision photolithography technique. It requires the formation of a photoresist film. In a solid-state imaging device in which a solid-state imaging device is connected face-down to a glass substrate or a transparent substrate, the space between the imaging surface and the substrate depends on the height of bumps or the like used for electrical connection. It is determined almost unambiguously, and the interval can not be changed drastically.However, if the interval of the space can be increased, for example, when dust adheres to the imaging surface side of the substrate, the shadow of the dust It is expected that the reflection on the imaging surface will be reduced.

The present invention has been made in view of the above-described problems, and requires a high-precision photolithography technique in a solid-state imaging device in which a solid-state imaging device is connected face-down to a substrate and covered with a protective transparent component. It is an object of the present invention to provide a solid-state imaging device that can be manufactured easily and can prevent contamination of an imaging surface of a solid-state imaging device due to penetration of a sealing resin.

[0010]

Means for Solving the Problems The above-mentioned problems can be solved by the structure of claim 1. The means for solving the problems will be described as follows.

In the solid-state imaging device according to the first aspect, a solid-state imaging device having an imaging surface connected face-down to a substrate and a protective transparent component for protecting the solid-state imaging device are joined with a narrow space, and the joining is performed. In a solid-state imaging device in which the peripheral portion of the object is sealed with a sealing resin, a recess having a larger area than the imaging surface or a shape enclosing an area larger than the imaging surface is formed on the inner surface of the protective transparent component facing the imaging surface. This device has an annular groove. In such a solid-state imaging device, even if the low-viscosity sealing resin applied enters the interior due to capillary action, the capillary action is cut off by a dent or an annular groove formed on the inner surface of the transparent component. Then, the penetration of the sealing resin is stopped. In addition, since the recess provided in the transparent component increases the distance between the solid-state imaging device and the protective transparent component, the shadow of dust adhering to the inner surface of the protective transparent component is reflected on the imaging surface. It has the secondary effect of reducing.
Although the annular groove does not provide such a secondary effect, by forming a shallower dent than the above-described dent inside the annular groove, a secondary effect that cannot be obtained only with the annular groove is provided. be able to.

According to a second aspect of the present invention, a wiring circuit for connecting the solid-state imaging device is formed on the protective transparent component, and the substrate and the protective transparent component are integrated. Device. In such a solid-state imaging device, a solid-state imaging device is connected to, for example, a glass substrate under heat and pressure via bumps by a flip-chip method, and has a simplest configuration and is thinner and smaller. . The solid-state imaging device according to claim 3 is dependent on claim 1, wherein the substrate is a flexible substrate, and the solid-state imaging device is connected face-down so that an imaging surface is positioned within an opening frame of the flexible substrate. This is a device in which a protective transparent component is joined to the surface opposite to the connection surface. Such a solid-state imaging device is manufactured with high mass productivity, for example, a TAB tape to which a solid-state imaging device is connected by a tape carrier method and a protective transparent component are bonded with an adhesive.

According to a fourth aspect of the present invention, in the solid-state imaging device according to the first aspect, the thin portion of the protection transparent component formed by the depression has a flat plate shape.
Alternatively, the device is formed in a lens shape. Such a solid-state imaging device is generally widely used by forming a thin portion of a protective transparent component through which imaging light is transmitted into a flat plate shape, and by forming a thin lens portion into a lens shape, thereby wide-angle imaging or telephoto. It is possible to perform various imaging. The solid-state imaging device according to claim 5 is a device in which the protective transparent component is transparent to visible light, infrared light, or ultraviolet light. Such a solid-state imaging device can capture an infrared image with a protective transparent component that is transparent to infrared rays, and can capture an infrared image with a protective transparent component that is transparent to ultraviolet rays, in addition to imaging under general visible light. Imaging is possible.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS As described above, the solid-state imaging device according to the present invention has a narrow space in which a solid-state imaging device having an imaging surface connected face-down to a substrate and a protective transparent component for protecting the solid-state imaging device are narrow. In a solid-state imaging device in which the peripheral portion of the joined product is sealed with a sealing resin, a recess having a larger area than the imaging surface on the inner surface facing the imaging surface of the protective transparent component, or This is an apparatus provided with an annular groove having a shape surrounding an area larger than the imaging surface. A recess may be further formed inside the annular groove. When the material for the protective transparent component is made of glass or plastics, the dents and annular grooves in these protective transparent components are obtained by putting them in a mold in a molten state, pressurizing and cooling,
Of course, a block-shaped object may be cut off, and in the case of a dent, it can be obtained by laminating a flat plate and a frame-shaped plate.

The substrate may be a protective transparent component provided with a wiring circuit to which a solid-state imaging device is to be connected, for example, a glass plate provided with a wiring circuit, that is, a glass substrate. It may be a substrate. Further, the substrate may be a flexible tape carrier provided with a wiring circuit to which a solid-state imaging device is to be connected. In this case, the surface of the tape carrier opposite to the surface to which the solid-state imaging device is connected is bonded to the protective transparent component.

The sectional shape of the thin portion due to the depression of the protective transparent component is not particularly limited, but is generally a plate having a uniform thickness. However, the lens may have a non-uniform thickness, and in this case, one surface may be planar. Furthermore, the protective transparent component may be glass or a transparent synthetic resin. Of course, transparency includes not only transparency to visible light but also transparency to infrared or ultraviolet light.

[0017]

Next, the solid-state imaging device of the present invention will be described by way of an embodiment.
This will be specifically described with reference to the drawings.

(Embodiment 1) FIG. 1 is a sectional view of a solid-state imaging device 1 according to Embodiment 1 and corresponds to FIG. 7 shown in a conventional example. FIG. 2 is an enlarged cross-sectional view of a portion indicated by a mark in FIG. The solid-state imaging device 1 includes a solid-state imaging device 11
Are connected to the glass substrate 14 with the imaging surface 12 facing down. That is, the bump 13 made of, for example, gold and the glass substrate 14 formed on the solid-state imaging device 11 are formed.
The heating is performed by aligning the wiring circuit 15 formed in
They are connected under pressure. A depression 16 is formed on the surface of the glass substrate 14 facing the imaging surface 12 of the solid-state imaging device 11 with a larger area than the imaging surface 12.
The space 17 above the depression 16 is formed by the bump 13 and the wiring circuit 15.
This is an intrinsic space between the solid-state imaging device 11 and the glass substrate 14 determined by The bumps 13 made of solder may be used instead of the bumps 13 made of gold.
The connection in that case is possible only by heating.

The above-mentioned solid-state image pickup device 11 and glass substrate 14
In a state where the sealing resin 19 is connected via the bump 13, an ultraviolet-curable sealing resin 19 before curing is applied to a peripheral portion thereof by a dispenser. After the application, the sealing resin 19 is cured by irradiating ultraviolet rays. In the process, the uncured low-viscosity sealing resin 19 forms a narrow space 17 between the solid-state imaging device 11 and the glass substrate 14 or the solid-state imaging device 11.
The space between the wiring circuit 15 and the wiring circuit 15 is penetrated by capillary action and enters the inside. As shown in FIG.
By a recess 16 is provided to the original space 17 to 4, capillary action because the gap size indicated by the arrow g ₁ is formed between the bottom surface and recess 16 of the solid-state imaging device 11 Then, the sealing resin 19 is suspended in the vertical direction at a position where the sealing resin 19 slightly enters the depression 16 and is stopped. Then, as the ultraviolet curing proceeds, the sealing resin 19 is completely solidified in the state shown in FIG.

In this manner, the contamination of the imaging surface 12 of the solid-state imaging device 11 by the infiltrating sealing resin 19 can be completely prevented, and excellent imaging quality can be obtained. Further, since the occurrence of defective products in which the sealing resin 19 contaminates the imaging surface 12 is prevented, the product yield is improved, and the productivity of the manufacturing line is improved. Further, the image pickup surface 12 of the solid-state imaging device 11 and the inner surface of the glass substrate 14 (the depression 1
6 (the bottom surface of the glass substrate 6), even if dust adheres to the inner surface of the glass substrate 14, the shadow of dust on the imaging surface 12 is reduced. Effect is obtained.

(Embodiment 2) FIG. 3 is an enlarged sectional view of the solid-state imaging device 2 of Embodiment 2 similar to FIG. 2 of Embodiment 1. Among the constituent elements, those in common with the constituent elements of the solid-state imaging device 1 of the first embodiment are denoted by the same reference numerals in the twentieth unit, and the description thereof is omitted. Will be explained. That is, as shown in FIG. 3, the glass substrate 24 facing the imaging surface 22 of the solid-state imaging device 21.
An annular groove 28 having a shape surrounding an area larger than the imaging surface 22 is formed instead of the depression 16 of the first embodiment. Although the annular groove 28 is shown as a trough-shaped groove, of course,
It may be a round trough-shaped groove.

As in the first embodiment, the solid-state imaging device 21
In a state where the glass substrate 24 and the glass substrate 24 are connected, an ultraviolet-curable sealing resin 29 before curing is applied to a peripheral portion thereof by a dispenser, and the sealing resin 29 is cured by irradiating ultraviolet rays. And the uncured low-viscosity sealing resin 29 is used for the space 2 between the solid-state imaging device 21 and the glass substrate 24.
7 penetrate by capillary action and reach the annular groove 28. However, since the size of the gap indicated by the arrow g ₂ between the bottom surface and the annular groove 28 of the solid-state imaging device 21 is formed by the annular groove 28 is cut standing capillary action, the sealing resin 29 Intrusion is stopped at a position slightly entering the annular groove 28, and solidification is caused by the progress of ultraviolet curing. In the solid-state imaging device 2 according to the second embodiment, the contamination of the imaging surface 22 by the sealing resin 29 can be sufficiently prevented. However, since the gap of the space 27 is not increased, the solid-state imaging device 2 as in the first embodiment is used. However, the effect of reducing the reflection of dust shadows on the inner surface of the glass substrate 24 on the imaging surface 22 cannot be obtained.

(Embodiment 3) FIG. 4 is an enlarged sectional view of the solid-state imaging device 3 of Embodiment 3 similar to FIG. 3 of Embodiment 2. Among the constituent elements, those common to the constituent elements of the solid-state imaging device 2 according to the second embodiment are denoted by the same reference numerals in the thirties and the description thereof is omitted, and different constituent elements are mainly described. Will be explained. That is, as shown in FIG. 4, the solid-state imaging device 3 is provided on the surface of the glass substrate 34 facing the imaging surface 32 of the solid-state imaging Providing a large annular groove 38,
A recess 36 shallower than the annular groove 38 inside the annular groove 38
Is formed. As in the case of the second embodiment, the uncured sealing resin 39 penetrating into the interior due to the capillary phenomenon.
Reaches the annular groove 38, the capillary action is cut off, and the intrusion is stopped. The depression 36 formed inside the annular groove 38 is shallower than the depression 16 provided in the glass substrate 14 of the solid-state imaging device 1 of the first embodiment, but is between the surface of the solid-state imaging device 31 and the bottom surface of the depression 36. it is possible to set the size of the gap g ₃ space appropriately.

(Embodiment 4) Embodiments 1 to 3 illustrate a solid-state imaging device in which a solid-state imaging device is connected to a glass substrate by a flip-chip method. The case of connecting to a protective transparent component by a carrier system is shown. That is, FIG. 5 is an enlarged cross-sectional view illustrating an end of the solid-state imaging device 4 according to the fourth embodiment.
As shown in FIG. 5, the solid-state imaging device 4 includes an imaging surface 42 of a solid-state imaging device 41 in a frame of an opening 47h of a flexible substrate 47 for TAB (tape automatic bonding) made of, for example, a copper foil-bonded polyimide sheet. Heating, pressing and connecting the bump 43 of the solid-state imaging device 41 to the wiring circuit 45 of the flexible substrate 47 so as to be located,
Adhesive 4 to glass plate 44 as a transparent part for protection
After joining at step 8, an ultraviolet-curing sealing resin 49 before curing is applied to the peripheral portion, and the resin is irradiated with ultraviolet rays to be light-cured to be manufactured. The glass plate 44 is provided with a depression 46 having an area larger than the imaging surface 42 at a portion corresponding to the opening 47h of the flexible substrate 47. Thus between the bottom surface and recess 46 of the solid-state imaging device 41, the gap size indicated by the arrow g ₄ are formed.

That is, while the sealing resin 49 is being cured, the low-viscosity uncured sealing resin 49 penetrates into the gap between the solid-state imaging device 41 and the flexible substrate 47 by capillary action. The capillarity breaks down to the depression 46 provided in the plate 44 and the intrusion is stopped, so that the solid-state imaging device 41 using the sealing resin 49 is formed.
Of the imaging surface 42 is prevented.

Although the solid-state imaging device of the present invention has been described in detail with reference to the embodiments, it is needless to say that the present invention is not limited to this, and various modifications can be made based on the technical concept of the present invention. .

For example, in the solid-state imaging device 2 according to the second embodiment, a simple annular groove 28 is provided in the glass substrate 24, but as long as the low-viscosity sealing resin 29 is stopped from entering, the annular groove 28 may have a plurality of annular grooves. The arc-shaped groove may be formed annularly via a narrow boundary wall. Further, a plurality of annular grooves may be provided concentrically. Further, in the solid-state imaging device 3 according to the third embodiment, the recess 36 continues inside the annular groove 38.
Is provided, but a recess 36 is formed inside the annular groove 38.
May be provided independently.

In each embodiment, the solid-state image pickup device and the solid-state image pickup device which is a component thereof have been described as being square. However, other solid-state image pickup devices may be polygonal, circular or elliptical. The shapes of the imaging device and the solid-state imaging device are not limited. In the fourth embodiment, the flexible substrate for TAB is exemplified by a copper foil-bonded polyimide sheet. However, a flexible substrate made of any other material may be used. Not limited. Further, in each of the embodiments, the ultraviolet curable resin is used as the sealing resin, but it goes without saying that a thermosetting resin may be used.

Further, in each of the embodiments, as a transparent component for protection, one made of glass, such as a glass substrate or a glass plate, is exemplified.
For example, quartz or transparent quartz may be used, or a transparent synthetic resin such as a polycarbonate resin or a polyacrylate resin may be used. In addition, in addition to materials that are transparent to visible light,
It is possible to take an infrared image of an object using potassium bromide (KBr) or polyethylene that is transparent to infrared rays, and use calcium fluoride (CaF ₂ ) or fluororesin as a material that is transparent to ultraviolet rays. Thus, an ultraviolet image can be captured.

[0030]

The present invention is embodied in the form described above, and has the following effects.

According to the solid-state imaging device of the first aspect, on the inner surface side of the protective transparent component facing the imaging surface of the solid-state imaging device,
A recess having an area larger than the imaging surface or an annular groove having a size surrounding the area larger than the imaging surface is provided, and a distance between the surface of the solid-state imaging device and the bottom of the depression or the surface of the solid-state imaging device and the bottom of the annular groove is large. Therefore, the capillarity is cut off by the depression or the annular groove, the intrusion of the sealing resin is stopped, and the imaging surface is not contaminated, so that good imaging quality can be obtained.
It also improves product yield and productivity. Further, in the case of the recessed portion, the distance between the surface of the solid-state imaging device and the inner surface of the protective transparent component (the bottom surface of the recess) becomes large, so that dust adheres to the inner surface of the protective transparent component. Even if there is, the reflection of the shadow on the imaging surface is reduced.

According to the solid-state imaging device of the second aspect, the wiring circuit is formed on the protective transparent component and the solid-state imaging device is directly connected, so that the configuration is simple and the transmission efficiency of the imaging signal is excellent. Further, a solid-state imaging device in which an imaging surface is not contaminated is provided. According to the solid-state imaging device of the third aspect, the imaging surface of the solid-state imaging device is positioned in the opening frame of the flexible substrate, and the solid-state imaging device connected in advance to the wiring circuit of the flexible substrate is joined to the protective transparent component. Therefore, a solid-state imaging device with good mass productivity and no contamination of the imaging surface is provided.

According to the solid-state image pickup device of the fourth aspect, the thin transparent portion of the protective transparent component formed by the depression is generally widely used, and the thin transparent portion is widely used in the form of a lens. And telephoto imaging. According to the solid-state imaging device of the fifth aspect, a transparent transparent component for visible light is generally widely used, and a transparent transparent component for infrared is used for imaging an infrared image, and a transparent transparent component for ultraviolet light is used for an ultraviolet image. Imaging is possible.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view of a solid-state imaging device according to a first embodiment.

FIG. 2 is a partially enlarged cross-sectional view of a portion marked with “〇” in FIG. 1;

FIG. 3 is a partially enlarged cross-sectional view of a solid-state imaging device according to a second embodiment.

FIG. 4 is a partially enlarged cross-sectional view of a solid-state imaging device according to a third embodiment.

FIG. 5 is a partially enlarged cross-sectional view of a solid-state imaging device according to a fourth embodiment.

FIG. 6 is a perspective view showing components of a conventional solid-state imaging device using a flip-chip method, wherein A shows a solid-state imaging device and a protective transparent component, and B shows a connected solid-state imaging device and a protective transparent component. 5 shows a solid-state imaging device formed by sealing a peripheral portion of the solid-state imaging device with a sealing resin.

FIG. 7 is a longitudinal sectional view of the conventional solid-state imaging device of FIG. 6B.

FIG. 8 is a partially enlarged cross-sectional view of another conventional solid-state imaging device using a flip-chip method.

FIG. 9 is a partially enlarged cross-sectional view of a conventional solid-state imaging device using a carrier tape system.

FIG. 10 is a longitudinal sectional view of a conventional solid-state imaging device using a wire bonding method in which a solid-state imaging device is housed in a package.

[Explanation of symbols]

1 ... solid-state imaging device, 11 ... solid-state imaging device, 12 ...
Imaging surface, 13 ... bump, 14 ... glass substrate, 15 ...
... wiring circuit, 16 ... recess, 17 ... space, 19 ... sealing resin, 28 ... annular groove.

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H04N 5/335 H01L 27/14 D (72) Inventor Shinichi Nakata 6-7 Kita Shinagawa, Shinagawa-ku, Tokyo 35 Inside Sony Corporation (72) Inventor Atsushi Tsukada 6-7-35 Kita-Shinagawa, Shinagawa-ku, Tokyo Sony Corporation (72) Keiji Sasano 6-35, Kita-Shinagawa, Shinagawa-ku, Tokyo Sony Corporation F term (reference) 4M109 AA01 BA04 CA06 DB06 GA01 4M118 AA10 AB01 GD03 GD07 HA05 HA10 HA11 HA14 HA25 HA26 HA27 HA31 5C024 CY47 CY48 EX23 EX24 EX25 GY01

Claims (5)

[Claims] 1. A solid-state imaging device having an imaging surface connected face-down to a substrate and a transparent protective component for protecting the solid-state imaging device are joined with a small space therebetween, and a peripheral edge of the joined product is sealed. In the solid-state imaging device sealed with a sealing resin, an inner surface of the protection transparent component facing the imaging surface, a recess having a larger area than the imaging surface, or a ring having a shape surrounding an area larger than the imaging surface. A solid-state imaging device having a groove. 2. A wiring circuit for connecting the solid-state imaging device to the protective transparent component is formed, and the substrate and the protective transparent component are integrated. Item 2. The solid-state imaging device according to Item 1. 3. The substrate is a flexible substrate, and the solid-state imaging device is connected face-down so that the imaging surface is positioned within an opening frame of the flexible substrate, and is opposite to a connection surface of the solid-state imaging device. The solid-state imaging device according to claim 1, wherein the protective transparent component is bonded to a side surface. 4. The solid-state imaging device according to claim 1, wherein the thin portion of the protection transparent component formed by the recess is formed in a flat plate shape or a lens shape. 5. The solid-state imaging device according to claim 1, wherein the transparent component for protection is transparent to visible light, infrared light, or ultraviolet light.