JP2001176994A - Cover member for sealing electronic component mounting container, electronic component housing structure and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component housing structure which can prevent a bad outer appearance and faulty electric characteristics such as short circuits caused by the flow of a sealing material. SOLUTION: An electronic component 105 is housed in an electronic component housing container 103. A cover member 101 is bonded to the electronic component housing container 103 through the sealing material 107. The cover member 101 is formed with projections 109a, 109b in correspondence with sealing areas A1, A2, causing a distance(d) between the main body of the cover member 101 and the container 103. Due to this structure, the overflowing of the sealing material 107 into the inside or outside of the container 103 can be prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cover member for sealing an electronic component mounting container, a storage structure for an electronic component, and a method for manufacturing the electronic component storage structure. The present invention relates to a lid member for sealing an electronic component mounting container, an electronic component storage structure, and a method of manufacturing an electronic component storage structure that can prevent poor electrical characteristics such as the above.

[0002]

2. Description of the Related Art Conventionally, a technique for accommodating electronic components by sealing a container for mounting the electronic components has been known.

FIG. 4 is a sectional view showing a conventional electronic component storage structure. Referring to FIG.
An electronic component (device) 105 is mounted on the device. The cover member 101 is attached to the electronic component mounting container 103 with the sealing material 107.
Is glued. The electronic component mounting container 103 is made of ceramic or the like, and the lid member 101 is made of metal. The sealing material 107 is made of a metal brazing material (solder or Au).
/ Sn).

[0004] Such a structure is manufactured by the following steps. That is, the cover member 101 is formed by punching a metal coil (or hoop) into the size of the electronic component mounting container 103. Next, the lid member 10
1 is coated with a sealing material 107 by plating or cladding. The lid member 1 on which the sealing material 107 is applied
No. 01 and the sealing side of the electronic component mounting container 103 are brought into contact with each other, and heating is performed in a state where a load is applied.
By melting 7, the lid member 101 and the electronic component mounting container 103 are bonded to each other.

[0005]

However, in the case where the electronic component mounting container is sealed with a lid in which a sealing material is applied to a metal material as described above, sealing conditions (temperature and load) are required.
As shown in FIG. 5, due to variations in the flatness of the container sealing portion and variations in the lid (difference in the thickness of the sealing material), the surplus sealing material 107 flows out, and the electronic component mounting container 103 The appearance defect that sticks out and the electronic component mounting container 10
In some cases, electrical characteristics failure such as short-circuit due to the flow of the sealing material 107 into the inside 3 may occur.

SUMMARY OF THE INVENTION Accordingly, the present invention provides a lid member for sealing a container for mounting an electronic component, an electronic component storage structure, and an electronic component, which can prevent poor appearance or short circuiting and other electrical characteristics when manufacturing an electronic component storage structure. It is an object of the present invention to provide a method for manufacturing a storage structure.

[0007]

According to one aspect of the present invention, there is provided an electronic component-mounting container sealing cover member for sealing an electronic component-mounting container. A container sealing lid member, comprising a projection provided at a portion in contact with the container, wherein when the container is sealed, there is an interval between the container and the lid member main body due to the projection. I do.

As described above, by using the projections and providing a space between the container and the lid member main body, it is possible to prevent the surplus sealing material from moving outside or inside the container, and to provide a poor appearance or poor appearance. Electrical characteristics defects such as short circuits can be prevented.

Preferably, at least the lid member body is made of a metal material. When the lid member body is made of a metal material in this way, the lid member can be used as a ground.

[0010] Preferably, the electronic component mounting container sealing lid member is characterized in that a sealing material is applied to a surface facing the container.

When the sealing material is applied to the surface facing the container, the container can be easily sealed.

According to another aspect of the present invention, the electronic component storage structure includes the above electronic component mounting container sealing lid member,
And an electronic component mounting container.

According to another aspect of the present invention, a method of manufacturing an electronic component housing structure is a step of manufacturing a lid member by punching a metal material, wherein a projection is formed on the lid member when punching is performed. And a step of bonding the lid member and the container by bringing the lid member and the container on which the electronic component is mounted into contact with a sealing material and heating, and bonding the lid member and the container. There is a gap between the main body of the lid member and the container.

In the step of bonding the lid member and the container in this manner, by providing a space between the main body of the lid member and the container by the projection, the sealing material is formed outside the container in the bonding step. And flowing inside can be prevented.

[0015]

FIG. 1 shows a first embodiment of the present invention.
FIG. 5 is a cross-sectional view of a storage structure for electronic components in one of the drawings, corresponding to FIG. 4.

Referring to the drawings, in the present embodiment,
Protrusions 109a and 109b are formed on a portion of the lid member 101 that is in contact with the electronic component mounting container 103. Thus, when the electronic component mounting container 103 is sealed, there is a gap d between the lid member 101 and the electronic component mounting container 103. The protrusions 109a and 109b are 10
The electronic component mounting container 10 having a height of about 100 μm
3 are formed at positions corresponding to the sealing area portions A1 and A2.

The size of the projections 109a and 109b in the horizontal direction is such that the projections 109a and 109b enter the sealing area portions A1 and A2.

FIG. 2 is a perspective view of the lid member 101. Referring to the drawing, protrusions 109a to 109d are
Are formed at the four corners. However, the number of projections is not limited to four. Further, the protrusion may be provided at the center of the four sides of the lid member 101. Further, as shown in FIG. 3, groove-shaped projections 109e and 109f may be formed on the lid member 101.

Such projections are formed by providing a projection in a metal mold when a metal coil (or hoop) coated with a sealing material is punched to the size of an electronic component mounting container.

The lid member body is preferably made of a metal material for use as a ground, but other materials may be used for the lid member.

Such an electronic component storage structure is manufactured by the following steps. (1) A step of manufacturing a lid member by punching a metal material (metal coil or hoop) to which a sealing material is applied, and a step of forming a projection on the lid member when punching is performed. (2) A lid member Step of bonding the lid member and the container by bringing the container and the container on which the electronic component is mounted into contact with each other via a sealing material and heating the same. As described above, in the present embodiment, the protrusion is formed on the lid member. Thereby, irrespective of the sealing conditions or the shape of the sealing surface, the sinking of the lid member due to the heating and melting of the sealing material is controlled, and a certain interval is generated between the lid member main body and the electronic component storage container. As a result, the surplus sealing material does not flow out, and it is possible to prevent the external structure of the electronic component storage structure from being defective in appearance or short-circuiting and other electrical characteristics.

The embodiments disclosed this time are to be considered in all respects as illustrative and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of an electronic component storage structure according to one embodiment of the present invention.

FIG. 2 is a perspective view of a lid member 101 of FIG.

FIG. 3 is a perspective view showing another configuration example of the lid member 101.

FIG. 4 is a cross-sectional view of a conventional electronic component storage structure.

FIG. 5 is a diagram for explaining a problem of the related art.

[Explanation of symbols]

101 lid member, 103 electronic component storage container, 105
Electronic component, 107 sealing material, A1, A2 sealing area, d interval, 109a to 109f protrusion.

Claims (5)

[Claims] An electronic component mounting container sealing lid member for sealing a container on which an electronic component is mounted, comprising: a projection provided at a portion in contact with the container; A lid member for sealing a container for mounting an electronic component, wherein the projection has a gap between the container and the lid member body when the projection is performed. 2. The electronic component mounting container sealing lid according to claim 1, wherein at least the lid member main body is made of a metal material. 3. The electronic component mounting container sealing lid member according to claim 1, wherein a sealing material is applied to a surface facing the container. 4. An electronic component storage structure, comprising: the electronic component mounting container sealing lid member according to claim 1; and an electronic component mounting container. 5. A step of manufacturing a lid member by punching a metal material, the step of forming a projection on the lid member at the time of punching; and a step of mounting the lid member and an electronic component. A step of bonding the lid member and the container by bringing the container into contact with a sealing material and heating, and in the bonding step, the projecting portion allows the main body of the lid member and the container to be bonded to each other. A method for manufacturing an electronic component storage structure, characterized in that there is an interval between them.