JP2001167240A - Ic tag - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a structure capable of surely destroying an IC tag when the IC tag stuck once on an article is released. SOLUTION: This IC tag is provided with at least a doughnut coil-shaped copper wire being an antenna, a circuit part including an IC chip, a lead part derived from the doughnut coil-shaped copper wire and electrically connected to the circuit part, double-coated adhesive sheet provided with a release paper on the face on which a material to be stuck is stuck, and an insulating sheet. Then, the doughnut coil-shaped copper wire, in which the circuit part is arranged inside a doughnut, is placed on the double-coated adhesive sheet, and an adhesive is applied on the upper part around the circuit part thus the doughnut coil- shaped copper wire and the circuit part including the IC chip are held between the double-coated adhesive sheet and the insulating sheet.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC chip storing tag information and an antenna as main internal parts, which are attached to an adherend (article, etc.) and contactlessly contact information with an external device. The present invention relates to an IC tag that communicates with the user.

[0002]

2. Description of the Related Art As a system for automatically reading and identifying tag information affixed to an article or the like, there is a bar code system or the like, but a data carrier capable of handling a larger amount of information and enabling remote reading. An IC tag system called a system is being developed.

[0003] This IC tag system comprises a transponder called an IC tag attached to an article or the like and an interrogator.
Non-contact communication is performed between these transponders and the interrogator via transmission media such as magnetism, induction electromagnetic fields, and microwaves (radio waves).

FIG. 1 is an exploded perspective view showing a conventional IC tag structure. 1 is an IC chip storing tag information,
Reference numeral 2 denotes a donut-shaped coiled copper wire serving as an antenna. The connection end 2a at the beginning of winding and the connection end 2b at the end of winding of the donut-shaped coiled copper wire 2 are directly connected to the IC chip 1 to form an IC tag.

[0005] After connecting the connection ends 2a and 2b of the donut-shaped coiled copper wire 2 to the IC chip 1, the IC tag is completed by using an insulating sheet 3 and a double-sided adhesive sheet 4 and sandwiching them from above and below. I do. A release paper (not shown) is provided on the surface of the double-sided adhesive sheet 4 to be attached to an article or the like.
When the IC tag is directly attached to an article or the like and used, the release paper is peeled off and attached to the article or the like and used as a transponder in an automatic tag information recognition system.

FIG. 2 is a sectional view showing a state where a conventional IC tag is attached to an article. An adhesive layer 5 is formed on the sheet 3. A donut-shaped coiled copper wire 2 having an IC chip 1 disposed inside is placed on the double-sided adhesive sheet 4, and is sandwiched between the insulating sheet 3 and the double-sided adhesive sheet 4 to form an IC tag. Although a release paper (not shown) is provided on the surface of the double-sided adhesive sheet 4 to be attached to an article or the like, it is peeled off when used for attaching to an article.

[0007]

Since an IC tag attached to an article stores tag information of the attached article itself, the IC tag attached once can be replaced with another article. In such a case, erroneous tag information is recognized and adversely affects the handling of the article. Therefore, the IC tag once attached to the article needs to have an IC tag structure that cannot be used again. FIG. 3 is a sectional view showing a state where the IC tag of FIG. 2 is peeled off. As shown in FIG. 3, the insulating sheet 3 (adhesive layer 5) and the double-sided adhesive sheet 4 are separated from each other, and the IC chip 1 and the donut-shaped coiled copper wire 2 are separated from each other.
It may be peeled off while being adhered to. At this time I
If the C chip 1 and the donut-shaped coiled copper wire 2 are separated and peeled off, the IC tag is broken and cannot be used. However, if the IC chip 1 and the coiled copper wire 2 are still connected to each other due to the function of the IC tag when they are peeled off as shown in FIG. 3, the double-sided adhesive sheet 4 is further removed from the article 6 by removing the double-sided adhesive sheet 4. It can be used by replacing it with an article. In addition, contrary to the state of FIG.
And the doughnut-shaped coiled conductive wire 2 are the adhesive layer 5 of the insulating sheet 3.
It may be peeled off while being adhered to. Also in this case, it is possible to use it by pasting it on another article as it is. In view of the above, an object of the present invention is to provide a structure in which the IC tag is reliably broken when the IC tag once attached to the article is to be peeled off.

[0008]

At least a donut-shaped coiled copper wire serving as an antenna, a circuit portion including an IC chip, and a lead wire derived from the donut-shaped coiled copper wire and electrically connected to the circuit portion. Part, a double-sided adhesive sheet provided with a release paper on the surface to be adhered to the adherend, provided with an insulating sheet, placed on the double-sided adhesive sheet a donut-shaped coiled copper wire having a circuit portion disposed inside the donut, An adhesive is applied to the upper part of the periphery of the circuit portion, and an IC tag having a circuit portion including a donut-shaped coiled copper wire and an IC chip is sandwiched between a double-sided adhesive sheet and an insulating sheet.

In the above IC tag, an insulating sheet and an IC
The adhesive strength between the circuit section including the chip and the double-sided adhesive sheet is determined by the relationship between the adhesive strength between the insulating sheet and the circuit section> the adhesive strength between the adherend and the double-sided adhesive sheet> the adhesive strength between the double-sided adhesive sheet and the insulating sheet Constitute.

[0010]

FIG. 4 shows an IC according to an embodiment of the present invention.
It is a figure for explaining a tag and is a sectional view in the state where it was stuck on an article (adherend). Reference numeral 7 denotes a double-sided adhesive sheet on which a donut-shaped coiled copper wire 8 having an IC chip 9 arranged inside a donut is placed and adhered to one surface thereof. Further I
An adhesive 10 is applied to the upper part of the periphery of the C chip 9, and the IC chip 9 and the donut-shaped coiled copper wire 8 are sandwiched between the insulating sheet 11 and the double-sided adhesive sheet 7 to form an IC tag. Although not shown, the start and end of the donut-shaped coiled copper wire are connected to the IC chip 9. A release paper (not shown) is provided on the surface of the double-sided adhesive sheet 7 on the side to be attached to the article 12, and is used when peeled off when attached to the article 12 to be adhered before use. is there. The insulating sheet 11 has a structure in which no adhesive layer is provided.

The adhesive strength of the insulating sheet 11, the IC chip 9, the donut-shaped coiled copper wire 8, and the double-sided adhesive sheet 7 constituting the above-described IC tag of the present invention is determined by the adhesive 10 with the IC chip 9 and the IC chip. 9 has the strongest adhesive strength with the insulating sheet 11 on the upper periphery. Next, the adhesive strength between the adherend (article 12) and the double-sided adhesive sheet 7 is made strong, and the adhesive strength between the double-sided adhesive sheet 7 and the insulating sheet 11 is made the weakest.

FIG. 5 is a view showing a state where the IC tag shown in FIG. 4 is peeled off. If you want to remove the IC tag,
The insulating sheet 11 and the double-sided adhesive sheet 7 which are the outer peripheral portion of the C tag are peeled off from the direction. At this time, the article 12
Since the adhesive strength of the double-sided adhesive sheet 7 is stronger than the adhesive strength of the insulating sheet 11 and the double-sided adhesive sheet 7, the insulating sheet 11 is inevitably separated from the double-sided adhesive sheet 7 and peeled off. Further, the IC tag is peeled off toward the center of the IC tag. However, since the adhesive layer is not formed on the insulating sheet 11, it is easily separated from the donut-shaped coiled copper wire 8, and the donut-shaped coiled copper wire 8 is It remains adhered to the adhesive sheet 7. The IC chip 9 is firmly fixed together with a part of the insulating sheet 11 and the double-sided adhesive sheet 7 located around the IC chip 9 by an adhesive 10 applied to the upper part of the periphery. The adhesive strength between the adhesive 10 and the insulating sheet 11 is I
Stronger than the adhesive strength of the C chip 9 and the double-sided adhesive sheet 7,
Further, the structure is stronger than the adhesive strength between the double-sided adhesive sheet 7 and the article 12. Therefore, the IC chip 9 is attached to the insulating sheet 1 by a force pulled upward in FIG.
1 is peeled off as it is adhered to
Is peeled off while destroying a part of the double-sided adhesive sheet to which is applied. As a result, the coiled copper wire 8 and the IC chip 9 are separated from each other, so that the connection portion (not shown) of the donut-shaped coiled copper wire is cut, and the IC tag is reliably broken.
Further, even if a part of the double-sided adhesive sheet 7 is not broken and remains in a state of being attached to the article 12, the IC chip 9
Is left adhered to the insulating sheet 11, the IC chip 9 and the donut-shaped coiled copper wire 8 are separated, and the IC tag is broken.

The insulating sheet 11 is preferably a polyester sheet having a certain strength and a thickness of about 0.1 mm and having excellent thermal stability. The material is not limited as long as it has an adhesive property capable of firmly fixing 9 with the adhesive 10.

The double-sided adhesive sheet in the present specification is a sheet having an adhesive layer on both sides of the sheet, an adhesive layer alone, or a laminate of adhesive layers.

[0015]

According to the present invention, when the IC chip and the donut-shaped coiled copper wire are sandwiched between the double-sided adhesive sheet and the insulating sheet, an adhesive is applied to the upper part of the periphery of the IC chip, so that the donut-shaped coiled copper wire and the insulating sheet are easily formed. The IC chip is left on the double-sided adhesive sheet side and is peeled off while being bonded to the insulating sheet side by the adhesive, so that the donut-shaped coiled copper wire and the IC chip are separated, and the IC tag can be broken.

By making the adhesive strength between the insulating sheet and the circuit portion stronger than the adhesive strength between the adherend and the double-sided adhesive sheet or the adhesive strength between the double-sided adhesive sheet and the insulating sheet,
The adhesive strength of the C chip to the insulating sheet side can be increased.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing a conventional IC tag.

FIG. 2 is a sectional view showing a state where a conventional IC tag is attached to an article.

FIG. 3 is a sectional view showing a state where the IC tag of FIG. 2 is peeled off;

FIG. 4 is a cross-sectional view of an embodiment of the present invention in which an IC tag is attached to an article.

FIG. 5 is a diagram showing a state in which the IC tag shown in FIG. 4 is removed.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 IC chip 2 Donut-shaped coiled copper wire 2a Connection end 2b Connection end 3 Insulation sheet 4 Double-sided adhesive sheet 5 Adhesive layer 6 Article 7 Double-sided adhesive sheet 8 Donut-shaped coiled copper wire 9 IC chip 10 Adhesive 11 Insulation sheet 12 articles

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2C005 MB10 NA09 PA18 5B035 BA05 BB09 CA01 CA23

Claims (2)

[Claims] At least a donut-shaped coiled copper wire serving as an antenna, a circuit portion including an IC chip, a lead portion derived from the donut-shaped coiled copper wire and electrically connected to the circuit portion, and A double-sided adhesive sheet provided with a release paper on the surface to be attached to the body, an insulating sheet, a donut-shaped coiled copper wire having a circuit portion disposed inside the donut is placed on the double-sided adhesive sheet, and the upper portion around the circuit portion is placed. An IC tag characterized in that a circuit part including a donut-shaped coiled copper wire and an IC chip is sandwiched between a double-sided adhesive sheet and an insulating sheet. 2. The adhesive strength of each of the insulating sheet, the circuit portion including the IC chip, and the double-sided adhesive sheet,
2. The IC tag according to claim 1, wherein an adhesive force between the insulating sheet and the circuit portion> an adhesive force between the adherend and the double-sided adhesive sheet> an adhesive force between the double-sided adhesive sheet and the insulating sheet.