JP4712157B2 - Non-contact data carrier - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a non-contact type data carrier having a resin substrate, an antenna, and an IC chip, and more particularly to a non-contact type data carrier capable of easily mounting an IC chip.
[0002]
[Prior art]
Conventionally, non-contact data carriers have been used in distribution systems and the like. Such a non-contact type data carrier is used by being attached to, for example, a product packaging box or the product itself.
[0003]
A non-contact type data carrier generally includes a resin base material, a metal antenna coil provided on the resin base material, and an IC chip connected to the antenna coil.
[0004]
When electromagnetic waves are emitted from the reader side to the non-contact type data carrier, an induced voltage is generated in the antenna coil, and the IC chip is operated.
[0005]
[Problems to be solved by the invention]
The non-contact type data carrier includes the metal antenna coil provided on the resin base as described above and the IC chip connected to the antenna coil. When the IC chip is mounted on the antenna coil, The IC chip is disposed at a predetermined position on the antenna coil, and this IC chip is heat-pressed to the antenna coil.
[0006]
However, it is difficult to position and arrange the IC chip at a predetermined position on the antenna coil. For this reason, it takes a long time to mount the IC chip.
[0007]
The present invention has been made in consideration of such points, and an object thereof is to provide a non-contact data carrier on which an IC chip can be easily and easily mounted.
[0008]
[Means for Solving the Problems]
The present invention includes a resin base material, an antenna provided on the resin base material, and an IC chip body connected to the antenna. The IC chip body is provided on the insulating substrate and the insulating substrate. The conductive pattern layer and an IC chip connected to the conductive pattern layer are provided, and a conductive crimping member is provided through the conductive pattern layer of the IC chip body, the insulating substrate, the antenna, and the resin base material. The member is a non-contact type data carrier that is formed by caulking to electrically connect the antenna and the conductive pattern layer .
[0009]
According to the present invention, an IC chip body including an insulating substrate, a conductive pattern layer, and an IC chip is prepared in advance, and the IC chip body is provided on the resin base material in a state where the conductive pattern layer is connected to the antenna. For this reason, it is not necessary to position and arrange the IC chip at a predetermined position of the antenna, and the IC chip can be easily mounted.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings. 1 to 3 are views showing a first embodiment of a contactless data carrier according to the present invention.
[0011]
As shown in FIGS. 1 to 3, for example, a non-contact data carrier 10 such as an IC card or an IC tag includes a resin base material 11 made of PET and an upper surface of the resin base material 11 (one side of the resin base material 11). An aluminum metal antenna coil 13 formed by etching using a photoresist layer (not shown) over almost the entire area, and an IC chip body 23 provided on the antenna coil 13 are provided.
[0012]
Among these, the IC chip body 23 has an insulating substrate 21, a conductive pattern layer 22 provided on the insulating substrate 21, and an IC chip 20 connected to the conductive pattern layer 22. The conductive pattern layer 22 of the IC chip body 23 is connected to the pair of end portions 13a and 13b of the antenna coil 13 through a conductive crimping member 25 as will be described later. Instead of the antenna coil 13, an area transmission / reception type antenna 33 shown in FIG.
[0013]
In addition, a metal reinforcing member 26 made of a metal plate is provided on the upper surface of the resin base material 11 in order to reinforce the strength when the IC chip body 23 is provided on the antenna coil 13.
[0014]
The pair of end portions 13a and 13b of the antenna coil 13 are disposed on the inner side and the outer side of the antenna coil 13, respectively.
[0015]
As shown in FIG. 1, a first protective layer 15 is provided on the upper surface of the resin base material 11 so as to cover the antenna coil 13 and the IC chip body 23.
[0016]
Next, the material and shape of each part will be described.
[0017]
As the resin base material 11, for example, a plastic film such as polyester, polyethylene, polypropylene, and polyimide, paper, or non-woven fabric can be used. However, polyester and polyimide are mainly used from the viewpoint of chemical resistance and heat resistance. Normally, the shape of the antenna coil 13 is about 40 mm × 40 mm, but the antenna coil 13 may be formed in a card shape or the like depending on the intended use and required performance. Moreover, the thickness of the resin base material 11 is 30-200 micrometers.
[0018]
The metal antenna coil 13 is made of aluminum and has a thickness of about 5 to 100 [mu] m, but is preferably 15 to 30 [mu] m from the viewpoint of cost and electrical characteristics. Further, the IC chip 20 having a size of 1.5 mm × 1.5 mm square and a thickness of about 180 μm is used.
[0019]
The metal reinforcing member 26 is made of aluminum and is formed at the same time as the antenna coil 13, but another metal member may be used.
[0020]
The first protective layer 15 is made of, for example, polyester, PVC, polyimide, polypropylene, polyethylene, etc., but polyester is mainly used in terms of strength, heat resistance, and the like.
[0021]
The non-contact type data carrier 10 having such a configuration is used by being affixed to, for example, a product packaging box or the product itself. That is, an induced electromotive force is generated in the antenna coil 13 by an electromagnetic wave from a reader of a distribution system (not shown), and then the IC chip 20 connected to the antenna coil 13 via the conductive caulking member 25 and the conductive pattern layer 22 is activated. Information from the IC chip 20 is transmitted to the reader side.
[0022]
Next, a method for manufacturing a non-contact type data carrier having such a configuration will be described. First, the resin base material 11 is prepared, and the antenna coil 13 is formed on the upper surface of the resin base material 11 by an etching method using a photoresist layer.
[0023]
At the same time, a metal reinforcing member 26 is provided on the upper surface of the resin base 11 by an etching method. The metal reinforcing member 26 may be provided on the resin substrate 11 by pasting.
[0024]
On the other hand, as shown in FIG. 2, the conductive pattern layer 22 is provided on the insulating base material 21, and the IC chip 20 is connected to the conductive pattern layer 22 to prepare the IC chip body 23 in advance.
[0025]
Next, as shown in FIG. 1, an IC chip body 23 is mounted on the resin base material 11 and the antenna coil 13. Next, a conductive caulking member 25 is provided through the conductive pattern layer 22 and the insulating substrate 21 of the IC chip body 23, the pair of ends 13 a and 13 b of the coil 13, and the resin base material 11. 25 is caulked and the resin base material 11 and the antenna coil 13 are joined.
[0026]
In this case, the pair of end portions 13 a and 13 b of the coil 13 are electrically connected to the IC chip 20 through the conductive pattern layer 22. Since the metal reinforcing member 26 is formed on the resin base material 11 when the conductive crimping member 25 is crimped, the force applied to the conductive caulking member 25 can be received by the metal reinforcing member 26, and the resin base material 11 sag and shrinkage is prevented.
[0027]
Thereafter, the first protective layer 15 is overlaid on the antenna coil 13 and the IC chip body 23 on the upper surface side of the resin base material 11, and the first protective layer 15 is formed on the antenna coil 13 and the IC chip body 23 by a laminating method. Crimped and fixed.
[0028]
As described above, according to the present embodiment, the IC chip body 23 including the insulating substrate 21, the conductive pattern layer 22, and the IC chip 20 is prepared in advance, and the IC chip body 23 is connected to the conductive caulking member. Since the antenna coil 13 on the resin base material 11 is connected by 25, the mounting operation of the IC chip 20 can be performed without positioning the antenna coil 13 and the IC chip 20. For this reason, the mounting operation of the IC chip 20 can be performed easily and simply.
[0029]
Next, a second embodiment of the present invention will be described with reference to FIG. In the embodiment shown in FIG. 4, an IC chip body 23 composed of an insulating substrate 21, a conductive pattern layer 22, and an IC chip 20 is disposed on the lower surface of the resin substrate 11, and an insulating adhesive 14 is used. Next, the IC chip body 23 is bonded to the resin base material 11 using the conductive caulking member 25.
[0030]
In FIG. 4, other configurations are substantially the same as those of the first embodiment shown in FIGS. 4, the same parts as those of the first embodiment shown in FIGS. 1 to 3 are denoted by the same reference numerals, and detailed description thereof is omitted.
[0031]
In FIG. 4, a first protective layer 15 is provided so as to cover the antenna coil 13, and a second protective layer 16 is provided so as to cover the IC chip body 23.
[0032]
Next, a third embodiment of the present invention will be described with reference to FIGS. In the embodiment shown in FIGS. 6 and 7, the insulating substrate 21 of the IC chip body 23 and the conductive pattern layer 22 are formed in an elongated shape, and other configurations are the same as those shown in FIGS. The first embodiment is substantially the same.
[0033]
6 and 7, the same parts as those of the first embodiment shown in FIGS. 1 to 3 are denoted by the same reference numerals, and detailed description thereof is omitted.
[0034]
As shown in FIGS. 6 and 7, since the insulating substrate 21 and the conductive pattern layer 22 of the IC chip body 23 are formed in an elongated shape, the pair of end portions 13 a and 13 b of the antenna coil 13 are separated from each other. Further, the IC chip body 23 can be easily connected between the pair of end portions 13a and 13b.
[0035]
【The invention's effect】
As described above, according to the present invention, an IC chip body that is an insulating substrate, a conductive pattern layer, and an IC chip is prepared in advance, and this IC chip body is bonded to a resin substrate. An IC chip can be mounted easily and easily without the need for positioning.
[Brief description of the drawings]
FIG. 1 is a side view showing a first embodiment of a contactless data carrier according to the present invention.
FIG. 2 is a side view showing an IC chip body.
FIG. 3 is a plan view showing a first embodiment of a contactless data carrier according to the present invention.
FIG. 4 is a side view showing a second embodiment of a contactless data carrier according to the present invention.
FIG. 5 is a diagram showing an area receiving / transmitting antenna;
FIG. 6 is a plan view showing a third embodiment of a contactless data carrier according to the present invention.
FIG. 7 is an enlarged view of an IC chip body.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 Non-contact-type data carrier 11 Resin base material 13 Antenna coil 15 1st protective layer 16 2nd protective layer 20 IC chip 21 Insulating substrate 22 Conductive pattern layer 23 IC chip body 25 Conductive caulking member 26 Metal reinforcement member

Claims (3)

A resin substrate;
An antenna provided on a resin substrate and having a pair of ends ;
An IC chip body connected to a pair of ends of the antenna,
The IC chip body has an insulating substrate, a conductive pattern layer provided on the insulating substrate, and an IC chip connected to the conductive pattern layer,
A conductive caulking member is provided through the conductive pattern layer of the IC chip body and the insulating substrate, the pair of end portions of the antenna and the resin base material, and the conductive caulking member is formed by caulking to form a pair of end portions of the antenna. The IC chip is mounted by conducting the pair of end portions of the antenna and the conductive pattern layer without positioning the IC chip and the IC chip, and a metal reinforcing plate is provided on the resin base. At the same time, a non-contact type data carrier formed near the pair of end portions of the antenna and receiving a force when caulking the conductive caulking member to prevent sagging and shrinkage of the resin base material.   2. The non-contact type data carrier according to claim 1, wherein the IC chip body is provided on the same side as the antenna of the resin base material.   2. The non-contact data carrier according to claim 1, wherein the IC chip body is provided on the side opposite to the antenna of the resin base material.

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