JP2001024294A5 - - Google Patents
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- Publication number
- JP2001024294A5 JP2001024294A5 JP1999195923A JP19592399A JP2001024294A5 JP 2001024294 A5 JP2001024294 A5 JP 2001024294A5 JP 1999195923 A JP1999195923 A JP 1999195923A JP 19592399 A JP19592399 A JP 19592399A JP 2001024294 A5 JP2001024294 A5 JP 2001024294A5
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- pattern
- printed wiring
- lead
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000001788 irregular Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Description
【特許請求の範囲】
【請求項１】
プリント配線基板に於いて、外部端子と部品を搭載する為のランドとを連結するリードパターンの一部分に蛇行状の異形パターンを備え、該部に所要量の半田を貯留せしめるように構成したことを特徴とするプリント配線基板。
【請求項２】
前記蛇行状のパターンに代えて格子状の異形パターンとしたことを特徴とする請求項１記載のプリント配線基板。
【請求項３】
プリント配線基板に於いて、外部端子から延長するリードパターンと部品を搭載する為のランドから延長するリードパターンとを間隔を隔して近傍配置された異形パターンを備え、更に、前記それぞれのリードパターンの間を跨るよう半田を塗布し両リードパターン間を導通するよう構成したことを特徴とするプリント配線基板。
【請求項４】
前記異形パターンを櫛形電極状に構成したことを特徴とする請求項３記載のプリント配線基板。
【請求項５】
前記異形パターンを前記基板に形成した凹陥部内に設けたことを特徴とする請求項１乃至請求項４記載のプリント配線基板。
【請求項６】
請求項１乃至請求項５記載のプリント配線基板を用いて構成されていることを特徴とする電子装置。
[Claims]
[Claim 1]
In the printed wiring board, a meandering irregular shape pattern is provided in a part of the lead pattern that connects the external terminal and the land for mounting the component, and the required amount of solder is stored in that part. A featured printed wiring board.
2.
The printed wiring board according to claim 1, wherein a lattice-shaped irregular pattern is used instead of the meandering pattern.
3.
The printed wiring board is provided with a deformed pattern in which a lead pattern extending from an external terminal and a lead pattern extending from a land for mounting a component are arranged close to each other at intervals, and further, each of the lead patterns is described above. A printed wiring board characterized in that solder is applied so as to straddle between the two lead patterns so as to conduct electricity between the two lead patterns.
4.
The printed wiring board according to claim 3, wherein the deformed pattern is formed in a comb-shaped electrode shape.
5.
The printed wiring board according to claim 1 to 4, wherein the deformed pattern is provided in a recess formed in the substrate.
6.
An electronic device according to claim 1 to 5, wherein the electronic device is configured by using the printed wiring board according to claim 5.
請求項３記載の発明はプリント配線基板に於いて、外部端子から延長するリードパターンと部品を搭載する為のランドから延長するリードパターンとを間隔を隔して近傍配置された異形パターンを備え、更に、前記それぞれのリードパターンの間を跨るよう半田を塗布し両リードパターン間を導通するよう構成したことを特徴としている。 The invention according to claim 3 includes, in a printed wiring board, a modified pattern in which a lead pattern extending from an external terminal and a lead pattern extending from a land for mounting a component are arranged close to each other at intervals. Further, it is characterized in that solder is applied so as to straddle between the respective lead patterns so that the lead patterns are made conductive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11195923A JP2001024294A (en) | 1999-07-09 | 1999-07-09 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11195923A JP2001024294A (en) | 1999-07-09 | 1999-07-09 | Printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001024294A JP2001024294A (en) | 2001-01-26 |
| JP2001024294A5 true JP2001024294A5 (en) | 2006-08-31 |
Family
ID=16349240
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11195923A Withdrawn JP2001024294A (en) | 1999-07-09 | 1999-07-09 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001024294A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008060430A (en) | 2006-08-31 | 2008-03-13 | Daikin Ind Ltd | Power converter |
-
1999
- 1999-07-09 JP JP11195923A patent/JP2001024294A/en not_active Withdrawn
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