JP2001053372A - Laser module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently dissipate heat generated from a laser diode chip to the outside and to adjust positional shift and angular shift of the laser diode chip. SOLUTION: In a laser module, having a laser module body 30 mounted on a metallic housing, while mounting a laser diode chip 41 having an emission center 411 in a resin package 31, a chip lead part 21 for mounting the laser diode chip 41 is coupled with frame support part 24, 25 for fixing the laser module body 30 to the housing via coupling parts 27, 28 and formed as a lead frame part 29. The laser module has a structure, extending orthogonally to the laser module mounting face with respect to the housing an being turnable about a rotational axis passing through the emission center 411. The lead frame part 29 is exposed to the outside, so that it can touch the laser module mounting face of the housing.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser module used for an optical pickup, and particularly to a laser module for a CD-R,
The present invention relates to a laser module suitable for an optical recording medium that can perform not only reading but also writing, such as a CD-RW, a DVD-RAM, and an MO.

[0002]

2. Description of the Related Art As is well known, various peripheral devices are connected to an electronic device such as a personal computer, and one of them is a storage device (recording medium). There are various types of storage devices (recording media), one of which is a CD.
-R (compact disc recordable). The CD-R is a recordable recording medium, and is compatible with a CD-ROM and an audio CD (CD-DA). Although writing to the CD-R requires a dedicated device and a writing application, reading from the CD-R can be performed with a normal CD-ROM drive. Once written, data cannot be erased, but can be appended many times.

Also, CD-RW, DVD-RAM, and magneto-optical disk (MO) are known as types of erasable / rewritable optical disks. CD-RW, DVD-R
AM writes information (data) by a phase change recording method.
MO writes information (data) using the thermo-magnetic effect of a magnetic thin film, and writes information (data) using the photo-magnetic effect.
This is a disk-shaped optical memory for reading out data.

In order to write information (data) on or read information (data) from an optical disk such as a CD-R or MO, a recording / reproducing light for irradiating a laser beam onto the optical disk is required. Pickup is required.

In general, this type of optical pickup includes a laser light source for emitting a laser beam and an optical system for guiding the emitted laser beam to a recording medium such as an optical disk. As described above, CD-R, CD-RW,
DVD-RAM and MO not only read information,
Information can be written, but CD-R, CD
-In optical pickups for RW, DVD-RAM and MO, the output of the laser beam emitted from the laser light source is
It is necessary to switch between reading information and writing information. The reason is that writing of information is performed by forming pits on the recording layer of the optical disk by irradiating a laser beam, and the output of the laser beam emitted from the laser light source at the time of writing information is It is larger than the output, for example, about 10 to 20 times.

Next, an optical pickup used in a recording / reproducing apparatus for an optical disk such as a CD-R will be described with reference to FIG.

[0007] The illustrated optical pickup 1 has an optical base 2.
And a lens holder 3 provided with an objective lens 3-1, a tracking coil (not shown) and a focusing coil (not shown), a damper base 4, and an actuator base 5 accommodating the lens holder 3 and the damper base 4.
Etc. are provided.

The optical pickup 1 has a laser section 11 which is a laser light source for emitting a laser beam. The laser beam emitted from the laser unit 11 passes through a diffraction grating (to be described later), a beam splitter (to be described later), a collimator lens (to be described later), and an objective lens 3-1, and an optical disk (CD) serving as an optical storage medium. -R, CD-R
W, DVD-RAM or MO) (to be described later). The reflected light from the optical disk is transmitted to the objective lens 3-
1. The light passes through a collimator lens and a beam splitter and enters a photodiode (PD) (described later), which is a light receiving device. That is, the photodiode receives the reflected light from the optical disk.

Optical components such as a laser unit 11 and a beam splitter are held on an optical base 2. The optical base 2 is further provided with an optical disk drive housing (not shown).
Slidably held. A circuit board 15 is fixed to a side surface of the optical base 2. The circuit board 15 is electrically connected to other circuit elements (not shown) of the optical disk drive by a flexible cable 16 connected thereto.

The lens holder 3 and the damper base 4 are connected by a plurality of suspension wires 6, and these assemblies are accommodated in the actuator base 5.
A part of the actuator base 5 is a yoke 7, and the yoke 7 is combined with a magnet.

The actuator base 5 has a receiving portion (not shown) for the damper base 4 at one end of a substantially frame-like body formed of a metal material. The receiving portion has a support block 5-1 for fixing the damper base 4. The support block 5-1 is formed integrally with the actuator base 5. Further, on both side walls of the substantially frame-shaped body, there are provided substantially semicircular projections 5-2 supported by support portions 2-1 provided on the optical base 2.

A damper base cover 4-2 made of a transparent resin material is attached to the damper base 4, and a fixing portion 4-1 for fixing one end of the suspension wire 6 is provided at a rear portion thereof. And a damping material (not shown) for suppressing the vibration of the suspension wire 6 in the space between the damper base 4 and the damper base cover 4-2.
Has been injected.

On the rear wall of the damper base 4, there is provided a flexible wiring board 8 for soldering connection with the end of the further fixed suspension wire 6. The damper base 4 is fixed while being inserted into a space between both side walls of the actuator base 5 and the support block 5-1.

The damper base 4 is mounted so that the support block 5-1 and the damper base 4 are sandwiched between the screws 9 so that the damper base 4 is rotatable around the screw 9. This is to adjust the skew.

The damper base 4 is replaced with an actuator base 5
Before fixing the suspension wire, the suspension wire 6 is attached to the damper base 4. That is, the lens holder 3 and the damper base 4 are housed and fixed in the actuator base 5 in a state of an assembly connected by a plurality of suspension wires 6.

FIG. 6 shows an example of the system configuration of the optical system of the optical pickup 1 described above. The illustrated optical system includes a laser diode LD (corresponding to the laser unit 11 in FIG. 3), a diffraction grating G
RT, polarizing beam splitter PBS, collimator lens CL, quarter-wave plate QWP, rising mirror MIR, objective lens OL (corresponding to objective lens 3-1 in FIG. 3), optical disc DISC, sensor lens SL, and photodiode ( Light receiving element) PD.

One laser beam emitted from the laser diode LD in the horizontal right direction is split into three laser beams by the diffraction grating GRT, and the polarization beam splitter PB
S, collimator lens CL, and quarter-wave plate QWP
, Is bent at a right angle by the rising mirror MIR, travels vertically upward, and is irradiated onto the optical disc DISC via the objective lens OL.

Incidentally, of the three laser beams separated by the diffraction grating GRT, one central laser beam is used for signal reading, and the remaining two laser beams are used for tracking servo. .

The reflected light from the optical disc DISC travels vertically downward, passes through the objective lens OL, is bent at a right angle by the rising mirror MIR, and travels horizontally leftward.
Through the 波長 wavelength plate QWP and the collimator lens CL,
The light is bent at a right angle by the polarizing beam splitter PBS, travels in the horizontal front direction, and is received by the photodiode PD through the sensor lens SL.

A laser diode used as a laser light source is provided as a laser module having a built-in or mounted laser diode chip. And
The laser module also has a photodiode chip (light receiving element) for monitoring the amount of light emitted from the laser diode chip. Normally, this photodiode chip is mounted as a back monitor that monitors light (light that is outside the optically effective range) emitted from the back side of the laser diode chip. This back monitor is used to control the amount of laser beam emitted from the laser diode chip.

Generally, this type of laser module is
A block (die) is mounted vertically on a stem made of copper or iron, and a laser diode chip is mounted on this die via a submount. Further, a photodiode chip (back monitor) for monitoring the amount of light emitted from the back of the laser diode chip is mounted on the back side of the laser diode chip. The die, submount, laser diode chip, and back monitor are covered with a cap.

However, the laser module having such a configuration has many drawbacks such as an increase in package cost and an increase in assembly time due to the different wire bonding directions of the laser diode chip and the photodiode chip.

Therefore, in order to solve such a drawback, a lead frame type laser module as shown in FIGS. 7 to 10 has been developed. However,
The illustrated laser module is used for a low-output optical pickup such as a CD-ROM.

FIG. 7 is a plan view showing a state in which an upper package (described later) is omitted, FIG. 8 is a front view showing a state of being mounted on a housing 50 ', FIG. 9 is a bottom view, and FIG. is there.

The illustrated laser module has a lead frame 20 'and a laser module main body 30', and has a substantially symmetrical shape with respect to a center line C extending in the front-rear direction. The laser module main body 30 ′ has a lower package 31 ′, an upper package 32 ′, and a cover glass 33. Lower package 31 'and upper package 3
2 ′ is collectively referred to simply as a package. Since the laser module is manufactured by integrally molding the lead frame 20 'and the package, there is an advantage that it is easy to manufacture.

The lead frame 20 'is formed into a shape as shown in FIG. 7 by pressing a conductive plate having a predetermined thickness. The illustrated lead frame 20 ′ has a chip mounting lead terminal 21 ′ on which a laser diode chip 41 and a back monitor (photodiode chip) 42 ′ are mounted.
A laser diode anode-side lead terminal 22 ′,
A back monitor cathode side lead terminal 23 'and a right frame support 24' and a left frame support 2 projecting outward from both sides of the laser module main body 30 'to mount the laser module main body 30' on the housing 50 '.
5 ′, and these are bridging portions 26 ′ indicated by a two-dot chain line.
Are connected by The laser diode chip 41 is mounted on the chip mounting lead terminal 21 ′ via the submount 43. The crosslinked portion 26 'is diver-cut in the last manufacturing process.

The chip mounting lead terminal 21 'extends in the direction of the center line C from the back side of the laser module main body 30'. Also, a laser diode anode lead terminal 22 'and a back monitor cathode lead terminal 23'.
Extend on the right and left sides of the chip-mounting lead terminal 21 ', respectively, in parallel with and spaced from the chip-mounting lead terminal 21'.

The laser diode chip 41, the back monitor 42 ', and the submount 43 are
It is housed in the housing space of the laser module body 30 ′ surrounded by 1 ′, the upper package 32 ′, and the cover glass 33. As is clear from FIGS. 7 and 10, the laser diode chip 41 and the submount 43 are mounted on the tip side (front) on the chip mounting lead terminal 21 ′.
The back monitor 42 'is mounted on the chip mounting lead terminal 21' on the back side of the laser diode chip 41.

A cutout 241 'is formed on the back side of the right frame support 24' so that the left frame support 2 '
A notch 251 'is formed on the front side of 5'.

Next, a method for manufacturing such a laser module will be described. First, the lead frame 20 '
Is molded by the lower package 31 ′.
Thereafter, as shown in FIG. 7, the laser diode chip 41 and the laser diode node side lead terminal 2 are connected.
2 ′ is wire-bonded with the first wire 61, and the back monitor (photodiode chip) 42 ′ and the back monitor cathode side lead terminal 23 ′ are connected to the second wire 6 ′.
2. Wire bonding is performed. Then, with the cover glass 33 disposed on the front surface, the lower package 31 'and the upper package 32' are joined by an adhesive or ultrasonic welding. Then, the crosslinked portion 26 'is diver-cut.

As shown in FIGS. 8 and 10, the laser module having such a configuration is arranged on a rectangular recess 51 'of a housing 50'. As described above, as shown in FIGS. 7 and 9, the notch portions 24 ′ are provided in the right frame support portion 24 ′ and the left frame support portion 25 ′, respectively.
1 'and 251' are provided. Also, the housing 5
A right boss 52 'and a left boss 53' protrude above 0 'at left and right positions close to the concave portion 51', respectively. When the laser module is mounted on the concave portion 51 'of the housing 50', as shown in FIGS.
2 ′ and the left boss 53 ′ are respectively connected to the cutout 241 ′ of the right frame support 24 ′ and the left frame support 2
The laser module is positioned by engaging the notch 251 'of the 5'. Then, UV adhesive 5
5 is dropped on the right boss 52 'and the left boss 53' from above, and the laser module is fixed on the housing 50 '. U
Instead of the V adhesive 55, it may be fused with solder or the like.

In the case of the lead frame type laser module having such a structure, the lead frame 20 'and the lower package 31' are integrally molded, and therefore, there is an advantage that manufacture is easy. Further, since the laser diode chip 41 and the back monitor 42 'can be arranged on the same plane, there is an advantage that wire bonding is easy.

[0033]

However, in the conventional lead frame type laser module, since the packages 31 'and 33' are made of resin, the thermal resistance is large. Therefore, as described above, this laser module is
-Only used for low power optical pickups such as ROM. Because, in the case of a high-power laser diode such as a laser diode for a CD-R or the like, the operating current is large, so that the generated heat changes the wavelength or shortens the life of the laser diode itself. It is because. Furthermore, since there is no mechanism for adjusting the position of the laser diode with respect to the housing, displacement of the laser diode,
There is a problem that it is difficult to adjust when an angle shift occurs. In particular, when mounting the laser diode chip 41 on the chip mounting lead terminal 21 ', it is absolutely necessary to
It is necessary to adjust the amount of inclination because the camera is installed in an inclined state by about °.

Accordingly, it is an object of the present invention to provide a laser module that can efficiently release heat generated from a laser diode chip to the outside.

Another object of the present invention is to provide a laser module capable of adjusting a position shift and an angle shift of a laser diode chip.

[0036]

According to the present invention, there is provided a laser module mounted on a metal casing (50), wherein a laser diode chip (41) having an emission center point (411) is formed of a resin. In a laser module having a laser module body (30) mounted in packages (31, 32) made of a semiconductor device, a chip lead portion (21) on which a laser diode chip (41) is mounted has a housing for mounting the laser module body (30). The laser module is integrated with a frame support (24, 25) for mounting to the (50) and formed as a lead frame part (21). 50) a structure extending in a direction perpendicular to the laser module mounting surface and rotatable around a rotation axis (O) passing through a light emission center point (411). Laser module is obtained, characterized in that.

In the above laser module, it is desirable that the lead frame portion (29) is exposed to the outside so as to be able to contact the laser module mounting surface of the housing (50). The lead frame portion (29) has a columnar recess (291) formed coaxially with the rotation axis (O). The housing (50) has a columnar recessed portion coaxial with the rotation axis (O). Is formed, and the convex portion (54) is formed.
Is rotatably inserted into the recess (291), thereby enabling the laser module to rotate around the rotation axis (O).

In the above laser module, the laser module body (30) has a columnar recess (291) formed coaxially with the rotation axis (O).
0) has a cylindrical projection (54) coaxially with the rotation axis (O).
Are formed, and the convex portion (54) is formed in the concave portion (291).
Rotatably inserted therein, thereby enabling the laser module to rotate about a rotation axis (O). Instead, the laser module body (30)
A columnar projection is formed coaxially with the rotation axis (O),
The housing (50) has a columnar recess formed coaxially with the rotation axis (O), and the projection is rotatably inserted into the recess so that the laser module can rotate around the rotation axis. You may make it rotatable.

Further, the laser module body (30) is provided with an adjustment hole (34) into which the tip (71) of the eccentric driver (70) can be inserted. By rotating this eccentric driver (70) with the 71) inserted in the adjustment hole (34),
The laser module may be rotatable around a rotation axis (O). The lead portions (22, 23) other than the chip mounting lead terminal (21) are replaced with the chip mounting lead terminals (2).
It is preferable to provide at a position higher than 1) by a predetermined height.

Note that the reference numerals in the parentheses are given for easy understanding and are merely examples, and it is a matter of course that the present invention is not limited to these.

[0041]

Embodiments of the present invention will be described below in detail with reference to the drawings.

A laser module according to one embodiment of the present invention will be described with reference to FIGS. The illustrated laser module is a CD-R, CD-RW, DVD
-Used for high-output optical pickups such as RAMs and MOs.

FIG. 1 is a plan view in which an upper package (to be described later) is omitted, FIG. 2 is a front sectional view taken along line II-II in FIG. 1, and FIG. FIG. 4 is a side sectional view.

The illustrated laser module has a lead frame 20 and a laser module main body 30, and has a substantially symmetrical shape with respect to a center line C extending in the front-rear direction. The laser module body 30 has a lower package 31, an upper package 32, and a cover glass 33. The lower package 31 and the upper package 32 are collectively called simply a package. Since the laser module is manufactured by integrally molding the lead frame 20 and the package, there is an advantage that the laser module is easy to manufacture.

The lead frame 20 is formed into a shape as shown in FIG. 1 by pressing a conductive plate having a predetermined thickness. The illustrated lead frame 20 includes a chip mounting lead terminal 21 on which a laser diode chip 41 and a front monitor (photodiode chip) 42 are mounted, a laser diode anode side lead terminal 22, a front monitor cathode side lead terminal 23, and a laser module. In order to mount the main body 30 on the housing 50, the laser module main body 30 has a right frame support portion 24 and a left frame support portion 25 that protrude outward from both side surfaces of the laser module main body 30. Are linked.

Further, the chip mounting lead terminal 21 and the right frame support 24 and the left frame support 25
They are connected by first and second connecting portions 27 and 28, respectively. That is, the chip mounting lead terminal 21 which is the chip lead portion on which the laser diode chip 41 is mounted is connected to the first and second connection portions 27 and 2.
8 form a lead frame portion 29 integrated with the right frame support portion 24 and the left frame support portion 25. This lead frame portion 29 is shown in FIG.
As shown in FIG. 2, the housing 50 is exposed to the outside so as to be able to contact the laser module mounting surface of the housing 50.

The laser diode chip 41 is mounted on the chip mounting lead terminal 21 via the submount 43. The crosslinked portion 26 is diver-cut in the last manufacturing process.

The chip mounting lead terminal 21 extends from the back side of the laser module main body 30 in the direction of the center line O. Also, the laser diode anode side lead terminal 22
The front monitor cathode side lead terminal 23 extends on the right and left sides of the chip mounting lead terminal 21 at an interval in parallel with the chip mounting lead terminal 21, respectively.

Laser diode anode side lead terminal 2
2 and the front monitor cathode side lead terminal 23
Each has bent portions 221 and 231, from which the laser module main body 30 is placed at a position higher than the chip mounting lead terminal 21. That is, steps are provided in the laser diode anode lead terminal 22 and the front monitor cathode lead terminal 23. The reason for providing the steps in this way is that insulation is taken into account,
This is to reduce the loop length of the wire at the time of wire bonding as much as possible to reduce disconnection defects.

Further, since the distance between the leads is long, the bonding to a flexible substrate (not shown) becomes easy.

In the illustrated example, the lead terminal 22 on the anode side of the laser diode and the lead terminal 23 on the cathode side of the front monitor are higher than the chip-mounted lead terminal 21 by an amount corresponding to the submount 43. Therefore, as is clear from FIG.
In the chip accommodation space 0, the laser diode anode lead terminal 22 and the front monitor cathode lead terminal 23 are higher than the chip mounting lead terminal 21.

The laser diode chip 41, the front monitor 42, and the submount 43 are
1. The laser module body 30 is housed in a chip housing space surrounded by the upper package 32 and the cover glass 33. As is clear from FIGS. 1 and 4, the laser diode chip 41 and the submount 43 are mounted a predetermined distance behind the tip on the chip mounting lead terminal 21, and the front monitor 42 is located on the front side of the laser diode chip 41. It is mounted on the tip of the chip mounting lead terminal 21.

The right frame support portion 24 has a notch 241 formed diagonally on the rear side thereof, and the left frame support portion 25 has a notch 251 diagonally formed on the front side thereof. In addition, as shown in FIG. 4, an adjustment hole 34 into which the tip 71 of the eccentric driver 70 can be inserted is formed in the back surface of the laser module main body 30.

Next, a method for manufacturing such a laser module will be described. First, the lead frame 20
It is molded by the lower package 31. Thereafter, as shown in FIG.
1 and the laser diode node-side lead terminal 22 are wire-bonded with a first wire 61, and the front monitor (photodiode chip) 42 and the front monitor cathode-side lead terminal 23 are wire-bonded with a second wire 62. Here, the laser diode anode-side lead terminal 21 and the front monitor cathode-side lead terminal 23 are configured and insulated at a position higher than the laser diode chip mounting surface, so that the first and second wires 61 and The loop length of 62 can be shortened. Therefore, disconnection defects can be reduced.

Then, the lower package 31 and the upper package 32 are joined by an adhesive or ultrasonic welding or the like, and a cover glass 33 is disposed on the front surface. Then, the crosslinked portion 26 is diver-cut.

The laser module having such a configuration is mounted on a disk-shaped pedestal 51 of a housing 50, as shown in FIGS. That is, the pedestal 51 functions as a laser module mounting surface. The center of the pedestal 51 is shown in FIG.
As shown in (1), it extends in a direction orthogonal to the laser diode chip mounting surface and is coaxial with the rotation axis O passing through the light emission center point 411 of the laser diode chip 41.
As shown in FIGS. 2 and 4, a columnar convex portion 54 coaxial with the rotation axis O protrudes from the pedestal 51. In the lead frame portion 29, a cylindrical concave portion 291 is formed coaxially with the rotation axis O. This recess 2
91 can be formed, for example, by compressing with a press.

On the other hand, as described above, the notch portions 241 and 25 are formed in the right frame support portion 24 and the left frame support portion 25, respectively, as shown in FIGS.
1 is provided. As shown in FIG. 1, the right boss 52 and the left boss 53 protrude from the housing 50 at symmetrical positions with respect to the emission center point 411 (the convex portion 54). When the laser module is mounted on the pedestal 51 of the housing 50, as shown in FIGS. 2 and 4, the convex portion 54 of the housing 50 is inserted into the concave portion 291 of the lead frame portion 29, and as shown in FIGS. As shown in 3, right boss 5
2 and the left boss 53, respectively,
And the notch 251 of the left frame support 25, thereby positioning the laser module. Then, as shown in FIG. 4, while the tip 71 of the eccentric driver 70 is inserted into the adjustment hole 34 via the adjustment jig 80, the eccentric driver 70 is rotated around its axis, thereby Rotating module O
To adjust the horizontal angle at the light emission center point 411 of the laser diode chip 41. Thereafter, the UV adhesive 55 is dropped on the right boss 52 and the left boss 53 from above, and the laser module is fixed on the housing 50.

As described above, in the present embodiment, since the lead frame portion 29 is brought into direct contact with the housing 50,
The heat generated from the laser diode chip 41 is directly
It can escape to the housing 50. Thereby, the thermal resistance of the laser module can be made equal to that of the CAN package laser module. Therefore, even if the high power laser diode chip 41 is used, an increase in operating current, a change in wavelength, and the like do not cause much problem. Also,
Since the laser module is rotatable around the rotation axis O with respect to the housing 50, it is possible to adjust the horizontal angle at the emission center point 411 of the laser diode chip 41. Further, since it can be manufactured by integrally molding the lead frame 20 and the resin packages 31 and 32, the cost is low. Further, a front monitor 42 can be mounted in place of the back monitor 41 '.

The present invention is not limited to the above-described embodiment, and it goes without saying that various changes can be made without departing from the spirit of the present invention. For example, in the above-described embodiment, the lead frame portion 29 is exposed to the outside, but it is not always necessary to expose the lead frame portion 29 to the outside. In this case, a conductive adhesive may be used as an adhesive for fixing the laser module on the housing 50. Thus, heat generated by the laser diode chip can be released to the housing via the lead frame portion and the boss. Further, in the above-described embodiment, the concave portion is formed on the laser module main body side and the convex portion is formed on the housing side. However, these may be provided in reverse. That is, a convex portion may be formed on the laser module body side and a concave portion may be formed on the housing side. Anyway, any structure may be adopted as long as the structure allows the laser module to rotate around the laser diode emission point with respect to the housing.

[0060]

As described above, according to the present invention, the chip lead portion on which the laser diode chip is mounted is integrated with the frame support for attaching the laser module body to the housing to form a lead frame portion. Since it is formed, the heat generated in the laser diode chip can be efficiently released to the outside. In addition, since the laser module is configured so as to be rotatable around a central axis passing through the emission center point of the laser diode chip with respect to the housing, the horizontal angle at the emission center point of the laser diode chip can be adjusted. Is possible.

[Brief description of the drawings]

FIG. 1 is a plan view showing a configuration of a laser module according to one embodiment of the present invention.

FIG. 2 is a front sectional view taken along line II-II of the laser module shown in FIG.

FIG. 3 is a bottom view of the laser module shown in FIG.

FIG. 4 is a side sectional view of the laser module shown in FIG. 1;

FIG. 5 is a plan view showing an optical pickup to which the laser module according to the present invention is applied.

FIG. 6 is a configuration diagram illustrating an optical system of the optical pickup illustrated in FIG. 5;

FIG. 7 is a plan view showing a configuration of a conventional laser module.

8 is a front view of the laser module shown in FIG.

9 is a bottom view of the laser module shown in FIG.

FIG. 10 is a side sectional view of the laser module shown in FIG. 7;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 20 Lead frame 21 Chip mounting lead terminal 22 Laser diode anode lead terminal 23 Front monitor cathode lead terminal 24 Right frame support part 25 Left frame support part 26 Bridged part 27, 28 Connection part 29 Lead frame part 291 Depression 30 Laser module body 31 Lower Package 32 Upper Package 33 Cover Glass 41 Laser Diode Chip 411 Light Emission Center Point 42 Front Monitor (Photodiode Chip) 43 Submount 50 Housing 51 Base 52 Right Boss 53 Left Boss 54 Convex 61, 62 Wire 70 Eccentric Driver O Rotary axis

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Susumu Ishida 8-8-2 Kokuryocho, Chofu-shi, Tokyo Mitsumi Electric Co., Ltd. F-term (reference) 5D117 AA02 CC07 HH01 HH12 KK01 5D119 AA36 AA38 BA01 FA05 FA31 FA32 FA35 FA37 5F073 AB21 BA05 FA02 FA06 FA30

Claims (7)

[Claims] 1. A laser module mounted on a metal housing (50), wherein a laser diode chip (41) having an emission center point (411) is placed in a resin package (31, 32). Installed laser module body (3
0), the chip lead portion (21) for mounting the laser diode chip (41) is provided in the laser module body (3).
0) is integrated with a frame supporting portion (24, 25) for attaching to the housing, and is formed as a lead frame portion (29). The laser module is mounted on the housing (50) with respect to the housing (50). ,
It has a structure extending in a direction perpendicular to the laser module mounting surface of the housing (50) and rotatable around a rotation axis (O) passing through the light emission center point (411). Laser module. 2. The device according to claim 1, wherein the lead frame portion is exposed outside so as to be able to contact the laser module mounting surface of the housing. Laser module. 3. The lead frame portion (29) includes:
A columnar recess (291) is formed coaxially with the rotation axis (O), and a columnar projection (54) is formed in the housing (50) coaxially with the rotation axis (O). The protrusion (54) is rotatably inserted into the recess (291), whereby the laser module is rotatable around the rotation axis (O). Item 3. A laser module according to item 2. 4. A cylindrical recess (291) coaxial with the rotation axis (O) in the laser module body (30).
Is formed on the housing (50), and a columnar projection (54) is formed coaxially with the rotation axis (O), and the projection (54) is formed in the recess (291). The laser module according to claim 1, wherein the laser module is rotatably inserted into the laser module, whereby the laser module is rotatable around the rotation axis (O). 5. The laser module body (30) has a columnar projection formed coaxially with the rotation axis (O), and the housing (50) has the rotation axis (O). A cylindrical concave portion is formed coaxially with the concave portion, and the convex portion is rotatably inserted into the concave portion, whereby the laser module is rotatable around the rotation axis. Item 2. The laser module according to item 1. 6. The laser module body (30) is provided with an adjustment hole (34) into which a tip (71) of an eccentric driver (70) can be inserted.
The laser module can be rotated around the rotation axis (O) by rotating the eccentric driver (70) in a state in which the tip (71) of (0) is inserted into the adjustment hole (34). The laser module according to claim 1, wherein: 7. A lead part (22, 23) other than the chip lead part (21) is replaced with the chip lead part (2).
2. The laser module according to claim 1, wherein the laser module is provided at a position higher than 1) by a predetermined height.