JP2000158268A - Wafer attaching plate for universal chuck and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wafer attaching plate for a universal chuck preventing the transcription of the pattern of a gas impermeable ceramic annular partition wall on a wafer in grinding and polishing and providing the wafer having a flat surface. SOLUTION: A plurality of gas permeable porous ceramic annular elements concentric to each other and having the same height are arranged about a gas permeable porous ceramic disk in the outer circumference of the disk, a gas impermeable film annular partition wall of a flame coating ceramic type with the width 0.1-0.8 mm and the height same as the disk are disposed between the gas permeable porous ceramic disk and the gas permeable porous ceramic annular elements plus between the gas permeable porous ceramic annular elements, and thereby the wafer attaching plate for the universal chuck constituting a disk as a whole is provided.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting plate for a universal chuck which can be used for a universal chuck which can chuck and grind or polish a single semiconductor wafer even if the semiconductor wafers have different diameters. About the method.
When the wafer is ground and polished using the universal chuck provided with the mounting plate, the annular mark on the partition wall of the mounting plate is not transferred to the wafer.

[0002]

2. Description of the Related Art Conventionally, as a vacuum chuck used for grinding and polishing of a semiconductor wafer, a wafer suction mounting plate having a different diameter has been used each time according to the wafer diameter (Japanese Patent No. 2711424, Japanese Patent Laid-Open No. 6-1994). No. 5569, 6-3
No. 9709). Therefore, when grinding wafers with different diameters, it is necessary to replace the wafer suction plate of the chuck,
The grinding or polishing operation is interrupted. As a chuck that eliminates such defects, a single chuck that can chuck and grind or polish wafers of different diameters using a single chuck.
Sulchuk has been proposed and put into practical use (Japanese Unexamined Patent Publication No.
-32537, 8-1464, 8-14854
No. 8, No. 9-174364).

As shown in FIGS. 1 and 2, for example, a universal chuck 1 has, as shown in FIG. 1 and FIG. 2, a (A) air-permeable porous ceramic disk 2 having the same axis as the outer periphery of the disk. And a plurality of permeable porous ceramic annular bodies 3a, 3b, 3c, 3d...
The width between the air-permeable porous ceramic disk 2 and the air-permeable porous ceramic annular bodies 3a, 3b, 3c, 3d... A wafer mounting plate 5 in which a non-breathable annular partition wall 4a, 4b, 4c, 4d,... Having the same millimeter and height as the disk are arranged to form a single disk as a whole; A concave annular edge 6 for accommodating the mounting plate, a concave portion 7 is provided at the center of an upper surface portion located below the mounting plate 5, and a plurality of fluid passages are formed around the concave portion 7. Are provided concentrically, and a plurality of intake holes 9, 9, 9, 9, 9, 9 are provided in the annular groove.
.. Are provided in the vertical direction, respectively, in the wafer mounting plate housing flange 10, and (C) the air permeability in the air suction area formed by the non-air permeable annular partition wall of the mounting plate and the air inlet provided in the annular groove of the flange. Porous ceramic disc,
.. Intake means 11a, 11b, 11c, 11d... For inhaling each bottom face of the permeable porous ceramic annular body, and pipes 12a, 12b, 12c for reducing or increasing the pressure of the intake means or for supplying a liquid such as water. , 12d,..., Switching valves 13a, 13b,
13c, 13d...

Although not shown, the pipe is connected to a compressor, a water suction pump, a vacuum pump, and the like. This universal chuck is usually mounted on a head supported on a hollow shaft or on a rotating table supported on a hollow shaft. The wafer is placed on a mounting plate of the chuck, and the universal chuck is mounted according to the diameter of the wafer. Disk 2 of plate 5
Is determined, and the switching valve 12a and the other switching valves 12b, 12c... Of the suction means 11 are opened, and the wafer is sucked under reduced pressure. Is pressed against the wafer surface, and both the wafer and the grindstone or polishing pad are rotated to grind or polish the wafer. During grinding or polishing, abrasive or abrasive slurry may be supplied to the wafer surface or polishing pad surface.

Further, the universal chuck is sometimes used as a wafer chuck of a mounting table for cleaning the back surface of the wafer before the wafer is attracted to the vacuum chuck (Japanese Patent Laid-Open No. Hei 4-267541). As a polishing cloth material for the polishing pad, a nonwoven fabric such as polyurethane, polyester, polyvinyl alcohol, polyamide, cellulose fiber, felt, or foam sheet is used. As a grindstone, a cup wheel type diamond grindstone or a CBN grindstone is used.

[0006]

Recently, in order to mass-produce LSIs and device wafers, the diameter of the wafer is 300 m.
m and 450 mm, and the surface flatness (TTV) of the wafer is required to be 0.5 μm or less. . In addition, multilayer wiring is indispensable for miniaturization of LSI wiring and high integration of 256 MB or more, and a wafer having a flat interlayer insulating film that satisfies the depth of focus of optical lithography of 0.25 μm or less is required.

Since the width of the non-permeable partition wall of the wafer mounting plate of the conventional universal chuck is as wide as 2 to 6 mm,
In the grinding and polishing of these large-diameter wafers, the annular pattern of the impermeable partition wall is transferred, and the flatness cannot be satisfied. Further, the non-permeable partition wall of the wafer mounting plate of the conventional universal chuck has a gap between the outer periphery of the permeable porous ceramic disk and the permeable porous ceramic annular body and the permeable porous member. The space between the ceramic annular bodies is filled with glass fiber reinforced liquid epoxy resin or phenolic resin, and the surface of the disk-shaped mounting plate obtained by curing is flattened or polished to be flush. The liquid resin penetrates and hardens the porous ceramic to reduce the porosity, and it is necessary to increase the degree of decompression (vacuum) for wafer adsorption during grinding or polishing. It is presumed that the pattern of the annular partition wall is transferred to the wafer during grinding and polishing of a wafer having a flat surface. SUMMARY OF THE INVENTION It is an object of the present invention to provide a universal chuck wafer mounting plate suitable for providing a wafer having excellent flatness without transferring the pattern of the partition wall onto the wafer.

[0008]

A first aspect of the present invention is a plurality of discs having a center of the same axis and a same height on the outer periphery of the disc centered on a permeable porous ceramic disc. Are arranged between the air-permeable porous ceramic disk and the air-permeable porous ceramic annular body and between the air-permeable porous ceramic annular bodies. Is a universal disk in which a non-breathable thin-film annular partition wall of a sprayed ceramic having a width of 0.1 to 0.8 mm and the same height as the disk is arranged to form one disk as a whole.
An object of the present invention is to provide a wafer mounting plate for a monkey chuck. The width of the non-permeable thin annular partition wall of the universal chuck wafer mounting plate is reduced to 0.1 to 0.8 mm, and a sprayed ceramic is used as a material. It does not penetrate and has high adhesive strength between the non-breathable thin-film annular partition wall and the breathable porous ceramic annular body.

A second aspect of the present invention is to form an annular air-impermeable ring by spraying ceramic powder on the outer periphery of a gas-permeable porous ceramic disk, and grinding the air-impermeable ring. And a non-breathable thin-film annular partition wall having a width of 0.1 to 0.8 mm.
To form an air-permeable porous ceramic annular body, and spray ceramic powder on the outer periphery of the air-permeable porous ceramic annular body to form an annular air-impermeable annular body. Grinding the permeable annular body, width 0.1-0.8m
m, a non-breathable thin-film annular partition wall, and a green sheet is sintered on the outer periphery of the non-breathable thin-film annular partition wall to form a breathable port.
An object of the present invention is to provide a method for manufacturing the wafer mounting plate for a universal chuck, comprising forming an annular body made of a lath ceramic. A non-breathable annular body formed to a width of 1 to 2 mm is ground or polished to a width of 0.1 to 0.8.
mm, preferably 0.2 to 0.5 mm, could form a non-permeable thin film annular partition wall.

A third aspect of the present invention is to form an annular air-impermeable ring by spraying ceramic powder on the outer periphery of a gas-permeable porous ceramic disk, and grinding the air-impermeable ring. To form a non-breathable thin-film annular partition wall having a width of 0.1 to 0.8 mm, a glass adhesive is applied to the outer periphery of the non-breathable thin-film annular partition wall, and then a breathable porous ceramic annular body is formed. The outer periphery of the air-permeable thin-film annular partition wall is fitted, and ceramic powder is sprayed on the outer periphery of the air-permeable porous ceramic annular body to form an annular air-impermeable annular body. Grinding to form a non-permeable thin-film annular partition wall having a width of 0.1 to 0.8 mm, applying a glass adhesive to the outer periphery of the non-permeable thin-film annular partition wall, and then forming an air-permeable porous ceramic annular body It is characterized in that it is fitted around the outer periphery of a non-breathable thin annular partition wall. That, Yuniba of claim 1 - is intended to provide a method of manufacturing a wafer mounting plate for monkey chuck. Since the liquid glass adhesive is applied to the non-breathable thin film annular partition wall with a thin thickness of 5 to 50 μm, the partition wall does not greatly increase in thickness, so that the transfer of the partition wall to the wafer occurs. Absent.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION The porous ceramic of the permeable disk of the disk-shaped mounting plate and the permeable annular body of the present invention are silicon nitride,
Ceramic powders such as boron nitride, silicon carbide, silica stone, feldspar, corundum, alumina, titanium carbide, zirconium oxide, etc. are mixed with n-butyl methacrylate / methacrylic acid copolymer, n-butyl methacrylate / methacrylic acid / styrene copolymer. Coalescence, n-butyl methacrylate / methacrylic acid
A green sheet formed in the form of a sheet is formed into a disk or a ring by using an aqueous acrylic emulsion such as a methyl methacrylate copolymer as a binder.
The calcined product is calcined at ~ 900 ° C, then calcined at 1000-1300 ° C, and the outer surface, inner surface, front and back surfaces are obtained using a cylindrical grinder (polishing machine) or a surface grinder (polishing machine). It is manufactured by grinding (polishing) flat. Injection molding or compression molding of ceramic powder mixed with thermoplastic resin such as polystyrene and polyethylene, binder, plasticizer such as diethyl phthalate and dibutyl phthalate, and lubricating agent such as zinc stearate. It may be formed.

The non-breathable annular thin film partition wall is formed by spraying the ceramic powder at 600 to 800 ° C. on the outer periphery of the permeable porous ceramic disk at a temperature of 600 to 800 ° C. Is formed, and the impervious annular body is ground to have a width of 0.1 to 0.8 mm, preferably 0.2 to 0.5 mm.
And a green sheet is calcined and fired (sintered) around the outer periphery of the non-breathable thin-film annular partition as described above to form a breathable porous ceramic annular body. Then, ceramic powder is sprayed on the outer periphery of the air-permeable porous ceramic annular body to form a non-air-permeable annular body having a thickness of 1 to 2 mm. 1
A non-permeable thin-film annular partition wall having a thickness of about 0.8 mm, preferably 0.2 to 0.5 mm, and a green sheet sintered on the outer periphery of the non-permeable thin-film annular partition wall to form a breathable porous ceramic. An annular body is formed. Also, this air-permeable porous ceramic annular body is prepared in advance by injection molding or compression molding, and a glass adhesive is applied to the outer periphery of the air-impermeable thin-film annular partition wall in a thickness of 5 to 50 μm, Next, an annular body made of a breathable porous ceramic may be fitted to the outer periphery of the glass adhesive.

The number of the air-permeable porous ceramic annular bodies and the air-impermeable thin-film annular partition walls is determined by the diameter of the universal chuck used for the wafer. The thickness of the mounting plate is generally 10 to 30 mm. The mounting plate 5 is housed in a housing flange 10 as shown in FIG. 2, and a suction means 11 is attached to make a universal chuck.
Either a wafer holder is formed, or a hollow shaft is used as a wafer mounting table, or a hollow shaft is used as a vacuum chuck.

[0014]

According to the wafer mounting plate of the universal chuck of the present invention, the width of the impermeable annular thin film partition wall is 0.1 to 0.1 mm.
0.8 mm, preferably 0.2-0.5 mm, and formed of sprayed ceramic, during the grinding and polishing of the wafer, it is possible to reduce the degree of decompression of the wafer suction, while grinding and polishing the wafer The pattern of the non-breathable annular thin film partition wall is not transferred to the wafer, and a wafer having extremely excellent flatness can be provided.

[Brief description of the drawings]

FIG. 1 is a perspective view of a universal chuck table with a part cut away.

FIG. 2 is a sectional view taken along line AA of FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Universal chuck table w Wafer 2 Air-permeable porous ceramic disk 3 Air-permeable porous ceramic ring 4 Non-air-permeable sprayed ceramic thin-film annular partition wall 5 Mounting plate 10 Mounting plate storage flange 11 Intake means

Claims (3)

[Claims] 1. A plurality of permeable porous ceramic annular bodies having the same axial center and the same height are arranged on the outer periphery of a circular plate made of a permeable porous ceramic. The width between the air-permeable porous ceramic disk and the air-permeable porous ceramic annular body and between the air-permeable porous ceramic annular bodies is 0.1 to 0.8 m.
m, a wafer mounting plate for a universal chuck in which non-breathable thin-film annular partition walls of sprayed ceramic having the same height as the circular plate are arranged to constitute one disk as a whole. 2. An annular air-impermeable annular body is formed by spraying ceramic powder on the outer periphery of a gas-permeable porous ceramic disk, and the non-air-permeable annular body is ground to a width of 0.1 to 0.1 mm. 0.
An 8 mm non-breathable thin-film annular partition is formed, and a green sheet is sintered around the outer periphery of the non-breathable thin-film annular partition to form a breathable porous ceramic annular body.
A ceramic powder is sprayed on the outer periphery of the lath ceramic annular body to form an annular air-impermeable annular body, and the air-impermeable annular body is ground to form a non-permeable thin-film annular partition having a width of 0.1 to 0.8 mm. 2. The universal as claimed in claim 1, wherein a green sheet is sintered around the outer periphery of the non-breathable thin-film annular partition wall to form a breathable porous ceramic annular body. Manufacturing method of wafer mounting plate for chuck. 3. An annular air-impermeable annular body is formed by spraying ceramic powder on the outer periphery of a gas-permeable porous ceramic disc, and the non-air-permeable annular body is ground to a width of 0.1 to 0.1 mm. 0.
An 8 mm non-permeable thin-film annular partition wall is coated with a glass adhesive around the outer periphery of the non-permeable thin-film annular partition wall. And a ceramic powder is sprayed on the outer periphery of the air-permeable porous ceramic annular body to form an annular air-impermeable annular body. 0.8mm non-breathable thin film annular partition wall,
A glass adhesive is applied to the outer periphery of the non-permeable thin-film annular partition wall, and then a permeable porous ceramic annular body is fitted to the outer periphery of the non-permeable thin-film annular partition wall. 2. The method for manufacturing a wafer mounting plate for a universal chuck according to 1.