JP2000147279A - Optical waveguide module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical waveguide module capable of suppressing the inflow of moisture into its inside and reducing temperature dependency even when it is used under an environment of high temperature and high humidity and having high optical characteristics. SOLUTION: A case is formed by a body 1 provided with a storing part 4 for a waveguide chip 11 and a cover member 2 for covering the upper part side of the body 1, the chip 11 and a Peltier element 6 for holding the chip 11 at set temp. are stored in the storing part 4 based on the detected temperature of a thermistor 23 and an optical fiber 7 connected to the chip 11 and conductors 18, 19 connected to the thermistor 23 and the element 6 are drawn out to the outside of the case. The storing part 4 is sealed by a moisture permeability preventing member consisting of rubber or plastic O-ring 5 arranged between the body 1 and the cover part 2 and the leading part side of the conductors 18, 19 from the case and the leading part side of the fiber 7 from the case are respectively fixed to the case by a potting agent 9.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to an optical communication system,
The present invention relates to an optical waveguide module used for an optical information processing device or the like.

[0002]

2. Description of the Related Art At present, in the field of optical communication, a flat optical waveguide circuit (PLC; Pl) in which a plurality of optical waveguides are juxtaposed on silicon and quartz wafers from the viewpoint of cost reduction and high integration.
anere Light-wave Circuit)
Is being put to practical use. Optical waveguide components such as PLC
When the (optical waveguide chip) is used for optical communication, an optical fiber array in which a plurality of optical fibers are accurately arranged in parallel is connected to an optical waveguide component and used as an optical waveguide module.

As an example of an optical waveguide component, one formed with an optical waveguide circuit such as a spectral splitter or an arrayed waveguide type diffraction grating is used, and these optical waveguide components have different wavelengths depending on the optical waveguide circuit. It has a function of splitting and multiplexing an optical signal. However, the optical waveguide component is generally formed by depositing a quartz optical waveguide on a silicon substrate. In the optical waveguide component, when the temperature of the optical waveguide fluctuates, the strain generated in the optical waveguide causes The wavelengths that are demultiplexed and multiplexed shift as described above, and accordingly, the wavelengths that are demultiplexed and multiplexed by the optical waveguide module fluctuate depending on the operating temperature environment of the optical waveguide module. Problems arise.

Therefore, in order to avoid this problem, an optical waveguide component is provided inside the case to insulate the outside of the case, and further, as a temperature holding means for holding the optical waveguide component at a predetermined set temperature, a low temperature side component is provided. By providing a small Peltier element capable of adjusting both temperatures on the high-temperature side in the case, the operating temperature of the optical waveguide module is generally reduced by -20.
° C to 70 ° C, while the temperature of the optical waveguide component is 45 ° C.
It is used to adjust the temperature to around ℃.

FIG. 2 shows an example of an optical waveguide module having the above-mentioned Peltier element in an exploded state. As shown in the figure, the optical waveguide module includes a Peltier element 6, a heat equalizing plate 12, and a waveguide chip 11 as an optical waveguide component in a housing 4 of a body (bottom component) 1 as a case body. The body 1 is housed in order and the upper side of the body 1 is covered with a cover member (cover) 2. The cover member 2 is fixed to the body 1 by screwing a screw 29 inserted into the hole 32 into a screw hole 28 of the body 1. The waveguide chip 11 is formed by PLC.

The heat equalizing plate 12 is for equalizing the planar temperature of the waveguide chip 11, and has a thermistor insertion hole 22 formed in the center thereof.
2, a thermistor 23 is inserted. Heat equalizing plate 1
A hole 33 is formed at the end of the body 2, and the screw 30 inserted into the hole 33 is screwed into the screw hole 34 of the body 1 via the spacer 27, whereby the heat equalizing plate 12 is 1
And the Peltier element 6 is also fixed to the body 1. The spacer 27 prevents the Peltier element 6 from being applied with an excessive force when the screw 33 is tightened.

Also, the Peltier element 6 to the Peltier element 6
A lead wire (electric wire) 19 that is connected to the control unit is drawn out, and power is supplied to the Peltier element 6 via the lead wire 19. The conducting wire 19 and the conducting wire (electric wire) 18 drawn from the thermistor 23 are both drawn out of the body 1 through the conducting wire insertion portion 38 and fixed by the stopper 26 provided on the upper side of the conducting wire insertion portion 38. Have been. The stopper 26 is fixed to the body 1 by a screw 31 inserted into the hole 35. The heat equalizing plate 12 and the Peltier element 6 are bonded with silicone grease, and silicone grease is provided between the stopper 26 and the body 1.

[0008] Optical fibers 7 are connected to the waveguide chip 11 on the connection end faces on both ends thereof by an adhesive. A glass plate 13 is provided on the connection end surface side of the waveguide chip 11, and glass plates 14 are provided on the connection end surface side of the optical fiber 7 on the upper and lower sides thereof.

In the optical waveguide module shown in FIG. 1, for example, the optical fiber 7 on the right side of the figure constitutes the optical fiber on the incident side, and the optical fiber 7 on the left side of the figure constitutes the optical fiber on the exit side. I have. Waveguide chip 1 of optical fiber 7
The side opposite to the side connected to the body 1 is drawn out of the case composed of the body 1 and the cover member 2 via an optical fiber insertion portion 36 formed in the body 1. Note that the optical fiber insertion portion 36 is provided with a boot 16 for fixing the optical fiber 7.
Through the optical fiber insertion hole 37.

In this type of optical waveguide module,
As described above, the temperature of the waveguide chip 11 is adjusted by the Peltier element 6. Specifically, when the outside air temperature becomes higher than the regulated temperature, for example, 45 ° C., the Peltier element 6 Take away the heat from 11,
The taken heat is radiated to the body 1, and the heat of the waveguide chip 11 is radiated to the outside through the body 1. Conversely, when the outside air temperature becomes low, the Peltier element 6 takes heat from the body 1 (takes external heat through the body 1), and applies this heat to the waveguide chip 11. ing.

As described above, in controlling the temperature by the Peltier element 6, the body 1 is provided with fins for heat radiation and heat absorption in order to release heat to the outside via the body 1 and to easily absorb heat from the outside. In some cases.

[0012]

Incidentally, in the above-described optical waveguide module, a small flat waveguide circuit is used, and the temperature is controlled by the small Peltier element 6 to reduce the size and the size of the optical waveguide module. An optical waveguide module having low temperature dependence of optical characteristics is formed. However, when the outside air is hot and humid, the air flowing into the case has a temperature of 45 ° C.
Is cooled on the waveguide chip 11 to form dew, which may adversely affect temperature control and optical characteristics.
In order to prevent moisture from flowing into the housing portion 4 from outside the case, a sealant is applied to a gap between the body 1 and the cover member 2 and the like.

However, even when the sealant is applied, moisture may flow into the housing portion 4 from outside through the sealant because the sealant itself has moisture permeability. The inflow of moisture into the interior could not be effectively prevented.

Further, in the configuration of the conventional optical waveguide module as shown in FIG.
Since the portions 8 and 19 are not firmly fixed at the portions where they are drawn out of the case, the portions where the optical fibers 7 are drawn out of the case through the optical fibers 7 and the conductors 18 and 19 which are drawn out of the case. When tension is applied to the lead portions of the conductors 18 and 19 from the case, the optical fiber 7
There is also a problem that a gap is generated between the optical fiber 7 or the conductive wires 18 and 19 and the sealant, and the moisture of the outside air flows into the housing portion 4 through the gap.

Therefore, in the conventional optical waveguide module, it is not possible to effectively prevent dew condensation on the waveguide chip 11 due to moisture flowing into the housing portion 4 from the outside, and the optical waveguide module is exposed to a high-temperature and high-humidity environment. If used below, the temperature control of the Peltier element 6 and the optical characteristics of the waveguide chip 11 are adversely affected.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned conventional problems, and an object of the present invention is to effectively prevent the inflow of moisture from the outside. An object of the present invention is to provide an optical waveguide module having excellent optical characteristics that can suppress temperature dependence of optical characteristics even when used below.

[0017]

In order to achieve the above-mentioned object, the present invention has the following structure to solve the problem. That is, the first invention has a case main body provided with a housing portion for an optical waveguide component, and a lid member that covers an upper side of the case main body, wherein the housing portion has an optical waveguide component, Temperature holding means for holding the optical waveguide component at a predetermined set temperature is housed therein, and the housing portion is sealed by a moisture-permeable member provided between the case body and the lid member. It is a means to solve the problem with a certain configuration.

In the second aspect of the present invention, in addition to the configuration of the first aspect of the present invention, the moisture permeation preventing member is a rubber or plastic O-ring to solve the problem.

Further, according to a third aspect of the present invention, in addition to the configuration of the first or second aspect, an optical fiber is connected to the optical waveguide component, and an optical fiber is connected to a connection side of the optical fiber with the optical waveguide component. The opposite side is drawn out of the case consisting of the case body and the lid member, and a lead for conducting the temperature holding means to the control unit of the temperature holding means is drawn out of the case. The drawer side of the optical fiber and the drawer side of the optical fiber from the case are fixed to the case by a potting agent, respectively.

[0020] In the present invention having the above structure, the accommodating portion for the optical waveguide component is provided between the case body and the lid member.
For example, since it is sealed by a moisture-permeable member formed by a rubber or plastic O-ring or the like, it is possible to effectively prevent moisture from outside the case from flowing into the housing portion of the optical waveguide component. Becomes possible.

In particular, as in the third aspect of the present invention,
In the optical fiber connected to the optical waveguide component, or in the case where the side of the lead wire from the case that leads the temperature holding unit to the control unit of the temperature holding unit from the case is fixed to the case by the potting agent, the potting agent is As is well known, since it is filled with a thermosetting resin or the like so as to withstand shock or vibration and eliminate the cause of moisture and corrosion, the optical fiber and the conductor are drawn out of the case by the potting agent at the side of the drawer from the case. Because it is fixed firmly,
Even if tension is applied to the optical fiber or the conducting wire, the optical fiber or the conducting wire is prevented from moving at the drawn portion from the case or moving inside the case.

Therefore, in the third aspect of the present invention, even if tension is applied to the optical fiber or the conductor, a gap is formed on the side of the lead-out portion of the optical fiber or the conductor, and moisture outside the case flows in from the gap. This can be effectively prevented.

Therefore, in the present invention, it is possible to effectively suppress the inflow of moisture from the outside into the accommodation portion of the optical waveguide component, and the moisture may adversely affect the temperature control and optical characteristics of the optical waveguide component. Therefore, even if the optical waveguide module is used in a high-temperature and high-humidity environment, the optical waveguide module has excellent optical characteristics with little temperature dependence of the optical characteristics, and the above problem is solved.

[0024]

Embodiments of the present invention will be described below with reference to the drawings. In the description of the present embodiment, the same reference numerals are given to the same parts as those in the conventional example, and the duplicate description thereof will be omitted. FIG. 1 shows an embodiment of the optical waveguide module according to the present invention. The optical waveguide module of the present embodiment also has the body 1 provided with the housing portion 4 of the waveguide chip 11 as an optical waveguide component and the lid member 2 as in the conventional example. (A) in the figure
3 shows a plan view of the optical waveguide module with the lid member 2 omitted, and FIG. 4B shows a cross-sectional view of the optical waveguide module of the present embodiment.

As shown in these figures, the present embodiment is constructed in a substantially similar manner using substantially the same components as the conventional example. O is a moisture-permeable member provided between the body 1 and the cover member 2 so that the housing portion 4 of the waveguide chip 11 is
The sealing by the ring 5 and the conductors 18,1
The drawer side from the case 9 and the drawer side from the case of the optical fiber 7 are fixed to the case by the potting agent 9, respectively.

The O-ring 5 is made of, for example, rubber or plastic. In this embodiment, a step 8 is provided at a fitting portion of the cover member 2 with the body 1. O-ring 5 is interposed in the gap between the O-ring 5 and the O-ring 5.

In this embodiment, potting agent injection recesses 10 are provided at both ends of the body 1, respectively, and the potting agent injection recess 10 is inserted through the optical fiber 7 so that the potting agent is inserted. 9 is injected, and the optical fiber 7 is fixed to the body 1 of the case. The body 1 is provided with a potting agent injection recess 20 at one end thereof, and the potting agent 9 is injected with the potting agent injection recess 20 inserted through the conductors 18 and 19. . The conducting wire 18 is guided to a control unit of the Peltier device 6, and the Peltier device 6 controls the temperature of the waveguide chip 11 based on the temperature detected by the thermistor 23.

The heat equalizing plate 12 is made of copper, and is fixed in close contact with the waveguide chip 11 with an adhesive. The heat equalizing plate 12 is fixed to the body 1 with a plastic screw 15.

The present embodiment is configured as described above. In this embodiment, the housing 4 of the waveguide chip 11 is provided.
Is sealed by a moisture-permeable O-ring 5 interposed between the body 1 and the lid member 2, so that moisture from outside the case flows into the housing portion 4 of the waveguide chip 11. Can be effectively prevented.

In this embodiment, the waveguide chip 1
The lead-out portion of the optical fiber 7 connected to the case 1 from the case and the lead-out portion side of the conducting wires 18 and 19 connected to the thermistor 23 and the Peltier element 6 from the case are firmly attached to the case body 1 by the potting agent 9. And the optical fiber 7 and the conductors 18 and 19
Even if tension is applied to the fiber, the optical fiber 7 and the conductive wires 18 and 19
Is prevented from moving at the drawer from the body 1 or inside the case, and the optical fiber 7 and the conductor 1 are prevented from moving.
A gap is formed on the side of the drawer 8 or 19, and it is possible to effectively prevent moisture from outside the case from flowing into the housing 4 from the gap.

Therefore, according to the present embodiment, it is possible to effectively prevent external moisture from flowing into the accommodating portion 4 of the waveguide chip 11, and to control the temperature of the waveguide chip 11 and the optical characteristics by the moisture. Therefore, even if the optical waveguide module is used in a high-temperature and high-humidity environment, an optical waveguide module having excellent optical characteristics with almost no temperature dependence of the optical characteristics can be obtained.

According to this embodiment, since the housing 4 is sealed by the O-ring 5 interposed between the body 1 and the cover member, the optical waveguide is sealed to seal the housing 4. The module does not increase in size. In particular, according to the present embodiment, the O-ring 5 is provided between the step portion 8 provided on the lid member 2 and the body 1 to seal the housing portion 4. In addition, the O-ring 5 is never bulky.

Further, according to this embodiment, the potting agent injection holes 10 and 20 through which the optical fiber 7 and the conductors 18 and 19 penetrate are provided in the body 1 so that the optical fiber 7 and the conductor 1
Because 8 and 19 are fixed with potting agent,
There is no need to provide a conventional stopper 26 for fixing the optical fiber 7 and the conducting wires 18 and 19, and a small-sized optical waveguide module having a very simple configuration can be obtained.

Also, the optical waveguide module of this embodiment is formed using the small waveguide chip 11 formed by PLC and the small Peltier element 6 as in the conventional example. Also in this respect, a small optical waveguide module can be obtained.

It should be noted that the present invention is not limited to the above-described embodiment, but can adopt various embodiments. For example, in the above-described embodiment, the step portion 8 is provided on the lid member 2 and the O-ring 5 is provided in the gap between the step portion 8 and the body 1. On the contrary, the step portion is provided on the body 1. An O-ring 5 may be provided in a gap between the step portion and the lid member 2, or the O-ring 5
The arrangement position and arrangement state are not particularly limited, and are appropriately set. The O-ring 5 is interposed between the body 1 and the lid member 2 to seal the housing portion 4. If possible.

In the above-described embodiment, the rubber or plastic O-ring 5 is provided between the body 1 and the cover member 2 as a moisture-permeable member. The member for preventing moisture permeation provided therebetween is not necessarily the O-ring 5 made of rubber or plastic, and may be any member that can effectively prevent moisture from flowing into the housing portion 4.

Further, in the above embodiment, the Peltier element 6 is provided as the temperature holding means for holding the waveguide chip 11 at the set temperature.
Other temperature holding means may be used.

Further, in the above embodiment, the side of the optical fiber 7 and the leads 18 and 19 extending from the case is fixed to the case with the potting agent 9. However, the method of fixing the optical fiber 7 and the leads 18 and 19 is as follows. It is not particularly limited, and is appropriately set. However, when the optical fiber 7 and the lead-out portions of the conductors 18 and 19 from the case are fixed to the case with a potting agent 9 as in the above embodiment, even if the optical fiber 7 and the conductor 1
Even if tension is applied to the optical fibers 7 and the conductors 1 and 8,
8 and 19 can be firmly and securely fixed to the case, and the inflow of moisture into the accommodating portion 4 of the waveguide chip 11 can be more reliably prevented.
It is desirable to fix the lead portions of the lead wires 18 and 19 from the case to the case with a potting agent 9.

Further, the detailed configuration such as the circuit of the waveguide chip 11 and the number of the optical fibers 7 used in the optical waveguide module of the present invention is not limited to the above embodiment, but may be set as appropriate. The optical waveguide module of the present invention includes a waveguide chip 11 (optical waveguide component),
The temperature maintaining means of the optical waveguide component is housed in the housing portion 4 of the body 1, and the housing portion 4 is sealed by a moisture-permeable member provided between the body 1 and the lid member 2. Anything should do.

[0040]

According to the present invention, the housing portion for the optical waveguide component is sealed by the moisture-permeable member provided between the case body and the lid member, so that the housing portion is protected from the outside of the case. Moisture can be effectively prevented from flowing into the housing of the optical waveguide component, and even if used in a high-temperature and high-humidity environment, it is hardly affected by the inflow of moisture, and the temperature dependence of optical characteristics An optical waveguide module having less optical properties and excellent optical characteristics can be obtained.

In the case where the moisture-permeable member is formed of a rubber or plastic O-ring or the like, an O-ring is provided between the case body and the lid member to achieve the above-described excellent effect. And a small optical waveguide module can be easily and reliably formed.

Further, the optical fiber connected to the optical waveguide component and the lead-out side of the conducting wire for conducting the temperature holding means to the control section of the temperature holding means from the case are fixed to the case by a potting agent, respectively. In, even if tension is applied to the optical fiber and the conductor, the optical fiber and the conductor are firmly fixed on the side of the drawer from the case, so the optical fiber and the conductor move at the drawer from the case, It can be prevented from moving inside the case. Therefore, a gap is formed on the side of the lead-out portion of the optical fiber or the conducting wire, and it is possible to effectively prevent moisture from outside the case from flowing in from the gap, and it is further less likely to be adversely affected by the inflow of moisture. It is possible to provide an optical waveguide module having further excellent optical characteristics with less temperature dependence of the characteristics.

[Brief description of the drawings]

FIG. 1 is a main part configuration diagram showing an embodiment of an optical waveguide module according to the present invention.

FIG. 2 is an explanatory view showing an example of a conventional optical waveguide module in an exploded state.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Body 2 Cover member 4 Housing part 5 O-ring 6 Peltier element 7 Optical fiber 8 Step part 9 Potting agent 10, 20 Potting agent injection hole 11 Waveguide chip 12 Heat equalizing plate 18, 19 Conducting wire

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Tsunetoshi Saito 2-6-1 Marunouchi, Chiyoda-ku, Tokyo Furukawa Electric Co., Ltd. F-term (reference) 2H047 QA07 TA00 TA01

Claims (3)

[Claims] 1. An optical waveguide component comprising: a case main body provided with a housing portion for an optical waveguide component; and a lid member covering an upper side of the case main body, wherein the housing portion has an optical waveguide component, and the optical waveguide component. Temperature holding means for holding the temperature at a predetermined set temperature, and the housing is sealed by a moisture-permeable member provided between the case body and the lid member. An optical waveguide module. 2. The optical waveguide module according to claim 1, wherein the moisture-permeable member is an O-ring made of rubber or plastic. 3. An optical fiber is connected to the optical waveguide component, and a side of the optical fiber opposite to the side connected to the optical waveguide component is drawn out of a case composed of a case body and a lid member, and is provided with a temperature holding means. A lead wire that leads to the control unit of the temperature holding means is drawn out of the case, and the lead portion side of the lead wire from the case and the lead portion side of the optical fiber from the case are respectively connected to the case by a potting agent. The optical waveguide module according to claim 1, wherein the optical waveguide module is fixed.