JP2000057292A - Noncontact data carrier label - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a peeling destruction type noncontact data carrier label whose embedded noncontact data carrier element is destroyed by illegal peeling. SOLUTION: The noncontact data carrier label 1 includes a base material film 2, a peeling agent layer 3 provided in a partial area on one surface of the base material film, and also includes an adhesive covering layer 4 in which a noncontact data element 5 is incorporated in an embedded state, provided on one top surface of the base material film while completely covering the whole peeling agent layer. The part of the adhesive covering layer which incorporates the noncontact data carrier element in an embedded state is present over substantially both a peeling part 21 covering the peeling agent layer and the a nonpeeling part 22 which does not cover the peeling layer.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a peel-off type non-contact data carrier label. Since the non-contact data carrier label according to the present invention has a structure in which the non-contact data carrier element embedded therein is destroyed if the label is forcibly peeled off when the label is used while being attached. Therefore, it is impossible to reuse the data after peeling, and therefore, it is possible to effectively prevent unauthorized use such as falsification of data stored in the non-contact data carrier element.

[0002]

2. Description of the Related Art In recent years, non-contact data carrier systems have become widespread. This system comprises a data carrier (responder) attached to an adherend (for example, a plastic card, a car or a logistics product) and an interrogator (interrogator). , Information communication is performed in a non-contact state. Fields of application of the non-contact data carrier system include, for example, commuter passes of various transportation means, entry / exit management at various organizations and companies, and distribution management of goods. In such a field, it is desired to confirm and update data in a non-contact state using a miniaturized data carrier. One example of a miniaturized data carrier is a labeled data carrier that is attached to an adherend with an adhesive. This labeled data carrier, that is, the non-contact data carrier label, is extremely advantageous in that it is easy to peel off the protective release paper and affix it to the adherend. Since the peeling is also easy, there is a risk of illegal reuse such as illegal reuse of a used label or illegal reuse after data falsification. Therefore, a non-contact data carrier label capable of preventing unauthorized use that exploits the ease of peeling as described above is desired.

[0003]

One of the effective means for preventing such unauthorized use is to peel off the non-contact data carrier label attached to the adherend from the adherend. The purpose is to have a structure in which the function as a data carrier is simultaneously destroyed by the peeling operation. Therefore, the object of the present invention is to peel off the non-contact data carrier label attached to the adherend from the adherend,
An object of the present invention is to provide a non-contact data carrier label of a destruction type in which the non-contact data carrier element embedded in the label is destroyed by the peeling operation and the function as a data carrier is also destroyed at the same time. .

[0004]

The object of the present invention is to provide (1) a base film, (2) a release agent layer provided in a partial area on one surface of the base film, and (3) A) a non-contact data carrier label comprising an embedded non-contact data carrier element, and an adhesive embedding layer provided on said one surface of said substrate film while completely covering said release agent layer. Wherein a portion of the adhesive embedding layer that embeds the non-contact data carrier element includes a releasable portion covering the release agent layer and a non-peeling portion not covering the release agent layer. The problem can be solved by the non-contact data carrier label described above, wherein the label substantially spans both of the non-contact portions. The present invention also relates to a non-contact data carrier label in which a slit is provided at a boundary portion between the peelable portion and the non-peelable portion in the adhesive embedding layer.

[0005]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of a contactless data carrier label according to the present invention is shown in FIGS. FIG. 1 shows a non-contact data carrier label 1 according to the present invention, which is peeled off from a protective release paper (not shown), and then a distribution article 10 as an adherend.
It is sectional drawing which shows the state attached to the surface of. It should be noted that the cross-sectional views attached to this specification, including this FIG. 1, mainly illustrate the layered structure of the non-contact data carrier label 1 according to the present invention, and thus the thickness of each layer is exaggerated. Is shown. FIG. 2 is a plan view showing a part of the non-contact data carrier label 1 of the present invention shown in FIG.

As shown in FIGS. 1 and 2, the non-contact data carrier label 1 of the present invention is provided on (1) a base film 2 and (2) a partial area on one surface of the base film 2. And (3) an adhesive embedding layer 4 provided on the one surface of the base film 2 while completely covering the entirety of the release agent layer 3. The adhesive embedding layer 4 includes a non-contact data carrier element 5 embedded in an adhesive 4a, and includes the adhesive 4a and the contact data carrier element 5.

The base film 2 is a support for the release agent layer 3 and the adhesive embedment layer 4, and is used when the non-contact data carrier label 1 of the present invention is affixed to, for example, the surface of a distribution product 10. Acts as a surface protective layer. The base material film 2 is provided with a release agent layer 3 only in a partial region on one surface (the release agent layer-adhesive embedding layer installation surface). The release agent layer 3 is provided on one surface of the base film 2.
Is provided with an adhesive embedding layer 4 that completely covers the entirety of.
Therefore, the one side surface (the release agent layer-adhesive embedding layer installation surface) of the base film 2 is in contact with the release agent layer 3 and not in contact with the adhesive 4a of the adhesive embedding layer 4 (peeling). Sex area)
And the adhesive 4 of the adhesive embedding layer 4 without contacting the release agent layer 3
and a region (non-peelable region) that is in contact with a. Since the one surface of the base film 2 is divided into the two regions as described above with respect to the releasability, the adhesive embedding layer 4 provided on the one surface of the base film 2 is formed.
Also, corresponding to those peelable areas and non-peelable areas,
Each is divided into a peelable portion 21 and a non-peelable portion 22. The adhesive embedment layer 4 needs to be provided to such an extent that the non-contact data carrier label 1 of the present invention can be attached to, for example, the surface of the physical distribution product 10. (The release agent layer-adhesive embedding layer installation surface). In addition, as the adhesive embedding layer, after embedding the non-contact data carrier element with a resin, an adhesive layer is provided on both sides of the embedding body, and one adhesive layer is attached to a base film. It can also be used by sticking it to the surface of a distribution product or the like with the other adhesive layer.

The non-contact data carrier element 5 can be composed of, for example, a semiconductor element 51, an antenna circuit 52, and a lead wire 53 connecting them. This non-contact data carrier element 5 is
And the non-peelable part 22, and is embedded in the adhesive embedding layer 4. For example,
As shown in FIGS. 1 and 2, the semiconductor element 51 is disposed on the peelable portion 21, and the antenna circuit 52 is mounted on the non-peelable portion 22.
Can be embedded and placed. It should be noted that FIG.
FIG. 2 is a plan view of the non-contact data carrier label 1 of the present invention shown in FIG. A part of the non-contact data carrier element 5 and a part of the release agent layer 3 embedded in the adhesive embedding layer 4 are indicated by broken lines.

When a force is applied to peel off the non-contact data carrier label 1 of the present invention shown in FIG. 1 from the surface of the logistics product 10, the peelable portion 21 causes the one-side surface ( The peeling easily occurs between the release agent layer-adhesive embedding layer setting surface) and the release agent layer 3 (the act of forcibly peeling off the surface of the logistics product 10 is hereinafter referred to as "illegal peeling". May be called). On the other hand, in the non-peelable portion 22, no peeling occurs between the one surface (the release agent layer-the surface on which the adhesive embedment layer is provided) of the base film 2 and the adhesive embedment layer 4. Peeling occurs between the embedding layer 4 and the surface of the logistics product 10. Therefore, as shown in FIG. 3, when the non-contact data carrier label 1 is forcibly peeled off (illegally peeled) from the surface of the logistics product 10, the peelable portion 21 tends to remain on the surface side of the logistics product 10. Since the non-peelable portion 22 tends to remain on the surface side of the base film 2, the inside of the adhesive embedding layer 4 is broken. As a result, the non-contact data carrier element 5 embedded in the adhesive embedding layer 4 is also cut by the lead wire 53, the semiconductor element 51 remains on the surface side of the logistics product 10, and the antenna circuit 52 is It is peeled off together with the material film 2. Since it is practically impossible to re-attach the non-contact data carrier label 1 that has been illegally peeled off until the lead wire 53 is cut off and connect the lead wire 53 again, the illegal peeling operation is performed. Accordingly, the function of the contactless data carrier label 1 of the present invention as a contactless data carrier is completely destroyed.

By appropriately selecting the combination of the base film and the release agent layer, and the combination of the combination with the adhesive of the adhesive embedding layer, the release agent layer and the adhesive layer can be removed during the above-mentioned illegal release. Peeling can also occur between the embedding layer. Also in this case, in the non-peelable part, the non-contact data carrier element is destroyed because the peeling occurs between the adhesive embedding layer and the surface of the logistics product.

The material constituting the base film that can be used for the non-contact data carrier label of the present invention is a material that can serve as a support for the release agent layer and the adhesive layer and also act as a surface protective layer. It is not particularly limited as long as it is, and may be, for example, a paper film or sheet, a natural or synthetic fiber material (for example, woven or knitted fabric or nonwoven fabric) film or sheet, or a synthetic resin film or sheet. As synthetic resins, polyethylene, polypropylene, polyvinyl chloride, polystyrene, polyester, polyvinyl acetate, polybutene, polyacrylic acid, polymethacrylic acid, polyacrylate, polymethacrylate, polyvinyl alcohol, polyvinyl formal, polyvinyl butyral, Polyacrylonitrile, polyimide, polycarbonate,
Examples include various resins such as polyamide, ethylene-vinyl acetate copolymer, ethylene-acrylate copolymer, polyvinyl acetal, ethyl cellulose, cellulose triacetate, hydroxypropyl cellulose, and acrylonitrile butadiene styrene copolymer.

In the non-contact data carrier label of the present invention, the release agent layer can be formed by applying a known release resin. Examples of the releasable resin include a silicone resin, a polyamide resin, a wax, a higher alcohol (meth) acrylate, and a higher fatty acid ester.

In the non-contact data carrier label of the present invention, the adhesive constituting the adhesive embedment layer comprising the adhesive and the non-contact data carrier element may be a known pressure-sensitive adhesive or a heat-sensitive adhesive. In addition, a normal adhesive can be used. Specifically, a pressure-sensitive or heat-sensitive adhesive containing acrylic resin, urethane resin, natural rubber, synthetic rubber, silicone resin, polyolefin resin, polyester resin, or ethylene-vinyl acetate copolymer as a main component; or Including curing components such as epoxy resins, phenolic resins, melamine resins, alkyd resins, isocyanate compounds, or low molecular weight acrylic compounds or vinyl compounds containing hydroxyl groups, glycidyl groups, unsaturated bonds, etc .; Curable adhesives that cure with a wire or the like can be cited, but are not limited thereto as long as they can embed the non-contact data carrier element and adhere to the substrate film. Further, if necessary, a tackifier may be added for the purpose of improving the adhesive strength of the adhesive. The tackifier is not particularly limited, and examples thereof include rosin, terpene, phenol, and xylene resin. Further, a light absorber, a heat stabilizer, a softener, a filler, or the like can be added.

[0014] The contactless data carrier element that can be used in the contactless data carrier label of the present invention includes:
There is no particular limitation as long as it has a structure capable of cutting and breaking a part of it during the illegal peeling. Note that, in the present specification, the portion of the adhesive embedding layer including the non-contact data carrier element embedded therein, the peelable portion,
The phrase "substantially" straddles both the non-peelable portion and the non-peelable portion, in a manner capable of cutting and breaking a part of the non-peelable portion in the case of the illegal peeling. And both. The portion that is cut and destroyed in the case of the illegal peeling is not limited to the above-described lead wire, and may be, for example, cut and destroyed in an antenna circuit or a semiconductor element portion.

[0015] In a preferred aspect of the present invention, a slit can be provided in the adhesive embedding layer in order to more accurately define a location where the adhesive embedding layer is destroyed during the illegal peeling. By providing the slit at the boundary between the peelable portion and the non-peelable portion, the slit is intentionally formed to have a structure easily broken at the boundary portion. It is provided for the purpose of controlling so that the embedding layer is destroyed. For example, as shown in FIGS. 4 and 5, one or more slits 6 having cuts at the boundary portions of the non-peelable portions 22 of the adhesive embedding layer 4 are formed into the peelable portions 21.
Around. FIG. 4 is a cross-sectional view showing a state in which the non-contact data carrier label 1 according to the present invention is attached to the surface of a logistics product 10 as in FIG. 1, and FIG. 5 is a view similar to FIG. FIG. 2 is a plan view showing a part of the non-contact data carrier label 1 shown in FIG. The slit may be a continuous band, but it is preferable to provide a plurality of discontinuous broken-line slits.

When the non-contact data carrier label 1 according to the present invention in which one or more slits 6 are provided around the peelable portion 21 as shown in FIGS.
Since the strength of the adhesive embedding layer 4 is weakened at the slit 6, the breakage easily occurs from the portion where the slit 6 is provided, and the peelable portion 21 and the non-peelable portion 22 are separated and broken. Can be.

As shown in FIG. 4, the slit may penetrate the adhesive embedding layer and reach the surface of the substrate film. It may not even reach the film surface. Further, as shown in FIG. 5, a slit can be provided on the entire outer peripheral portion of the peelable portion 21.
May be provided only in a part of the adjacent portion. In that case, it is preferable to provide the contactless data carrier element in the vicinity of the portion to be cut. When forming a slit, care must be taken not to destroy the non-contact data carrier element by the slit itself. When slits are provided on the entire outer peripheral portion of the peelable portion, it is preferable to provide a plurality of discontinuous slits.

The contactless data carrier label according to the present invention can be manufactured in various ways. For example, a release agent is applied to a partial region of one side surface of the base film, and dried to form a release agent layer. Subsequently, the one side of the base film is completely covered while completely covering the entire release agent layer. An adhesive embedding layer is laminated and adhered on the surface. Until the non-contact data carrier label according to the present invention is used, it is preferable to protect the surface of the adhesive embedding layer by attaching a release sheet.

The adhesive embedding layer used in the non-contact data carrier label of the present invention can be formed by various methods. For example, after providing a release agent layer in a partial area on one side surface of the base film, an adhesive is applied or bonded thereon, and the non-contact data carrier circuit is buried inside the adhesive layer. An adhesive embedding layer can be formed. Also, after providing a release agent layer in a partial area of one side surface of the base film, an adhesive is applied or bonded thereon, and after a non-contact data carrier circuit is bonded to the adhesive layer, An adhesive embedding layer can also be formed by applying or bonding an adhesive thereover. Furthermore, the non-contact data carrier circuit is buried in a synthetic resin sheet in advance to create a resin layer in which the non-contact data carrier elements are embedded, while, on the other hand, peeling off a partial area on one surface of the base film. After the agent layer is provided, an adhesive is applied or bonded thereon, and after bonding the resin layer in which the non-contact data carrier element is embedded, the adhesive is further applied or bonded thereon. By doing so, an adhesive embedding layer can also be formed. Furthermore, the above-mentioned various adhesive embedding layers provided on the base film may be provided with slits by using a punching blade processed into an arbitrary shape, if necessary. After being formed on a release sheet, after providing a slit using a punching blade processed into an arbitrary shape, and bonded to a substrate film provided with a release agent layer in a partial area of one surface, in the present invention Related non-contact data carrier labels can also be manufactured.

Note that the non-contact data carrier circuit is formed by attaching a non-contact data carrier element to a woven or non-woven sheet in advance, or by sandwiching between two woven or non-woven sheets. Or you may use it as a nonwoven fabric laminated body.

In order to manufacture the non-contact data carrier label of the present invention, for example, after a release agent layer is printed on a partial area of one surface of the base film, the antenna and the lead constituting the non-contact data carrier element are printed. The line may be formed by printing with a conductive ink, followed by mounting a semiconductor chip thereon, and then applying or laminating an adhesive thereon to form an adhesive embedding layer. The conductive ink used for printing the antenna and the lead wire is not particularly limited, for example, a metal such as gold, silver, copper, aluminum, nickel, or tin, or carbon, a glass bead or a plastic having a metal or alloy. Alternatively, a material coated with a metal oxide, a conductive polymer such as polyaniline or polypyrrole, or a material obtained by dispersing a conductive fine powder in which a conductive polymer is doped with a metal in a resin can be used. As a method of mounting the semiconductor chip on these antennas and lead wires, a known method, for example, a wire bonding method, bonding by soldering, bonding by conductive resin, flip chip bonding, or the like can be used.

The contactless data carrier label according to the present invention can be used by attaching it as a data carrier (responder) to any adherend in the contactless data carrier system. For example, it can be used as a label for affixing to the surface of a physical distribution product, or can be affixed to the surface of a plastic card to be used as a commuter pass for various transportation means, or as an entry / exit management card for various organizations or companies.

In the non-contact data carrier label according to the present invention, the adhesive strength of the adhesive contained in the adhesive embedding layer is:
Considering the properties of the surface of the base film, the release performance of the release agent layer to be used, and the properties of the surface of the target to be applied, and the presence or absence of slits in the adhesive embedding layer, the object of the present invention Can be determined as appropriate within a range in which can be achieved. According to the findings of the present inventor, for example, a polyethylene terephthalate resin is used as a base film, a silicone resin is used as a release agent, and a general-purpose non-contact data carrier label in which a target to be stuck is not specified. When no slit is provided in the adhesive embedding layer, the adhesive strength of the adhesive contained in the adhesive embedding layer is preferably 1700 g / 25 mm or more. Further, in the case of a non-contact data carrier label similar to the above, in which a slit is provided in the adhesive embedding layer, the adhesive strength of the adhesive contained in the adhesive embedding layer is 7
It is preferably at least 00 g / 25 mm. here,
The adhesive strength of the adhesive is a value measured by the method described in Example 1 (2) below.

In the non-contact data carrier label according to the present invention, a visual confirmation means may be provided in order to make it possible to visually identify when an illegal peeling has occurred. For example, after providing a transparent or translucent release agent layer in a partial area on one surface of the transparent or translucent base film, before providing an adhesive embedding layer on the release agent layer, A printing ink layer or a metal deposition film is provided to completely cover the release agent layer and to cover the entire surface of the one side surface of the base film, and thereafter, an adhesive embedding layer is formed on the entire printing ink layer or the metal deposition film. Can be provided. If a non-contact data carrier label having such a printing ink layer or a metal vapor deposition film is applied to a logistics product and then illegally peeled off, the printing ink layer or the metal vapor deposition film is separated into a base film side and a logistics side, Since it is impossible to re-attach both parts separated in this way, illegal peeling can be visually identified. As such a visual confirmation means, other known means can be appropriately used.

[0025]

EXAMPLES The present invention will be described below in more detail with reference to examples, but these examples do not limit the scope of the present invention.

Example 1 (1) Preparation of pressure-sensitive adhesive A pressure-sensitive adhesive composition 1 comprising a copolymer of butyl acrylate / ethyl acrylate / hydroxyethyl acrylate (weight average molecular weight = 250,000)
150 g of ethyl acetate was added to 00 g to prepare a pressure-sensitive adhesive solution. (2) Measurement of Adhesive Force The adhesive force of the pressure-sensitive adhesive prepared in Example 1 (1) was measured based on JIS ZO237, 8.3.1 180 degree peeling method. Polyethylene terephthalate film (thickness = 50 μm) prepared using the adhesive solution described in Example 1 (1) as a substrate for measuring adhesive strength
Was applied using a doctor blade, and put into a thermostat at 100 ° C. for 10 minutes to dry. The thickness of the pressure-sensitive adhesive applied to this film was 25 μm. This film coated with the pressure-sensitive adhesive was cut into a width of 25 mm and attached to a stainless steel plate. After leaving for 24 hours,
When the adhesive strength when peeled in the 180 ° direction was measured, the adhesive strength was 2200 g / 25 mm.

(3) Preparation of Non-Contact Data Carrier Label On one surface of a polyethylene terephthalate film (length = 6 cm, width = 9 cm, thickness = 50 μm) as a base film, from one short side end thereof A silicone resin was applied in a circular shape having a diameter of 1.8 cm to a thickness of 1 μm on a 1-cm inner portion by screen printing, placed in a thermostat at 140 ° C. for 1 minute, and cured to form a release agent layer. The adhesive solution prepared in Example 1 (1) was applied thereon by a doctor blade, and 10
Minutes and dried. The thickness of the pressure-sensitive adhesive applied to this film was 20 μm. Then, thickness 2
A non-contact data carrier circuit is created by crimping the terminal of the IC chip to an antenna coil made of 0 μm copper,
It was stuck on the adhesive surface. At this time, the position was adjusted so that the IC chip portion overlapped with the release agent layer portion previously provided on the base film. On the other hand, the adhesive solution prepared in Example 1 (1) above was applied to a polyethylene terephthalate film (length = 6 cm, width = 9 cm, thickness = 50 μm), the entire surface of which was peeled off with a silicone resin, using a doctor blade. Then, the mixture was applied to a thermostat at 100 ° C. for 10 minutes and dried. The thickness of the pressure-sensitive adhesive applied to the full release film was 20 μm. The adhesive surface of the full release film and the non-contact data carrier circuit surface on the previously prepared circuit mounting film were bonded together to produce a non-contact data carrier label. A non-contact transmission / reception test was performed on this non-contact data carrier label, and it was confirmed that transmission / reception was performed normally.

(4) Unauthorized peeling test The non-contact data carrier label prepared in Example 1 (3) was peeled off from the entire surface of the non-contact data carrier label, and the adhesive surface was affixed to float glass. After leaving for 24 hours,
An unauthorized peeling operation was performed to peel off the non-contact data carrier label from the float glass. Of the adhesive layer, the peelable portion is a circle having a diameter of 1.8 cm on the float glass.
The other non-peelable portions remaining together with the C chip were peeled off from the float glass together with the polyethylene terephthalate film. With the illegal peeling operation, the antenna coil and the IC chip portion were physically cut off. When a non-contact data transmission / reception test was performed on the non-contact data carrier label after performing the unauthorized peeling operation, no transmission / reception could be performed.

[0028]

Example 2 (1) Preparation of pressure-sensitive adhesive The pressure-sensitive adhesive solution prepared in Example 1 (1) was used. (2) Preparation of Non-Contact Data Carrier Label On one surface of a polyethylene terephthalate film (length = 6 cm, width = 9 cm, thickness = 50 μm) as a base film, 1 cm inward from one short side end thereof. A silicone resin was applied to the portion in a circular shape having a diameter of 1.8 cm with a thickness of 1 μm by screen printing, placed in a thermostat at 140 ° C. for 1 minute, and cured to form a release agent layer. The adhesive solution prepared in Example 1 (1) was applied thereon by a doctor blade. Subsequently, a terminal portion of the IC chip was crimped to an antenna coil made of copper having a thickness of 20 μm to form a non-contact data carrier circuit, which was immersed in the adhesive solution previously applied. At this time, after aligning the position of the IC chip so as to overlap with the release agent layer previously provided on the base film, the IC chip is put into a thermostat at 100 ° C. for 15 minutes to produce a non-contact data carrier label. did. The thickness of the pressure-sensitive adhesive applied to this non-contact data carrier was 60 μm. A non-contact transmission / reception test was performed on this non-contact data carrier label, and it was confirmed that transmission / reception was performed normally.

(3) Illegal peeling test The adhesive surface of the non-contact data carrier label prepared in Example 2 (2) was affixed to float glass. 2
After leaving for 4 hours, an unauthorized peeling operation was performed to peel off the non-contact data carrier label from the float glass. Of the adhesive layer, the peelable portion remains on the float glass in a circular shape with a diameter of 1.8 cm together with the IC chip, and the other non-peelable portions are peeled off from the float glass together with the polyethylene terephthalate film. Was. With the illegal peeling operation, the antenna coil and the IC chip portion were physically cut off. When a non-contact data transmission / reception test was performed on the non-contact data carrier label after performing the unauthorized peeling operation, no transmission / reception could be performed.

[0030]

Example 3 (1) Preparation of pressure-sensitive adhesive The pressure-sensitive adhesive prepared in Example 1 (1) was used. (2) Preparation of non-contact data carrier label Resin composition 100 comprising a copolymer of ethyl acrylate / methyl methacrylate / hydroxyethyl acrylate (weight average molecular weight = 100,000)
To 100 g, 100 g of methylene chloride was added to obtain a resin solution for embedding a non-contact data carrier label. A polyethylene terephthalate film (length = 6 cm, width = 9 cm, thickness = 50 μ), the entire surface of which is peeled off with a silicone resin
m) was coated with the above resin solution by a doctor blade. A non-contact data carrier element (manufactured by pressing the terminal portion of an IC chip by pressing an antenna coil made of copper with a thickness of 20 μm) is buried in the resin solution applied to the full release film, and the temperature is kept at 60 ° C. The mixture was put in a tank for 10 minutes and dried. Subsequently, the entire release film was peeled off to obtain a resin layer in which the non-contact data carrier element was embedded. The thickness of this carrier was 20 μm. Next, on one side surface of a polyethylene terephthalate film (length = 6 cm, width = 9 cm, thickness = 50 μm) as a base film, a diameter of 1 cm inside from an end on one short side is screen-printed. A silicone resin was applied in a circular shape of 1.8 cm in a thickness of 1 μm, placed in a thermostat at 140 ° C. for 1 minute, and cured to form a release agent layer. The pressure-sensitive adhesive solution prepared in Example 1 (1) was applied thereon by a doctor blade, put into a thermostat at 100 ° C. for 10 minutes, and dried. The thickness of the pressure-sensitive adhesive applied to this film was 20 μm. A resin layer in which the previously prepared non-contact data carrier element was embedded was bonded to the adhesive surface of the thus obtained film to obtain a bonded film having a resin layer. At this time, the position was adjusted so that the portion of the IC chip embedded in the resin layer overlapped the portion of the release agent layer provided on the base film.

On the other hand, the adhesive solution prepared in Example 1 (1) was placed on a polyethylene terephthalate film (length = 6 cm, width = 9 cm, thickness = 50 μm), the entire surface of which was peeled off with a silicone resin. Apply with a blade, put in a 100 ° C constant temperature bath for 10 minutes,
Let dry. The thickness of the pressure-sensitive adhesive applied to the full release film was 20 μm. The non-contact data carrier label was manufactured by laminating the adhesive surface of the full release film and the resin layer surface of the resin layer laminating film. A non-contact transmission / reception test was performed on this non-contact data carrier label, and it was confirmed that transmission / reception was performed normally.

(3) Unauthorized peeling test The whole peeling film was peeled off from the non-contact data carrier label prepared in Example 3 (2), and the adhesive surface was stuck to float glass. After leaving for 24 hours,
An unauthorized peeling operation was performed to peel off the non-contact data carrier label from the float glass. Of the adhesive layer, the peelable portion is a circle having a diameter of 1.8 cm on the float glass.
The other non-peelable portions remaining together with the C chip were peeled off from the float glass together with the polyethylene terephthalate film. With the illegal peeling operation, the antenna coil and the IC chip portion were physically cut off. When a non-contact data transmission / reception test was performed on the non-contact data carrier label after performing the unauthorized peeling operation, no transmission / reception could be performed.

[0033]

Example 4 (1) Preparation of Pressure-Sensitive Adhesive 100 g of a pressure-sensitive adhesive composition comprising a copolymer of butyl acrylate / methyl methacrylate / hydroxyethyl acrylate (weight average molecular weight = 150,000) Was added with 150 g of ethyl acetate to obtain a pressure-sensitive adhesive solution. (2) Measurement of Adhesive Force When the adhesive force of the pressure-sensitive adhesive prepared in Example 4 (1) was measured by the same method as in Example 1 (2), the adhesive force was 1000 g / 25 mm. Was.

(3) Preparation of Non-Contact Data Carrier Label A non-contact data carrier circuit manufactured by crimping a terminal portion of an IC chip on an antenna coil made of copper having a thickness of 20 μm is made of a 2 μm thick polyester fiber having a thickness of 40 μm. It was sandwiched from above and below by a piece of nonwoven fabric. A polyethylene terephthalate film (length = 6 cm, width = 9 cm, thickness = 50 μ), the entire surface of which is peeled off with a silicone resin
m) With the non-woven fabric laminate including the non-contact data carrier circuit placed thereon, apply the pressure-sensitive adhesive solution prepared in Example 3 (1) using a doctor blade, and maintain a constant temperature of 100 ° C. The mixture was put in a tank for 10 minutes and dried.
The thickness of the thus-obtained laminate of the nonwoven fabric embedded with an adhesive impregnated and non-contact data carrier circuit was 120 μm. Next, using a punching blade having a circular perforated pattern having a diameter of 1.98 cm, an IC chip and a non-contact data carrier circuit-embedded non-woven fabric laminate around the IC chip-embedded portion of the adhesive-impregnated non-contact data carrier circuit-embedded nonwoven fabric A slit was provided so as to avoid the antenna.

On the other hand, on a surface of one side of a polyethylene terephthalate film (length = 6 cm, width = 9 cm, thickness = 50 μm) as a base film, screen printing is performed on a portion 1 cm inward from one short side end. With a diameter of 1.
A silicone resin was applied in a circular shape of 8 cm in a thickness of 1 μm, placed in a thermostat at 140 ° C. for 1 minute, and cured to form a release agent layer. On the surface provided with the release agent layer of this film,
The adhesive-impregnated-non-contact data carrier circuit-embedded nonwoven fabric laminate prepared above was bonded to produce a non-contact data carrier label. At this time, the positions of the release agent layer provided on the base film and the slit were overlapped. A non-contact transmission / reception test was performed on this non-contact data carrier label, and it was confirmed that transmission / reception was performed normally.

(4) Illegal Peeling Test The whole peeling film was peeled off from the non-contact data carrier label prepared in Example 4 (3), and the surface of the adhesive was stuck to float glass. After leaving for 24 hours,
An unauthorized peeling operation was performed to peel off the non-contact data carrier label from the float glass. In the adhesive layer, the portion provided with the slit remained on the float glass in a circular shape with a diameter of 1.9 cm together with the IC chip, and the other portions were separated from the float glass together with the polyethylene terephthalate film. . With the illegal peeling operation,
The antenna coil and the IC chip were physically cut off. A non-contact transmission / reception test was performed on the non-contact data carrier label after performing this unauthorized peeling operation.
No transmissions could be made.

[0037]

Example 5 (1) Preparation of pressure-sensitive adhesive The pressure-sensitive adhesive prepared in Example 1 (1) was used. (2) Preparation of Non-Contact Data Carrier Label On one surface of a polyethylene terephthalate film (length = 6 cm, width = 9 cm, thickness = 50 μm) as a base film, 2 cm inward from one short side end. In the part, screen printing rectangular shape (length = 5cm, width =
1 cm) of silicone resin with a thickness of 1 μm.
It was placed in a constant temperature bath at 40 ° C. for 1 minute and cured to form a release agent layer. On this, using a conductive ink containing silver as a main component, the antenna circuit is screen-printed so that a part of the antenna circuit overlaps the release agent layer, and is placed in a thermostat at 140 ° C. for 30 minutes. The ink was dried. The thus formed antenna circuit and the junction of the IC chip are
A non-contact data carrier circuit was formed by flip chip mounting via an anisotropic conductive film (manufactured by Sony Chemical: product name "ACF, CP7642K") inserted between them. On this circuit, the embodiment 1
The pressure-sensitive adhesive solution prepared in (1) is applied by a doctor blade and put into a thermostat at 100 ° C. for 10 minutes.
Dry to form a non-contact data carrier label. A non-contact transmission / reception test was performed on this non-contact data carrier label, and it was confirmed that transmission / reception was performed normally.

(3) Illegal peeling test The adhesive surface of the non-contact data carrier label prepared in Example 5 (2) was affixed to float glass. 2
After leaving for 4 hours, an unauthorized peeling operation was performed to peel off the non-contact data carrier from the float glass. In the adhesive layer, the peelable portion has a rectangular shape (length = 5 cm, width = 1).
cm) on the float glass together with a part of the antenna circuit, and the other part was peeled off from the float glass together with the polyethylene terephthalate film. A part of the antenna circuit and the other circuit part were physically disconnected with the illegal peeling operation. When a non-contact data transmission / reception test was performed on the non-contact data carrier label after performing the unauthorized peeling operation, no transmission / reception could be performed.

[0039]

Comparative Example 1 (1) Preparation of Pressure-Sensitive Adhesive The pressure-sensitive adhesive prepared in Example 1 (1) was used. (2) Preparation of a non-contact data carrier label A pressure-sensitive material prepared in Example 1 (1) above on one surface of a polyethylene terephthalate film (length = 6 cm, width = 9 cm, thickness = 50 μm) as a base film. The adhesive solution was applied by a doctor blade, put into a thermostat at 100 ° C. for 10 minutes, and dried. The thickness of the pressure-sensitive adhesive applied to this film was 20 μm. Then, an antenna coil made of copper having a thickness of 20 μm
A terminal portion of the C chip was crimped to form a non-contact data carrier circuit, which was bonded to the pressure-sensitive adhesive surface. on the other hand,
A polyethylene terephthalate film (length = 6 cm, width = 9c) with all surfaces on one side peeled off with silicone resin
m, thickness = 50 μm) on the adhesive solution prepared in Example 1 (1) above with a doctor blade,
It was put into a thermostat at 100 ° C. for 10 minutes and dried. The thickness of the pressure-sensitive adhesive applied to this film was 20 μm. The adhesive surface of the full release film and the non-contact data carrier circuit surface on the previously prepared non-contact data carrier circuit mounting film were bonded to form a non-contact data carrier label. A non-contact transmission / reception test was performed on this non-contact data carrier label, and it was confirmed that transmission / reception was performed normally.

(3) Unauthorized peeling test The entire peeling-off film was peeled off from the non-contact data carrier label prepared in Comparative Example 1 (2), and the adhesive surface was affixed to float glass. After leaving for 24 hours,
When an unauthorized peeling operation was performed to peel off the non-contact data carrier label from the float glass, it was possible to easily peel off the label without breaking the antenna circuit or the IC circuit. A non-contact transmission / reception test was performed on the non-contact data carrier label after performing the unauthorized peeling operation. As a result, transmission / reception was normally performed.

[0041]

The peel-break type non-contact data carrier label according to the present invention includes a peelable portion and a non-peelable portion in an adhesive embedding layer, and wraps the non-contact data carrier element over both portions. As a result, the non-contact data carrier element is simultaneously destroyed by the illegitimate peeling action. Therefore, the illegal peeling act itself becomes useless, and the illegal peeling act can be effectively prevented. Further, in the peeling destruction type non-contact data carrier label according to the present invention, when a slit is provided in the periphery of the peelable portion of the adhesive embedding layer, the cutting and destruction of the non-contact data carrier element due to the illegal peeling action is further enhanced. Can be easily generated,
In addition, it is possible to more surely control the place where the cutting breakage occurs.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view schematically showing a state in which a non-contact data carrier label according to the present invention is attached to the surface of a logistics product.

FIG. 2 is a plan view showing a part of the non-contact data carrier label in FIG.

FIG. 3 is a cross-sectional view schematically showing a cutting and breaking state that occurs when the non-contact data carrier label of FIG.

FIG. 4 is a cross-sectional view schematically showing a state in which a non-contact data carrier label according to another embodiment of the present invention is attached to the surface of a logistics product.

FIG. 5 is a plan view showing a part of the non-contact data carrier label of FIG.

[Description of Signs] 1 ... non-contact data carrier label; 2 ... base film; 3 ... release agent layer; 4 ... adhesive embedding layer; 5
... non-contact data carrier element; 6 ... slit;
10: logistics product; 21: peelable part; 22:
Non-peelable portion; 51: semiconductor element; 52: antenna circuit; 53: lead wire.

Claims (3)

[Claims] (1) a base film, and (2) a release agent layer provided in a partial area on one surface of the base film;
(3) A non-contact data carrier including an embedded non-contact data carrier element and an adhesive embedding layer provided on the one surface of the base film while completely covering the entire release agent layer. A label, wherein a portion of the adhesive embedding layer that embeds the non-contact data carrier element includes a releasable portion covering the release agent layer and not covering the release agent layer. The non-contact data carrier label as described above, which substantially spans both the non-peelable portion. 2. The adhesive embedding layer is broken at a boundary between the peelable portion and the non-peelable portion.
Contactless data carrier label as described in. 3. The non-contact data carrier label according to claim 1, wherein a slit is provided in a boundary portion between the peelable portion and the non-peelable portion in the adhesive embedding layer.