JP1729851S - Substrate processing system shadow ring lifting assembly - Google Patents
Substrate processing system shadow ring lifting assemblyInfo
- Publication number
- JP1729851S JP1729851S JP2022006447F JP2022006447F JP1729851S JP 1729851 S JP1729851 S JP 1729851S JP 2022006447 F JP2022006447 F JP 2022006447F JP 2022006447 F JP2022006447 F JP 2022006447F JP 1729851 S JP1729851 S JP 1729851S
- Authority
- JP
- Japan
- Prior art keywords
- shadow ring
- processing system
- substrate processing
- lifting assembly
- ring lifting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 title abstract 4
- 238000005229 chemical vapour deposition Methods 0.000 abstract 2
Abstract
本願意匠に係る物品「基板処理システムのシャドウリング持ち上げ組立体」は、例えば化学蒸着(CVD)装置等の基板処理システムにおいて基板の一部を覆うシャドウリングを昇降させるための組立体であり、参考図に示すように、リフトピンを介してシャドウリングを支持しシャドウリングを昇降させる。The article "Shadow ring lifting assembly for substrate processing system" according to the design of the present application is an assembly for lifting and lowering a shadow ring that covers a part of a substrate in a substrate processing system such as a chemical vapor deposition (CVD) apparatus. As shown in the figure, the shadow ring is lifted and lowered by supporting the shadow ring via lift pins.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/809,534 USD997894S1 (en) | 2021-09-28 | 2021-09-28 | Shadow ring lift assembly |
Publications (1)
Publication Number | Publication Date |
---|---|
JP1729851S true JP1729851S (en) | 2022-11-15 |
Family
ID=84027355
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022006447F Active JP1729851S (en) | 2021-09-28 | 2022-03-28 | Substrate processing system shadow ring lifting assembly |
Country Status (3)
Country | Link |
---|---|
US (1) | USD997894S1 (en) |
JP (1) | JP1729851S (en) |
TW (1) | TWD223247S (en) |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5922133A (en) | 1997-09-12 | 1999-07-13 | Applied Materials, Inc. | Multiple edge deposition exclusion rings |
US6589352B1 (en) * | 1999-12-10 | 2003-07-08 | Applied Materials, Inc. | Self aligning non contact shadow ring process kit |
US20030000647A1 (en) | 2001-06-29 | 2003-01-02 | Applied Materials, Inc. | Substrate processing chamber |
JP2006324610A (en) | 2005-05-20 | 2006-11-30 | Matsushita Electric Ind Co Ltd | Device and method of treating substrate |
US20220172980A1 (en) * | 2008-10-31 | 2022-06-02 | Asm Ip Holding B.V. | Self-centering susceptor ring assembly |
US8801857B2 (en) * | 2008-10-31 | 2014-08-12 | Asm America, Inc. | Self-centering susceptor ring assembly |
US9236284B2 (en) | 2014-01-31 | 2016-01-12 | Applied Materials, Inc. | Cooled tape frame lift and low contact shadow ring for plasma heat isolation |
WO2016036496A1 (en) * | 2014-09-05 | 2016-03-10 | Applied Materials, Inc. | Susceptor and pre-heat ring for thermal processing of substrates |
US20180138074A1 (en) * | 2016-11-11 | 2018-05-17 | Samsung Electronics Co., Ltd. | Carrier ring and chemical vapor deposition apparatus including the same |
JP7407125B2 (en) | 2018-04-20 | 2023-12-28 | ラム リサーチ コーポレーション | edge exclusion control |
US11512393B2 (en) * | 2018-11-29 | 2022-11-29 | Lam Research Corporation | Dynamic sheath control with edge ring lift |
KR20210016946A (en) | 2019-08-06 | 2021-02-17 | 삼성전자주식회사 | Shower head and substrate treating apparatus having the same |
JP2023510550A (en) * | 2020-01-17 | 2023-03-14 | ラム リサーチ コーポレーション | Exclusion ring with channels for exhausting wafer edge gas |
JP2023514842A (en) | 2020-02-21 | 2023-04-11 | ラム リサーチ コーポレーション | Backside reactivity inhibiting gas |
JP1678330S (en) | 2020-05-27 | 2021-02-01 | ||
US20220108908A1 (en) * | 2020-10-06 | 2022-04-07 | Applied Materials, Inc. | Shadow ring kit for plasma etch wafer singulation process |
-
2021
- 2021-09-28 US US29/809,534 patent/USD997894S1/en active Active
-
2022
- 2022-03-09 TW TW111301131F patent/TWD223247S/en unknown
- 2022-03-28 JP JP2022006447F patent/JP1729851S/en active Active
Also Published As
Publication number | Publication date |
---|---|
USD997894S1 (en) | 2023-09-05 |
TWD223247S (en) | 2023-01-21 |
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