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JP1729851S - Substrate processing system shadow ring lifting assembly - Google Patents

Substrate processing system shadow ring lifting assembly

Info

Publication number
JP1729851S
JP1729851S JP2022006447F JP2022006447F JP1729851S JP 1729851 S JP1729851 S JP 1729851S JP 2022006447 F JP2022006447 F JP 2022006447F JP 2022006447 F JP2022006447 F JP 2022006447F JP 1729851 S JP1729851 S JP 1729851S
Authority
JP
Japan
Prior art keywords
shadow ring
processing system
substrate processing
lifting assembly
ring lifting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022006447F
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Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Publication of JP1729851S publication Critical patent/JP1729851S/en
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Links

Abstract

本願意匠に係る物品「基板処理システムのシャドウリング持ち上げ組立体」は、例えば化学蒸着(CVD)装置等の基板処理システムにおいて基板の一部を覆うシャドウリングを昇降させるための組立体であり、参考図に示すように、リフトピンを介してシャドウリングを支持しシャドウリングを昇降させる。The article "Shadow ring lifting assembly for substrate processing system" according to the design of the present application is an assembly for lifting and lowering a shadow ring that covers a part of a substrate in a substrate processing system such as a chemical vapor deposition (CVD) apparatus. As shown in the figure, the shadow ring is lifted and lowered by supporting the shadow ring via lift pins.

JP2022006447F 2021-09-28 2022-03-28 Substrate processing system shadow ring lifting assembly Active JP1729851S (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/809,534 USD997894S1 (en) 2021-09-28 2021-09-28 Shadow ring lift assembly

Publications (1)

Publication Number Publication Date
JP1729851S true JP1729851S (en) 2022-11-15

Family

ID=84027355

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022006447F Active JP1729851S (en) 2021-09-28 2022-03-28 Substrate processing system shadow ring lifting assembly

Country Status (3)

Country Link
US (1) USD997894S1 (en)
JP (1) JP1729851S (en)
TW (1) TWD223247S (en)

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5922133A (en) 1997-09-12 1999-07-13 Applied Materials, Inc. Multiple edge deposition exclusion rings
US6589352B1 (en) * 1999-12-10 2003-07-08 Applied Materials, Inc. Self aligning non contact shadow ring process kit
US20030000647A1 (en) 2001-06-29 2003-01-02 Applied Materials, Inc. Substrate processing chamber
JP2006324610A (en) 2005-05-20 2006-11-30 Matsushita Electric Ind Co Ltd Device and method of treating substrate
US20220172980A1 (en) * 2008-10-31 2022-06-02 Asm Ip Holding B.V. Self-centering susceptor ring assembly
US8801857B2 (en) * 2008-10-31 2014-08-12 Asm America, Inc. Self-centering susceptor ring assembly
US9236284B2 (en) 2014-01-31 2016-01-12 Applied Materials, Inc. Cooled tape frame lift and low contact shadow ring for plasma heat isolation
WO2016036496A1 (en) * 2014-09-05 2016-03-10 Applied Materials, Inc. Susceptor and pre-heat ring for thermal processing of substrates
US20180138074A1 (en) * 2016-11-11 2018-05-17 Samsung Electronics Co., Ltd. Carrier ring and chemical vapor deposition apparatus including the same
JP7407125B2 (en) 2018-04-20 2023-12-28 ラム リサーチ コーポレーション edge exclusion control
US11512393B2 (en) * 2018-11-29 2022-11-29 Lam Research Corporation Dynamic sheath control with edge ring lift
KR20210016946A (en) 2019-08-06 2021-02-17 삼성전자주식회사 Shower head and substrate treating apparatus having the same
JP2023510550A (en) * 2020-01-17 2023-03-14 ラム リサーチ コーポレーション Exclusion ring with channels for exhausting wafer edge gas
JP2023514842A (en) 2020-02-21 2023-04-11 ラム リサーチ コーポレーション Backside reactivity inhibiting gas
JP1678330S (en) 2020-05-27 2021-02-01
US20220108908A1 (en) * 2020-10-06 2022-04-07 Applied Materials, Inc. Shadow ring kit for plasma etch wafer singulation process

Also Published As

Publication number Publication date
USD997894S1 (en) 2023-09-05
TWD223247S (en) 2023-01-21

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