ITMI20121896A1 - Mems-chippackage e procedimento per fabbricare un mems-chippackage - Google Patents
Mems-chippackage e procedimento per fabbricare un mems-chippackageInfo
- Publication number
- ITMI20121896A1 ITMI20121896A1 IT001896A ITMI20121896A ITMI20121896A1 IT MI20121896 A1 ITMI20121896 A1 IT MI20121896A1 IT 001896 A IT001896 A IT 001896A IT MI20121896 A ITMI20121896 A IT MI20121896A IT MI20121896 A1 ITMI20121896 A1 IT MI20121896A1
- Authority
- IT
- Italy
- Prior art keywords
- chippackage
- mems
- procedure
- manufacturing
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
- B81B3/0067—Mechanical properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0061—Packages or encapsulation suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
- B81C1/0023—Packaging together an electronic processing unit die and a micromechanical structure die
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00325—Processes for packaging MEMS devices for reducing stress inside of the package structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0257—Microphones or microspeakers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Mechanical Engineering (AREA)
- Micromachines (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102011086764A DE102011086764A1 (de) | 2011-11-22 | 2011-11-22 | MEMS-Chippackage und Verfahren zum Herstellen eines MEMS-Chippackages |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ITMI20121896A1 true ITMI20121896A1 (it) | 2013-05-23 |
Family
ID=48047089
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT001896A ITMI20121896A1 (it) | 2011-11-22 | 2012-11-07 | Mems-chippackage e procedimento per fabbricare un mems-chippackage |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8981499B2 (it) |
| CN (1) | CN103130175B (it) |
| DE (1) | DE102011086764A1 (it) |
| FR (1) | FR2982852B1 (it) |
| IT (1) | ITMI20121896A1 (it) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10273147B2 (en) | 2013-07-08 | 2019-04-30 | Motion Engine Inc. | MEMS components and method of wafer-level manufacturing thereof |
| JP6339669B2 (ja) | 2013-07-08 | 2018-06-06 | モーション・エンジン・インコーポレーテッド | Ｍｅｍｓデバイスおよび製造する方法 |
| EP3028007A4 (en) | 2013-08-02 | 2017-07-12 | Motion Engine Inc. | Mems motion sensor and method of manufacturing |
| US9584889B2 (en) | 2013-08-27 | 2017-02-28 | Infineon Technologies Ag | System and method for packaged MEMS device having embedding arrangement, MEMS die, and grille |
| EP2871152B1 (en) * | 2013-11-06 | 2017-05-24 | Sensirion AG | Sensor device |
| US9793877B2 (en) | 2013-12-17 | 2017-10-17 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Encapsulated bulk acoustic wave (BAW) resonator device |
| JP6590812B2 (ja) | 2014-01-09 | 2019-10-16 | モーション・エンジン・インコーポレーテッド | 集積ｍｅｍｓシステム |
| WO2015154173A1 (en) | 2014-04-10 | 2015-10-15 | Motion Engine Inc. | Mems pressure sensor |
| WO2015184531A1 (en) | 2014-06-02 | 2015-12-10 | Motion Engine Inc. | Multi-mass mems motion sensor |
| CN105282670B (zh) * | 2014-07-01 | 2019-02-12 | 日月光半导体制造股份有限公司 | 包含微机电系统装置的电子装置及其制造方法 |
| US9718678B2 (en) | 2014-09-25 | 2017-08-01 | Infineon Technologies Ag | Package arrangement, a package, and a method of manufacturing a package arrangement |
| EP3018092A1 (en) | 2014-11-10 | 2016-05-11 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | MEMS package |
| EP3032227B1 (en) | 2014-12-08 | 2020-10-21 | Sensirion AG | Flow sensor package |
| US11287486B2 (en) | 2014-12-09 | 2022-03-29 | Motion Engine, Inc. | 3D MEMS magnetometer and associated methods |
| US10407299B2 (en) | 2015-01-15 | 2019-09-10 | Motion Engine Inc. | 3D MEMS device with hermetic cavity |
| DE102015107557A1 (de) * | 2015-05-13 | 2016-11-17 | USound GmbH | Leiterplattenmodul mit durchgehender Aussparung sowie diesbezügliche Schallwandleranordnung sowie Herstellungsverfahren |
| US9617142B1 (en) | 2015-09-30 | 2017-04-11 | Mems Drive, Inc. | MEMS grid for manipulating structural parameters of MEMS devices |
| US9630836B2 (en) | 2015-09-30 | 2017-04-25 | Mems Drive, Inc. | Simplified MEMS device fabrication process |
| DE102016200261A1 (de) * | 2016-01-13 | 2017-07-13 | Robert Bosch Gmbh | Mikroelektronische Bauelementanordnung und entsprechendes Herstellungsverfahren für eine mikroelektronische Bauelementanordnung |
| US20170283247A1 (en) * | 2016-04-04 | 2017-10-05 | Infineon Technologies Ag | Semiconductor device including a mems die |
| CH714339B1 (de) | 2016-09-21 | 2020-06-30 | Sensirion Ag | Gassensor. |
| DE102017207887B3 (de) * | 2017-05-10 | 2018-10-31 | Infineon Technologies Ag | Verfahren zur Herstellung von gehäusten MEMS-Bausteinen auf Waferebene |
| CN114615607B (zh) * | 2022-05-09 | 2022-08-12 | 华天科技(南京)有限公司 | 一种mems麦克风封装结构及制造方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6936918B2 (en) * | 2003-12-15 | 2005-08-30 | Analog Devices, Inc. | MEMS device with conductive path through substrate |
| US7393758B2 (en) * | 2005-11-03 | 2008-07-01 | Maxim Integrated Products, Inc. | Wafer level packaging process |
| DE102005055478A1 (de) | 2005-11-22 | 2007-05-24 | Robert Bosch Gmbh | Mikromechanische Struktur zum Empfang und/oder zur Erzeugung von akustischen Signalen, Verfahren zur Herstellung einer mikromechanischen Struktur und Verwendung einer mikromechanischen Struktur |
| US7550828B2 (en) | 2007-01-03 | 2009-06-23 | Stats Chippac, Inc. | Leadframe package for MEMS microphone assembly |
| TWI341014B (en) * | 2007-05-30 | 2011-04-21 | Ind Tech Res Inst | A device structure with preformed ring and method therefor |
| JP2009074979A (ja) * | 2007-09-21 | 2009-04-09 | Toshiba Corp | 半導体装置 |
| US7851925B2 (en) | 2008-09-19 | 2010-12-14 | Infineon Technologies Ag | Wafer level packaged MEMS integrated circuit |
| CN101533832A (zh) * | 2009-04-14 | 2009-09-16 | 李刚 | 微机电系统器件与集成电路的集成芯片及集成方法 |
| CN102238463B (zh) * | 2010-04-30 | 2014-09-03 | 比亚迪股份有限公司 | 一种将硅麦克风器件与集成电路单片集成的方法及芯片 |
-
2011
- 2011-11-22 DE DE102011086764A patent/DE102011086764A1/de not_active Withdrawn
-
2012
- 2012-11-07 IT IT001896A patent/ITMI20121896A1/it unknown
- 2012-11-20 FR FR1261026A patent/FR2982852B1/fr active Active
- 2012-11-21 US US13/683,229 patent/US8981499B2/en not_active Expired - Fee Related
- 2012-11-21 CN CN201210473930.XA patent/CN103130175B/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN103130175B (zh) | 2016-12-21 |
| US20130126992A1 (en) | 2013-05-23 |
| CN103130175A (zh) | 2013-06-05 |
| FR2982852B1 (fr) | 2018-09-07 |
| FR2982852A1 (fr) | 2013-05-24 |
| US8981499B2 (en) | 2015-03-17 |
| DE102011086764A1 (de) | 2013-05-23 |
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