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ITMI20031178A1 - Depositi multistrato getter non evaporabili ottenuti per - Google Patents

Depositi multistrato getter non evaporabili ottenuti per

Info

Publication number
ITMI20031178A1
ITMI20031178A1 IT001178A ITMI20031178A ITMI20031178A1 IT MI20031178 A1 ITMI20031178 A1 IT MI20031178A1 IT 001178 A IT001178 A IT 001178A IT MI20031178 A ITMI20031178 A IT MI20031178A IT MI20031178 A1 ITMI20031178 A1 IT MI20031178A1
Authority
IT
Italy
Prior art keywords
evaporable getter
deposits
multilayer non
deposits obtained
disclosed
Prior art date
Application number
IT001178A
Other languages
English (en)
Inventor
Andrea Conte
Marco Moraja
Original Assignee
Getters Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Publication of ITMI20031178A0 publication Critical patent/ITMI20031178A0/it
Priority to IT001178A priority Critical patent/ITMI20031178A1/it
Application filed by Getters Spa filed Critical Getters Spa
Priority to IL16206604A priority patent/IL162066A0/xx
Priority to CA2467790A priority patent/CA2467790C/en
Priority to TW093114646A priority patent/TWI293335B/zh
Priority to AT04425406T priority patent/ATE422561T1/de
Priority to ES04425406T priority patent/ES2319989T3/es
Priority to EP04425406A priority patent/EP1518599B1/en
Priority to DE602004019367T priority patent/DE602004019367D1/de
Priority to DK04425406T priority patent/DK1518599T3/da
Priority to BR0401946-6A priority patent/BRPI0401946A/pt
Priority to MYPI20042208A priority patent/MY140457A/en
Priority to US10/866,345 priority patent/US7413814B2/en
Priority to KR1020040042555A priority patent/KR100655009B1/ko
Priority to RU2004117768/02A priority patent/RU2277609C2/ru
Priority to SG200404136A priority patent/SG116556A1/en
Priority to JP2004174287A priority patent/JP4065440B2/ja
Priority to CNB2004100493838A priority patent/CN100381603C/zh
Publication of ITMI20031178A1 publication Critical patent/ITMI20031178A1/it
Priority to HK05105466A priority patent/HK1072784A1/xx
Priority to US11/497,802 priority patent/US20070037007A1/en
Priority to US12/152,490 priority patent/US7745014B2/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C16/00—Alloys based on zirconium
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/021—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J7/00—Details not provided for in the preceding groups and common to two or more basic types of discharge tubes or lamps
    • H01J7/14—Means for obtaining or maintaining the desired pressure within the vessel
    • H01J7/18—Means for absorbing or adsorbing gas, e.g. by gettering
    • H01J7/183—Composition or manufacture of getters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12479—Porous [e.g., foamed, spongy, cracked, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12611—Oxide-containing component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12806—Refractory [Group IVB, VB, or VIB] metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12806—Refractory [Group IVB, VB, or VIB] metal-base component
    • Y10T428/12812—Diverse refractory group metal-base components: alternative to or next to each other
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12806—Refractory [Group IVB, VB, or VIB] metal-base component
    • Y10T428/12819—Group VB metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12875—Platinum group metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12986—Adjacent functionally defined components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12993—Surface feature [e.g., rough, mirror]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Physical Vapour Deposition (AREA)
  • Solid-Sorbent Or Filter-Aiding Compositions (AREA)
  • Common Detailed Techniques For Electron Tubes Or Discharge Tubes (AREA)
  • Laminated Bodies (AREA)
  • Vessels, Lead-In Wires, Accessory Apparatuses For Cathode-Ray Tubes (AREA)
IT001178A 2003-06-11 2003-06-11 Depositi multistrato getter non evaporabili ottenuti per ITMI20031178A1 (it)

Priority Applications (20)

Application Number Priority Date Filing Date Title
IT001178A ITMI20031178A1 (it) 2003-06-11 2003-06-11 Depositi multistrato getter non evaporabili ottenuti per
IL16206604A IL162066A0 (en) 2003-06-11 2004-05-19 Non-evaporable getter multilayer deposits obtainedby cathodic deposition and process for their manu facturing
CA2467790A CA2467790C (en) 2003-06-11 2004-05-19 Non-evaporable getter multilayer deposits obtained by cathodic deposition and process for their manufacturing
TW093114646A TWI293335B (en) 2003-06-11 2004-05-24 Non-evaporable getter multilayer deposits obtained by cathodic deposition and process for their manufacturing
AT04425406T ATE422561T1 (de) 2003-06-11 2004-06-01 Nicht-verdampfbare getter-vielschicht- abscheidungen erhalten durch kathodische abscheidung und verfahren zu deren herstellung
ES04425406T ES2319989T3 (es) 2003-06-11 2004-06-01 Depositos multicapa de aleaciones absorbentes no evaporables obtenidos por deposicion catodica y proceso para su fabricacion.
EP04425406A EP1518599B1 (en) 2003-06-11 2004-06-01 Non-evaporable getter multilayer deposits obtained by cathodic deposition and process for their manufacturing
DE602004019367T DE602004019367D1 (de) 2003-06-11 2004-06-01 Nicht-verdampfbare Getter-Vielschicht-Abscheidungen erhalten durch kathodische Abscheidung und Verfahren zu deren Herstellung
DK04425406T DK1518599T3 (da) 2003-06-11 2004-06-01 Ikke-fordampelige getter-flerlagsaflejringer opnået ved katodisk aflejring og fremgangsmåde til fremstilling af disse
BR0401946-6A BRPI0401946A (pt) 2003-06-11 2004-06-09 Depósito de multicamadas de materiais absorvedores não evaporáveis, e, processo para manufaturar um depósito de multicamadas
MYPI20042208A MY140457A (en) 2003-06-11 2004-06-09 Non-evaporable getter multilayer deposits obtained by cathodic deposition and process for their manufacturing
US10/866,345 US7413814B2 (en) 2003-06-11 2004-06-10 Multilayer getter structures and methods for making same
KR1020040042555A KR100655009B1 (ko) 2003-06-11 2004-06-10 음극 증착에 의해 얻어지는 비-증발성 게터 다층 증착물및 그 제조 방법
RU2004117768/02A RU2277609C2 (ru) 2003-06-11 2004-06-10 Многослойные покрытия из неиспаряющегося геттера, получаемые катодным осаждением, и способ их изготовления
SG200404136A SG116556A1 (en) 2003-06-11 2004-06-10 Non-evaporable getter multilayer deposits obtainedby cathodic deposition and precess for their manu facturing.
JP2004174287A JP4065440B2 (ja) 2003-06-11 2004-06-11 非蒸発型ゲッター材料の多層堆積物
CNB2004100493838A CN100381603C (zh) 2003-06-11 2004-06-11 通过阴极沉积获得的非蒸发性吸气多层沉积物及其制造方法
HK05105466A HK1072784A1 (en) 2003-06-11 2005-06-29 Non-evaporable getter multilayer deposits obtainedby cathodic deposition and process for their manu facturing
US11/497,802 US20070037007A1 (en) 2003-06-11 2006-08-01 Multilayer getter structures and methods for making same
US12/152,490 US7745014B2 (en) 2003-06-11 2008-05-13 Multilayer getter structures and methods for making same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT001178A ITMI20031178A1 (it) 2003-06-11 2003-06-11 Depositi multistrato getter non evaporabili ottenuti per

Publications (2)

Publication Number Publication Date
ITMI20031178A0 ITMI20031178A0 (it) 2003-06-11
ITMI20031178A1 true ITMI20031178A1 (it) 2004-12-12

Family

ID=30131190

Family Applications (1)

Application Number Title Priority Date Filing Date
IT001178A ITMI20031178A1 (it) 2003-06-11 2003-06-11 Depositi multistrato getter non evaporabili ottenuti per

Country Status (18)

Country Link
US (3) US7413814B2 (it)
EP (1) EP1518599B1 (it)
JP (1) JP4065440B2 (it)
KR (1) KR100655009B1 (it)
CN (1) CN100381603C (it)
AT (1) ATE422561T1 (it)
BR (1) BRPI0401946A (it)
CA (1) CA2467790C (it)
DE (1) DE602004019367D1 (it)
DK (1) DK1518599T3 (it)
ES (1) ES2319989T3 (it)
HK (1) HK1072784A1 (it)
IL (1) IL162066A0 (it)
IT (1) ITMI20031178A1 (it)
MY (1) MY140457A (it)
RU (1) RU2277609C2 (it)
SG (1) SG116556A1 (it)
TW (1) TWI293335B (it)

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITMI20041443A1 (it) 2004-07-19 2004-10-19 Getters Spa Processo per la produzione di schermi al plasma con materiale getter distribuito e schermi cosi'ottenuti
US8160697B2 (en) 2005-01-25 2012-04-17 Cameron Health, Inc. Method for adapting charge initiation for an implantable cardioverter-defibrillator
WO2006089068A2 (en) * 2005-02-17 2006-08-24 Saes Getters S.P.A. Flexible multi-layered getter
JP4327747B2 (ja) * 2005-02-21 2009-09-09 双葉電子工業株式会社 非蒸発ゲッターを備えた電子デバイス及びその電子デバイスの製造方法
ITMI20050616A1 (it) 2005-04-12 2006-10-13 Getters Spa Processo per la formazione di depositi getter miniaturizzati e depositi getrter cosi'ottenuti
GB0523838D0 (en) * 2005-11-23 2006-01-04 Oxford Instr Analytical Ltd X-Ray detector and method
EP1821328A1 (en) 2006-02-10 2007-08-22 Nanoshell Materials Research & Development GmbH Metallic dendritic gas sorbents and method for producing the same
BRPI0716836A2 (pt) * 2006-09-15 2013-11-05 Getters Spa Sistemas de absorvedor de metal
JP2008135690A (ja) * 2006-10-30 2008-06-12 Denso Corp 半導体力学量センサおよびその製造方法
JP2009522104A (ja) * 2006-12-15 2009-06-11 ビ−エイイ− システムズ パブリック リミテッド カンパニ− 薄膜ゲッタ装置に関する改善
JP4820783B2 (ja) * 2007-07-11 2011-11-24 昭和電工株式会社 磁気記録媒体の製造方法および製造装置
FR2922202B1 (fr) * 2007-10-15 2009-11-20 Commissariat Energie Atomique Structure comportant une couche getter et une sous-couche d'ajustement et procede de fabrication.
DE102007050289A1 (de) * 2007-10-18 2009-04-23 Heraeus Noblelight Gmbh Carbonstrahler mit Getter
EP2071188A1 (en) * 2007-12-10 2009-06-17 VARIAN S.p.A. Device for the deposition of non-evaporable getters (NEGs) and method of deposition using said device
EP2100988B1 (en) * 2008-03-12 2019-06-12 Acktar Ltd. Thin-layered structure
FR2933389B1 (fr) 2008-07-01 2010-10-29 Commissariat Energie Atomique Structure a base d'un materiau getter suspendu
US7910992B2 (en) 2008-07-15 2011-03-22 Maxim Integrated Products, Inc. Vertical MOSFET with through-body via for gate
DE102008060796B4 (de) 2008-11-18 2014-01-16 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Ausbilden einer Mikro-Oberflächenstruktur sowie zum Herstellen eines mikroelektromechanischen Bauelements, Mikro-Oberflächenstruktur sowie mikroelektromechanisches Bauelement mit einer solchen Struktur
ITMI20090410A1 (it) * 2009-03-18 2010-09-19 Getters Spa Leghe getter non evaporabili adatte particolarmente per l'assorbimento di idrogeno
CN101987396B (zh) * 2009-07-31 2014-02-19 鸿富锦精密工业（深圳）有限公司 锆基块体非晶合金激光焊接方法及焊接结构
JP2011204594A (ja) * 2010-03-26 2011-10-13 Canon Inc 電界放出ディスプレイ用の非蒸発型ゲッター
JP5290238B2 (ja) 2010-05-21 2013-09-18 株式会社日立ハイテクノロジーズ 電子顕微鏡
CN102205228B (zh) * 2010-05-27 2013-05-08 福建赛特新材股份有限公司 用于维持中低真空环境的复合吸气剂及其制备方法
CN102534489A (zh) * 2010-12-30 2012-07-04 鸿富锦精密工业（深圳）有限公司 镀膜件及其制造方法
FR2976932A1 (fr) * 2011-06-23 2012-12-28 Commissariat Energie Atomique Structure a materiau getter protege hermetiquement lors de sa realisation
RU2474912C1 (ru) * 2011-08-23 2013-02-10 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Национальный исследовательский университет "МИЭТ" (МИЭТ) Способ получения газопоглощающей структуры
ITMI20111870A1 (it) * 2011-10-14 2013-04-15 Getters Spa Composizioni di getter non evaporabili che possono essere riattivate a bassa temperatura dopo l'esposizione a gas reattivi ad una temperatura maggiore
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