IT950041B - Transistore ad elevata dissipazio ne termica e metodo per il montag gio dello stesso su di un substrato - Google Patents
Transistore ad elevata dissipazio ne termica e metodo per il montag gio dello stesso su di un substratoInfo
- Publication number
- IT950041B IT950041B IT21647/72A IT2164772A IT950041B IT 950041 B IT950041 B IT 950041B IT 21647/72 A IT21647/72 A IT 21647/72A IT 2164772 A IT2164772 A IT 2164772A IT 950041 B IT950041 B IT 950041B
- Authority
- IT
- Italy
- Prior art keywords
- substrate
- mounting
- high thermal
- thermal dissipation
- dissipation transistor
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
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- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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- H01L24/10—Bump connectors ; Manufacturing methods related thereto
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- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16238—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bonding area protruding from the surface of the item
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- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
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- H01L2924/13—Discrete devices, e.g. 3 terminal devices
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13824471A | 1971-04-28 | 1971-04-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
IT950041B true IT950041B (it) | 1973-06-20 |
Family
ID=22481133
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT21647/72A IT950041B (it) | 1971-04-28 | 1972-03-09 | Transistore ad elevata dissipazio ne termica e metodo per il montag gio dello stesso su di un substrato |
Country Status (10)
Country | Link |
---|---|
US (1) | US3772575A (it) |
AU (1) | AU467540B2 (it) |
BE (1) | BE782752A (it) |
CA (1) | CA975870A (it) |
DE (1) | DE2218230A1 (it) |
ES (2) | ES401934A1 (it) |
FR (1) | FR2134553B1 (it) |
GB (1) | GB1374848A (it) |
IT (1) | IT950041B (it) |
NL (1) | NL7205728A (it) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53147968A (en) * | 1977-05-30 | 1978-12-23 | Hitachi Ltd | Thick film circuit board |
US4376287A (en) * | 1980-10-29 | 1983-03-08 | Rca Corporation | Microwave power circuit with an active device mounted on a heat dissipating substrate |
US5917707A (en) | 1993-11-16 | 1999-06-29 | Formfactor, Inc. | Flexible contact structure with an electrically conductive shell |
JP2598328B2 (ja) * | 1989-10-17 | 1997-04-09 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
US5148265A (en) | 1990-09-24 | 1992-09-15 | Ist Associates, Inc. | Semiconductor chip assemblies with fan-in leads |
US5148266A (en) * | 1990-09-24 | 1992-09-15 | Ist Associates, Inc. | Semiconductor chip assemblies having interposer and flexible lead |
US5679977A (en) * | 1990-09-24 | 1997-10-21 | Tessera, Inc. | Semiconductor chip assemblies, methods of making same and components for same |
US7198969B1 (en) | 1990-09-24 | 2007-04-03 | Tessera, Inc. | Semiconductor chip assemblies, methods of making same and components for same |
US5258330A (en) * | 1990-09-24 | 1993-11-02 | Tessera, Inc. | Semiconductor chip assemblies with fan-in leads |
GB2255672B (en) * | 1991-05-10 | 1994-11-30 | Northern Telecom Ltd | Opto-electronic components |
US7073254B2 (en) | 1993-11-16 | 2006-07-11 | Formfactor, Inc. | Method for mounting a plurality of spring contact elements |
US5820014A (en) * | 1993-11-16 | 1998-10-13 | Form Factor, Inc. | Solder preforms |
US5874782A (en) * | 1995-08-24 | 1999-02-23 | International Business Machines Corporation | Wafer with elevated contact structures |
US8033838B2 (en) | 1996-02-21 | 2011-10-11 | Formfactor, Inc. | Microelectronic contact structure |
US5994152A (en) * | 1996-02-21 | 1999-11-30 | Formfactor, Inc. | Fabricating interconnects and tips using sacrificial substrates |
US5937276A (en) | 1996-12-13 | 1999-08-10 | Tessera, Inc. | Bonding lead structure with enhanced encapsulation |
CN114407502A (zh) * | 2022-03-01 | 2022-04-29 | 苏州通富超威半导体有限公司 | 印刷治具以及印刷方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE636316A (it) * | 1962-08-23 | 1900-01-01 | ||
DE1627762B2 (de) * | 1966-09-17 | 1972-11-23 | Nippon Electric Co. Ltd., Tokio | Verfahren zur Herstellung einer Halbleitervorrichtung |
US3539882A (en) * | 1967-05-22 | 1970-11-10 | Solitron Devices | Flip chip thick film device |
US3567506A (en) * | 1968-03-22 | 1971-03-02 | Hughes Aircraft Co | Method for providing a planar transistor with heat-dissipating top base and emitter contacts |
JPS4831507B1 (it) * | 1969-07-10 | 1973-09-29 | ||
US3631307A (en) * | 1970-02-13 | 1971-12-28 | Itt | Semiconductor structures having improved high-frequency response and power dissipation capabilities |
US3697828A (en) * | 1970-12-03 | 1972-10-10 | Gen Motors Corp | Geometry for a pnp silicon transistor with overlay contacts |
-
1971
- 1971-04-28 US US00138244A patent/US3772575A/en not_active Expired - Lifetime
-
1972
- 1972-02-24 CA CA135,540A patent/CA975870A/en not_active Expired
- 1972-03-09 IT IT21647/72A patent/IT950041B/it active
- 1972-04-10 AU AU40970/72A patent/AU467540B2/en not_active Expired
- 1972-04-14 DE DE19722218230 patent/DE2218230A1/de active Pending
- 1972-04-20 ES ES401934A patent/ES401934A1/es not_active Expired
- 1972-04-21 GB GB1866972A patent/GB1374848A/en not_active Expired
- 1972-04-26 FR FR7214881A patent/FR2134553B1/fr not_active Expired
- 1972-04-27 NL NL7205728A patent/NL7205728A/xx unknown
- 1972-04-27 BE BE782752A patent/BE782752A/xx unknown
- 1972-09-14 ES ES406660A patent/ES406660A1/es not_active Expired
Also Published As
Publication number | Publication date |
---|---|
FR2134553B1 (it) | 1977-09-30 |
AU4097072A (en) | 1972-10-18 |
GB1374848A (en) | 1974-11-20 |
US3772575A (en) | 1973-11-13 |
DE2218230A1 (de) | 1972-11-09 |
NL7205728A (it) | 1972-10-31 |
AU467540B2 (en) | 1972-10-18 |
CA975870A (en) | 1975-10-07 |
ES401934A1 (es) | 1975-11-01 |
FR2134553A1 (it) | 1972-12-08 |
ES406660A1 (es) | 1975-09-16 |
BE782752A (fr) | 1972-08-16 |
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