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IT1399285B1 - SUBSTRATE PROCESSING SYSTEM - Google Patents

SUBSTRATE PROCESSING SYSTEM

Info

Publication number
IT1399285B1
IT1399285B1 ITUD2009A000129A ITUD20090129A IT1399285B1 IT 1399285 B1 IT1399285 B1 IT 1399285B1 IT UD2009A000129 A ITUD2009A000129 A IT UD2009A000129A IT UD20090129 A ITUD20090129 A IT UD20090129A IT 1399285 B1 IT1399285 B1 IT 1399285B1
Authority
IT
Italy
Prior art keywords
processing system
substrate processing
substrate
processing
Prior art date
Application number
ITUD2009A000129A
Other languages
Italian (it)
Inventor
Marco Galiazzo
Andrea Baccini
Tommaso Vercesi
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to ITUD2009A000129A priority Critical patent/IT1399285B1/en
Priority to CN200980160266.XA priority patent/CN102473588B/en
Priority to KR1020127003141A priority patent/KR20120039695A/en
Priority to US13/382,043 priority patent/US20120109355A1/en
Priority to PCT/EP2009/062845 priority patent/WO2011000442A1/en
Priority to JP2012516528A priority patent/JP2012531729A/en
Priority to EP09736883.1A priority patent/EP2449576B1/en
Priority to TW099121871A priority patent/TWI424581B/en
Publication of ITUD20090129A1 publication Critical patent/ITUD20090129A1/en
Application granted granted Critical
Publication of IT1399285B1 publication Critical patent/IT1399285B1/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67225Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Polarising Elements (AREA)
  • Threshing Machine Elements (AREA)
  • Types And Forms Of Lifts (AREA)
  • Coating Apparatus (AREA)
  • Photovoltaic Devices (AREA)
ITUD2009A000129A 2009-07-03 2009-07-03 SUBSTRATE PROCESSING SYSTEM IT1399285B1 (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
ITUD2009A000129A IT1399285B1 (en) 2009-07-03 2009-07-03 SUBSTRATE PROCESSING SYSTEM
CN200980160266.XA CN102473588B (en) 2009-07-03 2009-10-02 Substrate processing system
KR1020127003141A KR20120039695A (en) 2009-07-03 2009-10-02 Substrate processing system
US13/382,043 US20120109355A1 (en) 2009-07-03 2009-10-02 Substrate processing system
PCT/EP2009/062845 WO2011000442A1 (en) 2009-07-03 2009-10-02 Substrate processing system
JP2012516528A JP2012531729A (en) 2009-07-03 2009-10-02 Substrate processing system
EP09736883.1A EP2449576B1 (en) 2009-07-03 2009-10-02 Substrate processing system
TW099121871A TWI424581B (en) 2009-07-03 2010-07-02 Substrate processing system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITUD2009A000129A IT1399285B1 (en) 2009-07-03 2009-07-03 SUBSTRATE PROCESSING SYSTEM

Publications (2)

Publication Number Publication Date
ITUD20090129A1 ITUD20090129A1 (en) 2011-01-04
IT1399285B1 true IT1399285B1 (en) 2013-04-11

Family

ID=41683198

Family Applications (1)

Application Number Title Priority Date Filing Date
ITUD2009A000129A IT1399285B1 (en) 2009-07-03 2009-07-03 SUBSTRATE PROCESSING SYSTEM

Country Status (8)

Country Link
US (1) US20120109355A1 (en)
EP (1) EP2449576B1 (en)
JP (1) JP2012531729A (en)
KR (1) KR20120039695A (en)
CN (1) CN102473588B (en)
IT (1) IT1399285B1 (en)
TW (1) TWI424581B (en)
WO (1) WO2011000442A1 (en)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102393609B (en) * 2011-11-12 2014-03-05 哈尔滨工业大学 Device and method for exchanging of double workpiece tables on lintel type single/double guide rails in double-drive stepping scanning
DE102012205249A1 (en) 2012-03-30 2013-10-02 JRT Photovoltaics GmbH & Co. KG Processing station for flat substrates and method for processing of flat substrates
DE102012205252A1 (en) 2012-03-30 2013-10-02 JRT Photovoltaics GmbH & Co. KG Processing station e.g. screen printing for planar substrate e.g. blank solar cell wafer, has two interchange points that are respectively arranged in regions of processing units between transportation lines and linear transport units
ITUD20120061A1 (en) * 2012-04-13 2013-10-14 Applied Materials Italia Srl PROCEDURE FOR CHECKING A SCHEME PRINTED ON A SUBSTRATE
KR101471130B1 (en) * 2013-07-16 2014-12-11 숭실대학교산학협력단 Planar motor and processing apparatus using the same
KR102176282B1 (en) 2013-07-25 2020-11-09 삼성전기주식회사 PCB(Printed Circuit Board) loading/unloading apparatus
CN103779244B (en) * 2014-01-21 2017-06-13 谢创 A kind of chip on board encapsulation bonding automatic assembly line
CN112018011A (en) * 2014-12-02 2020-12-01 应用材料意大利有限公司 Device for printing on a substrate for producing solar cells and method for transporting said substrate
TWI732285B (en) 2015-01-23 2021-07-01 美商應用材料股份有限公司 Semiconductor process equipment
ITUB20161142A1 (en) 2016-02-29 2017-08-29 Vismunda Srl METHOD AND AUTOMATIC PRODUCTION PLANT FOR PRINTING ON PHOTOVOLTAIC CELLS.
JP6703785B2 (en) * 2016-05-09 2020-06-03 キヤノン株式会社 Substrate processing apparatus and article manufacturing method
WO2018048842A1 (en) * 2016-09-12 2018-03-15 Applied Materials, Inc. Semiconductor process equipment
DE102017204630A1 (en) * 2017-03-20 2018-09-20 Ekra Automatisierungssysteme Gmbh printing device
KR101951187B1 (en) * 2017-06-26 2019-04-29 주식회사 에스에프에이 Inline inkjet system
US10507991B2 (en) 2018-05-08 2019-12-17 Applied Materials, Inc. Vacuum conveyor substrate loading module
DE102018210558A1 (en) * 2018-06-28 2019-02-28 Heidelberger Druckmaschinen Ag Printing device with a planar motor system
WO2020072507A1 (en) 2018-10-04 2020-04-09 Applied Materials, Inc. Transport system
US11521870B2 (en) * 2020-07-08 2022-12-06 Applied Materials, Inc. Annealing chamber
CN111730968B (en) * 2020-08-05 2021-06-18 苏州迈为科技股份有限公司 Printing device
TWI767828B (en) * 2021-08-27 2022-06-11 開必拓數據股份有限公司 Motor controlling system for application in apparatus having roll-to-roll mechanism

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JP3501559B2 (en) * 1995-06-27 2004-03-02 キヤノン株式会社 Linear motor device
JPH10223527A (en) * 1996-12-06 1998-08-21 Nikon Corp Aligner
KR100512450B1 (en) * 1996-12-24 2006-01-27 에이에스엠엘 네델란즈 비.브이. Two-dimensionally stabilized positioning device with two object holders and lithographic device with such positioning device
JP3626504B2 (en) * 1997-03-10 2005-03-09 アーエスエム リソグラフィ ベスローテン フェンノートシャップ Positioning device having two article holders
US6206964B1 (en) * 1997-11-10 2001-03-27 Speedline Technologies, Inc. Multiple head dispensing system and method
JP2001057325A (en) * 1999-08-17 2001-02-27 Nikon Corp Stage device and aligner
EP1111471B1 (en) * 1999-12-21 2005-11-23 ASML Netherlands B.V. Lithographic projection apparatus with collision preventing device
JP2002116239A (en) * 2000-10-06 2002-04-19 Yokogawa Electric Corp Device inspecting device
US6927505B2 (en) * 2001-12-19 2005-08-09 Nikon Corporation Following stage planar motor
JP4096359B2 (en) * 2003-03-10 2008-06-04 セイコーエプソン株式会社 Manufacturing equipment for manufacturing objects
DE602004020634D1 (en) * 2003-08-07 2009-05-28 Nippon Kogaku Kk EXPOSURE METHOD
JP4112472B2 (en) * 2003-10-21 2008-07-02 株式会社東芝 Semiconductor device manufacturing method and semiconductor device manufacturing apparatus
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US7589822B2 (en) * 2004-02-02 2009-09-15 Nikon Corporation Stage drive method and stage unit, exposure apparatus, and device manufacturing method
CN100552879C (en) * 2004-02-02 2009-10-21 尼康股份有限公司 Microscope carrier driving method and bearing table device, exposure device, and manufacturing method
JP2005294468A (en) * 2004-03-31 2005-10-20 Canon Inc Positioner device, aligner and device manufacturing method
TWI454859B (en) * 2006-03-30 2014-10-01 尼康股份有限公司 Mobile device, exposure device and exposure method, and component manufacturing method
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DE102007003224A1 (en) * 2007-01-15 2008-07-17 Thieme Gmbh & Co. Kg Processing line for plate-like elements, in particular solar cells, and method for processing plate-like elements
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ITUD20070198A1 (en) * 2007-10-24 2009-04-25 Baccini S P A POSITIONING DEVICE TO POSITION ONE OR MORE PLATES OF ELECTRONIC CIRCUITS, IN A METAL DEPOSITION UNIT, AND ITS PROCEDURE
JP2009136065A (en) * 2007-11-29 2009-06-18 Canon Inc Flat motor and stage using the same
US8711327B2 (en) * 2007-12-14 2014-04-29 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
JP4871337B2 (en) * 2008-09-18 2012-02-08 Nskテクノロジー株式会社 Exposure equipment
US8413578B2 (en) * 2008-11-19 2013-04-09 Illinois Tool Works Inc. Modular printing system having vertically separated pass through conveyor system

Also Published As

Publication number Publication date
CN102473588A (en) 2012-05-23
EP2449576A1 (en) 2012-05-09
JP2012531729A (en) 2012-12-10
EP2449576B1 (en) 2017-01-25
TWI424581B (en) 2014-01-21
CN102473588B (en) 2015-06-03
ITUD20090129A1 (en) 2011-01-04
US20120109355A1 (en) 2012-05-03
TW201110403A (en) 2011-03-16
WO2011000442A1 (en) 2011-01-06
KR20120039695A (en) 2012-04-25

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