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HK1257717A1 - Scanning exposure apparatus and scanning exposure method - Google Patents

Scanning exposure apparatus and scanning exposure method

Info

Publication number
HK1257717A1
HK1257717A1 HK19100088.2A HK19100088A HK1257717A1 HK 1257717 A1 HK1257717 A1 HK 1257717A1 HK 19100088 A HK19100088 A HK 19100088A HK 1257717 A1 HK1257717 A1 HK 1257717A1
Authority
HK
Hong Kong
Prior art keywords
scanning exposure
exposure apparatus
exposure method
scanning
exposure
Prior art date
Application number
HK19100088.2A
Other languages
Chinese (zh)
Inventor
加藤正紀
Original Assignee
株式會社尼康
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式會社尼康 filed Critical 株式會社尼康
Publication of HK1257717A1 publication Critical patent/HK1257717A1/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/24—Curved surfaces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
    • G03F7/2059—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a scanning corpuscular radiation beam, e.g. an electron beam
    • G03F7/2063—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a scanning corpuscular radiation beam, e.g. an electron beam for the production of exposure masks or reticles
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70141—Illumination system adjustment, e.g. adjustments during exposure or alignment during assembly of illumination system
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Toxicology (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Liquid Crystal (AREA)
HK19100088.2A 2013-06-14 2016-07-18 Scanning exposure apparatus and scanning exposure method HK1257717A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013126150 2013-06-14

Publications (1)

Publication Number Publication Date
HK1257717A1 true HK1257717A1 (en) 2019-10-25

Family

ID=52022046

Family Applications (2)

Application Number Title Priority Date Filing Date
HK19100088.2A HK1257717A1 (en) 2013-06-14 2016-07-18 Scanning exposure apparatus and scanning exposure method
HK16108441.0A HK1220513A1 (en) 2013-06-14 2016-07-18 Substrate processing apparatus, device manufacturing method, and exposure method

Family Applications After (1)

Application Number Title Priority Date Filing Date
HK16108441.0A HK1220513A1 (en) 2013-06-14 2016-07-18 Substrate processing apparatus, device manufacturing method, and exposure method

Country Status (6)

Country Link
JP (4) JP6344387B2 (en)
KR (4) KR102178173B1 (en)
CN (4) CN106896651B (en)
HK (2) HK1257717A1 (en)
TW (4) TWI752469B (en)
WO (1) WO2014199744A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6882316B2 (en) * 2016-03-04 2021-06-02 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ Wire grid polarizing plate manufacturing method
JP7232586B2 (en) * 2018-07-31 2023-03-03 東京エレクトロン株式会社 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND STORAGE MEDIUM
KR20220046598A (en) * 2019-08-16 2022-04-14 도쿄엘렉트론가부시키가이샤 Methods and Processes for Probability-Based Defect Correction

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2830492B2 (en) 1991-03-06 1998-12-02 株式会社ニコン Projection exposure apparatus and projection exposure method
JP3724517B2 (en) * 1995-01-18 2005-12-07 株式会社ニコン Exposure equipment
JPH08288203A (en) * 1995-04-11 1996-11-01 Nikon Corp Scanning aligner
JPH08293461A (en) * 1995-04-21 1996-11-05 Nikon Corp Lighting system and projection aligner using it
KR20030096435A (en) * 1996-11-28 2003-12-31 가부시키가이샤 니콘 Aligner and method for exposure
JPH10256476A (en) * 1997-03-12 1998-09-25 Canon Inc Columnar device and aligner and manufacture of device
US6416908B1 (en) * 2000-06-29 2002-07-09 Anvik Corporation Projection lithography on curved substrates
JP2003178954A (en) * 2001-12-12 2003-06-27 Canon Inc Exposure system and method of manufacturing device
EP1646074A4 (en) * 2003-07-09 2007-10-03 Nikon Corp Exposure apparatus and method for manufacturing device
JP2006235533A (en) * 2005-02-28 2006-09-07 Nikon Corp Exposure device and method for manufacturing micro device
US20070084368A1 (en) * 2005-10-13 2007-04-19 Ryan Vest Dynamic UV-exposure and thermal development of relief image printing elements
JP2007227438A (en) * 2006-02-21 2007-09-06 Nikon Corp Exposure apparatus and exposure method, and mask for light exposure
JP2007227703A (en) * 2006-02-24 2007-09-06 Seiko Epson Corp Board dividing method, board dividing apparatus, electrooptical device, and electronic device
JP4984631B2 (en) * 2006-04-28 2012-07-25 株式会社ニコン EXPOSURE APPARATUS AND METHOD, EXPOSURE MASK, AND DEVICE MANUFACTURING METHOD
WO2008029917A1 (en) 2006-09-08 2008-03-13 Nikon Corporation Mask, exposure apparatus and device manufacturing method
JP5104107B2 (en) * 2007-08-02 2012-12-19 ウシオ電機株式会社 Strip-shaped workpiece exposure apparatus and focus adjustment method in strip-shaped workpiece exposure apparatus
EP2048543B1 (en) * 2007-10-09 2013-12-04 ASML Netherlands B.V. An optical focus sensor, an inspection apparatus and a lithographic apparatus
US8264666B2 (en) * 2009-03-13 2012-09-11 Nikon Corporation Exposure apparatus, exposure method, and method of manufacturing device
US8625076B2 (en) * 2010-02-09 2014-01-07 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer edge exposure module
JP5724564B2 (en) * 2010-04-13 2015-05-27 株式会社ニコン Mask case, mask unit, exposure apparatus, substrate processing apparatus, and device manufacturing method
JPWO2011129369A1 (en) * 2010-04-13 2013-07-18 株式会社ニコン Exposure apparatus, substrate processing apparatus, and device manufacturing method
JP2011221536A (en) * 2010-04-13 2011-11-04 Nikon Corp Mask moving device, exposure device, substrate processor and device manufacturing method
CN103380483B (en) * 2011-04-25 2016-11-02 株式会社尼康 Substrate board treatment
CN103477286A (en) * 2011-09-07 2013-12-25 株式会社尼康 Substrate processing device

Also Published As

Publication number Publication date
KR102072956B1 (en) 2020-02-03
KR20200012040A (en) 2020-02-04
JP6451826B2 (en) 2019-01-16
KR101988818B1 (en) 2019-06-12
JP2020170162A (en) 2020-10-15
JP2018077507A (en) 2018-05-17
CN106896651A (en) 2017-06-27
TW202032294A (en) 2020-09-01
CN105308507A (en) 2016-02-03
CN108873613A (en) 2018-11-23
TW201908877A (en) 2019-03-01
TWI646408B (en) 2019-01-01
TW201809916A (en) 2018-03-16
CN110045580B (en) 2021-07-23
KR101924270B1 (en) 2018-11-30
CN110045580A (en) 2019-07-23
JP7070598B2 (en) 2022-05-18
KR20190067257A (en) 2019-06-14
JP2019045874A (en) 2019-03-22
CN105308507B (en) 2018-12-25
KR102178173B1 (en) 2020-11-12
HK1220513A1 (en) 2017-05-05
TWI693480B (en) 2020-05-11
WO2014199744A1 (en) 2014-12-18
TWI752469B (en) 2022-01-11
TW201502716A (en) 2015-01-16
JPWO2014199744A1 (en) 2017-02-23
CN108873613B (en) 2020-11-13
JP6690695B2 (en) 2020-04-28
KR20180128522A (en) 2018-12-03
KR20160021191A (en) 2016-02-24
JP6344387B2 (en) 2018-06-20
CN106896651B (en) 2018-06-12
TWI604275B (en) 2017-11-01

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