GB8517373D0 - Laminated circuit material - Google Patents
Laminated circuit materialInfo
- Publication number
- GB8517373D0 GB8517373D0 GB858517373A GB8517373A GB8517373D0 GB 8517373 D0 GB8517373 D0 GB 8517373D0 GB 858517373 A GB858517373 A GB 858517373A GB 8517373 A GB8517373 A GB 8517373A GB 8517373 D0 GB8517373 D0 GB 8517373D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- circuit material
- laminated circuit
- laminated
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
- B32B27/322—Layered products comprising a layer of synthetic resin comprising polyolefins comprising halogenated polyolefins, e.g. PTFE
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/08—Reinforcements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0251—Non-conductive microfibers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Reinforced Plastic Materials (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US62916484A | 1984-07-09 | 1984-07-09 |
Publications (3)
Publication Number | Publication Date |
---|---|
GB8517373D0 true GB8517373D0 (en) | 1985-08-14 |
GB2162124A GB2162124A (en) | 1986-01-29 |
GB2162124B GB2162124B (en) | 1988-06-02 |
Family
ID=24521865
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB08517373A Expired GB2162124B (en) | 1984-07-09 | 1985-07-09 | Laminated circuit material |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPS6164448A (en) |
KR (1) | KR910009491B1 (en) |
DE (1) | DE3524482A1 (en) |
FR (1) | FR2569078B1 (en) |
GB (1) | GB2162124B (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4634631A (en) * | 1985-07-15 | 1987-01-06 | Rogers Corporation | Flexible circuit laminate and method of making the same |
JPS63224935A (en) * | 1987-03-14 | 1988-09-20 | 松下電工株式会社 | Laminated board |
JP2501331B2 (en) * | 1987-03-14 | 1996-05-29 | 松下電工株式会社 | Laminate |
US4869956A (en) * | 1987-08-20 | 1989-09-26 | Olin Corporation | Polymer/copper laminate and method for fabrication thereof |
EP0379514A4 (en) * | 1987-08-20 | 1991-01-30 | Olin Corporation | Novel polymer/metal laminate and method for fabrication thereof |
US4833022A (en) * | 1987-08-20 | 1989-05-23 | Olin Corporation | Polymer/copper laminate and method for fabrication thereof |
US5055342A (en) * | 1990-02-16 | 1991-10-08 | International Business Machines Corporation | Fluorinated polymeric composition, fabrication thereof and use thereof |
JP3687680B2 (en) * | 1995-07-12 | 2005-08-24 | イー・アイ・デユポン・ドウ・ヌムール・アンド・カンパニー | Improved fluoropolymer adhesion. |
SE509570C2 (en) * | 1996-10-21 | 1999-02-08 | Ericsson Telefon Ab L M | Temperature compensating means and procedure for mounting electronics on a circuit board |
CN110744839A (en) * | 2019-11-01 | 2020-02-04 | 中国电子科技集团公司第四十六研究所 | Process for preparing composite dielectric plate based on low dielectric constant turning film |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4050976A (en) * | 1976-01-27 | 1977-09-27 | Bofors America, Inc. | Strain gage application |
FR2407815A1 (en) * | 1977-11-04 | 1979-06-01 | Commissariat Energie Atomique | MECHANICALLY FORMABLE COMPOSITE PART, USED IN PARTICULAR FOR THE REALIZATION OF PRINTED CIRCUITS IN THE FORM OF CURVED PLATES |
JPS5669245A (en) * | 1979-11-07 | 1981-06-10 | Fuji Fiber Glass Kk | Product of cut glass filament |
JPS57167256A (en) * | 1981-04-08 | 1982-10-15 | Hitachi Chemical Co Ltd | Heat insulating film |
JPS59112099A (en) * | 1982-12-15 | 1984-06-28 | 日本無機株式会社 | Production of glass paper |
-
1985
- 1985-06-12 KR KR8504128A patent/KR910009491B1/en not_active IP Right Cessation
- 1985-07-05 FR FR8510310A patent/FR2569078B1/en not_active Expired
- 1985-07-08 JP JP60149873A patent/JPS6164448A/en active Pending
- 1985-07-09 DE DE19853524482 patent/DE3524482A1/en not_active Withdrawn
- 1985-07-09 GB GB08517373A patent/GB2162124B/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
KR910009491B1 (en) | 1991-11-19 |
DE3524482A1 (en) | 1986-05-07 |
FR2569078B1 (en) | 1988-12-16 |
GB2162124A (en) | 1986-01-29 |
FR2569078A1 (en) | 1986-02-14 |
JPS6164448A (en) | 1986-04-02 |
GB2162124B (en) | 1988-06-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 19920709 |