FR2407815A1 - MECHANICALLY FORMABLE COMPOSITE PART, USED IN PARTICULAR FOR THE REALIZATION OF PRINTED CIRCUITS IN THE FORM OF CURVED PLATES - Google Patents
MECHANICALLY FORMABLE COMPOSITE PART, USED IN PARTICULAR FOR THE REALIZATION OF PRINTED CIRCUITS IN THE FORM OF CURVED PLATESInfo
- Publication number
- FR2407815A1 FR2407815A1 FR7733222A FR7733222A FR2407815A1 FR 2407815 A1 FR2407815 A1 FR 2407815A1 FR 7733222 A FR7733222 A FR 7733222A FR 7733222 A FR7733222 A FR 7733222A FR 2407815 A1 FR2407815 A1 FR 2407815A1
- Authority
- FR
- France
- Prior art keywords
- plate
- realization
- printed circuits
- composite part
- curved plates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/057—Shape retainable
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09018—Rigid curved substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S505/00—Superconductor technology: apparatus, material, process
- Y10S505/80—Material per se process of making same
- Y10S505/812—Stock
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Laminated Bodies (AREA)
- Particle Accelerators (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
L'INVENTION A POUR OBJET UNE PIECE COMPOSITE APTE A ETRE MISE SOUS UNE FORME DONNEE PAR FORMAGE MECANIQUE. CETTE PIECE COMPORTE UNE PLAQUE DE MATERIAU SOUPLE ISOLANT ELECTRIQUE ETOU THERMIQUE, DONT L'UNE AU MOINS DES FACES EST REVETUE EN PARTIE DE METAL FORMANT SUR LADITE PLAQUE DES PARTIES METALLIQUES EN RELIEF ET ELLE SE CARACTERISE EN CE QUE LADITE PLAQUE ET LESDITES PARTIES METALLIQUES ONT RESPECTIVEMENT UNE EPAISSEUR TELLE QUE L'ON PEUT METTRE LADITE PIECE SOUS LA FORME DONNEE EN REALISANT PAR FORMAGE MECANIQUE DE LADITE PIECE UNE DEFORMATION PERMANENTE DESDITES PARTIES METALLIQUES SANS DEPASSER LE DOMAINE DE DEFORMATION ELASTIQUE DE LADITE PLAQUE. APPLICATION A LA REALISATION DE CIRCUITS IMPRIMES PRESENTANT LA FORME D'UNE PLAQUE INCURVEE.THE OBJECT OF THE INVENTION IS A COMPOSITE PART SUITABLE TO BE SHAPED INTO A GIVEN SHAPE BY MECHANICAL FORMING. THIS PART INCLUDES A PLATE OF FLEXIBLE ELECTRICAL AND / OR THERMAL INSULATING MATERIAL, AT LEAST ONE OF THE FACES IS COATED IN PART WITH METAL FORMING ON THE SAID PLATE RELATED METAL PARTS AND IT IS CHARACTERIZED IN THAT THE SIDING PLATE AND THE SAID PARTS UNIT RESPECTIVELY A THICKNESS SUCH THAT WE CAN PUT THE SAID PART IN THE SHAPE GIVEN BY MECHANICAL FORMING OF THE SAID PART A PERMANENT DEFORMATION OF THE SAID METAL PARTS WITHOUT EXCEEDING THE AREA OF ELASTIC DEFORMATION OF THE SAID PLATE. APPLICATION TO THE REALIZATION OF PRINTED CIRCUITS PRESENTING THE SHAPE OF A CURVED PLATE.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7733222A FR2407815A1 (en) | 1977-11-04 | 1977-11-04 | MECHANICALLY FORMABLE COMPOSITE PART, USED IN PARTICULAR FOR THE REALIZATION OF PRINTED CIRCUITS IN THE FORM OF CURVED PLATES |
US05/956,894 US4216258A (en) | 1977-11-04 | 1978-11-02 | Mechanically formable composite part |
DE19782847454 DE2847454A1 (en) | 1977-11-04 | 1978-11-02 | ASSEMBLED, MECHANICAL DEFORMABLE PART, IN PARTICULAR FOR THE MANUFACTURE OF PRINTED CIRCUITS ON CURVED CIRCUIT BOARDS |
JP13568978A JPS5498972A (en) | 1977-11-04 | 1978-11-02 | Compound member |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7733222A FR2407815A1 (en) | 1977-11-04 | 1977-11-04 | MECHANICALLY FORMABLE COMPOSITE PART, USED IN PARTICULAR FOR THE REALIZATION OF PRINTED CIRCUITS IN THE FORM OF CURVED PLATES |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2407815A1 true FR2407815A1 (en) | 1979-06-01 |
FR2407815B1 FR2407815B1 (en) | 1982-11-19 |
Family
ID=9197271
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7733222A Granted FR2407815A1 (en) | 1977-11-04 | 1977-11-04 | MECHANICALLY FORMABLE COMPOSITE PART, USED IN PARTICULAR FOR THE REALIZATION OF PRINTED CIRCUITS IN THE FORM OF CURVED PLATES |
Country Status (4)
Country | Link |
---|---|
US (1) | US4216258A (en) |
JP (1) | JPS5498972A (en) |
DE (1) | DE2847454A1 (en) |
FR (1) | FR2407815A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2569078A1 (en) * | 1984-07-09 | 1986-02-14 | Rogers Corp | LAMINATED CIRCUIT MATERIAL |
EP0652692A1 (en) * | 1993-11-06 | 1995-05-10 | Philips Patentverwaltung GmbH | Printed circuit board |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0722880Y2 (en) * | 1986-08-05 | 1995-05-24 | 工業技術院長 | Electron storage ring |
WO1992019786A1 (en) * | 1991-05-08 | 1992-11-12 | Superconductor Technologies, Inc. | Fabrication process for low loss metallizations on superconducting thin film devices |
GB0805021D0 (en) * | 2008-03-18 | 2008-04-16 | Renishaw Plc | Apparatus and method for electronic circuit manufacture |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1143248B (en) | 1961-04-26 | 1963-02-07 | Telefunken Patent | Printed circuit board |
US3427715A (en) * | 1966-06-13 | 1969-02-18 | Motorola Inc | Printed circuit fabrication |
-
1977
- 1977-11-04 FR FR7733222A patent/FR2407815A1/en active Granted
-
1978
- 1978-11-02 US US05/956,894 patent/US4216258A/en not_active Expired - Lifetime
- 1978-11-02 DE DE19782847454 patent/DE2847454A1/en not_active Withdrawn
- 1978-11-02 JP JP13568978A patent/JPS5498972A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2569078A1 (en) * | 1984-07-09 | 1986-02-14 | Rogers Corp | LAMINATED CIRCUIT MATERIAL |
EP0652692A1 (en) * | 1993-11-06 | 1995-05-10 | Philips Patentverwaltung GmbH | Printed circuit board |
Also Published As
Publication number | Publication date |
---|---|
US4216258A (en) | 1980-08-05 |
DE2847454A1 (en) | 1979-05-10 |
JPS5498972A (en) | 1979-08-04 |
FR2407815B1 (en) | 1982-11-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
TP | Transmission of property |