GB1369995A - Electrical connecting devices - Google Patents
Electrical connecting devicesInfo
- Publication number
- GB1369995A GB1369995A GB3987071A GB3987071A GB1369995A GB 1369995 A GB1369995 A GB 1369995A GB 3987071 A GB3987071 A GB 3987071A GB 3987071 A GB3987071 A GB 3987071A GB 1369995 A GB1369995 A GB 1369995A
- Authority
- GB
- United Kingdom
- Prior art keywords
- substrate
- legs
- bends
- aug
- leg
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10386—Clip leads; Terminals gripping the edge of a substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Combinations Of Printed Boards (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
1369995 Electric couplings INTERNATIONAL COMPUTERS Ltd 25 Aug 1972 [25 Aug 1971] 39870/71 Heading H2E A ceramic i.c. substrate 10 is supported on and connected to a circuit board 11 by connecting devices 1 which also make connection between wiring on opposite faces of the substrate 10. Each device 1 may be formed from a single piece of metal and comprises a central portion from one edge of which extends a leg 17 connected to the board 11 and from the other edge of which extend a leg 18 and two legs 19, bonded, soldered or spot welded to pads 20, 14 on opposite faces of the substrate 10. The bends in the legs 18, 19 are made not too sharp, to prevent solder from lodging in the bends and stiffening the legs 18, 19. The substrate 11 is encapsulated after the devices 1 are connected to it. Another form of connecting device (2, Fig. 4, not shown) may be connected to the substrate 10 at an earlier processing stage.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB3987071A GB1369995A (en) | 1972-08-25 | 1972-08-25 | Electrical connecting devices |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB3987071A GB1369995A (en) | 1972-08-25 | 1972-08-25 | Electrical connecting devices |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1369995A true GB1369995A (en) | 1974-10-09 |
Family
ID=10411933
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB3987071A Expired GB1369995A (en) | 1972-08-25 | 1972-08-25 | Electrical connecting devices |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB1369995A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2409123A1 (en) * | 1977-11-16 | 1979-06-15 | Comatel | IMPROVEMENTS TO WELDING CONTACTS |
DE3138285A1 (en) * | 1981-09-25 | 1983-04-07 | Siemens AG, 1000 Berlin und 8000 München | Supporting plate which can be plugged vertically onto a printed-circuit board by means of a plurality of rows of conductive pins, and a method for producing the supporting plate |
GB2122429A (en) * | 1982-04-08 | 1984-01-11 | Harris Corp | Socket for connecting leadless integrated circuit packages to a printed circuit board |
EP2355262A1 (en) * | 2010-01-29 | 2011-08-10 | Fujitsu Ltd. | Electronic apparatus and method related thereto |
EP2518766A3 (en) * | 2011-04-26 | 2014-03-19 | International Rectifier Corporation | Power module with press-fit clamps |
CN118553705A (en) * | 2024-07-24 | 2024-08-27 | 北京升宇科技有限公司 | High-reliability packaging structure, pin thereof and manufacturing method thereof |
-
1972
- 1972-08-25 GB GB3987071A patent/GB1369995A/en not_active Expired
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2409123A1 (en) * | 1977-11-16 | 1979-06-15 | Comatel | IMPROVEMENTS TO WELDING CONTACTS |
DE3138285A1 (en) * | 1981-09-25 | 1983-04-07 | Siemens AG, 1000 Berlin und 8000 München | Supporting plate which can be plugged vertically onto a printed-circuit board by means of a plurality of rows of conductive pins, and a method for producing the supporting plate |
GB2122429A (en) * | 1982-04-08 | 1984-01-11 | Harris Corp | Socket for connecting leadless integrated circuit packages to a printed circuit board |
EP2355262A1 (en) * | 2010-01-29 | 2011-08-10 | Fujitsu Ltd. | Electronic apparatus and method related thereto |
US8582315B2 (en) | 2010-01-29 | 2013-11-12 | Fujitsu Limited | Electronic apparatus and method related thereto |
EP2518766A3 (en) * | 2011-04-26 | 2014-03-19 | International Rectifier Corporation | Power module with press-fit clamps |
US9001518B2 (en) | 2011-04-26 | 2015-04-07 | International Rectifier Corporation | Power module with press-fit clamps |
CN118553705A (en) * | 2024-07-24 | 2024-08-27 | 北京升宇科技有限公司 | High-reliability packaging structure, pin thereof and manufacturing method thereof |
CN118553705B (en) * | 2024-07-24 | 2024-09-20 | 北京升宇科技有限公司 | High-reliability packaging structure, pin thereof and manufacturing method thereof |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PCNP | Patent ceased through non-payment of renewal fee |