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FR2524708B1 - Dispositif pour le refroidissement d'elements a semi-conducteurs - Google Patents

Dispositif pour le refroidissement d'elements a semi-conducteurs

Info

Publication number
FR2524708B1
FR2524708B1 FR8305477A FR8305477A FR2524708B1 FR 2524708 B1 FR2524708 B1 FR 2524708B1 FR 8305477 A FR8305477 A FR 8305477A FR 8305477 A FR8305477 A FR 8305477A FR 2524708 B1 FR2524708 B1 FR 2524708B1
Authority
FR
France
Prior art keywords
semiconductor elements
cooling semiconductor
cooling
elements
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8305477A
Other languages
English (en)
Other versions
FR2524708A1 (fr
Inventor
Souichi Yoshino
Tadashi Kusanagi
Masakazu Mori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP5625282A external-priority patent/JPS58173857A/ja
Priority claimed from JP5624982A external-priority patent/JPS58173854A/ja
Priority claimed from JP5625182A external-priority patent/JPS58173856A/ja
Priority claimed from JP5625082A external-priority patent/JPS58173855A/ja
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of FR2524708A1 publication Critical patent/FR2524708A1/fr
Application granted granted Critical
Publication of FR2524708B1 publication Critical patent/FR2524708B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01073—Tantalum [Ta]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR8305477A 1982-04-02 1983-04-01 Dispositif pour le refroidissement d'elements a semi-conducteurs Expired FR2524708B1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP5625282A JPS58173857A (ja) 1982-04-02 1982-04-02 半導体装置の製造方法
JP5624982A JPS58173854A (ja) 1982-04-02 1982-04-02 半導体素子用冷却装置
JP5625182A JPS58173856A (ja) 1982-04-02 1982-04-02 半導体素子用冷却装置
JP5625082A JPS58173855A (ja) 1982-04-02 1982-04-02 半導体素子用冷却装置

Publications (2)

Publication Number Publication Date
FR2524708A1 FR2524708A1 (fr) 1983-10-07
FR2524708B1 true FR2524708B1 (fr) 1987-05-15

Family

ID=27463318

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8305477A Expired FR2524708B1 (fr) 1982-04-02 1983-04-01 Dispositif pour le refroidissement d'elements a semi-conducteurs

Country Status (3)

Country Link
US (1) US4546409A (fr)
FR (1) FR2524708B1 (fr)
GB (1) GB2117972B (fr)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4811166A (en) * 1986-07-02 1989-03-07 Texas Instruments Incorporated Heat dissipating member for mounting a semiconductor device and electrical circuit unit incorporating the member
DE69009429T2 (de) * 1989-12-29 1994-09-15 Sumitomo Electric Industries Kühlkörper mit verbesserter Lebensdauer und thermischer Leitfähigkeit.
JPH07114250B2 (ja) * 1990-04-27 1995-12-06 インターナショナル・ビジネス・マシーンズ・コーポレイション 熱伝達システム
US5291371A (en) * 1990-04-27 1994-03-01 International Business Machines Corporation Thermal joint
US5265670A (en) * 1990-04-27 1993-11-30 International Business Machines Corporation Convection transfer system
US5097387A (en) * 1990-06-27 1992-03-17 Digital Equipment Corporation Circuit chip package employing low melting point solder for heat transfer
US5454506A (en) * 1994-03-01 1995-10-03 International Business Machines Corporation Structure and process for electro/mechanical joint formation
JP3426101B2 (ja) * 1997-02-25 2003-07-14 三菱電機株式会社 整流装置
US5921460A (en) * 1997-06-05 1999-07-13 Ford Motor Company Method of soldering materials supported on low-melting substrates
JP2000341953A (ja) * 1999-05-27 2000-12-08 Mitsubishi Electric Corp 車両用交流発電機の整流器
DE10127052A1 (de) * 2001-06-02 2002-12-12 Bosch Gmbh Robert Verbindung eines Halbleiterbauelements mit einem Kühlkörper, Halbleiterbauelement, Kühlkörper und Verfahren
US7223939B2 (en) * 2004-11-12 2007-05-29 Agc Automotive Americas, R & D, Inc. Electrical connector for a window pane of a vehicle
US7134201B2 (en) * 2004-11-12 2006-11-14 Agc Automotive Americas R&D, Inc. Window pane and a method of bonding a connector to the window pane
WO2008020985A2 (fr) * 2006-08-10 2008-02-21 Wayne Jackman Glacière et distributeur de boissons en canettes portables
CN101426357A (zh) * 2007-10-31 2009-05-06 鸿富锦精密工业（深圳）有限公司 散热装置
CN101765352B (zh) * 2008-12-23 2013-04-24 富瑞精密组件（昆山）有限公司 扁平型热导管及使用该热导管的散热模组
DE102011051463A1 (de) * 2011-06-30 2013-01-03 Elringklinger Ag Verfahren zum Herstellen einer Fügeverbindung zwischen einem ersten Bauteil und einem zweiten Bauteil und Baugruppe aus einem ersten Bauteil und einem zweiten Bauteil
US9272371B2 (en) 2013-05-30 2016-03-01 Agc Automotive Americas R&D, Inc. Solder joint for an electrical conductor and a window pane including same
US10263362B2 (en) 2017-03-29 2019-04-16 Agc Automotive Americas R&D, Inc. Fluidically sealed enclosure for window electrical connections
US10849192B2 (en) 2017-04-26 2020-11-24 Agc Automotive Americas R&D, Inc. Enclosure assembly for window electrical connections

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1898524U (de) * 1959-11-07 1964-08-13 Philips Nv Halbleitendes elektrodensystem enthaltendes geraet.
US3436005A (en) * 1962-02-13 1969-04-01 Philips Corp Welding apparatus provided with a vibrating contact tip
GB1091561A (en) * 1963-02-15 1967-11-22 English Electric Co Ltd Electrical assemblies
DE1614478A1 (de) * 1967-04-03 1970-07-16 Siemens Ag Baueinheit mit zwei Sammelschienen,auf den mindestens je ein Halbleiterelement befestigt ist
DE1765048A1 (de) * 1968-03-26 1971-07-01 Siemens Ag Verfahren zum Kontaktieren von Stromtraegern aus Aluminium
US3793570A (en) * 1968-09-26 1974-02-19 Gen Motors Corp Compact power semiconductor device and method of making same
BE758871A (fr) * 1969-11-13 1971-05-12 Philips Nv Procede pour relier des emplacements de contact metalliques de composants electriques avec des conducteurs metalliques d'un substratflasque
JPS5036225B1 (fr) * 1970-03-02 1975-11-21
US3662454A (en) * 1970-03-18 1972-05-16 Rca Corp Method of bonding metals together
JPS4943722U (fr) * 1972-07-21 1974-04-17
US3860949A (en) * 1973-09-12 1975-01-14 Rca Corp Semiconductor mounting devices made by soldering flat surfaces to each other
GB1457806A (en) * 1974-03-04 1976-12-08 Mullard Ltd Semiconductor device manufacture
US3917928A (en) * 1974-06-04 1975-11-04 Sperry Rand Corp Comparator for step data gyro compasses
US4057825A (en) * 1975-07-18 1977-11-08 Hitachi, Ltd. Semiconductor device with composite metal heat-radiating plate onto which semiconductor element is soldered
JPS5238885A (en) * 1975-09-22 1977-03-25 Nec Home Electronics Ltd Method for production of semiconductor device
JPS542067A (en) * 1977-06-07 1979-01-09 Hitachi Ltd Semiconductor device
US4142662A (en) * 1978-01-27 1979-03-06 Bell Telephone Laboratories, Incorporated Method of bonding microelectronic chips
JPS55123156A (en) * 1979-03-16 1980-09-22 Hitachi Ltd Manufacture of semiconductor device
US4360142A (en) * 1979-06-29 1982-11-23 International Business Machines Corporation Method of forming a solder interconnection capable of sustained high power levels between a semiconductor device and a supporting substrate
GB2067117B (en) * 1980-01-02 1983-07-06 Secr Defence Bonding semi-conductor bodies to aluminium thick-film circuits
JPS5943094B2 (ja) * 1980-03-01 1984-10-19 株式会社日立製作所 半導体装置
JPS577952A (en) * 1980-06-18 1982-01-16 Hitachi Ltd Lead frame and its manufacturing device
JPS5710742U (fr) * 1980-06-18 1982-01-20

Also Published As

Publication number Publication date
US4546409A (en) 1985-10-08
GB2117972B (en) 1985-12-04
GB2117972A (en) 1983-10-19
FR2524708A1 (fr) 1983-10-07

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