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FR2221533A1 - Metallising paste contg. copper and tin dispersion - in a flux contg. a reducing agent - Google Patents

Metallising paste contg. copper and tin dispersion - in a flux contg. a reducing agent

Info

Publication number
FR2221533A1
FR2221533A1 FR7408542A FR7408542A FR2221533A1 FR 2221533 A1 FR2221533 A1 FR 2221533A1 FR 7408542 A FR7408542 A FR 7408542A FR 7408542 A FR7408542 A FR 7408542A FR 2221533 A1 FR2221533 A1 FR 2221533A1
Authority
FR
France
Prior art keywords
contg
esp
reducing agent
flux
paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7408542A
Other languages
French (fr)
Other versions
FR2221533B3 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of FR2221533A1 publication Critical patent/FR2221533A1/en
Application granted granted Critical
Publication of FR2221533B3 publication Critical patent/FR2221533B3/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Paints Or Removers (AREA)
  • Powder Metallurgy (AREA)
  • Conductive Materials (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Paste pref. comprises copper and tin particles (0.01-40, esp. 2-12 mu size) in ratio esp. 85:15 to 50:50 and 3-20% (based on total wt. metal particles) of a flux, esp. colophony contg. a reducing agent such as triethanolamine. Although pure powders are prefd., the tin particles may contain as little as 40% Sn, e.g. may be a solder. Paste is esp. used for printed circuit prodn., but also as replacement for silver pastes in tantalum capacitors and hydrib circuits and for decorative purposes. In printed circuit prodn. the substrate may be coated with a thermosetting adhesive or impregnated with a partially set thermosetting resin.
FR7408542A 1973-03-14 1974-03-13 Metallising paste contg. copper and tin dispersion - in a flux contg. a reducing agent Granted FR2221533A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US34127573A 1973-03-14 1973-03-14

Publications (2)

Publication Number Publication Date
FR2221533A1 true FR2221533A1 (en) 1974-10-11
FR2221533B3 FR2221533B3 (en) 1976-12-24

Family

ID=23336917

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7408542A Granted FR2221533A1 (en) 1973-03-14 1974-03-13 Metallising paste contg. copper and tin dispersion - in a flux contg. a reducing agent

Country Status (4)

Country Link
JP (1) JPS5721085B2 (en)
DE (1) DE2411988A1 (en)
FR (1) FR2221533A1 (en)
NL (1) NL7403364A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0075324A2 (en) * 1981-09-23 1983-03-30 E.I. Du Pont De Nemours And Company Base metal conductor cathode coating for tantalum capacitors
FR2515675A1 (en) * 1981-11-05 1983-05-06 Comp Generale Electricite Low cost, reliable, low resistance contacts for silicon semiconductors - using a nickel conducting ink

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5682855A (en) * 1979-12-11 1981-07-06 Matsushita Electric Ind Co Ltd Conductive paint
GB2072707B (en) * 1980-03-31 1984-01-25 Hitachi Chemical Co Ltd Electroconductive paste and process for producing electroconductive metallized ceramics using the same
US4400214A (en) * 1981-06-05 1983-08-23 Matsushita Electric Industrial, Co., Ltd. Conductive paste
JPS58391U (en) * 1981-06-25 1983-01-05 株式会社東芝 Lightning arrester
JPS59193972A (en) * 1983-04-15 1984-11-02 Nippon Engeruharudo Kk Thermoplastic electroconductive paste composition
JPS63213975A (en) * 1987-03-03 1988-09-06 Matsushita Electric Ind Co Ltd Photovoltaic device
AT398675B (en) * 1989-08-29 1995-01-25 Austria Tech & System Tech Partial and selective electroplating of metal on printed circuit - by covering required area with conductive liquid or paste, which is peeled off or removed chemically after plating, esp. with noble metal
JPH0467509A (en) * 1990-07-06 1992-03-03 Kao Corp Conductive paste and conductive film
WO1996022670A1 (en) * 1995-01-18 1996-07-25 Coates Brothers Plc Production of electrical circuit boards
JP6029222B1 (en) 2015-07-08 2016-11-24 有限会社 ナプラ Metal particles, paste, molded body, and laminate

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS494057A (en) * 1972-05-09 1974-01-14

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0075324A2 (en) * 1981-09-23 1983-03-30 E.I. Du Pont De Nemours And Company Base metal conductor cathode coating for tantalum capacitors
EP0075324A3 (en) * 1981-09-23 1985-08-21 E.I. Du Pont De Nemours And Company Base metal conductor cathode coating for tantalum capacitors
FR2515675A1 (en) * 1981-11-05 1983-05-06 Comp Generale Electricite Low cost, reliable, low resistance contacts for silicon semiconductors - using a nickel conducting ink

Also Published As

Publication number Publication date
NL7403364A (en) 1974-09-17
DE2411988A1 (en) 1974-09-19
JPS501040A (en) 1975-01-08
JPS5721085B2 (en) 1982-05-04
FR2221533B3 (en) 1976-12-24

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Legal Events

Date Code Title Description
ST Notification of lapse