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GB959425A - Improvements in or relating to printed circuits for electronic and other electrical equipment - Google Patents

Improvements in or relating to printed circuits for electronic and other electrical equipment

Info

Publication number
GB959425A
GB959425A GB18265/62A GB1826562A GB959425A GB 959425 A GB959425 A GB 959425A GB 18265/62 A GB18265/62 A GB 18265/62A GB 1826562 A GB1826562 A GB 1826562A GB 959425 A GB959425 A GB 959425A
Authority
GB
United Kingdom
Prior art keywords
metal particles
adhesive
copper
pattern
printed circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB18265/62A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to GB18265/62A priority Critical patent/GB959425A/en
Publication of GB959425A publication Critical patent/GB959425A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0522—Using an adhesive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/105—Using an electrical field; Special methods of applying an electric potential
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

959,425. Printed circuits; resistors. G. POLLOCK. May 11, 1962, No. 18265/62. Headings H1R and H1S. A printed circuit is made by applying an adhesive medium to an insulating base member in the required circuit pattern, electrostatically depositing a film of metal particles on to the adhesive pattern, cleaning the base member of loose metal particles, and depositing a layer of solder or copper on to the pattern. Preferably the last step is dip soldering, but a layer of copper may be deposited after, or instead of, the solder. The adhesive, which may contain an inert filler, may comprise epoxy resins, alone or mixed with P.V.C. silicone adhesives and phenolic resins. The metal particles, which may be sieved, shaken, or vibrated on to the adhesive surface, are preferably copper, and may be plated with Ag, Au, Rh etc.; two applications are preferred. Double-sided and stacked circuits may be made by the method of the invention. Resistors may be made by using Ag or other precious metal particles.
GB18265/62A 1962-05-11 1962-05-11 Improvements in or relating to printed circuits for electronic and other electrical equipment Expired GB959425A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB18265/62A GB959425A (en) 1962-05-11 1962-05-11 Improvements in or relating to printed circuits for electronic and other electrical equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB18265/62A GB959425A (en) 1962-05-11 1962-05-11 Improvements in or relating to printed circuits for electronic and other electrical equipment

Publications (1)

Publication Number Publication Date
GB959425A true GB959425A (en) 1964-06-03

Family

ID=10109493

Family Applications (1)

Application Number Title Priority Date Filing Date
GB18265/62A Expired GB959425A (en) 1962-05-11 1962-05-11 Improvements in or relating to printed circuits for electronic and other electrical equipment

Country Status (1)

Country Link
GB (1) GB959425A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2298045A1 (en) * 2008-05-09 2011-03-23 Stora Enso Oyj An apparatus, a method for establishing a conductive pattern on a planar insulating substrate, the planar insulating substrate and a chipset thereof
EP2003941A3 (en) * 2007-06-14 2011-05-11 manroland AG Printed functional components

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2003941A3 (en) * 2007-06-14 2011-05-11 manroland AG Printed functional components
EP2298045A1 (en) * 2008-05-09 2011-03-23 Stora Enso Oyj An apparatus, a method for establishing a conductive pattern on a planar insulating substrate, the planar insulating substrate and a chipset thereof
EP2298045A4 (en) * 2008-05-09 2012-01-04 Stora Enso Oyj An apparatus, a method for establishing a conductive pattern on a planar insulating substrate, the planar insulating substrate and a chipset thereof
US8654502B2 (en) 2008-05-09 2014-02-18 Stora Enso Oyj Apparatus, a method for establishing a conductive pattern on a planar insulating substrate, the planar insulating substrate and a chipset thereof

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