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FR2210882A1 - Metal faced laminate - for making printed circuits - Google Patents

Metal faced laminate - for making printed circuits

Info

Publication number
FR2210882A1
FR2210882A1 FR7244747A FR7244747A FR2210882A1 FR 2210882 A1 FR2210882 A1 FR 2210882A1 FR 7244747 A FR7244747 A FR 7244747A FR 7244747 A FR7244747 A FR 7244747A FR 2210882 A1 FR2210882 A1 FR 2210882A1
Authority
FR
France
Prior art keywords
sheet
plastic
metal
thin
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR7244747A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fortin Laminating Corp
Original Assignee
Fortin Laminating Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to BE792930D priority Critical patent/BE792930A/en
Application filed by Fortin Laminating Corp filed Critical Fortin Laminating Corp
Priority to FR7244747A priority patent/FR2210882A1/en
Publication of FR2210882A1 publication Critical patent/FR2210882A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0344—Electroless sublayer, e.g. Ni, Co, Cd or Ag; Transferred electroless sublayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)

Abstract

A thin metal sheet adhering to a support base by the application of a predetermined maximum low pressure is assembled with a sheet of uncured plastic material and the assembly bonded under sufficient heat to cure the plastic and under pressure so that the adherence between the plastic and the metal sheet is greater than that between the metal and its base sheet. The base sheet is then removed. The process enables very thin Cu foil, less than 0.02 mm. thick, to be used, the circuit then being built up by "addition". The support sheet is pref. a flexilbe sheet of e.g. cellulose acetate or polyester on which a very thin layer of Cu is deposited chemically and built up to 2.5-17.8 mu by electrolytic deposition. The bond is subjected to a pressure of 0.356-0.89 kg/cm2. The coated support sheet is then pressed against a preimpregnated plastic sheet and bonded in the usual way.
FR7244747A 1971-05-26 1972-12-15 Metal faced laminate - for making printed circuits Withdrawn FR2210882A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
BE792930D BE792930A (en) 1971-05-26 Metal faced laminate - for making printed circuits
FR7244747A FR2210882A1 (en) 1972-12-15 1972-12-15 Metal faced laminate - for making printed circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7244747A FR2210882A1 (en) 1972-12-15 1972-12-15 Metal faced laminate - for making printed circuits

Publications (1)

Publication Number Publication Date
FR2210882A1 true FR2210882A1 (en) 1974-07-12

Family

ID=9108774

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7244747A Withdrawn FR2210882A1 (en) 1971-05-26 1972-12-15 Metal faced laminate - for making printed circuits

Country Status (1)

Country Link
FR (1) FR2210882A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2361224A1 (en) * 1976-08-11 1978-03-10 Uop Inc Metal clad laminates mfr. for printed circuit prodn. - by plating metal onto substrate roughening it, oxidising it, contacting it with bonding agent, laminating it, and removing substrate
FR2548857A1 (en) * 1983-07-04 1985-01-11 Cortaillod Cables Sa Automatic production of printed circuit cards
WO1985002969A1 (en) * 1983-12-19 1985-07-04 Microclad Laminates Limited Production of copper-clad dielectric boards

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2361224A1 (en) * 1976-08-11 1978-03-10 Uop Inc Metal clad laminates mfr. for printed circuit prodn. - by plating metal onto substrate roughening it, oxidising it, contacting it with bonding agent, laminating it, and removing substrate
FR2548857A1 (en) * 1983-07-04 1985-01-11 Cortaillod Cables Sa Automatic production of printed circuit cards
WO1985002969A1 (en) * 1983-12-19 1985-07-04 Microclad Laminates Limited Production of copper-clad dielectric boards

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Legal Events

Date Code Title Description
ST Notification of lapse