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ES2136421T3 - Procedimiento galvanoplastico para formar chapados de niquel, cobalto, aleaciones de niquel o aleaciones de cobalto. - Google Patents

Procedimiento galvanoplastico para formar chapados de niquel, cobalto, aleaciones de niquel o aleaciones de cobalto.

Info

Publication number
ES2136421T3
ES2136421T3 ES96920744T ES96920744T ES2136421T3 ES 2136421 T3 ES2136421 T3 ES 2136421T3 ES 96920744 T ES96920744 T ES 96920744T ES 96920744 T ES96920744 T ES 96920744T ES 2136421 T3 ES2136421 T3 ES 2136421T3
Authority
ES
Spain
Prior art keywords
cobalt
nickel
alloys
pct
galvanoplastic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES96920744T
Other languages
English (en)
Inventor
Peter Torben Tang
Henrik Dylmer
Per Moller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Application granted granted Critical
Publication of ES2136421T3 publication Critical patent/ES2136421T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrolytic Production Of Metals (AREA)

Abstract

METODO DE ELECTRODEPOSICION PARA FORMACION DE REVESTIMIENTOS ELECTROLITICOS DE NIQUEL, COBALTO, ALEACIONES DE NIQUEL O ALEACIONES DE COBALTO, CON TENSIONES REDUCIDAS, EN UN BAÑO DE ELECTRODEPOSICION, DE TIPO: BAÑO DE WATT, BAÑO DE CLORURO O UNA COMBINACION DE LOS MISMOS, EMPLEANDO UN METODO DE ELECTRODEPOSICION PULSADA, CON PULSOS PERIODICOS INVERTIDOS Y UN ADITIVO DE NAFTALENO SULFONADO. DICHO METODO PERMITE DEPOSITAR REVESTIMIENTOS ELECTROLITICOS DE NIQUEL, COBALTO, ALEACIONES DE NIQUEL O COBALTO, SIN TENSIONES INTERNAS.
ES96920744T 1995-06-21 1996-06-20 Procedimiento galvanoplastico para formar chapados de niquel, cobalto, aleaciones de niquel o aleaciones de cobalto. Expired - Lifetime ES2136421T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DK199500706A DK172937B1 (da) 1995-06-21 1995-06-21 Galvanisk fremgangsmåde til dannelse af belægninger af nikkel, kobalt, nikkellegeringer eller kobaltlegeringer

Publications (1)

Publication Number Publication Date
ES2136421T3 true ES2136421T3 (es) 1999-11-16

Family

ID=8096605

Family Applications (1)

Application Number Title Priority Date Filing Date
ES96920744T Expired - Lifetime ES2136421T3 (es) 1995-06-21 1996-06-20 Procedimiento galvanoplastico para formar chapados de niquel, cobalto, aleaciones de niquel o aleaciones de cobalto.

Country Status (12)

Country Link
US (1) US6036833A (es)
EP (1) EP0835335B1 (es)
JP (1) JPH11507991A (es)
AT (1) ATE184332T1 (es)
AU (1) AU6188496A (es)
CA (1) CA2224382C (es)
DE (1) DE69604180T2 (es)
DK (1) DK172937B1 (es)
ES (1) ES2136421T3 (es)
GR (1) GR3031549T3 (es)
NO (1) NO320887B1 (es)
WO (1) WO1997000980A1 (es)

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DE10061186C1 (de) 2000-12-07 2002-01-17 Astrium Gmbh Verfahren und Anordnung zur galvanischen Abscheidung von Nickel, Kobalt, Nickellegierungen oder Kobaltlegierungen mit periodischen Strompulsen und Verwendung des Verfahrens
JP4538959B2 (ja) * 2001-01-22 2010-09-08 日立金属株式会社 希土類系永久磁石の電気Ｎｉめっき方法
US6892002B2 (en) 2001-03-29 2005-05-10 Ibsen Photonics A/S Stacked planar integrated optics and tool for fabricating same
US6724067B2 (en) 2001-04-13 2004-04-20 Anadigics, Inc. Low stress thermal and electrical interconnects for heterojunction bipolar transistors
SE523309E (sv) * 2001-06-15 2010-03-02 Replisaurus Technologies Ab Metod, elektrod och apparat för att skapa mikro- och nanostrukturer i ledande material genom mönstring med masterelektrod och elektrolyt
DE10259362A1 (de) * 2002-12-18 2004-07-08 Siemens Ag Verfahren zum Abscheiden einer Legierung auf ein Substrat
GB0302222D0 (en) * 2003-01-31 2003-03-05 Univ Heriot Watt Stencil manufacture
US7727366B2 (en) * 2003-10-22 2010-06-01 Nexx Systems, Inc. Balancing pressure to improve a fluid seal
EP1678352A2 (en) * 2003-10-22 2006-07-12 Nexx Systems, Inc. Method and apparatus for fluid processing a workpiece
US20050283993A1 (en) * 2004-06-18 2005-12-29 Qunwei Wu Method and apparatus for fluid processing and drying a workpiece
US7329334B2 (en) * 2004-09-16 2008-02-12 Herdman Roderick D Controlling the hardness of electrodeposited copper coatings by variation of current profile
CN100441748C (zh) * 2004-10-26 2008-12-10 中国科学院兰州化学物理研究所 低应力、抗磨减摩梯度Ni-Co纳米合金镀层的制备方法
JP4678194B2 (ja) * 2005-02-02 2011-04-27 株式会社村田製作所 電子部品の製造方法、及び電子部品
US7425255B2 (en) * 2005-06-07 2008-09-16 Massachusetts Institute Of Technology Method for producing alloy deposits and controlling the nanostructure thereof using negative current pulsing electro-deposition
EP1919703B1 (en) 2005-08-12 2013-04-24 Modumetal, LLC Compositionally modulated composite materials and methods for making the same
US7615255B2 (en) * 2005-09-07 2009-11-10 Rohm And Haas Electronic Materials Llc Metal duplex method
US20100096850A1 (en) * 2006-10-31 2010-04-22 Massachusetts Institute Of Technology Nanostructured alloy coated threaded metal surfaces and methods of producing same
US20090286103A1 (en) * 2008-05-14 2009-11-19 Xtalic Corporation Coated articles and related methods
US20090283410A1 (en) * 2008-05-14 2009-11-19 Xtalic Corporation Coated articles and related methods
US9234294B2 (en) 2008-07-07 2016-01-12 Modumetal, Inc. Property modulated materials and methods of making the same
US7951600B2 (en) 2008-11-07 2011-05-31 Xtalic Corporation Electrodeposition baths, systems and methods
KR100917610B1 (ko) * 2008-11-14 2009-09-17 한국에너지기술연구원 고체산화물 연료전지용 금속연결재의 코팅방법
US8367217B2 (en) 2009-06-02 2013-02-05 Integran Technologies, Inc. Electrodeposited metallic-materials comprising cobalt on iron-alloy substrates with enhanced fatigue performance
US8545994B2 (en) 2009-06-02 2013-10-01 Integran Technologies Inc. Electrodeposited metallic materials comprising cobalt
US8309233B2 (en) * 2009-06-02 2012-11-13 Integran Technologies, Inc. Electrodeposited metallic-materials comprising cobalt on ferrous-alloy substrates
CN102639758B (zh) 2009-06-08 2016-05-18 莫杜美拓有限公司 用于防腐蚀的电镀纳米叠层涂层和包层
US10030312B2 (en) * 2009-10-14 2018-07-24 Massachusetts Institute Of Technology Electrodeposited alloys and methods of making same using power pulses
CN105386103B (zh) 2010-07-22 2018-07-31 莫杜美拓有限公司 纳米层压黄铜合金的材料及其电化学沉积方法
US8425751B1 (en) 2011-02-03 2013-04-23 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Systems and methods for the electrodeposition of a nickel-cobalt alloy
EA032264B1 (ru) 2013-03-15 2019-05-31 Модьюметл, Инк. Способ нанесения покрытия на изделие, изделие, полученное вышеуказанным способом, и труба
EP2971266A4 (en) 2013-03-15 2017-03-01 Modumetal, Inc. A method and apparatus for continuously applying nanolaminate metal coatings
CA2905513C (en) 2013-03-15 2022-05-03 Modumetal, Inc. Nickel chromium nanolaminate coating having high hardness
CN110273167A (zh) 2013-03-15 2019-09-24 莫杜美拓有限公司 通过添加制造工艺制备的制品的电沉积的组合物和纳米层压合金
AR102068A1 (es) 2014-09-18 2017-02-01 Modumetal Inc Métodos de preparación de artículos por electrodeposición y procesos de fabricación aditiva
CN106795645B (zh) 2014-09-18 2020-03-27 莫杜美拓有限公司 用于连续施加纳米层压金属涂层的方法和装置
WO2016108077A1 (en) * 2014-12-31 2016-07-07 Essilor International (Compagnie Generale D'optique) Method of mirror coating an optical article and article thereby obtained
US9777386B2 (en) * 2015-03-19 2017-10-03 Lam Research Corporation Chemistry additives and process for cobalt film electrodeposition
CN105332029B (zh) * 2015-10-28 2017-08-25 西安科技大学 一种导电耐蚀钴锰尖晶石涂层的制备方法
RU2617470C1 (ru) * 2015-12-28 2017-04-25 Федеральное государственное бюджетное образовательное учреждение высшего образования "Российский химико-технологический университе имени Д. И. Менделеева (РХТУ им. Д. И. Менделеева) Способ электроосаждения покрытий никель-фосфор
EA201990655A1 (ru) 2016-09-08 2019-09-30 Модьюметал, Инк. Способы получения многослойных покрытий на заготовках и выполненные ими изделия
JP7051823B2 (ja) 2016-09-14 2022-04-11 モジュメタル インコーポレイテッド 高信頼性、高スループットの複素電界生成のためのシステム、およびそれにより皮膜を生成するための方法
WO2018085591A1 (en) 2016-11-02 2018-05-11 Modumetal, Inc. Topology optimized high interface packing structures
EP3601641B1 (en) 2017-03-24 2024-11-06 Modumetal, Inc. Lift plungers with electrodeposited coatings, and systems and methods for producing the same
EP3612669A1 (en) 2017-04-21 2020-02-26 Modumetal, Inc. Tubular articles with electrodeposited coatings, and systems and methods for producing the same
CN112272717B (zh) 2018-04-27 2024-01-05 莫杜美拓有限公司 用于使用旋转生产具有纳米层压物涂层的多个制品的设备、系统和方法

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FR16632E (fr) * 1969-05-07 1913-03-18 Pestourie & Quentin Soc Soupape d'échappement libre
US3726768A (en) * 1971-04-23 1973-04-10 Atomic Energy Commission Nickel plating baths containing aromatic sulfonic acids
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US5352266A (en) * 1992-11-30 1994-10-04 Queen'university At Kingston Nanocrystalline metals and process of producing the same

Also Published As

Publication number Publication date
NO320887B1 (no) 2006-02-06
NO975769D0 (no) 1997-12-08
DK172937B1 (da) 1999-10-11
ATE184332T1 (de) 1999-09-15
EP0835335B1 (en) 1999-09-08
DK70695A (da) 1996-12-22
CA2224382A1 (en) 1997-01-09
DE69604180T2 (de) 2000-03-09
DE69604180D1 (de) 1999-10-14
CA2224382C (en) 2005-07-19
US6036833A (en) 2000-03-14
EP0835335A1 (en) 1998-04-15
GR3031549T3 (en) 2000-01-31
WO1997000980A1 (en) 1997-01-09
JPH11507991A (ja) 1999-07-13
AU6188496A (en) 1997-01-22
NO975769L (no) 1997-12-08

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