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ES2115306T3 - Composicion acuosa de plata. - Google Patents

Composicion acuosa de plata.

Info

Publication number
ES2115306T3
ES2115306T3 ES95117196T ES95117196T ES2115306T3 ES 2115306 T3 ES2115306 T3 ES 2115306T3 ES 95117196 T ES95117196 T ES 95117196T ES 95117196 T ES95117196 T ES 95117196T ES 2115306 T3 ES2115306 T3 ES 2115306T3
Authority
ES
Spain
Prior art keywords
coating compositions
silver
water
electrically conductive
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES95117196T
Other languages
English (en)
Inventor
Jerry Dr Steinberg
John Hochheimer
Michael Schlosser Skrzat
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WC Heraus GmbH and Co KG
Original Assignee
WC Heraus GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WC Heraus GmbH and Co KG filed Critical WC Heraus GmbH and Co KG
Application granted granted Critical
Publication of ES2115306T3 publication Critical patent/ES2115306T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
    • C09D133/02—Homopolymers or copolymers of acids; Metal or ammonium salts thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Power Engineering (AREA)
  • Organic Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • Paints Or Removers (AREA)
  • Agricultural Chemicals And Associated Chemicals (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
  • Conductive Materials (AREA)

Abstract

SE DESCRIBEN COMPOSICIONES DE REVESTIMIENTO DE LAMINILLA DE PLATA SUSPENDIDAS EN UN VEHICULO PREDOMINANTEMENTE ACUOSO PARA FIJAR UN REVESTIMIENTO DE METAL ELECTRICAMENTE CONDUCTOR EN SUSTANCIAS RESISTENTES O DIELECTRICAS UTILES EN LA INDUSTRIA ELECTRONICA. LAS COMPOSICIONES DE REVESTIMIENTO PROPORCIONAN UNA COMBINACION IDEAL DE CARGA DE PLATA ALTA Y VISCOSIDAD BAJA PARA PINTAR CON PULVERIZADOR REVESTIMIENTOS DE ESPESOR DESEADOS A ALTA VELOCIDAD EN UN PASO UNICO. LAS NUEVAS COMPOSICIONES INCLUYEN LAMINILLA DE PLATA, UN AGLUTINANTE DE POLIMERO SOLUBLE EN AGUA, AGUA Y UN CO-DISOLVENTE ORGANICO, SUSTANCIALMENTE COMPLETAMENTE SOLUBLE EN AGUA. LAS COMPOSICIONES DE REVESTIMIENTO TIENEN BUENA RESISTENCIA AL VERDE DESPUES DEL SECADO Y PUEDEN SER UTILIZADAS PARA APLICAR UNA BASE ELECTRICAMENTE CONDUCTORA QUE PERMITA EL ELECTROPLATEADO DE PIEZAS DE PLASTICO O ELASTOMERICAS. PUEDE AÑADIRSE ADHESIVOS DE SINTERIZACION OPCIONAL QUE PERMITAN ALTA TEMPERATURA, UNION PERMANENTE DE LA PLATA A UN SUSTRATO DE CERAMICA. LAS COMPOSICIONES DE REVESTIMIENTO TIENEN EXCELENTE ESTABILIDAD AL ALMACENAMIENTO DE MODO QUE LOS SOLIDOS ESTABLECIDOS PUEDAN SER REDISPERSADOS FACILMENTE CON AGITACION BREVE Y/O FLOJA.
ES95117196T 1994-11-07 1995-11-02 Composicion acuosa de plata. Expired - Lifetime ES2115306T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/335,146 US5492653A (en) 1994-11-07 1994-11-07 Aqueous silver composition

Publications (1)

Publication Number Publication Date
ES2115306T3 true ES2115306T3 (es) 1998-06-16

Family

ID=23310470

Family Applications (1)

Application Number Title Priority Date Filing Date
ES95117196T Expired - Lifetime ES2115306T3 (es) 1994-11-07 1995-11-02 Composicion acuosa de plata.

Country Status (9)

Country Link
US (2) US5492653A (es)
EP (1) EP0713930B1 (es)
KR (1) KR0174305B1 (es)
CN (1) CN1058741C (es)
AT (1) ATE164892T1 (es)
DE (1) DE69502004T2 (es)
ES (1) ES2115306T3 (es)
FI (1) FI114923B (es)
HK (1) HK1001465A1 (es)

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US5492653A (en) * 1994-11-07 1996-02-20 Heraeus Incorporated Aqueous silver composition
JPH0912385A (ja) * 1995-04-28 1997-01-14 Mitsuboshi Belting Ltd メッキ用表面処理剤およびこれを付着した基材
US5756008A (en) * 1996-08-14 1998-05-26 E. I. Du Pont De Nemours And Company Water cleanable silver composition
DE19638629C2 (de) * 1996-09-20 2000-05-31 Epcos Ag Verfahren zum Aufbringen einer elektrisch leitfähigen Grundschicht auf einen Keramikkörper
DE19647044A1 (de) * 1996-11-14 1998-05-20 Degussa Paste für Einbrennschichten
DE19737685C2 (de) * 1997-08-29 1999-08-12 Sonderhoff Ernst Fa Abschirmdichtung
JP3422233B2 (ja) * 1997-09-26 2003-06-30 株式会社村田製作所 バイアホール用導電性ペースト、およびそれを用いた積層セラミック基板の製造方法
US5855820A (en) * 1997-11-13 1999-01-05 E. I. Du Pont De Nemours And Company Water based thick film conductive compositions
DE19815291B4 (de) * 1998-04-06 2006-05-24 Ferro Gmbh Beschichtungszusammensetzung zur Herstellung von elektrisch leitfähigen Schichten
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US6576336B1 (en) * 1998-09-11 2003-06-10 Unitech Corporation, Llc Electrically conductive and electromagnetic radiation absorptive coating compositions and the like
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US6817088B1 (en) * 2000-06-16 2004-11-16 Watlow Electric Msg.C Termination method for thick film resistance heater
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US8178188B2 (en) * 2001-04-20 2012-05-15 Panasonic Corporation Base layer for manufacturing an electronic component by an etching process
WO2002086924A1 (fr) * 2001-04-20 2002-10-31 Matsushita Electric Industrial Co., Ltd. Procede de production de pieces electroniques, et element de production associe
US6866799B2 (en) * 2002-05-09 2005-03-15 Anuvu, Inc. Water-soluble electrically conductive composition, modifications, and applications thereof
US6945783B2 (en) * 2002-05-21 2005-09-20 The University Of Iowa Research Foundation Interactive breast examination training model
KR20040033855A (ko) * 2002-10-16 2004-04-28 주식회사 이페이퍼텍 티슈제조방법
JP3991218B2 (ja) * 2002-12-20 2007-10-17 信越化学工業株式会社 導電性接着剤及びその製造方法
KR20060004158A (ko) * 2004-07-08 2006-01-12 박철용 피티씨 특성을 갖는 수성 도전성 중합체 조성물 및 그제조방법
US7316475B2 (en) * 2004-11-10 2008-01-08 Robert Wilson Cornell Thermal printing of silver ink
JP4613362B2 (ja) * 2005-01-31 2011-01-19 Ｄｏｗａエレクトロニクス株式会社 導電ペースト用金属粉および導電ペースト
JP2008546157A (ja) * 2005-06-09 2008-12-18 ナショナル スターチ アンド ケミカル カンパニー 水性の印刷可能な電気導体
US7851545B2 (en) * 2005-07-15 2010-12-14 Chroma Australia Pty Limited Paint composition
US20070215883A1 (en) * 2006-03-20 2007-09-20 Dixon Michael J Electroluminescent Devices, Subassemblies for use in Making Electroluminescent Devices, and Dielectric Materials, Conductive Inks and Substrates Related Thereto
US20080010815A1 (en) * 2006-07-17 2008-01-17 W.E.T. Automotive Group Ag Heating tape structure
US8709288B2 (en) * 2006-09-08 2014-04-29 Sun Chemical Corporation High conductive water-based silver ink
US7919015B2 (en) * 2006-10-05 2011-04-05 Xerox Corporation Silver-containing nanoparticles with replacement stabilizer
WO2008127397A2 (en) * 2006-12-22 2008-10-23 Henkel Ag & Co. Kgaa Waterborne conductive compositions
JP4294705B2 (ja) * 2007-05-30 2009-07-15 Ｄｏｗａエレクトロニクス株式会社 有機物質で被覆された銀微粉の製法および銀微粉
CN101781496B (zh) * 2009-01-16 2013-10-02 比亚迪股份有限公司 一种水性银粉涂料组合物
US7935278B2 (en) * 2009-03-05 2011-05-03 Xerox Corporation Feature forming process using acid-containing composition
US20110126897A1 (en) * 2009-05-20 2011-06-02 E. I. Du Pont De Nemours And Company Composition for extruding fibers
CN102034877A (zh) * 2009-09-30 2011-04-27 比亚迪股份有限公司 一种太阳能电池用导电浆料及其制备方法
TW201113233A (en) * 2009-10-06 2011-04-16 Guo Chun Ying Method of coating noble metal nanoparticle in glassware
WO2011065135A1 (ja) * 2009-11-27 2011-06-03 トクセン工業株式会社 微小金属粒子含有組成物
GB201009847D0 (en) * 2010-06-11 2010-07-21 Dzp Technologies Ltd Deposition method, apparatus, printed object and uses
US9455088B2 (en) 2011-12-21 2016-09-27 3M Innovative Properties Company Resin composition and dielectric layer and capacitor produced therefrom
CN103177787B (zh) * 2011-12-26 2016-04-27 比亚迪股份有限公司 一种用于制备导电银浆的导电粉及导电银浆
CN103198876B (zh) * 2012-01-06 2015-09-09 任天斌 水性纳米电子银浆及其制备方法
DE102014105483A1 (de) 2014-04-17 2015-10-22 Heraeus Sensor Technology Gmbh Sensorelement, Sensormodul, Messanordnung und Abgasrückführsystem mit einem solchen Sensorelement sowie Herstellungsverfahren
WO2015187179A1 (en) 2014-06-06 2015-12-10 Hewlett-Packard Development Company, L.P. Ink composition
EP3152268B1 (en) * 2014-06-06 2018-02-21 Hewlett-Packard Development Company, L.P. Ink composition
KR102092533B1 (ko) 2014-06-06 2020-04-23 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. 잉크 조성물
CN117238554B (zh) * 2023-09-06 2024-07-16 淮安捷泰新能源科技有限公司 一种导电银浆及其制备方法

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Also Published As

Publication number Publication date
CN1134962A (zh) 1996-11-06
CN1058741C (zh) 2000-11-22
KR960017803A (ko) 1996-06-17
DE69502004T2 (de) 1998-09-24
FI955353A (fi) 1996-05-08
EP0713930A1 (en) 1996-05-29
HK1001465A1 (en) 1998-06-19
US5658499A (en) 1997-08-19
EP0713930B1 (en) 1998-04-08
US5492653A (en) 1996-02-20
ATE164892T1 (de) 1998-04-15
DE69502004D1 (de) 1998-05-14
FI955353A0 (fi) 1995-11-07
KR0174305B1 (ko) 1999-03-20
FI114923B (fi) 2005-01-31

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