[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

EP4166578A1 - Initiateur de polymérisation, kit de préparation de composition durcissable, composition durcissable, produit durci et matériau dentaire - Google Patents

Initiateur de polymérisation, kit de préparation de composition durcissable, composition durcissable, produit durci et matériau dentaire Download PDF

Info

Publication number
EP4166578A1
EP4166578A1 EP21842927.2A EP21842927A EP4166578A1 EP 4166578 A1 EP4166578 A1 EP 4166578A1 EP 21842927 A EP21842927 A EP 21842927A EP 4166578 A1 EP4166578 A1 EP 4166578A1
Authority
EP
European Patent Office
Prior art keywords
preparation
compound
curable composition
monomer
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP21842927.2A
Other languages
German (de)
English (en)
Other versions
EP4166578A4 (fr
Inventor
Issei Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Chemicals Inc
Original Assignee
Mitsui Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Chemicals Inc filed Critical Mitsui Chemicals Inc
Publication of EP4166578A1 publication Critical patent/EP4166578A1/fr
Publication of EP4166578A4 publication Critical patent/EP4166578A4/fr
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61K—PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES
    • A61K6/00—Preparations for dentistry
    • A61K6/60—Preparations for dentistry comprising organic or organo-metallic additives
    • A61K6/61—Cationic, anionic or redox initiators
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61K—PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES
    • A61K6/00—Preparations for dentistry
    • A61K6/70—Preparations for dentistry comprising inorganic additives
    • A61K6/79—Initiators
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61K—PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES
    • A61K6/00—Preparations for dentistry
    • A61K6/80—Preparations for artificial teeth, for filling teeth or for capping teeth
    • A61K6/884—Preparations for artificial teeth, for filling teeth or for capping teeth comprising natural or synthetic resins
    • A61K6/887—Compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
    • C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
    • C08F20/10—Esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F22/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides or nitriles thereof
    • C08F22/10—Esters
    • C08F22/1006—Esters of polyhydric alcohols or polyhydric phenols, e.g. ethylene glycol dimethacrylate

Definitions

  • the present disclosure relates to a polymerization initiator, a kit for preparing a curable composition, a curable composition, a cured product, and a dental material.
  • a synthetic resin molded product or the like is used to repair a tooth defect.
  • a curable composition that is referred to as cement is used as a tooth restorative material.
  • the range of use of cement has been expanded.
  • a curable composition for a dental material such as cement, a photopolymerization initiator, a chemical polymerization initiator, or the like can be used.
  • one of general chemical polymerization initiator systems is a redox polymerization initiator formed of a combination of an oxidizing agent and a reducing agent.
  • redox type polymerization initiators include, for example, a polymerization initiator system in which an organic peroxide is used as an oxidizing agent and an aromatic amine compound is used as a reducing agent.
  • Patent Document 1 describes a paste-state polymerizable composition that is characterized by being formed from a first paste and a second paste, the first paste being composed of: (a) a (meth)acrylate compound in an amount of 15 to 100 parts by weight; (b) a filler in an amount of 0 to 85 parts by weight; (c) one or more selected from a persulfate, a hydroperoxide, or a peroxy ester in an amount of 0.01 to 3 parts by weight with respect to 100 parts by weight in total of the component (a) and the component (b); and (d) benzoyl peroxide in an amount of 0.1 to 3 parts by weight with respect to 100 parts by weight in total of the component (a) and the component (b), and the second paste being composed of: (a') a (meth)acrylate compound in an amount of 15 to 100 parts by weight; (b') a filler in an amount of 0 to 85 parts by weight; and (e) an aromatic tertiary amine in an amount
  • Patent Document 1 Japanese Patent Application Laid-Open (JP-A) No. 2013-209598
  • the resulting cured product In the case of polymerizing a monomer by means of using a conventional polymerization initiator, the resulting cured product often becomes to have yellow color.
  • the cured product is used, for example, as a dental material, there is room for improvement in terms of the color of the cured product.
  • Patent Document 1 does not make sufficient analysis regarding achievement of both of the polymerizability of the monomer and the color of the resulting cured product.
  • a problem to be solved by an embodiment of the present disclosure is to provide a polymerization initiator that is capable of favorably improving monomer polymerizability and reducing discoloration of a resultant cured product, a kit for preparing a curable composition that includes the polymerization initiator, a curable composition, a cured product of the curable composition, and a dental material.
  • a polymerization initiator that is capable of favorably improving monomer polymerizability and reducing discoloration of a resultant cured product
  • a kit for preparing a curable composition that includes the polymerization initiator, a curable composition, a cured product of the curable composition, and a dental material.
  • any numerical range indicated using “to” means a range including numerical values described before and after “to” as a minimum value and a maximum value, respectively.
  • the upper limit value or the lower limit value of one numerical range may be replaced by the upper limit value or the lower limit value of another numerical range in the stepwise description.
  • the upper limit value or the lower limit value of any numerical range described in the present disclosure may also be replaced by a value described in Examples.
  • the amount of the component described in the present disclosure means the total amount of the plural substances present, unless otherwise specified.
  • (meth)acryl encompasses acryl and methacryl
  • (meth)acryloyl encompasses acryloyl and methacryloyl
  • the polymerization initiator of the present disclosure includes a transition metal compound, a nitrogen-containing compound, and a sulfonyl group-containing compound.
  • the polymerization initiator of the present disclosure enables the polymerization initiator to favorably improve monomer polymerizability, and to reduce discoloration of a resultant cured product.
  • the nitrogen-containing compound is a compound containing nitrogen.
  • the scope of the nitrogen-containing compound in the present disclosure also includes a salt form.
  • the nitrogen-containing compound in the present disclosure does not include the sulfonyl group-containing compound described in the present disclosure.
  • a compound containing nitrogen and also containing a sulfonyl group is classified to a sulfonyl group-containing compound.
  • Examples of the nitrogen-containing compound in the present disclosure include a compound containing an amino group.
  • Examples of the compound containing an amino group in the present disclosure include an amine compound containing one nitrogen atom, an amine compound containing two nitrogen atoms, and an amine compound containing three or more nitrogen atoms.
  • Examples of the compound containing an amino group include an aromatic amine compound, an aliphatic amine compound, and a heterocyclic amine compound.
  • the nitrogen-containing compound in the present disclosure preferably includes an aromatic amine compound, from the viewpoint of improving the polymerizability.
  • the aromatic amine compound in the present disclosure contains an aromatic hydrocarbon group in the structure thereof.
  • the scope of the aromatic amine compound in the present disclosure does not include a heterocyclic aromatic compound.
  • the nitrogen-containing compound in the present disclosure preferably further includes an aliphatic amine compound or a heterocyclic amine compound, from the viewpoint of improving storage stability.
  • An aliphatic amine compound and a heterocyclic amine compound can coordinate with the metal ion of the transition metal compound to trap the metal, and can thereby reduce the reactivity of a composition containing the transition metal compound and the nitrogen-containing compound.
  • the composition containing the transition metal compound and the nitrogen-containing compound can retain storage stability (that is, it is possible to include the transition metal compound and the nitrogen-containing compound in the same preparation).
  • the composition contains a transition metal compound and an aromatic amine
  • the composition preferably further contain an aliphatic amine compound as a nitrogen-containing compound, from the same viewpoint as that described above.
  • the nitrogen-containing compound in the present disclosure preferably further includes a heterocyclic amine compound.
  • aromatic amine compound examples include:
  • an aliphatic amine compound containing at least one selected from the group consisting of a primary amino group, a secondary amino group, and a tertiary amino group is preferable, and an aliphatic amine compound containing only a tertiary amino group is more preferable.
  • heterocyclic amine compound a heterocyclic amine compound containing at least one selected from the group consisting of a primary amino group, a secondary amino group, and a tertiary amino group is preferable, and a heterocyclic amine compound containing only a tertiary amino group is more preferable.
  • Examples of the aliphatic amine compound include EDTA-based (ethylenediaminetetraacetic acid), NTA-based (nitrilotetraacetic acid), DTPA-based (diethylenetriaminepentaacetic acid), HEDTA-based (hydroxyethylethylenediaminetriacetic acid), TTHA-based (triethylenetetraminehexaacetic acid), PDTA-based (1,3-propanediaminetetraacetic acid), DPTA-OH-based (1,3-diamino-2-hydroxypropanetetraacetic acid), HIDA-based (hydroxyethyliminodiacetic acid), DHEG-based (dihydroxyethylglycine), GEDTA-based (glycol ether diaminetraacetic acid), CMGA-based (dialkoxymethylglutamic acid), EDDS-based ((S,S)-ethylenediamine disuccinic acid), and EDTMP-based (ethylenediaminetetra(methylene
  • heterocyclic amine compound examples include a heterocyclic amine compound capable of functioning as a monodentate, bidentate, or tridentate heterocyclic electron donor ligand.
  • heterocyclic amine compounds derived from unsubstituted or substituted heteroarenes such as furan, thiophene, pyrrole, pyridine, bipyridine, picolylimine, ⁇ -pyran, ⁇ -thiopyran, phenanthroline, pyrimidine, bis-pyrimidine, pyrazine, indole, coumarin, thionaphthene, carbazole, dibenzofuran, dibenzothiophene, pyrazole, imidazole, benzimidazole, oxazole, thiazole, bis-thiazole, isoxazole, isothiazole, quinoline, biquinoline, isoquinoline, biisoquinoline, acridine, chroman, phenazine, phenoxazine, phenothiazine, triazine, thianthrene, purine, bisimidazole, and bisoxazoline; or salt
  • the aliphatic amine compound or heterocyclic amine compound is preferably N,N-dimethyl-N',N'-bis(2-dimethylaminoethyl)ethylenediamine, 2,2'-bipyridine, N-butyl-2-pyridylmethanimine, 4,4'-di-tert-butyl-2,2'-dipyridine, 4,4'-dimethyl-2,2'-dipyridine, 4,4'-dinonyl-2,2'-dipyridine, N-dodecyl-N-(2-pyridylmethylene)amine, 1,1,4,7,10,10-hexamethyl-triethylenetetramine, N-octadecyl-N-(2-pyridylmethylene)amine, N-octyl-2-pyridylmethanimine, N,N,N',N",N"-pentamethyl-diethylenetriamine, 1,4,8,11-tetra
  • the heterocyclic amine compound is preferably a compound represented by the following Formula (2), from the viewpoint of improving the storage stability.
  • the sulfonyl group-containing compound is a compound containing a sulfonyl group.
  • the sulfonyl group-containing compound preferably satisfies at least one of the following conditions: (i) the sulfonyl group-containing compound includes a carbonyl group; or (ii) the sulfonyl group-containing compound includes two or more sulfonyl groups.
  • the sulfonyl group-containing compound preferably satisfies both of the following conditions: (i) the sulfonyl group-containing compound includes a carbonyl group; and (ii) the sulfonyl group-containing compound includes two or more sulfonyl groups.
  • one of X 1 or X 2 is a sulfonyl group, and the other of X 1 or X 2 is a carbonyl group.
  • Y is preferably -NH- or -NNa-, and more preferably -NH-.
  • the bonding site represented by * may be directly bonded to an aromatic ring or may be bonded to an aromatic ring via a linking group.
  • the two bonding sites represented by * may be bonded to each other via an aromatic ring.
  • a configuration may be adopted in which the two bonding sites represented by * are bonded to each other via an aromatic ring so that the structure represented by Formula (1) has a fused ring (for example, a 5-membered ring).
  • the sulfonyl group-containing compound preferably contains an aromatic ring.
  • the number of aromatic rings contained in the sulfonyl group-containing compound is preferably 1 to 3, more preferably 1 or 2, and still more preferably 1.
  • the aromatic ring may contain a substituent or may be unsubstituted, and the aromatic ring is preferably unsubstituted.
  • the aromatic ring contains a substituent
  • substituents include an alkyl group and a carboxy group.
  • the substituent is preferably an alkyl group, and more preferably a methyl group.
  • aromatic ring examples include a benzene ring.
  • a group containing a sulfonyl group (for example, the group represented by Formula (1)) is excluded from the scope of the above substituent.
  • sulfonyl group-containing compound examples include the following compounds, but the scope of the sulfonyl group-containing compound in the present disclosure is not limited thereto.
  • saccharin and saccharin sodium are preferable, and saccharin is more preferable, as the sulfonyl group-containing compound.
  • the polymerization initiator of the present disclosure includes a transition metal compound.
  • the transition metal compound is preferably soluble in the monomer component contained in the kit for preparing a curable composition described below.
  • transition metal compound examples include a copper compound, a vanadium compound, a molybdenum compound, a scandium compound, a titanium compound, a chromium compound, a manganese compound, an iron compound, a cobalt compound, and a nickel compound.
  • the transition metal compound preferably includes at least one of a copper compound or a vanadium compound, and more preferably includes a copper compound.
  • Examples of the copper compound include: copper carboxylates such as copper acetate, copper isobutyrate, copper gluconate, copper citrate, copper phthalate, copper tartrate, copper oleate, copper octylate, copper octenoate, copper naphthenate, copper methacrylate, and copper 4-cyclohexylbutyrate; ⁇ -diketone coppers such as acetylacetone copper, trifluoroacetyl acetone copper, hexafluoroacetylacetone copper, 2,2,6,6-tetramethyl-3,5-heptanedionato copper, benzoylacetone copper; ⁇ -ketoester coppers such as copper ethylacetoacetate; copper alkoxides such as copper methoxide, copper ethoxide, copper isopropoxide, copper 2-(2-butoxyethoxy) ethoxide, copper 2-(2-methoxyethoxy) ethoxide; copper dithioc
  • copper carboxylate, ⁇ -diketone copper, and ⁇ -ketoester copper are preferable, and copper acetate and acetylacetone copper are more preferable, from the viewpoint of solubility in monomers and reactivity.
  • vanadium compound examples include vanadyl acetylacetonate, vanadium (III) naphthenate, vanadyl stearate, vanadium benzoyl acetonate, bis(maltolato) oxovanadium (IV), and oxobis(1-phenyl-1,3-butanedionato) vanadium (IV).
  • the blending amount of the transition metal compound is preferably 0.00005 parts by mass to 0.1 parts by mass, more preferably 0.0001 parts by mass to 0.05 parts by mass, and still more preferably 0.001 parts by mass to 0.03 parts by mass, with respect to 100 parts by mass of the total amount of monomer components contained in the kit of the present disclosure for preparing a curable composition.
  • the kit of the present disclosure for preparing a curable composition includes a first preparation containing a monomer (A) and a second preparation containing a monomer (B), and each of the transition metal compound, the nitrogen-containing compound, and the sulfonyl group-containing compound contained in the polymerization initiator of the present disclosure is independently contained in at least one of the first preparation or the second preparation.
  • the first preparation contains a monomer (A), and the second preparation contains a monomer (B).
  • the monomer (A) and the monomer (B) may be the same monomer or different monomers.
  • each of the monomer (A) and the monomer (B) may be a monomer that does not contain an acidic group or may be a monomer that contains an acidic group.
  • the monomer (A) and the monomer (B) preferably include a monomer that does not contain an acidic group.
  • the monomer is a monomer that forms a high molecular compound by undergoing a radical polymerization reaction advanced by the polymerization initiator of the present disclosure.
  • the number of monomers configuring the monomer as used in the present disclosure is not limited to one, and may be two or more.
  • Examples of the monomer that does not contain an acidic group include a (meth)acrylate monomer that does not contain an acidic group.
  • Examples of the (meth)acrylate monomer that does not contain an acidic group include a monofunctional monomer, a bifunctional monomer, and a tri- or higher functional monomer.
  • the monomer content (that is, the total amount of the monomer (A) and the monomer (B) in the curable composition to be prepared) is preferably from 10% by mass to 90% by mass, more preferably from 20% by mass to 75% by mass, and still more preferably from 30% by mass to 60% by mass, with respect to the total mass of the curable composition to be prepared.
  • Examples of the monofunctional monomer include 2-hydroxyethyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 1,3-dihydroxypropyl (meth)acrylate, and 2,3-dihydroxypropyl (meth)acrylate.
  • 2-hydroxyethyl methacrylate (HEMA) is preferable.
  • Examples of an aromatic compound-based bifunctional monomer include 2,2-bis((meth)acryloyloxyphenyl)propane, 2,2-bis[4-(3-(meth)acryloyloxy)-2-hydroxypropoxyphenyl]propane, 2,2-bis(4-(meth)acryloyloxyethoxyphenyl)propane, 2,2-bis(4-(meth)acryloyloxypolyethoxyphenyl)propane, and 2,2-bis(4-(meth)acryloyloxypolypropoxyphenyl)propane.
  • Bis-GMA 2,2-bis[4-(3-(methacryloyloxy)-2-hydroxypropoxyphenyl)propane
  • Bis-GMA 2,2-bis(4-methacryloyloxypolyethoxyphenyl)propane
  • Examples of an aliphatic compound-based bifunctional monomer include erythritol di(meth)acrylate, sorbitol di(meth)acrylate, mannitol di(meth)acrylate, pentaerythritol di(meth)acrylate, dipentaerythritol di(meth)acrylate, glycerol di(meth)acrylate, ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, butylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, 1,3-butanediol di(meth)acrylate, 1,5-pentanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,10-decan
  • glycerol dimethacrylate triethylene glycol dimethacrylate (TEGDMA), 1,6-hexanediol dimethacrylate (HexDMA), neopentyl glycol dimethacrylate (NPG), 2,2,4-trimethylhexamethylene bis(2-carbamoyloxyethyl) dimethacrylate (UDMA), and 1,2-bis(3-methacryloyloxy-2-hydroxypropyloxy)ethane are preferable.
  • TEGDMA triethylene glycol dimethacrylate
  • HexDMA 1,6-hexanediol dimethacrylate
  • NPG neopentyl glycol dimethacrylate
  • UDMA 2,2,4-trimethylhexamethylene bis(2-carbamoyloxyethyl) dimethacrylate
  • 1,2-bis(3-methacryloyloxy-2-hydroxypropyloxy)ethane are preferable.
  • tri- or higher functional monomer examples include trimethylolpropane tri(meth)acrylate, trimethylolethane tri(meth)acrylate, trimethylolmethane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol tri(meth)acrylate, dipentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, N,N-(2,2,4-trimethylhexamethylene)bis[2-(aminocarboxy)propane-1,3-diol] tetramethacrylate, and 1,7-diacryloyloxy-2,2,6,6-tetraacryloyloxymethyl-4-oxyheptane.
  • Any one of the above-listed monomers may be added singly, or a combination of two or more of the above-listed monomers may be added.
  • the blending amount of the monomer that does not contain an acidic group is preferably in a range of from 10 parts by mass to 100 parts by mass, more preferably in a range of 20 parts by mass to 100 parts by mass, and still more preferably in a range of 50 parts by mass to 100 parts by mass, with respect to 100 parts by mass of the total amount of monomer components contained in the kit of the present disclosure for preparing a curable composition.
  • the blending amount of the monomer that does not contain an acidic group is preferably from 10 parts by mass to 99 parts by mass, more preferably from 30 parts by mass to 97 parts by mass, and still more preferably from 50 parts by mass to 95 parts by mass, with respect to 100 parts by mass of the total amount of the monomer components contained in the kit of the present disclosure for preparing a curable composition.
  • the monomer (A) and the monomer (B) preferably include a (meth)acrylic monomer (C) having a molecular weight of 100 to 5000.
  • the molecular weight of the (meth)acrylic monomer (C) is more preferably 120 to 3000, still more preferably 150 to 2000, and particularly preferably 200 to 1000.
  • the content of the (meth)acrylic monomer (C) with respect to the total content of the monomer (A) and the monomer (B) is preferably 50% by mass or more, more preferably 70% by mass or more, and still more preferably 90% by mass or more.
  • the content of the (meth)acrylic monomer (C) with respect to the total content of the monomer (A) and the monomer (B) may be 98% by mass or less, or may be 95% by mass or less.
  • At least one of the first preparation or the second preparation may contain an acidic group-containing monomer.
  • the configuration in which at least one of the first preparation or the second preparation contain an acidic group-containing monomer can impart excellent tooth quality and high adhesiveness to dental prosthetic materials.
  • Examples of the acidic group-containing monomer include monomers having at least one acidic group and at least one polymerizable group, wherein examples of the acidic group include a phosphoric acid group, a pyrophosphoric acid group, a thiophosphoric acid group, a phosphonic acid group, a sulfonic acid group, and a carboxylic acid group, and examples of the polymerizable group include an acryloyl group, a methacryloyl group, a vinyl group, and a styrene group.
  • the acidic group-containing monomer has affinity with an adherend and has a tooth decalcification effect.
  • Examples of a phosphoric acid group-containing monomer include (meth)acryloyloxyalkyl dihydrogen phosphates such as 10-(meth)acryloyloxydecyl dihydrogen phosphate (MDP), bis[2-(meth)acryloyloxyethyl] hydrogen phosphate, bis[4-(meth)acryloyloxybutyl] hydrogen phosphate, bis[6-(meth)acryloyloxyhexyl] hydrogen phosphate, bis[8-(meth)acryloyloxyoctyl] hydrogen phosphate, bis[9-(meth)acryloyloxynonyl] hydrogen phosphate, bis[10-(meth)acryloyloxydecyl] hydrogen phosphate, 1,3-di(meth)acryloyloxypropyl dihydrogen phosphate, 2-(meth)acryloyloxyethyl phenyl hydrogen phosphate, 2-(meth)acryloyloxye
  • Examples of a pyrophosphoric acid group-containing monomer include bis[2-(meth)acryloyloxyethyl] pyrophosphate, bis[4-(meth)acryloyloxybutyl] pyrophosphate, and acid chlorides, alkali metal salts, and ammonium salts thereof.
  • Examples of a thiophosphoric acid group-containing monomer include 2-(meth)acryloyloxyethyl dihydrogen thiophosphate, 3-(meth)acryloyloxypropyl dihydrogen thiophosphate, and acid chlorides, alkali metal salts, and ammonium salts thereof.
  • Examples of a phosphonic acid group-containing monomer include 2-(meth)acryloyloxyethylphenylphosphonate, 5-(meth)acryloyloxypentyl-3-phosphonopropionate, and acid chlorides, alkali metal salts, and ammonium salts thereof.
  • Examples of a sulfonic acid group-containing monomer include 2-(meth)acrylamide-2-methylpropane sulfonic acid, styrene sulfonic acid, and 2-sulfoethyl (meth)acrylate.
  • Examples of a carboxylic acid group-containing monomer include a monomer that contains one carboxy group in a molecule thereof, and a monomer that contains plural carboxy groups in a molecule thereof.
  • Examples of the monomer that contains one carboxy group in a molecule thereof include (meth)acrylic acid, N-(meth)acryloylglycine, N-(meth)acryloylaspartic acid, O-(meth)acryloyltyrosine, N-(meth)acryloyltyrosine, N-(meth)acryloylphenylalanine, N-(meth)acryloyl-p-aminobenzoic acid, N-(meth)acryloyl-o-aminobenzoic acid, p-vinylbenzoic acid, 2-(meth)acryloyloxybenzoic acid, 3-(meth)acryloyloxybenzoic acid, 4-(meth)acryloyloxybenzoic acid, N-(meth)acryloyl-5-aminosalicylic acid, N-(meth)acryloyl-4-aminosalicylic acid, 2-(meth)acryloyloxyethyl hydrogen succinate
  • Examples of the monomer that contains plural carboxy groups in a molecule thereof include 6-(meth)acryloyloxyhexane-1,1-dicarboxylic acid, 9-(meth)acryloyloxynonane-1,1-dicarboxylic acid, 10-(meth)acryloyloxydecane-1,1-dicarboxylic acid, 11-(meth)acryloyloxyundecane-1,1-dicarboxylic acid, 12-(meth)acryloyloxydecane-1,1-dicarboxylic acid, 13-(meth)acryloyloxytridecane-1,1-dicarboxylic acid, 4-(meth)acryloyloxyethyl trimellitate, 4-(meth)acryloyloxyethyl trimellitate anhydride, 4-(meth)acryloyloxybutyl trimellitate, 4-(meth)acryloyloxyhexyl trimellitate, 4-(meth)acryloyloxyde
  • 10-(meth)acryloyloxydecyl dihydrogen phosphate MDP
  • 1,3-di(meth)acryloyloxypropyl dihydrogen phosphate 2-(meth)acryloyloxyethyl dihydrogen phosphate
  • 4-(meth)acryloyloxyethyl trimellitate anhydride 4-(meth)acryloyloxyethyl trimellitate
  • 2-(meth)acrylamide-2-methylpropane sulfonic acid 11-(meth)acryloyloxyundecane-1,1-dicarboxylic acid
  • dihydroxyethyl methacrylate trimethylhexyl dicarbamate are preferable from the viewpoint that they have a high adhesive power to an adherend.
  • the acidic group-containing monomer described above may be used singly or in combination of two or more thereof.
  • the blending amount of the acidic group-containing monomer is preferably from 1 part by mass to 50 parts by mass, more preferably from 3 parts by mass to 40 parts by mass, and still more preferably from 5 parts by mass to 30 parts by mass, with respect to 100 parts by mass of the total amount of monomer components contained in the kit of the present disclosure for preparing a curable composition.
  • the blending amount of the acidic group-containing monomer is 1 part by mass or more, high adhesiveness to various adherends can easily be obtained.
  • the total amount of monomer components means the total amount of the acidic group-containing monomer and the above-described monomer that does not contain an acidic group.
  • monomers described in known documents such as WO 2012/157566 , WO 2015/015220 , WO 2015/015221 , and JP-A No. 2016-094482 , for example, can be used.
  • At least one of the first preparation or the second preparation may contain a peroxide.
  • peroxide examples include organic peroxides and inorganic peroxides, and the peroxide in the present disclosure preferably includes an organic peroxide.
  • the organic peroxide is not particularly limited, and a known organic peroxide can be used.
  • Typical examples of the organic peroxide include hydroperoxides, peroxyesters, ketone peroxides, peroxyketals, dialkyl peroxides, diacyl peroxides, and peroxydicarbonates.
  • hydroperoxides are preferable from the viewpoint that use of hydroperoxides provides a small fluctuation in the length of time during which processing is possible even after the curable composition is provided in the dispensed form and stored for a long period of time.
  • the organic peroxide may be used singly or in combination of two or more thereof.
  • hydroperoxides include cumene hydroperoxide, t-butyl hydroperoxide, t-hexyl hydroperoxide, p-menthane hydroperoxide, diisopropylbenzene hydroperoxide, and 1,1,3,3-tetramethylbutyl hydroperoxide.
  • a peroxyester a known peroxyester that contains an acyl group on one side of a peroxy group (-OO- group) and a hydrocarbon group (or a group similar thereto) on the other side of the peroxy group can be used without any limitation.
  • Specific examples thereof include ⁇ , ⁇ -bis(neodecanoylperoxy) diisopropylbenzene, cumyl peroxyneodecanoate, 1,1,3,3-tetramethylbutyl peroxyneodecanoate, 1-cyclohexyl-1-methylethyl peroxyneodecanoate, t-hexyl peroxyneodecanoate, t-butyl peroxyneodecanoate, t-hexyl peroxypivalate, t-butyl peroxypivalate, 1,1,3,3-tetramethylbutyl peroxy-2-ethylhexanoate, 2,5-dimethyl-2,5-bis(2-ethylhexanoylperoxy)hexane, 1-cyclohexyl-1-methylethyl peroxy-2-ethylhexanoate, t-hexyl peroxy-2-ethylhexanoate
  • ketone peroxides examples include methyl ethyl ketone peroxide, cyclohexanone peroxide, methyl cyclohexanone peroxide, methyl acetoacetate peroxide, and acetylacetone peroxide.
  • peroxyketals examples include 1,1-bis(t-hexylperoxy)3,3,5-trimethylcyclohexane, 1,1-bis(t-hexylperoxy)cyclohexane, 1,1-bis(t-butylperoxy)3,3,5-trimethylcyclohexanone, 1,1-bis(t-butylperoxy)cyclohexane, 1,1-bis(t-butylperoxy)cyclodecane, 2,2-bis(t-butylperoxy)butane, n-butyl4,4-bis(t-butylperoxy) valerate, and 2,2-bis(4,4-di-t-butylperoxycyclohexyl)propane.
  • dialkyl peroxide examples include ⁇ , ⁇ -bis(t-butylperoxy)diisopropylbenzene, dicumyl peroxide, 2,5-dimethyl-2,5-bis(t-butylperoxy)hexane, t-butylcumyl peroxide, di-t-butyl peroxide, and 2,5-dimethyl-2,5-bis(t-butylperoxy)hexane-3.
  • diacyl peroxides examples include isobutyryl peroxide, 2,4-dichlorobenzoyl peroxide, 3,5,5-trimethylhexanoyl peroxide, octanoyl peroxide, lauroyl peroxide, stearyl peroxide, succinic acid peroxide, m-toluoylbenzoyl peroxide, and benzoyl peroxides.
  • peroxydicarbonate examples include di-n-propyl peroxydicarbonate, diisopropyl peroxydicarbonate, bis(4-t-butylcyclohexyl) peroxydicarbonate, di-2-ethoxyethyl peroxydicarbonate, di-2-ethylhexyl peroxydicarbonate, di-2-methoxybutyl peroxydicarbonate, and di(3-methyl-3-methoxybutyl) peroxydicarbonate.
  • the blending amount of the organic peroxide is preferably from 0.01 parts by mass to 1 part by mass, and more preferably from 0.05 parts by mass to 0.5 parts by mass, with respect to 100 parts by mass of the total amount of monomer components contained in the curable composition of the present disclosure.
  • examples of the inorganic peroxides include peroxodisulfates and peroxodiphosphates, and, among these, peroxodisulfates are preferable from the viewpoint of curability.
  • Specific examples of the peroxodisulfate include sodium peroxodisulfate, potassium peroxodisulfate, aluminum peroxodisulfate, and ammonium peroxodisulfate.
  • the peroxodisulfate may be used singly or in combination of two or more thereof.
  • peroxodisulfates described above sodium peroxodisulfate, potassium peroxodisulfate, and ammonium peroxodisulfate are preferable.
  • At least one of the first preparation or the second preparation may contain a filler.
  • the filler may be added singly, or a combination of two or more fillers may be added.
  • Examples of the filler include an inorganic filler, an organic filler, and a composite filler composed of an inorganic filler and an organic filler.
  • the inorganic filler examples include silica; silica-based minerals such as kaolin, clay, isinglass, and mica; and ceramics and glasses that contain silica as a base material and further contain, for example, Al 2 O 3 , B 2 O 3 , TiO 2 , ZrO 2 , BaO, La 2 O 3 , SrO, ZnO, CaO, P 2 O 5 , Li 2 O, and/or Na 2 O.
  • Preferable glasses for use include lanthanum glass, barium glass, strontium glass, soda glass, lithium borosilicate glass, zinc glass, fluoroaluminosilicate glass, borosilicate glass, and bioglass.
  • fine particle silica having a primary particle size of 0.001 ⁇ m to 0.1 ⁇ m is preferable for use, in terms of adhesive power and handleability.
  • Examples of commercially available products include AEROSII, OX 50, AEROSII, 50, AEROSII, 200, AEROSIL 380, AEROSIL R 972, and AEROSIL 130 (all of which are manufactured by Nippon Aerosil Co., Ltd.).
  • organic filler examples include polymethyl methacrylate, polyethyl methacrylate, a polymer of polyfunctional methacrylate, polyamide, polystyrene, polyvinyl chloride, chloroprene rubber, nitrile rubber, and styrene-butadiene rubber.
  • Examples of the composite filler composed of an inorganic filler and an organic filler include a composite filler that includes an inorganic filler dispersed in an organic filler, and an inorganic/organic composite filler that includes an inorganic filler coated with any of various polymers.
  • the filler may be surface-treated with a known surface treatment agent, such as a silane coupling agent, in advance, before use.
  • a known surface treatment agent such as a silane coupling agent
  • the surface treatment agent include vinyltrimethoxysilane, vinyltriethoxysilane, vinyltrichlorosilane, vinyltri( ⁇ -methoxyethoxy) silane, ⁇ -methacryloyloxypropyltrimethoxysilane, ⁇ -glycidoxypropyltrimethoxysilane, ⁇ -mercaptopropyltrimethoxysilane, and ⁇ -aminopropyltriethoxysilane.
  • the blending amount of the filler is preferably in a range of from 10% by mass to 80% by mass, more preferably in a range of from 30% by mass to 80% by mass, and still more preferably in a range of from 50% by mass to 75% by mass, with respect to the total mass of the curable composition of the present disclosure.
  • At least one of the first preparation or the second preparation preferably contains a non-conductive filler.
  • the non-conductive filler means a filler having a resistance value of 1.00 ⁇ 10 -4 ⁇ m or more.
  • the upper limit of the resistance value of the non-conductive filler is not particularly limited, and may be, for example, 1.00 ⁇ 10 20 Qm.
  • non-conductive filler examples include organic substances such as polyethylene, polystyrene, a phenol resin, an epoxy resin, an acrylic resin, and a benzoguanamine resin; inorganic substances such as silicas (such as silica dimethyl silylate), silicates (borosilicate glasses (such as barium borosilicate glass), aluminosilicate glasses (such as boroaluminosilicate glass, strontium boroaluminosilicate glass, fluoroaluminosilicate glass, and barium aluminosilicate glass)), ceramic, boron nitride, and barium nitride.
  • organic substances such as polyethylene, polystyrene, a phenol resin, an epoxy resin, an acrylic resin, and a benzoguanamine resin
  • inorganic substances such as silicas (such as silica dimethyl silylate), silicates (borosilicate glasses (such as barium borosilicate glass), aluminosi
  • silicas and silicates are preferable as the material of the non-conductive filler, and silica dimethyl silylate and barium aluminosilicate are more preferable.
  • the first preparation contains a non-conductive filler, and the content of the non-conductive filler in the first preparation is 10% by mass or more with respect to the total mass of the first preparation; the content of the non-conductive filler is more preferably 20% by mass or more, and still more preferably 30% by mass or more, with respect to the total mass of the first preparation.
  • the content of the non-conductive filler may be 99% by mass or less, or 95% by mass or less, with respect to the total mass of the first preparation.
  • the second preparation contains the non-conductive filler at content of 10% by mass or more with respect to the total mass of the second preparation; the content of the non-conductive filler in the second preparation is more preferably 20% by mass or more, and still more preferably 30% by mass or more, with respect to the total mass of the second preparation.
  • the content of the non-conductive filler may be 99% by mass or less, or 95% by mass or less, based on the total mass of the second preparation.
  • the content of the non-conductive filler in the first preparation is, if contained in the first preparation, preferably 10% by mass or more with respect to the total mass of the first preparation
  • the content of the non-conductive filler in the second preparation is, if contained in the second preparation, preferably 10% by mass or more with respect to the total mass of the second preparation.
  • the first preparation contains a non-conductive filler at a content of 10% by mass or more with respect to the total mass of the first preparation
  • the second preparation contains a non-conductive filler at a content of 10% by mass or more with respect to the total mass of the second preparation.
  • At least one of the first preparation or the second preparation may contain a reducing agent.
  • Examples of the reducing agent include a sulfinic acid compound or a salt thereof, a hydrazine compound or a salt thereof, and an ascorbic acid compound or a salt thereof.
  • Examples of the sulfinic acid compound or salt thereof include an alkanesulfinic acid or a salt thereof, an alicyclic sulfinic acid or a salt thereof, and an aromatic sulfinic acid or a salt thereof.
  • Examples of the salt of a sulfinic acid compound include a lithium salt, a sodium salt, a potassium salt, a rubidium salt, a cesium salt, a magnesium salt, a calcium salt, a strontium salt, an iron salt, a zinc salt, an ammonium salt, a tetramethylammonium salt, and a tetraethylammonium salt.
  • alkanesulfinic acid examples include methanesulfinic acid.
  • Examples of the alicyclic sulfinic acid include cyclohexanesulfinic acid and cyclooctanesulfinic acid.
  • aromatic sulfinic acid examples include benzenesulfinic acid, p-toluenesulfinic acid, o-toluenesulfinic acid, ethylbenzenesulfinic acid, decylbenzenesulfinic acid, dodecylbenzenesulfinic acid, 2,4,6-trimethylbenzenesulfinic acid, 2,4,6-triisopropylbenzenesulfinic acid, chlorobenzenesulfinic acid, and naphthalenesulfinic acid.
  • the first preparation or the second preparation when the first preparation or the second preparation contains a sulfinic acid compound, the first preparation or second preparation preferably contains the above-described heterocyclic amine compound, from the viewpoint of improving the storage stability.
  • the heterocyclic amine compound can reduce, during storage, unnecessary reactions caused by the sulfinic acid compound in the first preparation or second preparation.
  • the configuration in which the first preparation or the second preparation contains a heterocyclic amine compound enables the first preparation or second preparation that contains a sulfinic acid compound to maintain storage stability.
  • the heterocyclic amine compound preferably contains at least one of a secondary or tertiary amino group.
  • the heterocyclic amine compound to be used may be an azole compound such as imidazole, triazole, mercaptotriazole, oxazole, oxadiazole, thiadiazole, tetrazole, benzimidazole, benzotriazole, hydroxybenzotriazole, mercaptobenzotriazole, benzoxazole, and benzothiadiazole.
  • azole compound such as imidazole, triazole, mercaptotriazole, oxazole, oxadiazole, thiadiazole, tetrazole, benzimidazole, benzotriazole, hydroxybenzotriazole, mercaptobenzotriazole, benzoxazole, and benzothiadiazole.
  • benzimidazole and benzotriazole are preferable, and benzotriazole is more preferable, for use as the heterocyclic amine compound to be used in a case in which the first preparation or the second preparation contains a sulfinic acid compound.
  • hydrazine compound or a salt thereof examples include adipic acid dihydrazide, isophthalic acid dihydrazide, azelaic acid dihydrazide, acetohydrazide, benzoylhydrazine, tert-butyl 2-methylcarbazate, carbohydrazide, N,N'-dibenzoylhydrazine, malonic acid hydrazide, phthalic acid hydrazide, acetylphenylhydrazine, and salts of these hydrazine compounds.
  • Examples of the ascorbic acid compound or salt thereof include palmitoyl ascorbate.
  • the curable composition of the present disclosure may include a borate compound.
  • a borate compound in the curable composition of the present disclosure can further improve the polymerizability of the curable composition.
  • a compound that corresponds to the above-described nitrogen-containing compound and that is also a borate salt is classified into the above-described nitrogen-containing compound rather than the borate compound.
  • borate compound examples include tetraalkylborate, tetraalkylammonium borate, and salts thereof.
  • tetraalkylborates and salts thereof are preferable, tetraphenylborate and salts thereof are more preferable, and sodium tetraphenylborate is still more preferable for use as the borate compound.
  • At least one of the first preparation or the second preparation preferably contains at least one selected from the group consisting of a sulfinic acid compound and a borate compound.
  • a configuration in which the first preparation contains a sulfonyl group-containing compound and in which the second preparation contains a nitrogen-containing compound is preferable from the viewpoint of improving storage stability.
  • the second preparation contains sulfinic acid and nitrogen-containing compounds including an aromatic amine compound and a heterocyclic amine compound.
  • a configuration in which the second preparation contains an aromatic amine compound, a heterocyclic amine compound, and sulfinic acid imparts higher storage stability than that in a case in which the second preparation does not contain a heterocyclic amine compound.
  • the total content of organic peroxides contained in the first preparation and the second preparation is preferably 0.10% by mass or less (including a case in which the content is 0% by mass) with respect to the total mass of the curable composition to be prepared.
  • a configuration in which the total content is 0.10% by mass or less can prevent deterioration of handleability caused by, for example, a phenomenon that the curable composition becomes heated during storage.
  • the total content of organic peroxides contained in the first preparation and the second preparation is more preferably 0.05% by mass or less with respect to the total mass of the curable composition to be prepared.
  • the total content of organic peroxides contained in the first preparation and the second preparation may be more than 0% by mass, or 0.01% by mass or more, with respect to the total mass of the curable composition to be prepared.
  • the curable composition of the present disclosure may contain additives such as a photopolymerization initiator, a stabilizer (polymerization inhibitor), a colorant, a fluorescent agent, and an ultraviolet absorber.
  • additives such as a photopolymerization initiator, a stabilizer (polymerization inhibitor), a colorant, a fluorescent agent, and an ultraviolet absorber.
  • photopolymerization initiator a known photopolymerization initiator can be used, and examples thereof include camphorquinone (CQ) and ethyl dimethylaminobenzoate (EDB).
  • CQ camphorquinone
  • EDB ethyl dimethylaminobenzoate
  • An antimicrobial substance such as cetylpyridinium chloride, benzalkonium chloride, (meth)acryloyloxydecylpyridinium bromide, (meth)acryloyloxyhexadecylpyridinium chloride, (meth)acryloyloxydecylammonium chloride, or triclosan may be added.
  • Known dyes and pigments may be added to the curable composition of the present disclosure.
  • the kit of the present disclosure for preparing a curable composition is preferably a kit for a dental material.
  • the curable composition of the present disclosure includes the polymerization initiator of the present disclosure and a monomer.
  • the curable composition of the present disclosure may have favorably improved polymerizability, by means of having the foregoing configuration.
  • the curable composition of the present disclosure preferably further contains a non-conductive filler.
  • non-conductive filler in the curable composition are the same as those of the non-conductive filler described above.
  • the cured product of the present disclosure is a cured product of the curable composition of the present disclosure or a cured product obtained using the kit of the present disclosure for preparing a curable composition.
  • the cured product of the present disclosure can be suitably used as a dental material. That is, the dental material of the present disclosure preferably contains the cured product of the present disclosure.
  • the prepared first preparation and second preparation were mixed to prepare a curable composition of each of Examples 1 to 34 and Comparative Examples 1 to 4.
  • the curable composition immediately after mixing was filled into an aluminum pan, the temperature inside the aluminum pan was rapidly adjusted to 37°C condition, and the curable composition was cured to produce a cured product.
  • the temperature of the curable composition was measured over time, and the maximum temperature (highest peak value) of the curable composition and the time that elapsed until the temperature reached the maximum temperature (also referred to as the "maximum temperature reaching time") were measured.
  • the results are indicated in Tables 1 to 9.
  • the temperature (°C) indicated at the heading "polymerizability" in Tables 1 to 9 means the maximum value of the temperature peaks of the curable composition. The lower the maximum value of the temperature peaks is, the better the polymerizability of the monomer in the curable composition is.
  • the time (minute) indicated at the heading "polymerizability" in Tables 1 to 9 means the time that had elapsed until the maximum value of the temperature peaks was obtained. The shorter the time that had elapsed until the maximum value of the temperature peaks was obtained is, the better the polymerizability of the monomer in the curable composition is.
  • the time that had lapsed until the curable composition reached the maximum temperature was measured by the same method as the method described in ⁇ Evaluation of Monomer Polymerizability>.
  • Example 21 First preparation Second preparation First preparation Second preparation First preparation Second preparation Basic composition 1 98.9987 98.0000 98.9987 98.0000 98.9987 98.0000 Transition metal compound Acetylacetone copper 0.0013 0.0013 0.0013 Copper acetate Copper ethylhexanoate Copper(II) bromide Copper(II) chloride Sulfinic acid compound Sodium p-toluenesulfinate 1.0000 Borate compound Sodium tetraphenylborate 1.0000 Nitrogen-containing compound Dimethyl-p-toluidine 1.0000 1.0000 Tetraphenylborate dimethyl-p-toluidine 2.0000 Sulfonyl group-containing compound Saccharin 1.0000 1.0000 1.0000 Sulfobenzoic acid anhydride Benzodithiolone dioxide Metthyltosylbenzenesulfoamide Sum 100.0000 100.0000 100.0000 100.0000 100.0000 100.0000 Polymerizability Maximum temperature reaching time (min)
  • the numbers indicated in the columns for the respective compositions or ingredients in Tables 1 to 9 refer to the amounts (parts by mass) of the compositions or ingredients with respect to the total mass of the first or second preparation.
  • Basic composition 1 in Tables 1 to 9 refers to a composition common to the Examples and Comparative Examples that contain basic composition 1. The ingredients and contents thereof in basic composition 1 are as indicated in Table 10.
  • Table 10 Basic composition 1 % by mass Monomer Dihydroxyethyl methacrylate trimethylhexyl dicarbamate 29.58 Neopentyl glycol dimethacrylate 7.14 Filler Barium aluminum silicate 61.21 Silica dimethyl silylate 2.04 Polymerization inhibitor Di-tert-butylhydroxytoluene 0.03 Sum 100
  • the numbers indicated in the columns for the basic composition or the ingredients in Table 10 refer to the amounts (parts by mass) of the composition or the ingredients with respect to the total mass of the basic composition.
  • Comparative Example 1 in which a polymerization initiator that did not contain a nitrogen-containing compound was used, Comparative Example 2, in which a polymerization initiator that did not contain a transition metal compound was used, and Comparative Example 3, in which a polymerization initiator that did not contain a sulfonyl group-containing compound was used, polymerization did not proceed, and a cured product was not obtained.
  • Examples 31 to 34 in which a sulfinic acid compound and a heterocyclic aromatic compound as a nitrogen-containing compound were contained, exhibited a superior storage stability, compared to Comparative Example 4, in which a sulfinic acid compound and a heterocyclic aromatic compound were not contained.
  • Examples 31,33, and 34 which contained benzothiazole, benzoxazole, or benzotriazole as a heterocyclic aromatic compound, exhibited more improved storage stability.
  • a first preparation and a second preparation for each of Examples 35 to 37 were prepared using the ingredients indicated in Table 11.
  • the prepared first preparation and second preparation were mixed to prepare a curable composition of each of Examples 35 to 37.
  • a cow mandiblar anterior tooth was subjected to tooth root cutting and pulpectomy. This tooth was placed in a plastic cylindrical container having a diameter of 25 mm and a depth of 25 mm, and embedded in an acrylic resin.
  • the resultant product will be also referred to as a cow tooth for adhesion.
  • the cow tooth for adhesion was polished with water-resistant emery paper (P 400) immediately before use, and the smooth surface of the cow tooth dentin was exposed by polishing and used.
  • P 400 water-resistant emery paper
  • the first preparation and the second preparation of each of the Examples and Comparative Examples prepared in the ⁇ Evaluation of Monomer Polymerizability> were used as test samples to be used in the measurement of adhesive power, and adhesiveness was evaluated in accordance with ISO 16506.
  • adhesive power was measured: after the adhered items were left to stand still at 37°C for 90 minutes, in the case of chemical polymerization; or after the adhered items were irradiated with light from 2 directions, for 10 seconds for each direction, using an LED visible light irradiator (TRANSLUX 2WAVE, manufactured by Kulzer) so as to cause curing, and then left to stand still at 37°C for 30 minutes, in the case of photopolymerization,
  • TRANSLUX 2WAVE manufactured by Kulzer
  • Each of basic compositions 2 to 5 in Table 11 is a composition common to Examples and Comparative Examples that contain the designated basic composition.
  • the ingredients and contents thereof in basic compositions 2 to 5 are as indicated in Tables 12 to 15.
  • Table 12 Basic composition 2 % by mass Polymerization inhibitor Di-tert-butylhydroxytoluene 0.028 Monomer Ethoxylated bisphenol A dimethacrylate 23.833 Neopentyl glycol dimethacrylate 8.256 Filler Aluminum oxide 2.752 Barium aluminum silicate 65.132 Sum 100 Table 13 Basic composition 3 % by mass Polymerization inhibitor Di-tert-butylhydroxytoluene 0.050 Monomer Ethoxylated bisphenol A dimethacrylate 10.995 Bisphenol A dimethacrylate 17.491 Hydroxyethyl methacrylate 6.497 Filler Nano silica 4.998 Silica 59.970 Sum 100 Table 14 Basic composition 4 % by mass Polymerization inhibitor Di-tert-butylhydroxytoluene 0.049 Mono
  • the first preparation and the second preparation of each of Examples 38 to 43 were prepared using the ingredients indicated in Tables 16 and 17.
  • the prepared first preparation and second preparation were mixed to prepare a curable composition of each of Examples 38 to 43.
  • the time that had lapsed until the curable composition reached the maximum temperature was measured by the same method as the method described in ⁇ Evaluation of Monomer Polymerizability>.
  • the difference between the maximum temperature reaching time measured after storage and the maximum temperature reaching time measured without performing storage was calculated, and the storage stability was evaluated according to the following criteria.
  • Example 40 First preparation Second preparation First preparation Second preparation First preparation Second preparation Basic composition 1 98.8000 97.0000 98.8000 97.0000 98.8000 97.0000 Transition metal compound Acetylacetone copper 0.0020 0.0020 0.0020 Sulfonyl group-containing compound Saccharin 1.0000 1.0000 1.0000 Sulfinic acid compound Sodium p-toluenesulfinate 1.0000 1.0000 1.0000 Nitrogen-containing compound Diethanol-p-toluidine 1.0000 Dimethylamino-1,4-phenylethanol 1.0000 Dimethyl-p-toluidine 1.0000 Benzoxazole 1.0000 1.0000 1.0000 Sum 99.8020 100.0000 99.8020 100.0000 99.8020 100.0000 Polymerizability Measured before storage Maximum temperature reaching time (min) 1.7 1.3 1.0 Maximum temperature (°C) 40.4 43.6 43.6 Storage stability 2 80°C, 0.5 hours Max.

Landscapes

  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • General Health & Medical Sciences (AREA)
  • Animal Behavior & Ethology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Epidemiology (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Plastic & Reconstructive Surgery (AREA)
  • Dental Preparations (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
EP21842927.2A 2020-07-15 2021-07-09 Initiateur de polymérisation, kit de préparation de composition durcissable, composition durcissable, produit durci et matériau dentaire Pending EP4166578A4 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020121716 2020-07-15
PCT/JP2021/025955 WO2022014492A1 (fr) 2020-07-15 2021-07-09 Initiateur de polymérisation, kit de préparation de composition durcissable, composition durcissable, produit durci et matériau dentaire

Publications (2)

Publication Number Publication Date
EP4166578A1 true EP4166578A1 (fr) 2023-04-19
EP4166578A4 EP4166578A4 (fr) 2024-07-24

Family

ID=79555423

Family Applications (1)

Application Number Title Priority Date Filing Date
EP21842927.2A Pending EP4166578A4 (fr) 2020-07-15 2021-07-09 Initiateur de polymérisation, kit de préparation de composition durcissable, composition durcissable, produit durci et matériau dentaire

Country Status (4)

Country Link
US (1) US20230242681A1 (fr)
EP (1) EP4166578A4 (fr)
JP (1) JP7539471B2 (fr)
WO (1) WO2022014492A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024190887A1 (fr) * 2023-03-16 2024-09-19 サンメディカル株式会社 Kit de polymérisation dentaire

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2558139A (en) * 1947-08-26 1951-06-26 L D Caulk Company Dental material and method
DE3689667T2 (de) * 1985-07-24 1994-07-14 Loctite Corp Substituierte saccharinverbindungen und vernetzbare zusammensetzungen daraus.
WO2012086189A1 (fr) * 2010-12-20 2012-06-28 クラレノリタケデンタル株式会社 Composition dentaire durcissable
EP2710994B1 (fr) 2011-05-16 2018-08-01 Mitsui Chemicals, Inc. Matériau dentaire, composition de matériau dentaire, matériau de réparation dentaire, et produit durci
JP5878065B2 (ja) 2012-03-30 2016-03-08 株式会社ジーシー ペースト状重合性組成物
JP6016656B2 (ja) 2013-02-05 2016-10-26 株式会社トクヤマデンタル 歯科用硬化性組成物
GB2519055A (en) 2013-08-01 2015-04-15 Calla Lily Personal Care Ltd Drug delivery device
GB201313850D0 (en) 2013-08-02 2013-09-18 Johnson Matthey Plc Getter composition
JP6654519B2 (ja) * 2016-06-30 2020-02-26 株式会社ジーシー １剤型の歯科用重合性組成物
WO2018008141A1 (fr) 2016-07-08 2018-01-11 Ｇｋｎ ドライブライン ジャパン株式会社 Dispositif de transmission de puissance
EP3702377A4 (fr) * 2017-10-26 2021-08-25 Mitsui Chemicals, Inc. Composition durcissable

Also Published As

Publication number Publication date
US20230242681A1 (en) 2023-08-03
WO2022014492A1 (fr) 2022-01-20
EP4166578A4 (fr) 2024-07-24
JPWO2022014492A1 (fr) 2022-01-20
JP7539471B2 (ja) 2024-08-23

Similar Documents

Publication Publication Date Title
EP2213275B1 (fr) Composition durcissable pour des applications dentaires
EP2656831B1 (fr) Composition dentaire durcissable
JP6514686B2 (ja) 歯科材料用重合性モノマー
US20100311864A1 (en) Dental primer, and dental adhesive set
KR102309461B1 (ko) 화학중합개시제, 접착성 조성물, 접착성 조성물 키트, 치과용 재료, 치과용 재료 키트 및 접착성 조성물의 보관 방법
JP6025656B2 (ja) 硬化性組成物
US11306160B2 (en) Curable composition
CA3008362A1 (fr) Trousse de materiau adhesif dentaire comprenant une composition adhesive aqueuse et une composition durcissable
US12221524B2 (en) Polymerization initiator, curable composition, dental material, and preparation kit for curable composition
EP3666247B1 (fr) Composition durcissable divisée
EP4166578A1 (fr) Initiateur de polymérisation, kit de préparation de composition durcissable, composition durcissable, produit durci et matériau dentaire
EP3888616B1 (fr) Composition dentaire photodurcissable avec une excellente sélection de ton de couleur
JP2014111555A (ja) 歯科用硬化性組成物及びこれを用いた歯科用セメント
JP5878065B2 (ja) ペースト状重合性組成物
JP7574526B2 (ja) 重合開始剤、硬化性組成物調製用キット、硬化性組成物、硬化物及び歯科材料
WO2018181710A1 (fr) Monomère multifonctionnel pour matériau dentaire, et monomère contenant un groupe hydroxyle pour matériau dentaire
EP4501974A1 (fr) Accélérateur de polymérisation, initiateur de polymérisation, kit de préparation de composition durcissable, composition durcissable, produit durci et matériau dentaire
WO2024029508A1 (fr) Kit pour préparation de composition durcissable pour produit dentaire, composition durcissable pour produit dentaire, et produit dentaire
EP4484421A1 (fr) Dérivé d'acide ascorbique ou sel de celui-ci, additif pour initier la polymérisation, initiateur de polymérisation, kit pour préparer une composition durcissable, composition durcissable, produit durci et matériau dentaire
WO2024029507A1 (fr) Kit pour préparation de composition durcissable, composition durcissable, objet durci, et produit dentaire
EP4056163A1 (fr) Composition d'adhésif dentaire excellente en stabilité au stockage

Legal Events

Date Code Title Description
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE

PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20230110

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

RAP3 Party data changed (applicant data changed or rights of an application transferred)

Owner name: MITSUI CHEMICALS, INC.

DAV Request for validation of the european patent (deleted)
DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20240624

RIC1 Information provided on ipc code assigned before grant

Ipc: C08F 22/10 20060101ALI20240619BHEP

Ipc: A61K 6/61 20200101ALI20240619BHEP

Ipc: A61K 6/887 20200101ALI20240619BHEP

Ipc: A61K 6/79 20200101ALI20240619BHEP

Ipc: A61K 6/70 20200101ALI20240619BHEP

Ipc: C08F 2/44 20060101ALI20240619BHEP

Ipc: C08F 4/00 20060101ALI20240619BHEP

Ipc: C08F 20/10 20060101AFI20240619BHEP