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EP3680930B1 - Speichersystem und reinigungsverfahren in einem speichersystem - Google Patents

Speichersystem und reinigungsverfahren in einem speichersystem Download PDF

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Publication number
EP3680930B1
EP3680930B1 EP18854967.9A EP18854967A EP3680930B1 EP 3680930 B1 EP3680930 B1 EP 3680930B1 EP 18854967 A EP18854967 A EP 18854967A EP 3680930 B1 EP3680930 B1 EP 3680930B1
Authority
EP
European Patent Office
Prior art keywords
shelf
controller
purge
nozzle
clean gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP18854967.9A
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English (en)
French (fr)
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EP3680930A4 (de
EP3680930A1 (de
Inventor
Tatsuo Tsubaki
Takashi Yamaji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Machinery Ltd
Original Assignee
Murata Machinery Ltd
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Publication date
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Publication of EP3680930A1 publication Critical patent/EP3680930A1/de
Publication of EP3680930A4 publication Critical patent/EP3680930A4/de
Application granted granted Critical
Publication of EP3680930B1 publication Critical patent/EP3680930B1/de
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
    • B65G1/02—Storage devices
    • B65G1/04—Storage devices mechanical
    • B65G1/137—Storage devices mechanical with arrangements or automatic control means for selecting which articles are to be removed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
    • B65G1/02—Storage devices
    • B65G1/04—Storage devices mechanical
    • B65G1/0407—Storage devices mechanical using stacker cranes
    • B65G1/0421—Storage devices mechanical using stacker cranes with control for stacker crane operations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67373—Closed carriers characterised by locking systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
    • B65G1/02—Storage devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0297—Wafer cassette
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67733—Overhead conveying

Definitions

  • the present invention which is defined by the appended claims, relates to a storage system, such as a purge stocker, and a purge method in the storage system.
  • Purge stockers have shelves and nozzles provided in the shelves; the nozzles are configured to be made in contact with valves in the bottoms of containers, such as FOUPs, stored on the shelves, and are configured to supply clean gas, such as nitrogen gas or clean dry air, into the containers.
  • containers such as FOUPs
  • Patent Document 1 JP4692584B
  • Patent Document 2 JP5557061B
  • Patent Document 2 JP5557061B
  • This purge stocker has a reduced consumption amount of clean gas, since the cleaning is carried out just in the shelf assigned for the unloading position and since the purge is triggered by the start of movement of the transport apparatus.
  • US 2014/017040 A1 teaches an article storage facility including a transport device for transporting containers to a plurality of storage sections.
  • An inactive gas feed section which supplies inactive gas to the interior of the container stored in the storage section, and a controller for controlling operation of the device and operation of the flow rate adjusting device of the inactive gas feed section are provided.
  • JP 2016 218603 A discloses a purge stocker comprising a control device which causes a purge device to start supplying purge gas. Supply of the purge gas is started after a container is placed on a storage rack or before the container is placed.
  • the object of the present invention is to provide a storage system and a purge method in the storage system, capable of fully cleaning nozzles before transferring containers to and on the corresponding shelves, with a reduced amount of clean gas consumption, and without phenomena such as delaying the transfer by the transport apparatus for waiting for the completion of the nozzle cleaning.
  • a storage system comprises: a plurality of shelves, respectively provided with at least one nozzle for supplying clean gas into containers; a plurality of flow amount controlling devices, respectively controlling supply amount of said clean gas to said at least one nozzle; at least one transport apparatus transferring said containers to and from said shelves; and a controller controlling said at least one transport apparatus and said flow amount controlling devices.
  • said controller is configured and programmed
  • a purge method uses a storage system comprising: a plurality of shelves, respectively provided with at least one nozzle for supplying clean gas into containers; a plurality of flow amount controlling devices, respectively controlling supply amount of said clean gas to said at least one nozzle; at least one transport apparatus transferring said containers to and from said shelves; and a controller controlling said at least one transport apparatus and said flow amount controlling devices.
  • the method according to the present invention comprises: unloading an incoming container on a shelf of the plurality of shelves at an unloading position, making an assignment of at least one shelf in preparation for storing a next incoming container immediately after the unloading of the incoming container is completed and before the occurrence of said next incoming container, by said controller; and supplying said clean gas to said at least one nozzle in said at least one shelf, based upon said assignment, wherein supply of the clean gas is started when the assignment of the shelf for the next incoming container is made and before the occurrence of said next incoming container.
  • said at least one shelf is assigned for storing the incoming container and the cleaning of the nozzle in the assigned shelf is started. Therefore, when the incoming container will arrive at the shelf, the nozzle will be fully cleaned. In addition, an enough time duration is present for the nozzle cleaning, and therefore, there arises no delay of transfer motion by the transport apparatus for unloading the incoming container to the shelf, due to waiting for the completion of the nozzle cleaning.
  • said storage system is a purge stocker and is further provided with an entrance and dispatch port
  • said at least one transport apparatus transports said incoming container between said entrance and dispatch port and said shelves
  • said controller is further configured and programmed to make said assignment of said at least one shelf in advance, before said incoming container will arrive at said entrance and dispatch port.
  • the assignment of the shelf, and the nozzle cleaning are commenced before the incoming container will arrive; and therefore, the nozzle is fully cleaned before the incoming container will arrive at the shelf.
  • said controller is further configured and programmed to control said one of said flow amount controlling devices to intermittently supply said clean gas to said at least one nozzle in said at least one shelf.
  • said controller is further configured and programmed to control said one of said flow amount controlling devices to intermittently supply said clean gas to said at least one nozzle in said at least one shelf.
  • said at least one transport apparatus is provided with a transfer device entering into and unloading said incoming container on said shelves, and said controller is further configured and programmed to control said one of said flow amount controlling devices to supply a larger flow amount of said clean gas to said at least one nozzle, from when said transfer device starts advancement towards said at least one shelf and until completing unloading of said incoming container, than an amount before said transfer device starts advancement. Then, not only the nozzle but also the bottom (abutting the nozzle) of the incoming container held by the transfer device are made clean .
  • Figs. 1-8 indicate a purge stocker 2 according to an embodiment.
  • the purge stocker 2 is provided within a clean room and so on, and stores containers for semiconductor wafers, reticles, and so on.
  • the purge stocker 2 is shut off from outside atmosphere by a wall 4, and the wall 4 is provided with a door 5.
  • the purge stocker 2 is provided with a transport apparatus 6 and a plurality of shelves 14; the transport apparatus 6 is, for example, a stacker crane, but the species of the transport apparatus 6 is arbitrary.
  • the transport apparatus 6 has a running vehicle 7 that runs on a rail 11 and supports a mast 8, and a carriage 9 elevates and lowers along the mast 8.
  • the carriage 9 in the transport apparatus 6 is provided with a transfer device 10, such as a SCARA arm, a sliding fork, and so on, for transferring a container 16 between a shelf 14.
  • a transfer device 10 such as a SCARA arm, a sliding fork, and so on
  • the container 16 is a FOUP which stores semiconductor wafers and is provided with a valve in the bottom portion that receives clean gas from a nozzle in the shelf 14, and thus, the inside of the container is kept clean.
  • the species of the container 16 is arbitrary, as long as the container 16 is configured to be purged by clean gas blown into from a nozzle of a shelf 14.
  • Fig. 2 indicates the shelves 14.
  • the shelf 14 is provided with a shelf support 18 having an opening 17; the transport apparatus 10 enters the arm, fork, or the like, into the opening 17 and transfers a FOUP 16 between the shelf 14.
  • Each of the shelves 14 has three pins 19 and these pins 19 are coupled with grooves in the bottom of FOUP 16 and position the FOUP 16.
  • a pair of or one purge nozzle 20 is provided and the purge nozzle 20 supplies clean gas such as nitrogen or clean dry air into a FOUP 16 supported on the shelf support 18.
  • the shelf support 18 is further provided with a load sensor 21; the load sensor 21 detects whether a FOUP 16 is present or absent on the corresponding shelf 14.
  • An MFC 22 (mass flow controller, an example of flow amount controlling device) supplies clean gas through a pipe 23 to the purge nozzle 20 (hereinafter, may be simply referred to as "nozzle 20" or “nozzle”).
  • the shelf 14 may be provided further with an exhaust nozzle for evacuating the atmosphere in a FOUP 16, and so on in addition to the purge nozzle 20.
  • an MFC 22 is provided for each shelf 14 so that the flow amount of clean gas from a nozzle 20 is controlled for each shelf 14.
  • a common MFC 22 for a column or a row may be provided so that the total flow amount of clean gas for the column or the row is controlled.
  • Fig. 3 indicates the control system for the purge stocker 2.
  • a stocker controller 30 is the top-level controller in the purge stocker 2 and communicates with a transport controller 32 that controls the transport apparatus 6, in particular, the running motor 33, the elevation motor 34, and the transfer device10, and also with a purge controller 36 that controls the MFCs 22.
  • the stocker controller 30 also communicates with an outside controller 38 and so on, and assigns a shelf 14 for an unloading position for an incoming FOUP 16, when informed that the incoming FOUP 16 shall be entered in. Further, when the incoming FOUP 16 arrives at an entrance and dispatch port, not shown in the drawings, the stocker controller 30 instructs the transport controller 32 to unload the incoming FOUP 16 on the shelf 14 designated as the unloading position.
  • the stocker controller 30 determines a shelf 14 as the next unloading position, in advance and in preparation for the occurrence of a next incoming FOUP 16 to be entered, when the above unloading job of the incoming FOUP 16 is completed. Namely, the stocker controller 30 assigns in advance one shelf 14 for the next unloading position, in preparation for the storage of the next incoming FOUP 16.
  • the stocker controller 30 designates, to the transport controller 32, the shelf 14 where the FOUP 16 to be dispatched is stored and instructs it to load the FOUP 16 at the designated shelf 14 and to transport to the entrance and dispatch port.
  • a port for both entrance and dispatch may be provided, or an entrance port and a separate dispatch port may be provided.
  • the stocker controller 30 has a memory that stores a file such as a shelf file 31; the memory stores the status of each shelf 14 comprising: "empty”, “empty but assigned for an incoming or next incoming container", "storing a container”, “storing a container assigned to dispatch”, etc.
  • a file such as a shelf file 31
  • the memory stores the status of each shelf 14 comprising: "empty”, “empty but assigned for an incoming or next incoming container", "storing a container”, “storing a container assigned to dispatch”, etc.
  • Physically one controller may form all of the controllers 30, 32, and 36, or each of the controllers 30, 32, and 36 may comprise plural computers.
  • the purge controller 36 controls the MFC 22 to carry out storage purge (purge for maintaining the cleanliness in a FOUP 16) when it detects that a FOUP 16 was unloaded on a shelf 14, by a signal from a load sensor 21. Further, when the purge controller 36 is informed, by the stocker controller 30, that a shelf 14 is assigned for a next incoming FOUP 16, before the actual occurrence of the next incoming FOUP 16 (immediately after the completion of a preceding entrance job), in preparation for the entrance job of the next incoming FOUP 16, the purge controller 36 carries out nozzle purge (purge for cleaning a nozzle 20) in the assigned shelf 14 so that the nozzle 20 in the assigned shelf 14 is cleaned.
  • storage purge purge for maintaining the cleanliness in a FOUP 16
  • the purge controller 36 when the purge controller 36 is informed, through the transport controller 32 and the stocker controller 30, that the arm, the fork, or the like of the transfer device 10 is advancing towards the shelf 14 for unloading, or the similar event, the purge controller 36 carries out bottom purge (purge for cleaning the bottom portion of a FOUP 16 facing a nozzle 20) for cleaning the bottom portion (inlet portion of clean gas in the bottom) of the incoming FOUP 16.
  • the bottom purge may be omitted.
  • the purge controller 36 may carry out the storage purge according to an information, via the stocker controller 30 from the transport controller 32, that the entrance job of the incoming FOUP 16 to the shelf 14 has been completed, rather than carrying out the storage purge according to the signal from the load sensor 21.
  • Fig. 4 indicates the purge algorithm for a FOUP 16 according to the embodiment.
  • the purge controller 36 starts the nozzle purge for the assigned shelf 14 (S1).
  • the purge controller 36 changes the nozzle purge to the bottom purge (S2).
  • the bottom purge may be omitted.
  • the purge controller 36 may start the bottom purge.
  • the purge controller 36 recognizes that the FOUP 16 has been unloaded on the shelf 14, by a signal from the load sensor 21, the transport controller 32, etc. (e3), the purge controller 36 carries out the storage purge (S3).
  • the status of the shelf 14 returns to the empty status, and no further purge is necessary until it will be assigned for a next incoming FOUP.
  • Fig. 5 indicates a standard purge pattern.
  • the purge controller 36 starts the nozzle purge for the assigned shelf 14.
  • the nozzle purge is carried out intermittently; in other words, clean gas is repetitively discharged as pulses for a short duration from the nozzle 20.
  • the solid line in Fig. 6 indicates the flow amount pattern of the clean gas according to the embodiment.
  • the chain line in Fig. 6 indicates a constant flow amount pattern of the clean gas for the same total flow amount.
  • the velocity of the clean gas is increased and the pressure around the nozzle 20 is fluctuated due to the on and off of the clean gas flow, and therefore, the nozzle is more efficiently cleaned than when the clean gas is discharged at a constant and small flow amount.
  • the discharge duration and the discharge amount of the clean gas for one discharge pulse may be constant or not constant.
  • the clean gas may be discharged for a relatively longer duration so that the nozzle 20 is cleaned and then, the clean gas may be repetitively discharged for relatively shorter duration for preventing the recontamination of the nozzle 20.
  • the flow amount of the clean gas may be changed in such a way that, initially, at a relatively larger flow amount, the nozzle purge is performed and then the nozzle purge is performed at a relatively smaller flow amount.
  • the start of the advancement of the arm, the fork, or the like of the transfer device 10, and also the start of lowering of the arm, the fork, or the like, indicate the presence of a FOUP 16 over the shelf 14. Therefore, at the time when the arm, the fork, or the like of the transfer device 10 starts to advance, or at the time when they start to lower, clean gas is discharged, for example continuously, at a relatively larger flow amount from the nozzle 20.
  • This process is called bottom purge, and its flow amount pattern is indicated in Fig. 7 .
  • the bottom purge may be omitted.
  • the discharge of clean gas from the nozzle 20 may be made on and off so that pulsation of clean gas flow is applied to the input valve and its neighborhood.
  • the purge controller 36 carries out the storage purge that replaces the atmosphere in the FOUP 16 by clean gas.
  • the purge controller 36 starts the purge of the nozzle 20, and therefore, the purge is carried out for an enough long duration.
  • the purge controller 36 starts the purge of the nozzle 20, and therefore, the purge is carried out for an enough long duration.
  • the intermittent nozzle purge makes the nozzle cleaner, efficiently with a small total flow amount.
  • Fig. 9 indicates a clean gas flow amount pattern for one group of shelves according to a modification where plural shelves 14 are controlled as one group. This modification is suitable for a case where a common MFC 22 is provided for a column or a row of shelves as a unit.
  • the purge controller 36 starts the nozzle purge in all shelves 14 within the group. Further, when the transport apparatus 6 starts the transfer of the FOUP 16 to the assigned shelf 14 for unloading, the purge controller 36 increases the flow amount of the clean gas so that the bottom portion of the FOUP 16 is purged.
  • the stocker controller 30 assigns the empty shelf for a next incoming FOUP 16.
  • the storage purge is carried out for the unloaded FOUP 16 so that the atmosphere in the FOUP 16 is substituted by the clean gas.
  • the purge controller 36 restarts the nozzle purge.
  • Fig. 10 indicates an embodiment where an overhead transport system is used as the storage system.
  • a plurality of overhead transport vehicles 42 run, and there are provided a plurality of buffers 44 for storing temporarily FOUPs, along the running rail 40.
  • the buffers 44 may have one or plural shelves 45 per buffer.
  • a system controller 46 controls the entire overhead transport system, communicates with an outside controller, and receives transport requests of FOUPs from the outside controller.
  • the buffer 44 is provided with a nozzle 20 in each shelf 45, and a purge controller 48 controls an MFC 22 so as to regulate the supply of clean gas to the nozzle 20.
  • the system controller 46 assigns an empty buffer 44 for temporarily storing a FOUP in advance, when it is required to transport a FOUP from an outside controller, or spontaneously without waiting for the request from the outside controller. Then, the system controller 46 instructs the purge controller 48 in the assigned empty buffer 44 to start the nozzle purge. Further, if the entrance of a transfer device of an overhead transport vehicle 42 over the shelf 45 is detectable, the purge controller 48 carries out the bottom purge.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)

Claims (8)

  1. Ein Speichersystem, das folgende Merkmale aufweist:
    eine Mehrzahl von Fächern (14), die jeweils mit zumindest einer Düse (20) versehen sind, die konfiguriert ist, Reingas in Behälter (16) zuzuführen;
    eine Mehrzahl von Flussbetragssteuervorrichtungen (22), die jeweils konfiguriert sind, einen Zuführbetrag des Reingases in die zumindest eine Düse (20) zu steuern;
    zumindest eine Transportvorrichtung (6), die konfiguriert ist, die Behälter (16) zu und von den Fächern (14) zu übertragen; und
    eine Steuerung (30,32,36), die konfiguriert ist, die zumindest eine Transportvorrichtung (6) und die Flussbetragssteuervorrichtungen (22) zu steuern,
    wobei die Steuerung (30,32,36) konfiguriert und programmiert ist zum
    Abladen eines ankommenden Behälters (16) auf einem Fach (14) der Mehrzahl von Fächern (14) an einer Abladeposition,
    Vornehmen einer Zuweisung von zumindest einem Fach, in Vorbereitung zum Speichern eines nächsten ankommenden Behälters (16), unmittelbar nachdem das Abladen des ankommenden Behälters (16) abgeschlossen ist und vor dem Erscheinen des nächsten ankommenden Behälters (16) und
    Steuern von einer der Flussbetragssteuervorrichtungen (22), um basierend auf der Zuweisung das Reingas der zumindest einen Düse (20) in dem zumindest einen Fach (14) zuzuführen,
    wobei eine Zufuhr des Reingases begonnen wird, wenn die Zuweisung des Fachs für den nächsten ankommenden Behälter (16) vorgenommen ist und vor dem Erscheinen des nächsten ankommenden Behälters (16).
  2. Das Speichersystem gemäß Anspruch 1, wobei das Speichersystem ein Spülbefüller (2) ist und ferner mit einem Eingangs- und Ausgabetor versehen ist,
    wobei die zumindest eine Transportvorrichtung (6) konfiguriert ist, die Behälter (16) zwischen dem Eingangs- und Ausgabetor und den Fächern (14) zu transportieren und
    wobei die Steuerung (30) ferner konfiguriert und programmiert ist, die Zuweisung des zumindest einen Fachs (14) im Voraus vorzunehmen, bevor der ankommende Behälter (16) an dem Eingangs- und Ausgabetor ankommt.
  3. Das Speichersystem gemäß Anspruch 1 oder 2, bei dem die Steuerung (36) ferner konfiguriert und programmiert ist, die eine der Flussbetragssteuervorrichtungen (22) zu steuern, um das Reingas intermittierend der zumindest einen Düse (20) in dem zumindest einen Fach (14) zuzuführen.
  4. Das Speichersystem gemäß einem der Ansprüche 1 bis 3, bei dem die zumindest eine Transportvorrichtung (6) mit einer Übertragungsvorrichtung (10) versehen ist, die konfiguriert ist, in den ankommenden Behälter (16) auf den Fächern (14) einzutreten und denselben abzuladen und
    wobei die Steuerung (36) ferner konfiguriert und programmiert ist, die eine der Flussbetragssteuervorrichtungen (22) zu steuern, um der zumindest einen Düse (20) von dem Zeitpunkt ab, zu dem die Übertragungsvorrichtung (6) die Vorbewegung zu dem zumindest einen Fach (14) beginnt und bis das Abladen des ankommenden Behälters (16) abgeschlossen ist, einen Flussbetrag des Reingases zuzuführen, der größer ist als ein Betrag, bevor die Übertragungsvorrichtung (6) eine Vorbewegung beginnt.
  5. Das Speichersystem gemäß Anspruch 4, bei dem die Steuerung (36) ferner konfiguriert ist, eine Speicherspülung durchzuführen, zum Beibehalten der Sauberkeit in einem Behälter, wenn die Steuerung (36) erkennt, dass der Behälter (16) auf das Fach (14) abgeladen wurde.
  6. Ein Spülverfahren in einem Speichersystem, das folgende Merkmale aufweist: eine Mehrzahl von Fächern (14), die jeweils mit zumindest einer Düse (20) versehen sind, die konfiguriert ist, Reingas in Behälter (16) zuzuführen; eine Mehrzahl von Flussbetragssteuervorrichtungen (22), die jeweils konfiguriert sind, einen Zuführbetrag des Reingases in die zumindest eine Düse (20) zu steuern; zumindest eine Transportvorrichtung (6), die konfiguriert ist, die Behälter (16) zu und von den Fächern (14) zu übertragen; und eine Steuerung (30,32,36), die konfiguriert ist, die zumindest eine Transportvorrichtung (6) und die Flussbetragssteuervorrichtungen (22) zu steuern, wobei das Verfahren folgende Schritte aufweist:
    Abladen eines ankommenden Behälters (16) auf einem Fach (14) der Mehrzahl von Fächern (14) in einer Abladeposition,
    Vornehmen einer Zuweisung von zumindest einem Fach (14) durch die Steuerung (30), in Vorbereitung zum Speichern eines nächsten ankommenden Behälters (16) unmittelbar nachdem das Abladen des ankommenden Behälters (16) abgeschlossen ist und vor dem Erscheinen des nächsten ankommenden Behälters (16) und
    Zuführen des Reingases zu der zumindest einen Düse (20) in dem zumindest einen Fach (14) basierend auf der Zuweisung,
    wobei eine Zufuhr des Reingases begonnen wird, wenn die Zuweisung des Fachs für den nächsten ankommenden Behälter (16) vorgenommen ist und vor dem Erscheinen des nächsten ankommenden Behälters (16).
  7. Das Spülverfahren gemäß Anspruch 6, bei dem die zumindest eine Transportvorrichtung (6) mit einer Übertragungsvorrichtung (10) versehen ist, die konfiguriert ist, in den ankommenden Behälter (16) auf den Fächern (14) einzutreten und denselben abzuladen, wobei das Verfahren ferner ein Steuern der einen der Flussbetragssteuervorrichtungen (22) durch die Steuerung (36) aufweist, um der zumindest einen Düse (20) von dem Zeitpunkt ab, zu dem die Übertragungsvorrichtung (6) eine Vorbewegung zu dem zumindest einen Fach (14) beginnt und bis das Abladen des ankommenden Behälters (16) abgeschlossen ist, einen Flussbetrag des Reingases zuzuführen, der größer ist als ein Betrag, bevor die Übertragungsvorrichtung eine Vorbewegung beginnt.
  8. Das Spülverfahren gemäß Anspruch 7, das ferner folgenden Schritt aufweist, durchgeführt durch die Steuerung (36): Ausführen einer Speicherspülung zum Beibehalten der Sauberkeit in einem Behälter, wenn die Steuerung (36) erkennt, dass der Behälter (16) auf das Fach (14) entladen wurde.
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