EP3310146A1 - Substrate work machine and recognition method - Google Patents
Substrate work machine and recognition method Download PDFInfo
- Publication number
- EP3310146A1 EP3310146A1 EP15894974.3A EP15894974A EP3310146A1 EP 3310146 A1 EP3310146 A1 EP 3310146A1 EP 15894974 A EP15894974 A EP 15894974A EP 3310146 A1 EP3310146 A1 EP 3310146A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- hole
- section
- insertion hole
- movable section
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 14
- 239000000758 substrate Substances 0.000 title 1
- 238000003384 imaging method Methods 0.000 claims description 18
- 238000003780 insertion Methods 0.000 abstract description 83
- 230000037431 insertion Effects 0.000 abstract description 83
- WABPQHHGFIMREM-OIOBTWANSA-N lead-204 Chemical compound [204Pb] WABPQHHGFIMREM-OIOBTWANSA-N 0.000 description 11
- 238000010276 construction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0473—Cutting and clinching the terminal ends of the leads after they are fitted on a circuit board
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/0006—Industrial image inspection using a design-rule based approach
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30164—Workpiece; Machine component
Definitions
- the present invention relates to a board work machine provided with a cutting device for cutting a lead of a leaded component, and to a recognition method for recognizing the position of a through-hole into which a lead of the cutting device is to be inserted.
- a cutting device for cutting a lead of a leaded component for example, is provided with a fixed section in which a first through-hole is formed, and a movable section that slides with respect to the fixed section and in which is formed a second through-hole that overlaps the first through-hole.
- the lead is cut by being inserted into the overlapping first through-hole and second through-hole, and then the movable section being slid.
- An object of the present invention is to appropriately cut a lead.
- a board work machine of the present invention is a board work machine including: a cutting device provided with (A) a fixed section in which is formed a first through-hole and (B) a movable section configured to slide with respect to the fixed section and in which is formed a second through-hole configured to overlap the first through-hole, the cutting device being configured to cut a lead of a leaded component by the lead being inserted into the first through-hole and second through-hole that are in an overlapping state and the movable section being slid; a moving device configured to move the cutting device; and a recognition device configured to recognize a position of an upper through-hole that is an upper-positioned through-hole of the first through-hole and the second through-hole that are in the overlapping state, based on image data of one of the fixed section and the movable section in which the uppermost through-hole is formed.
- a recognition method of the present invention is a recognition method for, in a cutting device provided with (A) a fixed section in which is formed a first through-hole and (B) a movable section configured to slide with respect to the fixed section and in which is formed a second through-hole configured to overlap the first through-hole and configured to cut a lead of a leaded component by the lead being inserted into the first through-hole and second through-hole that are in an overlapping state and the movable section being slid, recognizing a position of an upper through-hole that is an upper-positioned through-hole of a first through-hole and a second through-hole that are in the overlapping state, the recognition method including: imaging of the one of the fixed section and the movable section in which the upper through-hole is formed; and recognizing the position of the upper through-hole based on image data obtained by the imaging.
- a position of an upper through-hole that is one of the first through-hole and the second through-hole that overlap is recognized based on image data of the one of the fixed section and the movable section in which the upper through-hole is formed.
- Fig. 1 shows component mounter 10.
- Component mounter 10 performs work of mounting components on circuit board 12.
- Component mounter 10 is provided with device main body 20, board conveying and holding device 22, component mounting device 24, mark camera 26, component camera 28, component supply device 30, loose component supply device 32, cut and clinch device (refer to fig. 3 ) 34, and control device (refer to fig. 8 ) 36.
- circuit board 12 include circuit boards and boards with a three-dimensional construction, examples of a circuit board being a printed wiring board or a printed circuit board.
- Device main body 20 is configured from frame section 40 and beam section 42 that is mounted on the frame section 40.
- Board conveying and holding device 22 is positioned centrally inside frame section 40 in the front-rear direction, and includes conveyance device 50 and clamp device 52.
- Conveyance device 50 conveys circuit board 12, and clamp device 52 holds circuit board 12.
- board conveying and holding device 22 conveys circuit board 12 and fixedly holds circuit board 12 at a specified position.
- the conveyance direction of circuit board 12 is referred to as the X direction
- the direction horizontally perpendicular to the X direction is referred to as the Y direction
- the vertical direction is referred to as the Z direction. That is, the width direction of component mounter 10 is the X direction, and the front-rear direction is the Y direction.
- Component mounting device 24 is provided on beam section 42, and includes work heads 60 and 62 and work head moving device 64. As shown in fig. 2 , suction nozzle 66 is provided on a lower surface of each work head 60 and 62, with a component being picked up and held by the suction nozzle 66. Further, work head moving device 64 includes X-direction moving device 68, Y-direction moving device 70, and Z-direction moving device 72. Work heads 60 and 62 are moved together to any position on frame 40 by X-direction moving device 68 and Y-direction moving device 70.
- work heads 60 and 62 are detachably attached to sliders 74 and 76 respectively, and Z-direction moving device 72 moves sliders 74 and 76 in a vertical direction individually. That is, work heads 60 and 62 are moved in a vertical direction individually by Z-direction moving device 72.
- Mark camera 26 is attached to slide 74 in a state facing downwards, and is moved in the X direction, Y direction, and Z direction together with work head 60. Thus, mark camera 26 images any position on frame section 40. As shown in fig. 1 , component camera 28 is provided in a state facing upwards on frame section 40 between board conveying and holding device 22 and component supply device 30. Thus, component camera 28 images a component held by suction nozzle 66 of work heads 60 or 62.
- Component supply device 30 is provided at an end of frame section 40 in the front-rear direction.
- Component supply device 30 includes tray-type component supply device 78 and feeder-type component supply device (refer to fig. 8 ) 80.
- Tray-type component supply device 78 supplies components in a state arranged in a tray.
- Feeder-type component supply 80 device supplies components via a tape feeder or stick feeder (not shown).
- Loose component supply device 32 is provided at the other end of frame section 40 in the front-rear direction. Loose component supply device 32 lines up multiple components that are in a scattered state, and supplies the components in a lined-up state. That is, this device arranges multiple components that have random orientations to have a specified orientation and supplies the components in the specified orientation.
- components supplied by component supply device 30 and loose component supply device 32 may include electronic circuit components, configuration components of solar panels, configuration components of power modules, and the like. Also, electronic circuit components include components with leads and components without leads.
- Cut and clinch device 34 is arranged below conveyance device 50 and, as shown in fig. 3 , includes cut and clinch unit 100 and unit moving device 102.
- cut and clinch unit 100 includes unit main body 110, pair of slide bodies 112, and pitch changing mechanism 114.
- slide rail 116 is arranged extending in the X direction.
- the pair of slide bodies 112 is supported by slide rail 116 so as to be movable.
- pitch changing mechanism 114 includes electromagnetic motor 118, and the distance between the pair of slide bodies 112 can be controllably changed by operation of electromagnetic motor 118.
- each of the pair of slide bodies 112 includes main body section 120, movable section 122, and slide device 124, and is supported at main body section 120 so as to be slidable on slide rail 116.
- Two slide rails 126 are fixed to the rear side of main body section 120 extending in the X direction, and movable section 122 is slidably supported by those two slide rails 126.
- slide device 124 includes electromagnetic motor (refer to fig. 8 ) 128, and movable section 122 is controllably slid by operation of electromagnetic motor 128.
- first insertion hole 130 is formed so as to pierce the upper end section in a vertical direction.
- First insertion hole 130 is open at an upper end to an upper end surface of main body section 120, and is open at a lower end to a side surface of main body section 120.
- the edge of first insertion hole 130 that opens to the upper end surface of main body section 120 is formed as fixed blade 131 (refer to fig. 9 ). Also, below where first insertion hole 130 opens to a side surface of main body section 120, discard box 132 is provided.
- an upper end section of movable section 122 is also formed tapered towards the end, and L-shaped curved section 133 is formed at the upper end section of movable section 122.
- Curved section 133 extends upwards of the upper end surface of main body section 120, and there is slight clearance between curved section 133 and the upper end of main body section 120.
- first insertion hole 130 that opens at the upper end surface of main body section 120 is covered by curved section 133, and second insertion hole 136 is formed in curved section 133 so as to face first insertion hole 130.
- Second insertion hole 136 pierces through curved section 133 in a vertical direction, and an internal surface of second insertion hole 136 is a tapered surface configured with a diameter that gets smaller going down.
- the internal surface of first insertion hole 130 approaching the opening to the upper end surface of main body section 120 is not a tapered surface, the internal surface of insertion hole 130 approaching the opening has an approximately regular diameter.
- the edge of second insertion hole 136 that opens to the lower end surface of curved section 133 is formed as movable blade 138 (refer to fig. 9 ).
- guide groove 140 is formed in the upper end surface of curved section 133 extending in the X-axis direction.
- Guide groove 140 is formed to straddle the opening of second insertion hole 136, and guide groove 140 and second insertion hole 136 are linked.
- movable section 122 is configured from first section 144 and second section 146.
- First section 144 configures a lower side portion of movable section 122, and as shown in fig. 5 , is slidably supported by slide rail 126.
- second section 146 configures an upper side portion of movable section 122, and includes curved section 133.
- Second section 146 and first section 144 are connected by bolts, and as shown in fig. 7 , it is possible to remove second section 146 from first section 144 by removing the bolts.
- unit moving device 102 includes X-direction moving device 150, Y-direction moving device 152, Z-direction moving device 154, and rotating device 156.
- X-direction moving device 150 includes slide rail 160 and X slider 162.
- Slide rail 160 extends in the X direction, and X slider 162 is slidably supported on X slide rail 160.
- X slider 162 moves in the X direction by the driving of electromagnetic motor 164 (refer to fig. 8 ).
- Y-direction moving device 152 includes slide rail 166 and Y slider 168.
- Slide rail 166 is arranged on X slider 162 extending in the Y direction, and Y slider 168 is slidably supported on slide rail 166.
- Y slider 168 moves in the Y direction by the driving of electromagnetic motor 170 (refer to fig. 8 ).
- Z-direction moving device 154 includes slide rail 172 and Z slider 174.
- Slide rail 172 is arranged on Y slider 168 extending in the Z direction, and Z slider 174 is slidably supported on slide rail 172.
- Z slider 174 moves in the Z direction by the driving of electromagnetic motor 176 (refer to fig. 8 ).
- rotating device 156 includes rotating table 178 that is roughly disc-shaped.
- Rotating table 178 is supported by Z slider 174 so as to be rotatable around its own center, and is rotated by the driving of electromagnetic motor 180 (refer to fig. 8 ).
- Cut and clinch unit 100 is arranged on rotating table 178. According to such a configuration, cut and clinch unit 100 can be moved to any position by X-direction moving device 150, Y-direction moving device 152, and Z-direction moving device 154, and can be rotated to any angle by rotating device 156.
- second insertion hole 136 of cut and clinch unit 100 can be positioned at any position under circuit board 12 held by clamp device 52.
- control device 38 is provided with controller 190, multiple drive circuits 192, and image processing device 196.
- the multiple drive circuits 192 are connected to conveyance device 50, clamp device 52, work heads 60 and 62, work head moving device 64, tray type component supply device 78, feeder type component supply device 80, loose component supply device 32, and electromagnetic motors 118, 128, 164, 170, 176, and 180.
- Controller 190 is provided with a CPU, ROM, RAM, and so on, is formed mainly from a computer, and is connected to the multiple drive circuits 192. By this, operation of board conveying and holding device 22, component mounting device 24, and so on is controlled by controller 190. Further, controller 190 is also connected to image processing device 196.
- Image processing device 196 is for processing image data acquired by mark camera 26 and component camera 28, and controller 190 acquires various information from the image data.
- Component mounter 10 mounts components on circuit board 12 held by board conveying and holding device 22. With component mounter 10, it is possible to mount various components to circuit board 12; descriptions are given below of a case in which components with leads (hereinafter also referred to as “leaded component”) are mounted on circuit board 12.
- circuit board 12 is conveyed to a work position, and is fixedly held at that position by clamp device 52.
- mark camera 26 moves above circuit board 12 and images circuit board 12.
- component supply device 30 or loose component supply device 32 supplies components at a specified supply position.
- One of the work heads 60 or 62 moves above the component supply position and holds a component using suction nozzle 66.
- leaded component 200 is configured from component main body section 202, and two leads 204 protruding from the bottom surface of component main body section 202. Leaded component 200 is picked up and held by a suction nozzle 66 on component main body section 202.
- work head 60 or 62 holding leaded component 200 is moved above component camera 28, and leaded component 200 held by suction nozzle 66 is imaged by component camera 28. Accordingly, information related to the holding position of the component is obtained.
- work head 60 or 62 holding leaded component 200 moves above circuit board 12, and corrects the error in the holding position of circuit board 12 and the error in the holding position of the component and so on.
- the two leads 204 of leaded component 200 held by suction nozzle 66 are inserted into two through-holes 208 formed in circuit board 12.
- cut and clinch unit 100 is moved below circuit board 12.
- Cut and clinch unit 100 is moved such that coordinates in the XY directions of second insertion hole 136 of movable section 122 and coordinates in the XY directions of through-holes 208 of circuit board 12 match, the upper surface of movable section 122 and the lower surface of circuit board 12 do not contact each other, and the upper surface of movable section 122 is slightly below the lower surface of circuit board 12.
- the distance between the pair of slide bodies 112 is adjusted by pitch changing mechanism 114 such the distance between the pair of second insertion holes 136 of movable section 122 of slide body 122 is the same as the distance between the two through-holes 208 formed in circuit board 12. And, by operation of unit moving device 102, cut and clinch unit 100 is moved in the XYZ directions and rotated.
- leads 204 of leaded component 200 held by suction nozzle 66 are inserted into through-holes 208 of circuit board 12, as shown in fig. 9 , the end section of leads 204 is inserted into first insertion hole 130 of main body section 120 through second insertion hole 136 of movable section 122 of cut and clinch unit 100.
- second insertion hole 136 positioned below through-hole 208 is tapered, even in a case in which lead 204 is bent slightly, it is possible to ensure that the tip section of lead 204 appropriately enters second insertion hole 136.
- movable section 122 is slid by operation of slide device 124.
- lead 204 is cut by fixed blade 131 of first insertion hole 130 and movable blade 138 of second insertion hole 136.
- the tip section separated by the cutting of lead 204 falls inside first insertion hole 130 and is discarded in discard box 132.
- the new tip section formed by the cutting of lead 204 is bent along the tapered surface of the inside of second insertion hole 136 in accordance with the sliding of movable section 122, and the tip section of lead 204 is bent along guide groove 140 by the further sliding of movable section 122.
- leaded 200 component is mounted into circuit board 12 in a state in which leads 204 are prevented from coming out of through-holes 208.
- leaded component 200 is mounted into circuit board 12 by lead 204 being cut and bent by cut and clinch device 34.
- second insertion hole 136 into which lead 204 is inserted during cutting by cut and clinch device 34 is relatively small. Therefore, to insert lead 204 appropriately into second insertion hole 136, before moving cut and clinch unit 100 as above, it is necessary to appropriately recognize the opening position of second insertion hole 136 and to perform calibration. Thus, for example, it may be considered to image the opening of second insertion hole 136 using mark camera 26, and to recognize the opening position of second insertion hole 136 based on the image.
- second insertion hole 136 because the internal surface of second insertion hole 136 is tapered, it is not possible to appropriately image the opening of second insertion hole 136 due to reflection of light from the tapered surface during imaging. Therefore, it is not possible to appropriately recognize the opening position of second insertion hole 136 by imaging the opening of second insertion hole 136.
- second section 146 of movable section 122 can be removed from first section 144 by removing bolts.
- Mark camera 26 may be moved above this exposed opening of first insertion hole 130, and the opening of first insertion hole 130 may be imaged using mark camera 26.
- the internal surface of the opening section of first insertion hole 130 is not a tapered surface, the opening section of insertion hole 130 has an approximately regular diameter.
- problems arising due to reflection and so on from the tapered surface during imaging do not occur, and the opening of first insertion hole 130 can be appropriately imaged.
- the opening position of first insertion hole 130 is recognized based on the image data.
- first insertion hole 130 and second insertion hole 136 overlap in the vertical direction in a state that virtually matches, the opening position of first insertion hole 130 can be recognized as the opening position of second insertion hole 136. In this manner, by imaging first insertion hole 130, it is possible to recognize the opening position of second insertion hole 136.
- first insertion hole 130 it is necessary to remove second section 146 of movable section 122 from first section 144, which puts a load on an operator. Therefore, with cut and clinch device 34, a recognition mark is provided on bent section 133 of movable section 122, and the opening position of second insertion hole 136 is recognized by imaging this recognition mark.
- a pair of recognition marks 210 are provided on an upper surface of bent section 133 of movable section 122. These pair of recognition marks 210 are provided centered around the center of the opening of second insertion hole 136. That is, the center point of the pair of recognition marks 210 is the center of the opening of second insertion hole 136. Also, because recognition marks are provided at a position different to second insertion hole 136 and guide groove 140, it is possible to appropriately image recognition marks 210 using mark camera 26. Therefore, by imaging the pair of recognition marks 210 using mark camera 26, the position of the pair of recognition marks is recognized based on the image data. And, the center position of the pair of recognition marks 210 is calculated, and that position is recognized as the opening position of second insertion hole 136. By this, it is possible to appropriately recognize the opening position of second insertion hole 136.
- the opening position of second insertion hole 136 is recognized by providing a recognition mark on bent section 133 of movable section 122, and recognizing the opening position of second insertion hole 136 by imaging this recognition mark.
- controller 190 of control device 38 includes imaging section 220 and recognition section 222.
- Imaging section 220 is a functional section for imaging recognition mark 210 using mark camera 26.
- Recognition section 222 is a functional section for recognizing the opening position of second insertion hole 136.
- Component mounter 10 is an example of a board work machine.
- Cut and clinch device 34 is an example of a cutting device.
- Control device 38 is an example of a recognition device.
- Unit moving device 102 is an example of a moving device.
- Main body section 120 is an example of a fixed section.
- Movable section 122 is an example of a movable section.
- First insertion hole 130 is an example of a first through-hole.
- Second insertion hole 136 is an example of a second through-hole and an upper through-hole.
- Leaded component 200 is an example of a leaded component.
- Lead 204 is an example of a lead.
- Recognition mark 210 is an example of a recognition mark.
- a process performed by imaging section 220 is an example of an imaging process.
- a process performed by recognition section 222 is an example of a recognition process. Note that, cutting may be performed by either one of the fixed section provided with the first through-hole or the movable section provided with the second through-hole moving, or by both the fixed section provided with the first through-hole and the movable section provided with the second through-hole moving. Also, either the fixed section or the movable section may be positioned above the other.
- a pair of recognition marks 210 are provided on movable section 122, and the opening position of second insertion hole 136 is recognized using the pair of recognition marks 210; however, one recognition mark may be provided on movable section 122, and the opening position of second insertion hole 136 may be recognized using the single recognition mark.
- movable section 122 is provided above main body section 120, and the opening position of second insertion hole 136 of movable section 122 is recognized using a recognition mark; however, main body section 120 may be provided above movable section 122, and the opening position of first insertion hole 130 of main body section 120 may be recognized using the recognition mark.
- the internal surface of first insertion hole 130 must be tapered, and a recognition mark must be provided on main body section 120.
- recognition mark 210 is imaged automatically by mark camera 26, but the position of second insertion hole 136 may be recognized and a correction value or the like for calibration may be acquired by an operator moving mark camera 26 manually and imaging recognition mark 210.
- 10 component mounter (board work machine); 34: cut and clinch device (cutting device); 38: control device (recognition device); 102: unit moving device (moving device); 120: main body section (fixed section); 122: movable section; 130: first insertion hole (first through-hole); 136: second insertion hole (second through-hole) (upper through hole); 200: lead; 204: leaded component; 210: recognition mark
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Quality & Reliability (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
- The present invention relates to a board work machine provided with a cutting device for cutting a lead of a leaded component, and to a recognition method for recognizing the position of a through-hole into which a lead of the cutting device is to be inserted.
- A cutting device for cutting a lead of a leaded component, for example, is provided with a fixed section in which a first through-hole is formed, and a movable section that slides with respect to the fixed section and in which is formed a second through-hole that overlaps the first through-hole. Thus, the lead is cut by being inserted into the overlapping first through-hole and second through-hole, and then the movable section being slid. The patent literature below discloses examples of a cutting device.
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- Patent literature 1:
JP-A-2002-261493 - Patent literature 2:
JP-A-H5-175696 - An object of the present invention is to appropriately cut a lead.
- To solve the above problems, a board work machine of the present invention is a board work machine including: a cutting device provided with (A) a fixed section in which is formed a first through-hole and (B) a movable section configured to slide with respect to the fixed section and in which is formed a second through-hole configured to overlap the first through-hole, the cutting device being configured to cut a lead of a leaded component by the lead being inserted into the first through-hole and second through-hole that are in an overlapping state and the movable section being slid; a moving device configured to move the cutting device; and a recognition device configured to recognize a position of an upper through-hole that is an upper-positioned through-hole of the first through-hole and the second through-hole that are in the overlapping state, based on image data of one of the fixed section and the movable section in which the uppermost through-hole is formed.
- To solve the above problems, a recognition method of the present invention is a recognition method for, in a cutting device provided with (A) a fixed section in which is formed a first through-hole and (B) a movable section configured to slide with respect to the fixed section and in which is formed a second through-hole configured to overlap the first through-hole and configured to cut a lead of a leaded component by the lead being inserted into the first through-hole and second through-hole that are in an overlapping state and the movable section being slid, recognizing a position of an upper through-hole that is an upper-positioned through-hole of a first through-hole and a second through-hole that are in the overlapping state, the recognition method including: imaging of the one of the fixed section and the movable section in which the upper through-hole is formed; and recognizing the position of the upper through-hole based on image data obtained by the imaging.
- With a board work machine and a recognition method of the present invention, a position of an upper through-hole that is one of the first through-hole and the second through-hole that overlap is recognized based on image data of the one of the fixed section and the movable section in which the upper through-hole is formed. Thus, it is possible to appropriately recognize the position of the upper through-hole, and to insert the lead into the through-holes and appropriately cut the lead.
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- [
Fig. 1 ]
Fig. 1 is a perspective view of a component mounter. - [
Fig. 2 ]
Fig. 2 is a perspective view of a component mounting device. - [
Fig. 3 ]
Fig. 3 is a perspective view of a cut and clinch device. - [
Fig. 4 ]
Fig. 4 is a perspective view of a cut and clinch unit. - [
Fig. 5 ]
Fig. 5 is a cross section of a slide body. - [
Fig. 6 ]
Fig. 6 is an enlarged view of the slide body. - [
Fig. 7 ]
Fig. 7 is an enlarged view of a slide body in a state removed from a second section of a movable section. - [
Fig. 8 ]
Fig. 8 is a block diagram showing a control device. - [
Fig. 9 ]
Fig. 9 is a schematic view of a cut and clinch unit immediately before a lead of a leaded component is cut. - [
Fig. 10 ]
Fig. 10 is a schematic view of a cut and clinch unit after a lead of a leaded component has been cut. - [
Fig. 11 ]
Fig. 11 is an enlarged view of a curved section of the movable section. - The following describes in detail referring to the figures an example embodiment of the present invention.
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Fig. 1 showscomponent mounter 10.Component mounter 10 performs work of mounting components oncircuit board 12.Component mounter 10 is provided with devicemain body 20, board conveying andholding device 22,component mounting device 24,mark camera 26,component camera 28,component supply device 30, loosecomponent supply device 32, cut and clinch device (refer tofig. 3 ) 34, and control device (refer tofig. 8 ) 36. Note that, examples ofcircuit board 12 include circuit boards and boards with a three-dimensional construction, examples of a circuit board being a printed wiring board or a printed circuit board. - Device
main body 20 is configured from frame section 40 and beam section 42 that is mounted on the frame section 40. Board conveying andholding device 22 is positioned centrally inside frame section 40 in the front-rear direction, and includesconveyance device 50 andclamp device 52.Conveyance device 50conveys circuit board 12, andclamp device 52 holdscircuit board 12. Thus, board conveying and holdingdevice 22 conveyscircuit board 12 and fixedly holdscircuit board 12 at a specified position. Note that, in the descriptions below, the conveyance direction ofcircuit board 12 is referred to as the X direction, the direction horizontally perpendicular to the X direction is referred to as the Y direction, and the vertical direction is referred to as the Z direction. That is, the width direction ofcomponent mounter 10 is the X direction, and the front-rear direction is the Y direction. -
Component mounting device 24 is provided on beam section 42, and includeswork heads head moving device 64. As shown infig. 2 ,suction nozzle 66 is provided on a lower surface of eachwork head suction nozzle 66. Further, workhead moving device 64 includesX-direction moving device 68, Y-direction moving device 70, and Z-direction moving device 72.Work heads X-direction moving device 68 and Y-direction moving device 70. Also,work heads sliders direction moving device 72 movessliders work heads direction moving device 72. - Mark
camera 26 is attached toslide 74 in a state facing downwards, and is moved in the X direction, Y direction, and Z direction together withwork head 60. Thus,mark camera 26 images any position on frame section 40. As shown infig. 1 ,component camera 28 is provided in a state facing upwards on frame section 40 between board conveying andholding device 22 andcomponent supply device 30. Thus,component camera 28 images a component held bysuction nozzle 66 ofwork heads -
Component supply device 30 is provided at an end of frame section 40 in the front-rear direction.Component supply device 30 includes tray-typecomponent supply device 78 and feeder-type component supply device (refer tofig. 8 ) 80. Tray-typecomponent supply device 78 supplies components in a state arranged in a tray. Feeder-type component supply 80 device supplies components via a tape feeder or stick feeder (not shown). - Loose
component supply device 32 is provided at the other end of frame section 40 in the front-rear direction. Loosecomponent supply device 32 lines up multiple components that are in a scattered state, and supplies the components in a lined-up state. That is, this device arranges multiple components that have random orientations to have a specified orientation and supplies the components in the specified orientation. Note that, components supplied bycomponent supply device 30 and loosecomponent supply device 32 may include electronic circuit components, configuration components of solar panels, configuration components of power modules, and the like. Also, electronic circuit components include components with leads and components without leads. - Cut and clinch
device 34 is arranged belowconveyance device 50 and, as shown infig. 3 , includes cut and clinchunit 100 andunit moving device 102. As shown infig. 4 , cut and clinchunit 100 includes unitmain body 110, pair ofslide bodies 112, and pitch changingmechanism 114. At an upper end of unitmain body 110,slide rail 116 is arranged extending in the X direction. The pair ofslide bodies 112 is supported byslide rail 116 so as to be movable. Also, pitch changingmechanism 114 includeselectromagnetic motor 118, and the distance between the pair ofslide bodies 112 can be controllably changed by operation ofelectromagnetic motor 118. - Also, as shown in
fig. 5 , each of the pair ofslide bodies 112 includesmain body section 120,movable section 122, andslide device 124, and is supported atmain body section 120 so as to be slidable onslide rail 116. Twoslide rails 126 are fixed to the rear side ofmain body section 120 extending in the X direction, andmovable section 122 is slidably supported by those two slide rails 126. Also,slide device 124 includes electromagnetic motor (refer tofig. 8 ) 128, andmovable section 122 is controllably slid by operation ofelectromagnetic motor 128. - Also, the upper end section of
main body section 120 is formed tapered towards the end, andfirst insertion hole 130 is formed so as to pierce the upper end section in a vertical direction.First insertion hole 130 is open at an upper end to an upper end surface ofmain body section 120, and is open at a lower end to a side surface ofmain body section 120. Note that, the edge offirst insertion hole 130 that opens to the upper end surface ofmain body section 120 is formed as fixed blade 131 (refer tofig. 9 ). Also, below wherefirst insertion hole 130 opens to a side surface ofmain body section 120, discardbox 132 is provided. - Further, as shown in
fig. 6 , an upper end section ofmovable section 122 is also formed tapered towards the end, and L-shapedcurved section 133 is formed at the upper end section ofmovable section 122.Curved section 133 extends upwards of the upper end surface ofmain body section 120, and there is slight clearance betweencurved section 133 and the upper end ofmain body section 120. And,first insertion hole 130 that opens at the upper end surface ofmain body section 120 is covered bycurved section 133, andsecond insertion hole 136 is formed incurved section 133 so as to facefirst insertion hole 130.Second insertion hole 136 pierces throughcurved section 133 in a vertical direction, and an internal surface ofsecond insertion hole 136 is a tapered surface configured with a diameter that gets smaller going down. On the other hand, the internal surface offirst insertion hole 130 approaching the opening to the upper end surface ofmain body section 120 is not a tapered surface, the internal surface ofinsertion hole 130 approaching the opening has an approximately regular diameter. Also, the edge ofsecond insertion hole 136 that opens to the lower end surface ofcurved section 133 is formed as movable blade 138 (refer tofig. 9 ). - Note that, guide
groove 140 is formed in the upper end surface ofcurved section 133 extending in the X-axis direction.Guide groove 140 is formed to straddle the opening ofsecond insertion hole 136, and guidegroove 140 andsecond insertion hole 136 are linked. Also,movable section 122 is configured fromfirst section 144 andsecond section 146.First section 144 configures a lower side portion ofmovable section 122, and as shown infig. 5 , is slidably supported byslide rail 126. On the other hand,second section 146 configures an upper side portion ofmovable section 122, and includescurved section 133.Second section 146 andfirst section 144 are connected by bolts, and as shown infig. 7 , it is possible to removesecond section 146 fromfirst section 144 by removing the bolts. - Also, as shown in
fig. 3 ,unit moving device 102 includesX-direction moving device 150, Y-direction moving device 152, Z-direction moving device 154, androtating device 156.X-direction moving device 150 includesslide rail 160 andX slider 162.Slide rail 160 extends in the X direction, andX slider 162 is slidably supported onX slide rail 160.X slider 162 moves in the X direction by the driving of electromagnetic motor 164 (refer tofig. 8 ). Y-direction moving device 152 includesslide rail 166 andY slider 168.Slide rail 166 is arranged onX slider 162 extending in the Y direction, andY slider 168 is slidably supported onslide rail 166.Y slider 168 moves in the Y direction by the driving of electromagnetic motor 170 (refer tofig. 8 ). Z-direction moving device 154 includesslide rail 172 andZ slider 174.Slide rail 172 is arranged onY slider 168 extending in the Z direction, andZ slider 174 is slidably supported onslide rail 172.Z slider 174 moves in the Z direction by the driving of electromagnetic motor 176 (refer tofig. 8 ). - Further,
rotating device 156 includes rotating table 178 that is roughly disc-shaped. Rotating table 178 is supported byZ slider 174 so as to be rotatable around its own center, and is rotated by the driving of electromagnetic motor 180 (refer tofig. 8 ). Cut and clinchunit 100 is arranged on rotating table 178. According to such a configuration, cut and clinchunit 100 can be moved to any position byX-direction moving device 150, Y-direction moving device 152, and Z-direction moving device 154, and can be rotated to any angle by rotatingdevice 156. Thus,second insertion hole 136 of cut and clinchunit 100 can be positioned at any position undercircuit board 12 held byclamp device 52. - As shown in
fig. 8 , control device 38 is provided withcontroller 190,multiple drive circuits 192, andimage processing device 196. Themultiple drive circuits 192 are connected toconveyance device 50,clamp device 52, work heads 60 and 62, workhead moving device 64, tray typecomponent supply device 78, feeder typecomponent supply device 80, loosecomponent supply device 32, andelectromagnetic motors Controller 190 is provided with a CPU, ROM, RAM, and so on, is formed mainly from a computer, and is connected to themultiple drive circuits 192. By this, operation of board conveying and holdingdevice 22,component mounting device 24, and so on is controlled bycontroller 190. Further,controller 190 is also connected toimage processing device 196.Image processing device 196 is for processing image data acquired bymark camera 26 andcomponent camera 28, andcontroller 190 acquires various information from the image data. -
Component mounter 10, according to the above configuration, mounts components oncircuit board 12 held by board conveying and holdingdevice 22. Withcomponent mounter 10, it is possible to mount various components tocircuit board 12; descriptions are given below of a case in which components with leads (hereinafter also referred to as "leaded component") are mounted oncircuit board 12. - Specifically,
circuit board 12 is conveyed to a work position, and is fixedly held at that position byclamp device 52. Next,mark camera 26 moves abovecircuit board 12 andimages circuit board 12. By this, information related to a holding position ofcircuit board 12 is obtained. Also,component supply device 30 or loosecomponent supply device 32 supplies components at a specified supply position. One of the work heads 60 or 62 moves above the component supply position and holds a component usingsuction nozzle 66. Note, as shown infig. 9 ,leaded component 200 is configured from componentmain body section 202, and twoleads 204 protruding from the bottom surface of componentmain body section 202.Leaded component 200 is picked up and held by asuction nozzle 66 on componentmain body section 202. - Continuing,
work head leaded component 200 is moved abovecomponent camera 28, andleaded component 200 held bysuction nozzle 66 is imaged bycomponent camera 28. Accordingly, information related to the holding position of the component is obtained. Continuing,work head leaded component 200 moves abovecircuit board 12, and corrects the error in the holding position ofcircuit board 12 and the error in the holding position of the component and so on. Then, the two leads 204 ofleaded component 200 held bysuction nozzle 66 are inserted into two through-holes 208 formed incircuit board 12. Here, cut and clinchunit 100 is moved belowcircuit board 12. Cut and clinchunit 100 is moved such that coordinates in the XY directions ofsecond insertion hole 136 ofmovable section 122 and coordinates in the XY directions of through-holes 208 ofcircuit board 12 match, the upper surface ofmovable section 122 and the lower surface ofcircuit board 12 do not contact each other, and the upper surface ofmovable section 122 is slightly below the lower surface ofcircuit board 12. - Specifically, with cut and clinch
unit 100, the distance between the pair ofslide bodies 112 is adjusted bypitch changing mechanism 114 such the distance between the pair of second insertion holes 136 ofmovable section 122 ofslide body 122 is the same as the distance between the two through-holes 208 formed incircuit board 12. And, by operation ofunit moving device 102, cut and clinchunit 100 is moved in the XYZ directions and rotated. Thus, the coordinates in the XY directions ofsecond insertion hole 136 ofmovable section 122 and coordinates in the XY directions of through-holes 208 ofcircuit board 12 match, the upper surface ofmovable section 122 and the lower surface ofcircuit board 12 do not contact each other, and the upper surface ofmovable section 122 is slightly below the lower surface ofcircuit board 12. - Then, when leads 204 of
leaded component 200 held bysuction nozzle 66 are inserted into through-holes 208 ofcircuit board 12, as shown infig. 9 , the end section ofleads 204 is inserted intofirst insertion hole 130 ofmain body section 120 throughsecond insertion hole 136 ofmovable section 122 of cut and clinchunit 100. Here, because the internal surface ofsecond insertion hole 136 positioned below through-hole 208 is tapered, even in a case in which lead 204 is bent slightly, it is possible to ensure that the tip section oflead 204 appropriately enterssecond insertion hole 136. - Next, when the tip section of
lead 204 has been inserted intofirst insertion hole 130 ofmain body section 120,movable section 122 is slid by operation ofslide device 124. Thus, as shown infig. 10 , lead 204 is cut by fixedblade 131 offirst insertion hole 130 andmovable blade 138 ofsecond insertion hole 136. Then, the tip section separated by the cutting oflead 204 falls insidefirst insertion hole 130 and is discarded in discardbox 132. Also, the new tip section formed by the cutting oflead 204 is bent along the tapered surface of the inside ofsecond insertion hole 136 in accordance with the sliding ofmovable section 122, and the tip section oflead 204 is bent alongguide groove 140 by the further sliding ofmovable section 122. Thus, leaded 200 component is mounted intocircuit board 12 in a state in which leads 204 are prevented from coming out of through-holes 208. - In this manner, with
component mounter 10,leaded component 200 is mounted intocircuit board 12 bylead 204 being cut and bent by cut and clinchdevice 34. However,second insertion hole 136 into which lead 204 is inserted during cutting by cut and clinchdevice 34 is relatively small. Therefore, to insertlead 204 appropriately intosecond insertion hole 136, before moving cut and clinchunit 100 as above, it is necessary to appropriately recognize the opening position ofsecond insertion hole 136 and to perform calibration. Thus, for example, it may be considered to image the opening ofsecond insertion hole 136 usingmark camera 26, and to recognize the opening position ofsecond insertion hole 136 based on the image. However, because the internal surface ofsecond insertion hole 136 is tapered, it is not possible to appropriately image the opening ofsecond insertion hole 136 due to reflection of light from the tapered surface during imaging. Therefore, it is not possible to appropriately recognize the opening position ofsecond insertion hole 136 by imaging the opening ofsecond insertion hole 136. - Considering these circumstances, one may consider a method of imaging not
second insertion hole 136 butfirst insertion hole 130 usingmark camera 26, recognizing the position offirst insertion hole 130 based on the image data, and recognizing the position offirst insertion hole 130 instead of the position ofsecond insertion hole 136. Specifically, before performing mounting work, in cut and clinchdevice 34,second section 146 ofmovable section 122 can be removed fromfirst section 144 by removing bolts. By this, as shown infig. 7 , the opening offirst insertion hole 130 ofmain body section 120 is exposed.Mark camera 26 may be moved above this exposed opening offirst insertion hole 130, and the opening offirst insertion hole 130 may be imaged usingmark camera 26. As described above, the internal surface of the opening section offirst insertion hole 130 is not a tapered surface, the opening section ofinsertion hole 130 has an approximately regular diameter. Thus, problems arising due to reflection and so on from the tapered surface during imaging do not occur, and the opening offirst insertion hole 130 can be appropriately imaged. Then, the opening position offirst insertion hole 130 is recognized based on the image data. Also, becausefirst insertion hole 130 andsecond insertion hole 136 overlap in the vertical direction in a state that virtually matches, the opening position offirst insertion hole 130 can be recognized as the opening position ofsecond insertion hole 136. In this manner, by imagingfirst insertion hole 130, it is possible to recognize the opening position ofsecond insertion hole 136. However, to image the opening offirst insertion hole 130, it is necessary to removesecond section 146 ofmovable section 122 fromfirst section 144, which puts a load on an operator. Therefore, with cut and clinchdevice 34, a recognition mark is provided onbent section 133 ofmovable section 122, and the opening position ofsecond insertion hole 136 is recognized by imaging this recognition mark. - Specifically, as shown in
fig. 11 , a pair of recognition marks 210 are provided on an upper surface ofbent section 133 ofmovable section 122. These pair of recognition marks 210 are provided centered around the center of the opening ofsecond insertion hole 136. That is, the center point of the pair of recognition marks 210 is the center of the opening ofsecond insertion hole 136. Also, because recognition marks are provided at a position different tosecond insertion hole 136 and guidegroove 140, it is possible to appropriately image recognition marks 210 usingmark camera 26. Therefore, by imaging the pair of recognition marks 210 usingmark camera 26, the position of the pair of recognition marks is recognized based on the image data. And, the center position of the pair of recognition marks 210 is calculated, and that position is recognized as the opening position ofsecond insertion hole 136. By this, it is possible to appropriately recognize the opening position ofsecond insertion hole 136. - In this manner, with cut and clinch
device 34, the opening position ofsecond insertion hole 136 is recognized by providing a recognition mark onbent section 133 ofmovable section 122, and recognizing the opening position ofsecond insertion hole 136 by imaging this recognition mark. By this, it is possible to recognize the opening position ofsecond insertion hole 136 without removingsecond section 146 ofmovable section 122, thereby reducing the load on the operator. - Note that,
controller 190 of control device 38, as shown infig. 8 , includesimaging section 220 andrecognition section 222.Imaging section 220 is a functional section forimaging recognition mark 210 usingmark camera 26.Recognition section 222 is a functional section for recognizing the opening position ofsecond insertion hole 136. -
Component mounter 10 is an example of a board work machine. Cut and clinchdevice 34 is an example of a cutting device. Control device 38 is an example of a recognition device.Unit moving device 102 is an example of a moving device.Main body section 120 is an example of a fixed section.Movable section 122 is an example of a movable section.First insertion hole 130 is an example of a first through-hole.Second insertion hole 136 is an example of a second through-hole and an upper through-hole.Leaded component 200 is an example of a leaded component.Lead 204 is an example of a lead.Recognition mark 210 is an example of a recognition mark. A process performed byimaging section 220 is an example of an imaging process. A process performed byrecognition section 222 is an example of a recognition process. Note that, cutting may be performed by either one of the fixed section provided with the first through-hole or the movable section provided with the second through-hole moving, or by both the fixed section provided with the first through-hole and the movable section provided with the second through-hole moving. Also, either the fixed section or the movable section may be positioned above the other. - Further, the present invention is not limited to the above example embodiments, and various changed or improved methods of embodiment are possible based on the knowledge of someone skilled in the art. Specifically, for example, in an embodiment above, a pair of recognition marks 210 are provided on
movable section 122, and the opening position ofsecond insertion hole 136 is recognized using the pair of recognition marks 210; however, one recognition mark may be provided onmovable section 122, and the opening position ofsecond insertion hole 136 may be recognized using the single recognition mark. - Also, in an embodiment above,
movable section 122 is provided abovemain body section 120, and the opening position ofsecond insertion hole 136 ofmovable section 122 is recognized using a recognition mark; however,main body section 120 may be provided abovemovable section 122, and the opening position offirst insertion hole 130 ofmain body section 120 may be recognized using the recognition mark. However, in this case, the internal surface offirst insertion hole 130 must be tapered, and a recognition mark must be provided onmain body section 120. - Also, in an embodiment above,
recognition mark 210 is imaged automatically bymark camera 26, but the position ofsecond insertion hole 136 may be recognized and a correction value or the like for calibration may be acquired by an operator movingmark camera 26 manually andimaging recognition mark 210. - 10: component mounter (board work machine); 34: cut and clinch device (cutting device); 38: control device (recognition device); 102: unit moving device (moving device); 120: main body section (fixed section); 122: movable section; 130: first insertion hole (first through-hole); 136: second insertion hole (second through-hole) (upper through hole); 200: lead; 204: leaded component; 210: recognition mark
Claims (4)
- A board work machine comprising:a cutting device provided with (A) a fixed section in which is formed a first through-hole and (B) a movable section configured to slide with respect to the fixed section and in which is formed a second through-hole configured to overlap the first through-hole, the cutting device being configured to cut a lead of a leaded component by the lead being inserted into the first through-hole and the second through-hole that are in an overlapping state and the movable section being slid;a moving device configured to move the cutting device; anda recognition device configured to recognize a position of an upper through-hole that is an upper-positioned through-hole of the first through-hole and the second through-hole that are in the overlapping state, based on image data of one of the fixed section and the movable section in which the uppermost through-hole is formed.
- The board work machine according to claim 1 wherein
an internal surface of the upper through-hole is a tapered surface configured with a diameter that gets smaller going down,
a recognition mark for recognizing the position of the upper through-hole is formed on the one of the fixed section and the movable section in which the upper through-hole is formed, and
the recognition device recognizes the position of the upper through-hole based on image data of the recognition mark. - The board work machine according to claim 2, wherein
a pair of the recognition marks are provided opposite each other centered around the upper through-hole on the one of the fixed section and the movable section in which the upper through-hole is formed. - A recognition method for, in a cutting device provided with (A) a fixed section in which is formed a first through-hole and (B) a movable section configured to slide with respect to the fixed section and in which is formed a second through-hole configured to overlap the first through-hole and configured to cut a lead of a leaded component by the lead being inserted into the first through-hole and second through-hole that are in an overlapping state and the movable section being slid, recognizing a position of an upper through-hole that is an upper-positioned through-hole of the first through-hole and the second through-hole that are in the overlapping state, the recognition method comprising:imaging of the one of the fixed section and the movable section in which the upper through-hole is formed; andrecognizing the position of the upper through-hole based on image data obtained by the imaging.
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PCT/JP2015/066987 WO2016199289A1 (en) | 2015-06-12 | 2015-06-12 | Substrate work machine and recognition method |
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US (1) | US10506750B2 (en) |
EP (1) | EP3310146B1 (en) |
JP (1) | JP6648132B2 (en) |
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US10813259B2 (en) * | 2015-11-18 | 2020-10-20 | Fuji Corporation | Board work machine and insertion method |
EP3780930A4 (en) * | 2018-03-26 | 2021-03-24 | Fuji Corporation | Lead-cutting system, and lead component installation system |
WO2019220499A1 (en) * | 2018-05-14 | 2019-11-21 | 株式会社Fuji | Lead wire cutting unit and mounter provided with same |
WO2021038850A1 (en) * | 2019-08-30 | 2021-03-04 | 株式会社Fuji | Work machine |
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2015
- 2015-06-12 WO PCT/JP2015/066987 patent/WO2016199289A1/en active Application Filing
- 2015-06-12 JP JP2017523066A patent/JP6648132B2/en active Active
- 2015-06-12 EP EP15894974.3A patent/EP3310146B1/en active Active
- 2015-06-12 US US15/573,947 patent/US10506750B2/en active Active
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US10506750B2 (en) | 2019-12-10 |
US20180295759A1 (en) | 2018-10-11 |
JP6648132B2 (en) | 2020-02-14 |
EP3310146A4 (en) | 2018-06-27 |
WO2016199289A1 (en) | 2016-12-15 |
JPWO2016199289A1 (en) | 2018-03-29 |
EP3310146B1 (en) | 2020-07-01 |
CN107637191B (en) | 2021-09-10 |
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