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EP3375910A2 - Connector - Google Patents

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Publication number
EP3375910A2
EP3375910A2 EP18000214.9A EP18000214A EP3375910A2 EP 3375910 A2 EP3375910 A2 EP 3375910A2 EP 18000214 A EP18000214 A EP 18000214A EP 3375910 A2 EP3375910 A2 EP 3375910A2
Authority
EP
European Patent Office
Prior art keywords
layer
containing layer
amorphous
connector
nanocrystalline
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP18000214.9A
Other languages
German (de)
French (fr)
Other versions
EP3375910A3 (en
Inventor
Uwe Zeigmeister
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Diehl Metal Applications GmbH
Original Assignee
Diehl Metal Applications GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Diehl Metal Applications GmbH filed Critical Diehl Metal Applications GmbH
Publication of EP3375910A2 publication Critical patent/EP3375910A2/en
Publication of EP3375910A3 publication Critical patent/EP3375910A3/en
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
    • H01R4/62—Connections between conductors of different materials; Connections between or with aluminium or steel-core aluminium conductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/619—Amorphous layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials

Definitions

  • the invention relates to a connector.
  • a connector is z. B. from the DE 10 2008 042 824 A1 known, which is suitable to be inserted or pressed into a hole of a printed circuit board.
  • the connector has an approximately cylindrical region in which a connector inserted into a printed circuit board makes electrical contact with the printed circuit board, which is called in the further contact area.
  • the conventional connector has a press-fit body, which may be made of copper, bronze or CuSn 6 .
  • the injection-molded body is coated with two layers arranged at least partly on one another, wherein the outer layer comprises thiol.
  • the thiol serves as a passivating or lubricating agent to limit the pressing forces necessary during pressing.
  • the disadvantage of this connector is that an organic intermediate layer in the contact area is necessary, which adversely affects the electrical properties.
  • the object of the present invention is to eliminate the disadvantages of the prior art.
  • a connector is to be specified, which can be pressed with low insertion forces into a printed circuit board and is easy to manufacture.
  • a connector comprising a press body which is coated with a first Ni-containing layer and a second Ni-containing layer, wherein the first and / or the second Ni-containing layer is a nanocrystalline or amorphous layer ,
  • the first Ni-containing layer and the second Ni-containing layer have grain sizes of different orders of magnitude.
  • one of the layers may be microcrystalline and the other nanocrystalline or amorphous.
  • microcrystalline is meant a particle size in the range of 0.3 ⁇ m to 7 ⁇ m, in particular 0.5 ⁇ m to 3 ⁇ m.
  • nanocrystalline is meant a particle size of 4 nm to 200 nm, in particular 4 nm to 100 nm, in particular 4 nm to 80 nm, in particular 4 nm to 60 nm.
  • amorphous is meant that no crystallites are detectable by conventional methods such as X-ray diffraction, electron diffraction or transmission electron microscopy.
  • the Ni-containing layers contain no appreciable amounts of organic contaminants.
  • the Ni-containing layers expediently contain at least 80% by weight, in particular at least 90% by weight, of nickel.
  • the Ni-containing layers particularly preferably contain at least 95% by weight, in particular at least 97% by weight, of nickel.
  • the first and the second Ni-containing layer are at least partially superimposed, preferably superimposed over the entire surface.
  • the advantage of the connector according to the invention is that it by means of electroplating, z. B. strip electroplating can be coated. A separate coating by means of an organic aid is not required.
  • the connector according to the invention thus has no organic coating, in particular in the contact area, in which the connector is contacted when pressed into a circuit board to the circuit board.
  • one of the Ni-containing layers is a matt nickel and the other Ni-containing layer is a bright nickel.
  • a bright nickel is understood to mean a nickel coating which has a smooth, glossy surface.
  • a matte nickel has a dull, d. H. rougher surface.
  • electrolytes can be used to produce a gloss or a matt nickel known electrolytes.
  • the first or the second Ni-containing layer of the connector according to the invention is an amorphous layer which contains up to 15% by weight of phosphorus, in particular up to 10% by weight of phosphorus. By adding phosphorus, the amorphous Ni-containing layer can be stabilized.
  • the nanocrystalline and / or amorphous layer preferably has a thickness of 0.1 to 3 ⁇ m, in particular 0.1 to 2.2 ⁇ m, in particular 0.1 to 1 ⁇ m, in particular 0.1 to 0.7 ⁇ m, in particular 0.1 to 0.3 ⁇ m.
  • the sequence of layers on the injection-molding body can in particular be selected from one of the layer sequences listed in Table I: Table I first Ni-containing layer second Ni-containing layer third Ni-containing layer amorphous nanocrystalline amorphous microcrystalline nanocrystalline amorphous nanocrystalline microcrystalline microcrystalline amorphous microcrystalline nanocrystalline nanocrystalline microcrystalline amorphous nanocrystalline nanocrystalline nanocrystalline nanocrystalline nanocrystalline nanocrystalline nanocrystalline nanocrystalline nanocrystalline nanocrystalline nanocrystalline nanocrystalline nanocrystalline nanocrystalline nanocrystalline nanocrystalline nanocrystalline nanocrystalline nanocrystalline nanocrystalline nanocrystalline nanocrystalline nanocrystalline nanocrystalline nanocrystalline nanocrystalline nanocrystalline nanocrystalline nanocrystalline nanocrystalline nanocrystalline nanocrystalline nanocrystalline nanocrystalline nanocrystalline nanocrystalline nanocrystalline nanocrystalline nanocrystalline nanocrystalline nanocrystalline nanocrystalline nanocrystalline nanocrystalline nanocrystalline nanocrystalline nanocrystalline nanocrystalline
  • the press-fit body of the connector according to the invention comprises copper, a copper alloy or steel.
  • the copper alloy may be an alloy of CuFe, FuFe 2 P, CuNiSn, CuNiSi, CuZn, CuSnZn, CuSn 4 , CuSn 6 or CuSn 8 .
  • an intermediate layer of Cu or Sn can be arranged between the injection body and the first Ni-containing layer. Through the intermediate layer, the surface roughness can be further reduced.
  • Fig. 1 shows a connector 1, which is suitable for pressing into an opening of a printed circuit board made of copper, which is coated with bronze and / or tin.
  • the connector 1 includes a pen tip 10, a press-fit body 2 having a press-fit portion 11 and a mounting portion 12.
  • the connector 1 is coated with two Ni-containing layers at least partially overlapping each other.
  • a cylindrical portion of the press-fit portion 11 serves as a contact surface.
  • Fig. 2 shows a first embodiment of the layer structure of the connector 1.
  • On a first Ni-containing layer 3 is arranged with an average grain size of 0.8 microns.
  • the end surface forms a nanocrystalline second Ni-containing layer 4, which has an average grain size of 30 nm.
  • the surface hardness is increased, which has a modulus of 205 +/- 7 GPa and an indentation hardness of 9.4 +/- 0.6 GPa at a grain size of 30 nm.
  • the nanocrystalline structure of the second Ni-containing layer 4 produces a smoother surface which has improved sliding properties.
  • Such a layer sequence is particularly suitable for a one-time insertion process.
  • Fig. 3 shows a further embodiment of a layer structure of a connector.
  • the layer structure has an intermediate layer 5 between the injection-molded body 2 and the first Ni-containing layer 3.
  • the intermediate layer 5 is made of tin. It serves as a primer layer and to level the roughness of the injection body 2.
  • the intermediate layer is a nanocrystalline layer having a grain size of 30 nm.
  • the intermediate layer 5 may also consist of copper.
  • Fig. 4 shows a third embodiment of a layer structure on a press-fit body 2 with three Ni-containing layers, wherein the first Ni-containing layer 3 is a nanocrystalline layer, the second Ni-containing layer 4 is a microcrystalline and the third Ni-containing layer 6 is an amorphous layer ,
  • the amorphous layer contains 12% by weight of phosphorus.
  • Such a Ni-P layer has an E-modulus of 149 +/- 6 GPa and an indentation hardness of 9 +/- 0.7 GPa.
  • the surface of the amorphous layer has a consistently low frictional resistance against a copper friction surface. Cold welding to a copper or bronze layer can be minimized or prevented with such a layer structure.
  • the amorphous layer has increased resistance to frictional oxidation and poor layer degradation, making it well suited for repeated mating applications.
  • Fig. 5 shows a layer structure on a press-in body 2 with three Ni-containing layers, and an intermediate layer 5.
  • the three Ni-containing layers 3, 4, 6 correspond to those of in Fig. 4 shown embodiment.
  • the intermediate layer 5 is made of tin.
  • Fig. 6 shows the result of two rubbing tests between a copper pin and a disc which is coated with a matt nickel or a bright nickel.
  • the time is plotted on the horizontal axis and the coefficient of friction (COF) is plotted on the vertical axis.
  • the curve of the glossy nickel shows a running-in phase in which the friction coefficient increases during the rubbing test, whereas the coefficient of friction in the rubbing test on matt nickel has an approximately constant value.
  • Fig. 7 is a diagram and shows a comparison of a further Reib flows between a copper pin and a coated with bright nickel or an amorphous Ni-P layer disc.
  • the rubbing tests on the amorphous Ni-P layer show a consistently low coefficient of friction, while the rubbing test on the bright nickel has an increasing coefficient of friction.
  • After 10 cycles of friction occurs in bright nickel material transfer of Cu particles as in the schematic representation of the microscopic examination in Fig. 8 it is apparent.
  • no transfer of material was observed on the friction surface after 10 rubbing cycles, as in Fig. 9 is shown.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Laminated Bodies (AREA)

Abstract

Die Erfindung betrifft einen Steckverbinder (1), umfassend einen Einpresskörper (2), welcher mit einer ersten Ni-haltigen Schicht (3) und einer zweiten Ni-haltigen Schicht (4) beschichtet ist, wobei die erste und/oder die zweite Ni-haltige Schicht eine nanokristalline oder amorphe Schicht ist.

Figure imgaf001
The invention relates to a connector (1) comprising a press-fit body (2) which is coated with a first Ni-containing layer (3) and a second Ni-containing layer (4), wherein the first and / or the second Ni containing layer is a nanocrystalline or amorphous layer.
Figure imgaf001

Description

Die Erfindung betrifft einen Steckverbinder.The invention relates to a connector.

Ein Steckverbinder ist z. B. aus der DE 10 2008 042 824 A1 bekannt, welcher geeignet ist in ein Loch einer Leiterplatte eingeführt bzw. eingedrückt zu werden. Der Steckverbinder weist einen näherungsweise zylinderförmigen Bereich auf, in dem ein in eine Leiterplatte eingeführter Steckverbinder elektrischen Kontakt mit der Leiterplatte herstellt, welcher im weiteren Kontaktbereich genannt wird. Der herkömmliche Steckverbinder weist einen Einpresskörper auf, welcher aus Kupfer, Bronze oder CuSn6 hergestellt sein kann. Der Einpresskörper ist mit zwei zumindest teilweise aufeinander angeordneten Schichten beschichtet, wobei die äußere Schicht Thiol umfasst. Das Thiol dient als Passivierungs- bzw. Schmiermittel, um die beim Einpressen notwendigen Einpresskräfte zu begrenzen. Der Nachteil dieses Steckverbinders besteht darin, dass eine organische Zwischenschicht im Kontaktbereich notwendig ist, die die elektrischen Eigenschaften negativ beeinflusst.A connector is z. B. from the DE 10 2008 042 824 A1 known, which is suitable to be inserted or pressed into a hole of a printed circuit board. The connector has an approximately cylindrical region in which a connector inserted into a printed circuit board makes electrical contact with the printed circuit board, which is called in the further contact area. The conventional connector has a press-fit body, which may be made of copper, bronze or CuSn 6 . The injection-molded body is coated with two layers arranged at least partly on one another, wherein the outer layer comprises thiol. The thiol serves as a passivating or lubricating agent to limit the pressing forces necessary during pressing. The disadvantage of this connector is that an organic intermediate layer in the contact area is necessary, which adversely affects the electrical properties.

Die Aufgabe der vorliegenden Erfindung ist es, die Nachteile nach dem Stand der Technik zu beseitigen. Insbesondere soll ein Steckverbinder angegeben werden, welcher mit niedrigen Einpresskräften in eine Leiterplatte eingepresst werden kann und der einfach herzustellen ist.The object of the present invention is to eliminate the disadvantages of the prior art. In particular, a connector is to be specified, which can be pressed with low insertion forces into a printed circuit board and is easy to manufacture.

Diese Aufgabe wird durch die Merkmale des Patentanspruchs 1 gelöst. Zweckmäßige Ausgestaltungen der Erfindung ergeben sich aus den Unteransprüchen.This object is solved by the features of patent claim 1. Advantageous embodiments of the invention will become apparent from the dependent claims.

Nach Maßgabe der Erfindung wird ein Steckverbinder, umfassend einen Einpresskörper, angegeben, welcher mit einer ersten Ni-haltigen Schicht und einer zweiten Ni-haltigen Schicht beschichtet ist, wobei die erste und/oder die zweite Ni-haltige Schicht eine nanokristalline oder amorphe Schicht ist.In accordance with the invention, a connector comprising a press body is provided which is coated with a first Ni-containing layer and a second Ni-containing layer, wherein the first and / or the second Ni-containing layer is a nanocrystalline or amorphous layer ,

Die erste Ni-haltige Schicht und die zweite Ni-haltige Schicht besitzen Korngrößen in unterschiedlichen Größenordnungen. Insbesondere kann eine der Schichten mikrokristallin und die andere nanokristallin oder amorph sein. Unter "mikrokristallin" wird eine Korngröße im Bereich von 0,3 µm bis 7 µm, insbesondere 0,5 µm bis 3 µm, verstanden. Unter "nanokristallin" wird eine Korngröße von 4 nm bis 200 nm, insbesondere 4 nm bis 100 nm, insbesondere 4 nm bis 80 mn, insbesondere 4 nm bis 60 nm, verstanden. Unter "amorph" wird verstanden, dass keine Kristallite mittels üblicher Verfahren wie Röntgenbeugung, Elektronenbeugung oder Transmissionselektronenmikroskopie nachweisbar sind.The first Ni-containing layer and the second Ni-containing layer have grain sizes of different orders of magnitude. In particular, one of the layers may be microcrystalline and the other nanocrystalline or amorphous. By "microcrystalline" is meant a particle size in the range of 0.3 μm to 7 μm, in particular 0.5 μm to 3 μm. By "nanocrystalline" is meant a particle size of 4 nm to 200 nm, in particular 4 nm to 100 nm, in particular 4 nm to 80 nm, in particular 4 nm to 60 nm. By "amorphous" is meant that no crystallites are detectable by conventional methods such as X-ray diffraction, electron diffraction or transmission electron microscopy.

Die Ni-haltigen Schichten enthalten insbesondere keine nennenswerten Mengen an organischen Verunreinigungen. Zweckmäßigerweise enthalten die Ni-haltigen Schichten zumindest 80 Gew.%, insbesondere zu zumindest 90 Gew.% Nickel. Besonders bevorzugt enthalten die Ni-haltigen Schichten zumindest 95 % Gew.%, insbesondere zumindest 97 Gew.% Nickel. Die erste und die zweite Ni-haltige Schicht überlagern sich zumindest teilweise, vorzugsweise überlagern sie sich vollflächig.In particular, the Ni-containing layers contain no appreciable amounts of organic contaminants. The Ni-containing layers expediently contain at least 80% by weight, in particular at least 90% by weight, of nickel. The Ni-containing layers particularly preferably contain at least 95% by weight, in particular at least 97% by weight, of nickel. The first and the second Ni-containing layer are at least partially superimposed, preferably superimposed over the entire surface.

Der Vorteil des erfindungsgemäßen Steckverbinders liegt darin, dass er mittels galvanischer Beschichtung, z. B. Bandgalvanik beschichtet werden kann. Eine separate Beschichtung mittels eines organischen Hilfsmittels ist nicht erforderlich. Der erfindungsgemäße Steckverbinder weist somit keine organische Beschichtung insbesondere im Kontaktbereich auf, in dem der Steckverbinder beim Einpressen in eine Leiterplatte mit der Leiterplatte kontaktiert wird.The advantage of the connector according to the invention is that it by means of electroplating, z. B. strip electroplating can be coated. A separate coating by means of an organic aid is not required. The connector according to the invention thus has no organic coating, in particular in the contact area, in which the connector is contacted when pressed into a circuit board to the circuit board.

In einer vorteilhaften Ausgestaltung ist eine der Ni-haltigen Schichten ein Mattnickel und die andere Ni-haltige Schicht ein Glanznickel. Unter einem Glanznickel wird eine Nickelbeschichtung verstanden, welche eine glatte, glänzende Oberfläche aufweist. Ein Mattnickel weist eine matte, d. h. rauere Oberfläche auf. Zur Erzeugung eines Glanz- bzw. eines Mattnickels können bekannte Elektrolyten eingesetzt werden.In an advantageous embodiment, one of the Ni-containing layers is a matt nickel and the other Ni-containing layer is a bright nickel. A bright nickel is understood to mean a nickel coating which has a smooth, glossy surface. A matte nickel has a dull, d. H. rougher surface. To produce a gloss or a matt nickel known electrolytes can be used.

In einer weiteren Ausgestaltung ist die erste oder die zweite Ni-haltige Schicht des erfindungsgemäßen Steckverbinders eine amorphe Schicht, welche bis zu 15 Gew. % Phosphor, insbesondere bis zu 10 Gew. % Phosphor, enthält. Durch den Zusatz von Phosphor kann die amorphe Ni-haltige Schicht stabilisiert werden.In a further embodiment, the first or the second Ni-containing layer of the connector according to the invention is an amorphous layer which contains up to 15% by weight of phosphorus, in particular up to 10% by weight of phosphorus. By adding phosphorus, the amorphous Ni-containing layer can be stabilized.

Vorzugsweise weist die nanokristalline und/oder amorphe Schicht eine Dicke von 0,1 bis 3 µm, insbesondere 0,1 bis 2,2 µm, insbesondere 0,1 bis 1 µm, insbesondere 0,1 bis 0,7 µm, insbesondere 0,1 bis 0,3 µm, auf. Die Schichtabfolge auf dem Einpresskörper kann insbesondere aus einer der in Tabelle I aufgeführten Schichtabfolgen ausgewählt sein: Tabelle I erste Ni-haltige Schicht zweite Ni-haltige Schicht dritte Ni-haltige Schicht amorph nanokristallin amorph mikrokristallin nanokristallin amorph nanokristallin mikrokristallin mikrokristallin amorph mikrokristallin nanokristallin nanokristallin mikrokristallin amorph nanokristallin mikrokristallin nanokristallin mikrokristallin nanokristallin amorph The nanocrystalline and / or amorphous layer preferably has a thickness of 0.1 to 3 μm, in particular 0.1 to 2.2 μm, in particular 0.1 to 1 μm, in particular 0.1 to 0.7 μm, in particular 0.1 to 0.3 μm. The sequence of layers on the injection-molding body can in particular be selected from one of the layer sequences listed in Table I: Table I first Ni-containing layer second Ni-containing layer third Ni-containing layer amorphous nanocrystalline amorphous microcrystalline nanocrystalline amorphous nanocrystalline microcrystalline microcrystalline amorphous microcrystalline nanocrystalline nanocrystalline microcrystalline amorphous nanocrystalline microcrystalline nanocrystalline microcrystalline nanocrystalline amorphous

In einer bevorzugten Ausgestaltung umfasst der Einpresskörper des erfindungsgemäßen Steckverbinders Kupfer, eine Kupferlegierung oder Stahl. Insbesondere kann die Kupferlegierung eine Legierung aus CuFe, FuFe2P, CuNiSn, CuNiSi, CuZn, CuSnZn, CuSn4, CuSn6 oder CuSn8 sein.In a preferred embodiment, the press-fit body of the connector according to the invention comprises copper, a copper alloy or steel. In particular, the copper alloy may be an alloy of CuFe, FuFe 2 P, CuNiSn, CuNiSi, CuZn, CuSnZn, CuSn 4 , CuSn 6 or CuSn 8 .

In einer weiteren Ausgestaltung kann zwischen dem Einpresskörper und der ersten Ni-haltigen Schicht eine Zwischenschicht aus Cu oder Sn angeordnet sein. Durch die Zwischenschicht kann die Oberflächenrauheit weiter reduziert werden.In a further embodiment, an intermediate layer of Cu or Sn can be arranged between the injection body and the first Ni-containing layer. Through the intermediate layer, the surface roughness can be further reduced.

Nachführend wird die Erfindung anhand von Ausführungsbeispielen unter Bezugnahme auf die Zeichnungen näher erläutert. Die Zeichnungen sind schematische Darstellungen und zeigen:

Fig. 1
einen erfindungsgemäßen Steckverbinder,
Fig. 2
eine schematische Darstellung der Beschichtungsabfolge des Steckverbinders von Fig. 1,
Fig. 3
ein zweites Ausführungsbeispiel einer Schichtabfolge der Beschichtung eines Steckverbinders,
Fig. 4
ein drittes Ausführungsbeispiel der Beschichtungsabfolge eines Steckverbinders,
Fig. 5
ein viertes Ausführungsbeispiel einer Beschichtung eines Steckverbinders,
Fig. 6
ein Diagramm eines Reibversuchs,
Fig. 7
ein weiteres Diagramm eines Reibversuchs,
Fig. 8
eine schematische Darstellung einer TEM-Querschnittsabbildung einer Glanznickel-Oberfläche, und
Fig. 9
eine schematische Darstellung einer TEM-Querschnittsabbildung einer amorphen NiP-Oberfläche.
The invention will be explained in more detail by means of exemplary embodiments with reference to the drawings. The drawings are schematic representations and show:
Fig. 1
a connector according to the invention,
Fig. 2
a schematic representation of the coating sequence of the connector of Fig. 1 .
Fig. 3
A second embodiment of a layer sequence of the coating of a connector,
Fig. 4
A third embodiment of the coating sequence of a connector,
Fig. 5
A fourth embodiment of a coating of a connector,
Fig. 6
a diagram of a rubbing test,
Fig. 7
another diagram of a rubbing test,
Fig. 8
a schematic representation of a TEM cross-sectional image of a bright nickel surface, and
Fig. 9
a schematic representation of a TEM cross-sectional image of an amorphous NiP surface.

Fig. 1 zeigt einen Steckverbinder 1, der zum Einpressen in eine Öffnung einer Leiterplatte aus Kupfer, welche mit Bronze und/oder Zinn beschichtet ist, geeignet ist. Der Steckverbinder 1 umfasst eine Stiftspitze 10, einen Einpresskörper 2 mit einem Einpressbereich 11 und einen Befestigungsbereich 12. Der Steckverbinder 1 ist mit zwei Ni-haltigen Schichten, die einander zumindest teilweise überlagern, beschichtet. Ein zylinderförmiger Abschnitt des Einpressbereichs 11 dient als Kontaktfläche. Fig. 1 shows a connector 1, which is suitable for pressing into an opening of a printed circuit board made of copper, which is coated with bronze and / or tin. The connector 1 includes a pen tip 10, a press-fit body 2 having a press-fit portion 11 and a mounting portion 12. The connector 1 is coated with two Ni-containing layers at least partially overlapping each other. A cylindrical portion of the press-fit portion 11 serves as a contact surface.

Fig. 2 zeigt ein erstes Ausführungsbeispiel des Schichtaufbaus des Steckverbinders 1. Der Einpresskörper 2 ist aus CuSn6 hergestellt und besitzt eine Rauigkeit Ra = 0,5 µm. Darauf ist eine erste Ni-haltige Schicht 3 mit einer durchschnittlichen Korngröße von 0,8 µm angeordnet. Die Endoberfläche bildet eine nanokristalline zweite Ni-haltige Schicht 4, welche eine durchschnittliche Korngröße von 30 nm aufweist. Durch die zweite Ni-haltige Schicht 4 mit nanokristalliner Korngröße wird die Oberflächenhärte erhöht, welche bei einer Korngröße von 30 nm einen E-Modul von 205 +/- 7 GPa und eine Eindruckhärte von 9,4 +/- 0,6 GPa aufweist. Durch das nanokristalline Gefüge der zweiten Ni-haltigen Schicht 4 wird eine glattere Oberfläche erzeugt, die verbesserte Gleiteigenschaften aufweist. Eine solche Schichtabfolge eignet insbesondere für einen einmaligen Steckvorgang. Fig. 2 shows a first embodiment of the layer structure of the connector 1. The injection body 2 is made of CuSn 6 and has a roughness Ra = 0.5 microns. On a first Ni-containing layer 3 is arranged with an average grain size of 0.8 microns. The end surface forms a nanocrystalline second Ni-containing layer 4, which has an average grain size of 30 nm. By the second Ni-containing layer 4 with nanocrystalline grain size, the surface hardness is increased, which has a modulus of 205 +/- 7 GPa and an indentation hardness of 9.4 +/- 0.6 GPa at a grain size of 30 nm. The nanocrystalline structure of the second Ni-containing layer 4 produces a smoother surface which has improved sliding properties. Such a layer sequence is particularly suitable for a one-time insertion process.

Fig. 3 zeigt ein weiteres Ausführungsbeispiel eines Schichtaufbaus eines Steckverbinders. Der Schichtaufbau weist zwischen dem Einpresskörper 2 und der ersten Ni-haltigen Schicht 3 eine Zwischenschicht 5 auf. Die Zwischenschicht 5 besteht aus Zinn. Sie dient als Haftvermittlerschicht sowie zur Einebnung der Rauigkeit des Einpresskörpers 2. Bei der Zwischenschicht handelt es sich um eine nanokristalline Schicht mit einer Korngröße von 30 nm. Alternativ kann die Zwischenschicht 5 auch aus Kupfer bestehen. Fig. 3 shows a further embodiment of a layer structure of a connector. The layer structure has an intermediate layer 5 between the injection-molded body 2 and the first Ni-containing layer 3. The intermediate layer 5 is made of tin. It serves as a primer layer and to level the roughness of the injection body 2. The intermediate layer is a nanocrystalline layer having a grain size of 30 nm. Alternatively, the intermediate layer 5 may also consist of copper.

Fig. 4 zeigt ein drittes Ausführungsbeispiel eines Schichtaufbaus auf einem Einpresskörper 2 mit drei Ni-haltigen Schichten, wobei die erste Ni-haltige Schicht 3 eine nanokristalline Schicht, die zweite Ni-haltige Schicht 4 eine mikrokristalline und die dritte Ni-haltige Schicht 6 eine amorphe Schicht ist. Die amorphe Schicht enthält 12 Gew. % Phosphor. Eine solche Ni-P Schicht hat einen E-Modul von 149 +/- 6 GPa und eine Eindruckhärte von 9 +/- 0,7 GPa. Die Oberfläche der amorphen Schicht weist einen gleichbleibend geringen Reibwiderstand gegenüber einer Kupferreibfläche auf. Ein Kaltverschweißen gegen eine Kupfer- oder Bronzeschicht kann mit einem solchen Schichtaufbau minimiert oder verhindert werden. Die amorphe Schicht weist eine erhöhte Stabilität gegen Reiboxidation und eine geringe Schichtdegradation auf, so dass sie auch für wiederholte Steckanwendungen gut geeignet ist. Fig. 4 shows a third embodiment of a layer structure on a press-fit body 2 with three Ni-containing layers, wherein the first Ni-containing layer 3 is a nanocrystalline layer, the second Ni-containing layer 4 is a microcrystalline and the third Ni-containing layer 6 is an amorphous layer , The amorphous layer contains 12% by weight of phosphorus. Such a Ni-P layer has an E-modulus of 149 +/- 6 GPa and an indentation hardness of 9 +/- 0.7 GPa. The surface of the amorphous layer has a consistently low frictional resistance against a copper friction surface. Cold welding to a copper or bronze layer can be minimized or prevented with such a layer structure. The amorphous layer has increased resistance to frictional oxidation and poor layer degradation, making it well suited for repeated mating applications.

Fig. 5 zeigt einen Schichtaufbau auf einem Einpresskörper 2 mit drei Ni-haltigen Schichten, sowie einer Zwischenschicht 5. Die drei Ni-haltigen Schichten 3, 4, 6 entsprechen denjenigen des in Fig. 4 gezeigten Ausführungsbeispiels. Die Zwischenschicht 5 besteht aus Zinn. Fig. 5 shows a layer structure on a press-in body 2 with three Ni-containing layers, and an intermediate layer 5. The three Ni-containing layers 3, 4, 6 correspond to those of in Fig. 4 shown embodiment. The intermediate layer 5 is made of tin.

Fig. 6 zeigt das Ergebnis von zwei Reibversuchen zwischen einem Kupferstift und einer Scheibe, die mit einem Mattnickel bzw. einem Glanznickel beschichtet ist. Auf der waagerechten Achse ist die Zeit aufgetragen, auf der senkrechten Achse ist der Reibungskoeffizient (COF) aufgetragen. Die Kurve des Glanznickels zeigt eine Einlaufphase, in der der Reibungskoeffizient während des Reibversuchs zunimmt, wohingegen der Reibungskoeffizient bei dem Reibversuch auf Mattnickel einen näherungsweise gleichbleibenden Wert aufweist. Fig. 6 shows the result of two rubbing tests between a copper pin and a disc which is coated with a matt nickel or a bright nickel. The time is plotted on the horizontal axis and the coefficient of friction (COF) is plotted on the vertical axis. The curve of the glossy nickel shows a running-in phase in which the friction coefficient increases during the rubbing test, whereas the coefficient of friction in the rubbing test on matt nickel has an approximately constant value.

Fig. 7 ist ein Diagramm und zeigt einen Vergleich eines weiteren Reibversuchs zwischen einem Kupferstift und einer mit Glanznickel bzw. einer amorphen Ni-P Schicht beschichteten Scheibe. Die Reibversuche auf der amorphen Ni-P Schicht zeigen einen gleichbleibend niedrigen Reibungskoeffizienten, während der Reibversuch auf dem Glanznickel einen ansteigenden Reibungskoeffizienten aufweist. Nach 10 Reibzyklen tritt beim Glanznickel ein Materialübertrag von Cu-Partikeln, wie in der schematischen Darstellung der mikroskopischen Untersuchung in Fig. 8 ersichtlich ist, auf. Bei einer amorphen Ni-P Schicht wurde kein Materialübertrag an der Reiboberfläche nach 10 Reibzyklen beobachtet, wie in Fig. 9 gezeigt ist. Fig. 7 is a diagram and shows a comparison of a further Reibversuchs between a copper pin and a coated with bright nickel or an amorphous Ni-P layer disc. The rubbing tests on the amorphous Ni-P layer show a consistently low coefficient of friction, while the rubbing test on the bright nickel has an increasing coefficient of friction. After 10 cycles of friction occurs in bright nickel material transfer of Cu particles, as in the schematic representation of the microscopic examination in Fig. 8 it is apparent. In the case of an amorphous Ni-P layer, no transfer of material was observed on the friction surface after 10 rubbing cycles, as in Fig. 9 is shown.

BEZUGSZEICHENLISTELIST OF REFERENCE NUMBERS

11
Steckkontaktplug contact
22
EinpresskörperPress Fit
33
erste Ni-haltige Schichtfirst Ni-containing layer
44
zweite Ni-haltige Schichtsecond Ni-containing layer
55
Zwischenschichtinterlayer
66
dritte Ni-haltige Schichtthird Ni-containing layer
1010
Stiftspitzepen tip
1111
Einpressbereichpress-in
1212
Befestigungsbereichfastening area

Claims (9)

Steckverbinder (1), umfassend einen Einpresskörper (2), welcher mit einer ersten Ni-haltigen Schicht (3) und einer zweiten Ni-haltigen Schicht (4) beschichtet ist,
wobei die erste (3) und/oder die zweite Ni-haltige Schicht (4) eine nanokristalline oder amorphe Schicht ist.A connector (1) comprising a press-fit body (2) coated with a first Ni-containing layer (3) and a second Ni-containing layer (4),
wherein the first (3) and / or the second Ni-containing layer (4) is a nanocrystalline or amorphous layer. Steckverbinder nach Anspruch 1, wobei eine der Ni-haltigen Schichten (3, 4) ein Mattnickel und die andere Ni-haltige Schicht ein Glanznickel ist.A connector according to claim 1, wherein one of the Ni-containing layers (3, 4) is a matte nickel and the other Ni-containing layer is a bright nickel. Steckverbinder nach Anspruch 1, wobei die erste oder die zweite Ni-haltige Schicht (3, 4) eine amorphe Schicht ist, welche bis zu 15 Gew.% Phosphor, insbesondere bis zu 10 Gew.% Phosphor enthält.A connector according to claim 1, wherein the first or second Ni-containing layer (3, 4) is an amorphous layer containing up to 15% by weight of phosphorus, especially up to 10% by weight of phosphorus. Steckverbinder nach einem der vorhergehenden Ansprüche, wobei die nanokristalline und/oder die amorphe Schicht eine Dicke von 0,1 - 3 µm, insbesondere 0,1 - 2,2 µm, insbesondere 0,1 - 1 µm, insbesondere 0,1 - 0,7 µm, insbesondere 0,1 - 0,3 µm aufweist.Connector according to one of the preceding claims, wherein the nanocrystalline and / or the amorphous layer has a thickness of 0.1-3 μm, in particular 0.1-2.2 μm, in particular 0.1-1 μm, in particular 0.1-0 , 7 microns, in particular 0.1 - has 0.3 microns. Steckverbinder nach einem der vorhergehenden Ansprüche, wobei auf der zweiten Ni-haltigen Schicht (4) eine dritte Ni-haltige Schicht (6) angeordnet ist.Connector according to one of the preceding claims, wherein on the second Ni-containing layer (4), a third Ni-containing layer (6) is arranged. Steckverbinder nach einem der vorhergehenden Ansprüche, wobei die zweite Ni-haltige Schicht (4) mikrokristallin und die dritte Ni-haltige Schicht (6) nanokristallin oder amorph ist.Connector according to one of the preceding claims, wherein the second Ni-containing layer (4) is microcrystalline and the third Ni-containing layer (6) is nanocrystalline or amorphous. Steckverbinder nach einem der vorhergehenden Ansprüche, wobei der Einpresskörper (2) aus Kupfer, einer Kupferlegierung oder Stahl besteht.Connector according to one of the preceding claims, wherein the press-fit body (2) consists of copper, a copper alloy or steel. Steckverbinder nach Anspruch 7, wobei die Kupferlegierung eine Legierung aus CuFe, FuFe2P, CuNiSn, CuNiSi, CuZn, CuSnZn, CuSn4, CuSn6 oder CuSn8 ist.A connector according to claim 7, wherein the copper alloy is an alloy of CuFe, FuFe 2 P, CuNiSn, CuNiSi, CuZn, CuSnZn, CuSn 4 , CuSn 6 or CuSn 8 . Steckverbinder nach einem der vorhergehenden Ansprüche, wobei zwischen dem Einpresskörper (2) und der ersten Ni-haltigen Schicht (3) eine Zwischenschicht (5) aus Cu oder Sn angeordnet ist.Connector according to one of the preceding claims, wherein between the injection body (2) and the first Ni-containing layer (3) an intermediate layer (5) made of Cu or Sn is arranged.
EP18000214.9A 2017-03-14 2018-03-06 Connector Withdrawn EP3375910A3 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020244866A1 (en) * 2019-06-05 2020-12-10 Erni International Ag Electric contact element for high operating voltages
US12142864B2 (en) 2019-06-05 2024-11-12 Erni International Ag Electric contact element for high operating voltages

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102018203800B4 (en) * 2018-03-13 2019-11-21 Te Connectivity Germany Gmbh Contact pin and arrangement for connecting electrical conductors made of copper and aluminum
WO2024202237A1 (en) * 2023-03-30 2024-10-03 Ｊｘ金属株式会社 Metal material and sliding component

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008042824A1 (en) 2008-10-14 2010-04-15 Robert Bosch Gmbh Electric conductor and method of making an electrical conductor

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6335107B1 (en) * 1999-09-23 2002-01-01 Lucent Technologies Inc. Metal article coated with multilayer surface finish for porosity reduction
JP4362599B2 (en) * 2004-03-05 2009-11-11 Ｄｏｗａメタルテック株式会社 Metal member and electrical contact using the same
JP5424666B2 (en) * 2009-02-17 2014-02-26 学校法人早稲田大学 Fine crystal-amorphous mixed gold alloy and plating film, and plating solution and plating film forming method therefor
US8652649B2 (en) * 2009-07-10 2014-02-18 Xtalic Corporation Coated articles and methods
KR20140047077A (en) * 2011-06-23 2014-04-21 엑스탤릭 코포레이션 Printed circuit boards and related articles including electrodeposited coatings
DE102011078546A1 (en) * 2011-07-01 2013-01-03 Tyco Electronics Amp Gmbh Electrical contact coating
TWI493798B (en) * 2012-02-03 2015-07-21 Jx Nippon Mining & Metals Corp Push-in terminals and electronic parts for their use
EP2975162B1 (en) * 2014-07-18 2018-09-05 FRANZ Oberflächentechnik GmbH & Co KG Method for providing a workpiece with a protective coating
TWI527920B (en) * 2014-11-26 2016-04-01 財團法人金屬工業研究發展中心 Protection film and method for depositing the protection film
CN107250430A (en) * 2016-02-16 2017-10-13 思力柯集团 Product and method including laminated coating

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008042824A1 (en) 2008-10-14 2010-04-15 Robert Bosch Gmbh Electric conductor and method of making an electrical conductor

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020244866A1 (en) * 2019-06-05 2020-12-10 Erni International Ag Electric contact element for high operating voltages
CN113491039A (en) * 2019-06-05 2021-10-08 埃尔尼国际股份有限公司 Electrical contact element for high operating voltages
RU2769459C1 (en) * 2019-06-05 2022-03-31 Эрни Интернациональ Аг Electric contact element for high operating voltages
US12142864B2 (en) 2019-06-05 2024-11-12 Erni International Ag Electric contact element for high operating voltages

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CN108574161A (en) 2018-09-25

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