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EP3261170B1 - Compact double-cell hyperfrequency circulator and manufacturing method - Google Patents

Compact double-cell hyperfrequency circulator and manufacturing method Download PDF

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Publication number
EP3261170B1
EP3261170B1 EP17177380.7A EP17177380A EP3261170B1 EP 3261170 B1 EP3261170 B1 EP 3261170B1 EP 17177380 A EP17177380 A EP 17177380A EP 3261170 B1 EP3261170 B1 EP 3261170B1
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European Patent Office
Prior art keywords
cell
dielectric
ferrite
circulator
core
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EP17177380.7A
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German (de)
French (fr)
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EP3261170A1 (en
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Richard Lebourgeois
Clément Tolant
Christophe Galindo
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Thales SA
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Thales SA
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/32—Non-reciprocal transmission devices
    • H01P1/38—Circulators
    • H01P1/383—Junction circulators, e.g. Y-circulators
    • H01P1/387—Strip line circulators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
    • H01P5/022—Transitions between lines of the same kind and shape, but with different dimensions
    • H01P5/028—Transitions between lines of the same kind and shape, but with different dimensions between strip lines

Definitions

  • the field of the invention is that of microwave circulators.
  • These low-loss magnetic passive components typically operate at frequencies of the order of a few gigahertz to a few tens of gigahertz.
  • Such components are currently particularly sought after both for civil telecommunications applications and for RADAR applications.
  • These are essential components because they make it possible to isolate parasitic reflections while presenting low losses to transmit high powers, and this in a completely passive way.
  • the figure 1 illustrates this type of component, comprising three ports, one of which is connected to a 50 ⁇ load to provide isolation from parasitic reflections.
  • microwave circulators The operation of these microwave circulators is based on the non-reciprocal effect of a magnetically saturated ferrite. They are conventionally manufactured using expensive assembly technologies because the ferrite that forms the heart of the component, a ferrimagnetic garnet, is a ceramic sintered at high temperature (> 1400°C). They are bulky and difficult to integrate with other components used in microelectronic circuits because they are generally not presented as chip-based components but are fabricated as independent ferrite devices. Also the microwave transmitter/receiver subassemblies used in radars and telecommunications applications tend to avoid their use by replacing them with other solutions: diodes, MEMS, etc.
  • a circulator is conventionally made up of a ferrite part, most often a disc, a permanent magnet placed as close as possible to the ferrite and metal tracks allowing the propagation of the electromagnetic wave.
  • the metal tracks form a Y to respect the 120° symmetry.
  • the picture 2 illustrates a 3-port circulator with a channel 1, a channel 2 and a channel 3 materialized by metal tracks Pi, the magnetic ferrite core 10, coupled to a magnet 12.
  • the picture 3a shows such a configuration of two cells comprising a magnetic ferrite core activated by magnets 12.
  • the first cell comprises two access channels 1 and 2, the second cell comprising two access channels 3 and 4, materialized by metal tracks Pi , one of these metal tracks ensuring the connection between the two cells.
  • each circulator be magnetized in the opposite direction, as illustrated in figure 3b .
  • the figure 4 illustrates the interconnection of a double cell circulator in a Radar transceiver module, the transmitter comprising an HPA for “High Power Amplifier” and the receiver comprising an LNA for “Low Noise Amplifier”.
  • the transmitter comprising an HPA for “High Power Amplifier”
  • the receiver comprising an LNA for “Low Noise Amplifier”.
  • a 50 ⁇ load is connected on one of the ports. In this way, the insulation on the transmitter side is reinforced, which allows better control of the transmission signal.
  • the documents US 2002/135434 A1 , XP000315333 and WO 02/099924 A1 disclose circulators with two superposed ferrite cells.
  • the document US 2015/028961 A1 discloses two superposed independent ferrite circulators.
  • the document WO 2012/042168 A1 discloses the fixing of several layers of ferrite by cosintering, and the document US 2002/093392 A1 discloses several arrangements of access ports to the circulator depending on the position and size of the other components of the circuit of an antenna system.
  • the present invention relates to a solution making it possible to reduce the size of the circulators and in particular the surface occupied by the component on the microwave cards.
  • the subject of the present invention is a method for manufacturing a microwave circulator comprising the steps of claim 1, and also the microwave circulator obtained according to said method.
  • the cells comprise one or more layers of co-sintered ferrite material or dielectric or weakly magnetic material.
  • the cells comprise a stack of layers of co-sintered ferrite material or dielectric or weakly magnetic material.
  • each layer comprises a core of ferrite material, surrounded by dielectric or weakly magnetic material.
  • said cell connection comprises at least one main conductor via passing through said first cell and said second cell.
  • the first cell can be covered by an assembly comprising a core of ferrite material surrounded by dielectric or weakly magnetic material, the second cell being covered by an assembly comprising a core of ferrite material surrounded by dielectric material.
  • the access tracks and the connecting tracks are buried in said three-plate structure.
  • said cells further comprise secondary conductor vias opening onto the ground plane(s) and distributed around said main conductor via, making it possible to provide shielding around the RF connection of said cells.
  • the microwave circulator comprises at least one magnet attached to at least one cell or to one of the upper or lower ground planes.
  • the ferrite material has a garnet structure.
  • the dielectric or weakly magnetic material is a garnet structure material with weak magnetic magnetization.
  • the method comprises the production of at least one conductive via in said assembly to obtain said connection between the connecting track of said first structure and the connecting track of said second structure.
  • the method comprises the production of a first structure comprising a core of ferrite material surrounded by a dielectric or weakly magnetic material and of a second structure comprising a core of ferrite material surrounded by a material dielectric or weakly magnetic effected by cosintering of a multilayer stack, each of the layers comprising a core of ferrite material surrounded by dielectric or weakly magnetic material.
  • this method of the present invention makes it possible to collectively and automatically produce double-cell circulators having an implantation surface twice as small as that of the state of the art.
  • the invention also relates to a microwave circulator obtained according to the manufacturing method of the invention.
  • the double cell microwave circulator of the invention can comprise, without this being restrictive, a configuration Y circulator with three channels, including two access channels and a link channel providing an RF connection between the two cells.
  • This type of circulator thus has three channels at 120° to each other around a central body where the elements are located which give the circulator its non-reciprocity under the action of a magnetic field.
  • the circulator of the present invention comprises the superposition of two cells each comprising a core of ferrite material surrounded by dielectric or weakly magnetic material and assembled by cosintering.
  • Each cell comprises on one of its so-called active faces metallizations, comprising tracks connected to access ports, and a junction track, all of these tracks thus being able to form a Y junction and a connection providing RF communication between the two cells, the face opposite the active face having a ground plane, the two cells thus having a common ground plane, such an architecture making it possible to reduce the surface occupied.
  • the microwave circulator comprises a first cell C 1 superimposed on a second cell C 2 .
  • Each cell comprises on one of its so-called active faces, metallizations, comprising tracks Pi forming channels 1, 2, 3 and 4 respectively.
  • Each cell comprises a core of ferrite material whose surface is metallized, connected to tracks 1, 2 and 5 (for the first cell) and connected to tracks 3, 4 and 5' (for the second cell).
  • the double-cell circulator further comprises a connection C 1-2 connecting channels 5 and 5' in the form of a conductive via passing through the first cell and the second cell.
  • the ground plane schematized by the plane P M can be constituted for example by the metallization of one of the faces of one of the two cells and having an opening O PM .
  • a magnet not shown in the figure is attached to the outer face of one of the cells, directly on the disc of metallized ferrite material or else at a predefined distance, using a layer of material low-loss dielectric serving as a “spacer”.
  • the superposition described above is carried out using multilayer cosintering technology.
  • the cast strips can have a thickness of a hundred microns, the thickness of a structure having a thickness of a few hundred microns.
  • strip thicknesses of 500 microns it is either possible to have a single strip 500 microns thick, or to laminate 5 strips of 100 microns.
  • the access ports of one cell are not positioned opposite those of the other cell, as shown in figure 6 which highlights the ports P 1 and P 2 of the first cell C 1 at the level of two opposite sides and the ports P 3 and P 4 of the second cell C 2 on a side located perpendicular to the sides at the level of which the ports P 1 and P 2 , the ends of the channels referenced 5 and 5' being connectable by a via connecting P5 and P5'
  • the vertical connections are made using shielded vias consisting of a main via surrounded by several other peripheral shielding vias.
  • the main via connects the Y-junctions while the peripheral vias connect to the ground plane embedded in the overlay.
  • FIG 7 An example of a microstrip or micro-ribbon type circulator is thus illustrated in figure 7 which highlights the connection made between the connecting tracks.
  • This cell connection is ensured by a set of conductor vias comprising a main central via V P , surrounded by peripheral vias V iB .
  • the ground plane can be produced by metallization of one of the faces of a previously prepared cell, having taken the precaution of leaving an opening O P so that the main via is not in contact with said ground plane P M.
  • the figure 8 illustrates the adjustment of the circulator thanks to the presence of two magnets 12, arranged on either side of the Y junctions, the assembly being transferred to a substrate S, having a dielectric part S D and a metallized part S M and comprising connecting tracks Pj.
  • the assemblies are stacked so as to have, from top to bottom, the following structure: ground plane P MS - assembly C 1' with junction Y1 - assembly C 1 - ground plane P M - assembly C 2 with junction Y2 - assembly C 2' - PMI ground plane, as shown in figure 9 .
  • Sets C 1 and C 2 have a metallic ink via.
  • the ground plane 2 is not metallized over the entire surface, to allow the passage of the via connecting 5 and 5'.
  • the crossing of the ground planes is ensured by removing the metallization around the connection vias.
  • Accesses 1 and 2 can be on the perpendicular faces as illustrated in figure 10 .
  • this three-plate configuration has four sets of ferrite core surrounded by dielectric material. Y junctions are made on two of them, to make the cells C 1 and C 2 , on the faces opposite the faces comprising the Y junctions, at least one of the faces is metallized to form the internal ground plane referenced in figure 9 , ground plane P M .
  • the three-plate structure comprises, symmetrically, two other sets C 1 ' and C 2' also having a ferrite core surrounded by dielectric material, not shown.
  • the assembly C 1′ faces the cell C 1
  • the assembly C 2′ faces the cell C 2′ .
  • An upper ground plane is produced on the external face of assembly C 1'
  • a lower ground plane is produced on the external face of assembly C 2' .
  • the three ground planes P MS , P M and P Mi are interconnected by peripheral conductive vias V iB , the connection between the Y junctions of the two cells is ensured by the main conductive via V P .

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  • Non-Reversible Transmitting Devices (AREA)
  • Soft Magnetic Materials (AREA)

Description

Le domaine de l'invention est celui des circulateurs hyperfréquences. Ces composants passifs magnétiques à faibles pertes fonctionnent typiquement à des fréquences de l'ordre de quelques Gigahertz à quelques dizaines de Gigahertz. De tels composants sont particulièrement recherchés actuellement tant pour des applications civiles de télécommunications que pour des applications RADAR. Ce sont des composants essentiels car ils permettent d'isoler des réflexions parasites tout en présentant des pertes faibles pour transmettre des puissances importantes, et ce de manière complètement passive. La figure 1 illustre ce type de composant, comprenant trois ports dont un est connecté à une charge 50 Ω pour assurer l'isolation des réflexions parasites.The field of the invention is that of microwave circulators. These low-loss magnetic passive components typically operate at frequencies of the order of a few gigahertz to a few tens of gigahertz. Such components are currently particularly sought after both for civil telecommunications applications and for RADAR applications. These are essential components because they make it possible to isolate parasitic reflections while presenting low losses to transmit high powers, and this in a completely passive way. The figure 1 illustrates this type of component, comprising three ports, one of which is connected to a 50 Ω load to provide isolation from parasitic reflections.

Le fonctionnement de ces circulateurs hyperfréquences est basé sur l'effet non-réciproque d'un ferrite magnétiquement saturé. Ils sont fabriqués de manière conventionnelle en utilisant des technologies d'assemblage coûteuses car le ferrite qui constitue le cœur du composant, un grenat ferrimagnétique, est une céramique frittée à haute température (> 1400°C). Ils sont volumineux et difficiles à intégrer avec d'autres composants employés dans les circuits de microélectronique parce qu'ils ne se présentent généralement pas comme des composants sous forme de puce mais qu'ils sont fabriqués comme des dispositifs à ferrite indépendants. Aussi les sous-ensembles émetteur/récepteur hyperfréquences utilisés dans les radars et les applications de télécommunications ont tendance à éviter leur utilisation en les remplaçant par d'autres solutions : diodes, MEMS...The operation of these microwave circulators is based on the non-reciprocal effect of a magnetically saturated ferrite. They are conventionally manufactured using expensive assembly technologies because the ferrite that forms the heart of the component, a ferrimagnetic garnet, is a ceramic sintered at high temperature (> 1400°C). They are bulky and difficult to integrate with other components used in microelectronic circuits because they are generally not presented as chip-based components but are fabricated as independent ferrite devices. Also the microwave transmitter/receiver subassemblies used in radars and telecommunications applications tend to avoid their use by replacing them with other solutions: diodes, MEMS, etc.

Un circulateur est classiquement constitué d'une partie en ferrite, le plus souvent un disque, d'un aimant permanent placé au plus près du ferrite et de pistes métalliques permettant la propagation de l'onde électromagnétique. Dans un circulateur à 3 ports, les pistes métalliques forment un Y pour respecter la symétrie à 120°. La figure 2 illustre un circulateur 3 ports avec une voie 1, une voie 2 et une voie 3 matérialisées par des pistes métalliques Pi, le noyau en ferrite magnétique 10, couplé à un aimant 12.A circulator is conventionally made up of a ferrite part, most often a disc, a permanent magnet placed as close as possible to the ferrite and metal tracks allowing the propagation of the electromagnetic wave. In a 3-port circulator, the metal tracks form a Y to respect the 120° symmetry. The picture 2 illustrates a 3-port circulator with a channel 1, a channel 2 and a channel 3 materialized by metal tracks Pi, the magnetic ferrite core 10, coupled to a magnet 12.

Pour augmenter les performances d'isolation, les fabricants proposent des composants dits à 2 cellules constitués de 2 circulateurs reliés par un des ports. La figure 3a montre une telle configuration de deux cellules comprenant un noyau ferrite magnétique activées par des aimants 12. La première cellule comprend deux voies d'accès 1 et 2, la seconde cellule comportant deux voies d'accès 3 et 4, matérialisées par des pistes métalliques Pi, l'une de ces pistes métalliques assurant la liaison entre les deux cellules.To increase insulation performance, manufacturers offer so-called 2-cell components consisting of 2 circulators connected through one of the ports. The picture 3a shows such a configuration of two cells comprising a magnetic ferrite core activated by magnets 12. The first cell comprises two access channels 1 and 2, the second cell comprising two access channels 3 and 4, materialized by metal tracks Pi , one of these metal tracks ensuring the connection between the two cells.

Pour réduire la désaimantation de chaque cellule due à la proximité des aimants 12, il est préférable que chaque circulateur soit aimanté en sens inverse, comme illustré en figure 3b.To reduce the demagnetization of each cell due to the proximity of the magnets 12, it is preferable that each circulator be magnetized in the opposite direction, as illustrated in figure 3b .

La figure 4 illustre l'interconnexion d'un circulateur double cellule dans un module Radar d'émission-réception, l'émetteur comprenant un HPA pour « High Power Amplifier » et le récepteur comprenant un LNA pour « Low Noise Amplifier ». Dans cette configuration, sur l'un des ports, par exemple celui de la voie 2, une charge 50 Ω est connectée. De cette manière, l'isolation côté émetteur est renforcée ce qui permet un meilleur contrôle du signal d'émission.The figure 4 illustrates the interconnection of a double cell circulator in a Radar transceiver module, the transmitter comprising an HPA for “High Power Amplifier” and the receiver comprising an LNA for “Low Noise Amplifier”. In this configuration, on one of the ports, for example that of channel 2, a 50 Ω load is connected. In this way, the insulation on the transmitter side is reinforced, which allows better control of the transmission signal.

L'amélioration des performances d'isolation due à la présence d'une double cellule est cependant obtenue au détriment de la surface occupée par le composant qui est multipliée par deux.The improvement in insulation performance due to the presence of a double cell is however obtained to the detriment of the surface occupied by the component which is multiplied by two.

Les documents US 2002/135434 A1 , XP000315333 et WO 02/099924 A1 divulguent des circulateurs avec deux cellules de ferrite superposées. Le document US 2015/028961 A1 divulgue deux circulateurs de ferrite indépendants superposés. Le document WO 2012/042168 A1 divulgue la fixation de plusieurs couches de ferrite par cofrittage, et le document US 2002/093392 A1 divulgue plusieurs arrangements des ports d'accès au circulateur en fonction de la position et dimension des autres composants du circuit d'un système antennaire.The documents US 2002/135434 A1 , XP000315333 and WO 02/099924 A1 disclose circulators with two superposed ferrite cells. The document US 2015/028961 A1 discloses two superposed independent ferrite circulators. The document WO 2012/042168 A1 discloses the fixing of several layers of ferrite by cosintering, and the document US 2002/093392 A1 discloses several arrangements of access ports to the circulator depending on the position and size of the other components of the circuit of an antenna system.

Dans ce contexte, et pour résoudre notamment le problème précité, la présente invention a pour objet une solution permettant de réduire l'encombrement des circulateurs et notamment la surface occupée par le composant sur les cartes hyperfréquences.In this context, and in order in particular to solve the aforementioned problem, the present invention relates to a solution making it possible to reduce the size of the circulators and in particular the surface occupied by the component on the microwave cards.

Plus précisément la présente invention a pour objet un procédé de fabrication d'un circulateur hyperfréquence comprenant les étapes de la revendication 1, et aussi le circulateur hyperfréquence obtenu selon ledit procédé.More specifically, the subject of the present invention is a method for manufacturing a microwave circulator comprising the steps of claim 1, and also the microwave circulator obtained according to said method.

Selon des variantes de l'invention, les cellules comprennent une ou des couches de matériau ferrite ou matériau diélectrique ou faiblement magnétique cofrittées.According to variants of the invention, the cells comprise one or more layers of co-sintered ferrite material or dielectric or weakly magnetic material.

Selon des variantes de l'invention, les cellules comprennent un empilement des couches de matériau ferrite ou matériau diélectrique ou faiblement magnétique cofrittées. Dans ce cas, chaque couche comprend un noyau de matériau ferrite, entouré de matériau diélectrique ou faiblement magnétique.According to variants of the invention, the cells comprise a stack of layers of co-sintered ferrite material or dielectric or weakly magnetic material. In this case, each layer comprises a core of ferrite material, surrounded by dielectric or weakly magnetic material.

Selon des variantes de l'invention, ladite connexion de cellules comprend au moins un via conducteur principal traversant ladite première cellule et ladite seconde cellule.According to variants of the invention, said cell connection comprises at least one main conductor via passing through said first cell and said second cell.

Selon des variantes de l'invention, le circulateur hyperfréquence comporte une structure triplaque cofrittée comprenant :

  • un plan de masse supérieur ;
  • une première cellule ;
  • une seconde cellule ;
  • un plan de masse inférieur.
According to variants of the invention, the microwave circulator comprises a co-sintered three-plate structure comprising:
  • a higher ground plane;
  • a first cell;
  • a second cell;
  • a lower ground plane.

Dans une configuration triplaque, la première cellule peut être recouverte par un ensemble comprenant un noyau de matériau ferrite entouré de matériau diélectrique ou faiblement magnétique, la seconde cellule étant recouverte par un ensemble comprenant un noyau de matériau ferrite entouré de matériau diélectrique. Ainsi les pistes d'accès et les pistes de liaison sont enterrées dans ladite structure triplaque.In a three-plate configuration, the first cell can be covered by an assembly comprising a core of ferrite material surrounded by dielectric or weakly magnetic material, the second cell being covered by an assembly comprising a core of ferrite material surrounded by dielectric material. Thus the access tracks and the connecting tracks are buried in said three-plate structure.

Selon des variantes de l'invention, lesdites cellules comprennent en outre des via conducteurs secondaires débouchant sur le ou les plan(s) de masse et répartis autour dudit via conducteur principal, permettant d'assurer un blindage autour de la connexion RF desdites cellules.According to variants of the invention, said cells further comprise secondary conductor vias opening onto the ground plane(s) and distributed around said main conductor via, making it possible to provide shielding around the RF connection of said cells.

Selon des variantes de l'invention, le circulateur hyperfréquence comprend au moins un aimant rapporté sur au moins une cellule ou sur un des plans de masse supérieur ou inférieur.According to variants of the invention, the microwave circulator comprises at least one magnet attached to at least one cell or to one of the upper or lower ground planes.

Selon des variantes de l'invention, le matériau ferrite est de structure grenat.According to variants of the invention, the ferrite material has a garnet structure.

Selon des variantes de l'invention, le matériau ferrite de structure grenat répond à la formule chimique suivante :

        YaTRbBib'FecAldIneCafCugZrhViCojSikO12±γ

avec TR : une terre rare ou une combinaison de terres rares et :

  • -1 ≤ γ ≤ 1 ;
  • 3 (a+b+b'+c+d+e) + 2 (f+g+j) + 4 (h+k) + 5i = 24±2γ ;
  • 1 ≤ a ≤ 3,5 ;
  • 0 ≤ b ≤ 1,5 ;
  • 0 < b' ≤ 1 ;
  • 4 ≤ c ≤ 5 ;
  • 0 ≤ d ≤ 1,5;
  • 0 ≤ e ≤ 0,8 ;
  • 0 ≤ f ≤ 1 ;
  • 0 < g < 0,05 ;
  • 0 ≤ h ≤ 1
  • 0 ≤ i ≤ 0,8 ;
  • 0 ≤ j ≤ 0,5 ;
  • 0 ≤ k ≤ 0,5.
avec b + d ≤ 1.According to variants of the invention, the ferrite material of garnet structure corresponds to the following chemical formula:

Y a TR b Bi b' Fe c Al d In e Ca f Cu g Zr h V i Co j Si k O 12±γ

with TR: a rare earth or a combination of rare earths and:
  • -1 ≤ γ ≤ 1;
  • 3 (a+b+b'+c+d+e) + 2 (f+g+j) + 4 (h+k) + 5i = 24±2γ;
  • 1 ≤ a ≤ 3.5;
  • 0 ≤ b ≤ 1.5;
  • 0 <b' ≤ 1;
  • 4 ≤ c ≤ 5;
  • 0≤d≤1.5;
  • 0 ≤ e ≤ 0.8;
  • 0 ≤ f ≤ 1;
  • 0<g<0.05;
  • 0 ≤ h ≤ 1
  • 0 ≤ i ≤ 0.8;
  • 0 ≤ d ≤ 0.5;
  • 0 ≤ k ≤ 0.5.
with b + d ≤ 1.

Selon des variantes de l'invention, le matériau diélectrique ou faiblement magnétique est un matériau de structure grenat à faible aimantation magnétique.According to variants of the invention, the dielectric or weakly magnetic material is a garnet structure material with weak magnetic magnetization.

Selon des variantes de l'invention, le matériau de structure grenat à faible aimantation magnétique répond à la formule chimique suivante :

        YaTRbBib'FecAldIneCafCugZrhViCojSikO12±γ

avec TR : une terre rare ou une combinaison de terres rares et :

  • -1 ≤ γ ≤ 1 ;
  • 3 (a+b+b'+c+d+e) + 2 (f+g+j) + 4 (h+k) + 5i = 24±2γ
  • 1 ≤ a ≤ 3,5 ;
  • 0 ≤ b ≤ 1,5 ;
  • 0 < b' ≤ 1 ;
  • 4 ≤ c ≤ 5 ;
  • 0 ≤ d ≤ 1,5 ;
  • 0 ≤ e ≤ 0,8 ;
  • 0 ≤ f ≤ 1 ;
  • 0 < g < 0,05 ;
  • 0 ≤ h ≤ 1
  • 0 ≤ i ≤ 0,8 ;
  • 0 ≤ j ≤ 0,5 ;
  • 0 ≤ k ≤ 0,5.
avec b + d ≥ 1,2.According to variants of the invention, the garnet structure material with low magnetic magnetization corresponds to the following chemical formula:

Y a TR b Bi b' Fe c Al d In e Ca f Cu g Zr h V i Co j Si k O 12±γ

with TR: a rare earth or a combination of rare earths and:
  • -1 ≤ γ ≤ 1;
  • 3 (a+b+b'+c+d+e) + 2 (f+g+j) + 4 (h+k) + 5i = 24±2γ
  • 1 ≤ a ≤ 3.5;
  • 0 ≤ b ≤ 1.5;
  • 0 <b' ≤ 1;
  • 4 ≤ c ≤ 5;
  • 0≤d≤1.5;
  • 0 ≤ e ≤ 0.8;
  • 0 ≤ f ≤ 1;
  • 0<g<0.05;
  • 0 ≤ h ≤ 1
  • 0 ≤ i ≤ 0.8;
  • 0 ≤ d ≤ 0.5;
  • 0 ≤ k ≤ 0.5.
with b + d ≥ 1.2.

Selon des variantes de l'invention, le procédé comprend la réalisation d'au moins un via conducteur dans ledit assemblage pour obtenir ladite connexion entre la piste de liaison de ladite première structure et la piste de liaison de ladite seconde structure.According to variants of the invention, the method comprises the production of at least one conductive via in said assembly to obtain said connection between the connecting track of said first structure and the connecting track of said second structure.

Selon des variantes de l'invention, le procédé comprend la réalisation d'une première structure comprenant un noyau de matériau ferrite entouré d'un matériau diélectrique ou faiblement magnétique et d'une seconde structure comprenant un noyau de matériau ferrite entouré d'un matériau diélectrique ou faiblement magnétique effectuée par cofrittage d'un empilement multicouches, chacune des couches comprenant un noyau de matériau ferrite entouré de matériau diélectrique ou faiblement magnétique.According to variants of the invention, the method comprises the production of a first structure comprising a core of ferrite material surrounded by a dielectric or weakly magnetic material and of a second structure comprising a core of ferrite material surrounded by a material dielectric or weakly magnetic effected by cosintering of a multilayer stack, each of the layers comprising a core of ferrite material surrounded by dielectric or weakly magnetic material.

Ainsi, ce procédé de la présente invention permet de réaliser de manière collective et automatique des circulateurs double cellules présentant une surface d'implantation deux fois plus petite que celle de l'état de l'art.Thus, this method of the present invention makes it possible to collectively and automatically produce double-cell circulators having an implantation surface twice as small as that of the state of the art.

Ce procédé de coffrittage d'empilement multicouches particulièrement intéressant peut notamment comprendre les étapes suivantes :

  • la réalisation de bandes de matériau ferrite et de matériau diélectrique ou faiblement magnétique par coulage ;
  • la découpe desdites bandes ;
  • la réalisation d'au moins un via ;
  • le remplissage d'au moins ledit via avec une encre métallique, le métal pouvant être de l'argent, de l'or, ou un alliage d'argent et de palladium Ag-Pd ;
  • la réalisation de pistes d'accès et de liaison jointes entre elles au niveau du noyau de matériau ferrite sur un sous-ensemble de bandes et de plans de masse sur certaines autres bandes;
  • l'empilement desdites bandes par pressage à chaud ;
  • le cofrittage dudit empilement conduisant à la solidarisation de la structure multicouches.
This particularly advantageous multilayer stack formwork method may in particular comprise the following steps:
  • the production of strips of ferrite material and of dielectric or weakly magnetic material by casting;
  • cutting said strips;
  • making at least one via;
  • the filling of at least said via with a metallic ink, the metal possibly being silver, gold, or an alloy of silver and palladium Ag-Pd;
  • the production of access and connection tracks joined together at the level of the core of ferrite material on a subset of strips and ground planes on certain other strips;
  • stacking said strips by hot pressing;
  • the cosintering of said stack leading to the joining of the multilayer structure.

Avantageusement le matériau diélectrique ou faiblement magnétique mis en oeuvre dans le procédé de la présente invention peut répondre à la formule suivante :

        YaTRbBib'FecAldIneCafCugZrhViCojSikO12±γ

avec TR : une terre rare ou une combinaison de terres rares et :

  • -1 ≤ γ ≤ 1 ;
  • 3 (a+b+b'+c+d+e) + 2 (f+g+j) + 4 (h+k) + 5i = 24±2γ
  • 1 ≤ a ≤ 3,5 ;
  • 0 ≤ b ≤ 1,5 ;
  • 0 < b' ≤ 1 ;
  • 4 ≤ c ≤ 5 ;
  • 0 ≤ d ≤ 1,5 ;
  • 0 ≤ e ≤ 0,8 ;
  • 0 ≤ f ≤ 1 ;
  • 0 < g < 0,05 ;
  • 0 ≤ h ≤ 1
  • 0 ≤ i ≤ 0,8 ;
  • 0 ≤ j ≤ 0,5 ;
  • 0 ≤ k ≤ 0,5.
avec b + d ≥ 1,2.Advantageously, the dielectric or weakly magnetic material used in the method of the present invention can correspond to the following formula:

Y a TR b Bi b' Fe c Al d In e Ca f Cu g Zr h V i Co j Si k O 12±γ

with TR: a rare earth or a combination of rare earths and:
  • -1 ≤ γ ≤ 1;
  • 3 (a+b+b'+c+d+e) + 2 (f+g+j) + 4 (h+k) + 5i = 24±2γ
  • 1 ≤ a ≤ 3.5;
  • 0 ≤ b ≤ 1.5;
  • 0 <b' ≤ 1;
  • 4 ≤ c ≤ 5;
  • 0≤d≤1.5;
  • 0 ≤ e ≤ 0.8;
  • 0 ≤ f ≤ 1;
  • 0<g<0.05;
  • 0 ≤ h ≤ 1
  • 0 ≤ i ≤ 0.8;
  • 0 ≤ d ≤ 0.5;
  • 0 ≤ k ≤ 0.5.
with b + d ≥ 1.2.

Avantageusement, le matériau ferrite mis en œuvre dans le procédé de la présente invention peut être de structure grenat et répondre à la formule suivante :

        YaTRbBib'FecAldIneCafCugZrhViCojSikO12±γ

avec TR : une terre rare ou une combinaison de terres rares et :

  • -1 ≤ γ ≤ 1 ;
  • 3 (a+b+b'+c+d+e) + 2 (f+g+j) + 4 (h+k) + 5i = 24±2γ ;
  • 1 ≤ a ≤ 3,5 ;
  • 0 ≤ b ≤ 1,5 ;
  • 0 < b' ≤ 1 ;
  • 4 ≤ c ≤ 5 ;
  • 0 ≤ d ≤ 1,5;
  • 0 ≤ e ≤ 0,8 ;
  • 0 ≤ f ≤ 1 ;
  • 0 < g < 0,05 ;
  • 0 ≤ h ≤ 1
  • 0 ≤ i ≤ 0,8 ;
  • 0 ≤ j ≤ 0,5 ;
  • 0 ≤ k ≤ 0,5.
avec b + d ≤ 1.Advantageously, the ferrite material used in the process of the present invention can be of garnet structure and correspond to the following formula:

Y a TR b Bi b' Fe c Al d In e Ca f Cu g Zr h V i Co j Si k O 12±γ

with TR: a rare earth or a combination of rare earths and:
  • -1 ≤ γ ≤ 1;
  • 3 (a+b+b'+c+d+e) + 2 (f+g+j) + 4 (h+k) + 5i = 24±2γ;
  • 1 ≤ a ≤ 3.5;
  • 0 ≤ b ≤ 1.5;
  • 0 <b' ≤ 1;
  • 4 ≤ c ≤ 5;
  • 0≤d≤1.5;
  • 0 ≤ e ≤ 0.8;
  • 0 ≤ f ≤ 1;
  • 0<g<0.05;
  • 0 ≤ h ≤ 1
  • 0 ≤ i ≤ 0.8;
  • 0 ≤ d ≤ 0.5;
  • 0 ≤ k ≤ 0.5.
with b + d ≤ 1.

L'invention a également pour objet un circulateur hyperfréquence obtenu selon le procédé de fabrication de l'invention.The invention also relates to a microwave circulator obtained according to the manufacturing method of the invention.

L'invention sera mieux comprise et d'autres avantages apparaîtront à la lecture de la description qui va suivre donnée à titre non limitatif et grâce aux figures annexées parmi lesquelles :

  • la figure 1 schématise le fonctionnement d'un circulateur hyperfréquence à trois ports dont un est isolé ;
  • la figure 2 schématise un circulateur hyperfréquence comprenant un ferrite ;
  • les figures 3a et 3b illustrent une vue de dessus et une vue en coupe d'un circulateur hyperfréquence double cellule de l'art antérieur utilisant un ferrite;
  • la figure 4 schématise l'intégration d'un circulateur hyperfréquence double cellule utilisant un ferrite dans une chaîne d'émission / réception ;
  • la figure 5 illustre une variante de circulateur hyperfréquence selon un exemple pas couvert par les revendications schématisé avec le plan de masse incorporé dans la superposition des deux cellules ;
  • la figure 6 illustre par des vues de dessus un mode de superposition des cellules utilisées dans une variante de circulateur hyperfréquence de l'invention ;
  • la figure 7 met en évidence la connexion entre les cellules superposées dans une variante de circulateur hyperfréquence qui n'est pas couverte par les revendications;
  • la figure 8 illustre la même variante de circulateur hyperfréquence que celle illustrée en figure 7 et activée entre deux aimants rapportée sur un substrat ;
  • la figure 9 illustre une variante de circulateur hyperfréquence de type triplaque, qui n'est pas couverte par les revendications.
  • La figure 10 illustre une variante de circulateur hyperfréquence de type triplaque qui n'est pas couverte par les revendications.
The invention will be better understood and other advantages will appear on reading the following description, given without limitation and thanks to the appended figures, among which:
  • the figure 1 diagrams the operation of a microwave circulator with three ports, one of which is isolated;
  • the picture 2 schematizes a microwave circulator comprising a ferrite;
  • the figure 3a and 3b illustrate a top view and a cross-sectional view of a prior art dual cell microwave circulator using a ferrite;
  • the figure 4 diagrams the integration of a double-cell microwave circulator using a ferrite in a transmission/reception chain;
  • the figure 5 illustrates a variant of microwave circulator according to an example not covered by the claims schematized with the ground plane incorporated in the superposition of the two cells;
  • the figure 6 illustrates by top views a mode of superposition of the cells used in a variant of microwave circulator of the invention;
  • the figure 7 highlights the connection between overlapping cells in a variant microwave circulator which is not covered by the claims;
  • the figure 8 illustrates the same variation of microwave circulator as shown in figure 7 and activated between two magnets attached to a substrate;
  • the figure 9 illustrates a variant of microwave circulator of the stripline type, which is not covered by the claims.
  • The figure 10 illustrates a variant microwave circulator of the stripline type which is not covered by the claims.

Même si les modes de réalisation des figures 5 et 7-10 ne sont pas couverts par les revendications, ils présentent des aspects qui, étant combinés avec la configuration des ports d'accès de la figure 6, font partie de la portée des revendications.Even if the embodiments of figure 5 and 7-10 are not covered by the claims, they present aspects which, being combined with the configuration of the access ports of the figure 6 , are within the scope of the claims.

De manière générale, le circulateur hyperfréquence double cellule de l'invention peut comprendre sans que cela soit restrictif, une configuration de circulateur en Y à trois voies, dont deux voies d'accès et une voie de liaison assurant une connexion RF entre les deux cellules. Ce type de circulateur comporte ainsi trois voies à 120° les unes des autres autour d'un corps central où se trouvent les éléments qui confèrent au circulateur sa nonréciprocité sous l'action d'un champ magnétique.In general, the double cell microwave circulator of the invention can comprise, without this being restrictive, a configuration Y circulator with three channels, including two access channels and a link channel providing an RF connection between the two cells. This type of circulator thus has three channels at 120° to each other around a central body where the elements are located which give the circulator its non-reciprocity under the action of a magnetic field.

Le circulateur de la présente invention comporte la superposition de deux cellules comprenant chacune un noyau de matériau ferrite entouré de matériau diélectrique ou faiblement magnétique et assemblés par cofrittage. Chaque cellule comprend sur une de ses faces dite active des métallisations, comprenant des pistes reliées à des ports d'accès, et un piste de jonction, l'ensemble de ces pistes pouvant ainsi former une jonction Y et une connexion assurant la communication RF entre les deux cellules, la face opposée à la face active présentant un plan de masse, les deux cellules présentant ainsi un plan de masse mis en commun, une telle architecture permettant de réduire la surface occupée.The circulator of the present invention comprises the superposition of two cells each comprising a core of ferrite material surrounded by dielectric or weakly magnetic material and assembled by cosintering. Each cell comprises on one of its so-called active faces metallizations, comprising tracks connected to access ports, and a junction track, all of these tracks thus being able to form a Y junction and a connection providing RF communication between the two cells, the face opposite the active face having a ground plane, the two cells thus having a common ground plane, such an architecture making it possible to reduce the surface occupied.

Selon la figure 5, le circulateur hyperfréquence comprend une première cellule C1 superposée à une seconde cellule C2. Chaque cellule comprend sur une de ses faces dite active, des métallisations, comprenant des pistes Pi réalisant respectivement les voies 1, 2, 3 et 4.According to figure 5 , the microwave circulator comprises a first cell C 1 superimposed on a second cell C 2 . Each cell comprises on one of its so-called active faces, metallizations, comprising tracks Pi forming channels 1, 2, 3 and 4 respectively.

Chaque cellule comporte un noyau de matériau ferrite dont la surface est métallisée, reliée aux pistes 1, 2 et 5 (pour la première cellule) et reliée aux pistes 3, 4 et 5' (pour la seconde cellule). Le circulateur double cellule comporte en outre une connexion C1-2 reliant les voies 5 et 5' sous forme de via conducteur traversant la première cellule et la seconde cellule. Le plan de masse schématisé par le plan PM peut être constitué par exemple par la métallisation d'un des faces d'une des deux cellules et présentant une ouverture OPM.Each cell comprises a core of ferrite material whose surface is metallized, connected to tracks 1, 2 and 5 (for the first cell) and connected to tracks 3, 4 and 5' (for the second cell). The double-cell circulator further comprises a connection C 1-2 connecting channels 5 and 5' in the form of a conductive via passing through the first cell and the second cell. The ground plane schematized by the plane P M can be constituted for example by the metallization of one of the faces of one of the two cells and having an opening O PM .

Pour aimanter l'ensemble, un aimant non représenté sur la figure est reporté sur la face externe d'une des cellules, directement sur le disque de matériau ferrite métallisé ou bien à une distance prédéfinie, à l'aide d'une couche de matériau diélectrique faibles pertes servant « d'espaceur ».To magnetize the assembly, a magnet not shown in the figure is attached to the outer face of one of the cells, directly on the disc of metallized ferrite material or else at a predefined distance, using a layer of material low-loss dielectric serving as a “spacer”.

La hauteur totale d'aimant nécessaire peut ainsi être inférieure au cas classique où les deux cellules sont dans le même plan pour les deux raisons suivantes :

  • en superposant les deux cellules, l'aimant qui aimante la première cellule aimante également la deuxième cellule ;
  • le coefficient démagnétisant de l'ensemble des deux disques de matériau ferrite superposés diminuant, le champ démagnétisant diminue également.
The total height of magnet required may thus be lower than in the classic case where the two cells are in the same plane for the following two reasons:
  • by superimposing the two cells, the magnet which magnetizes the first cell also magnetizes the second cell;
  • the demagnetizing coefficient of the set of two superposed discs of ferrite material decreasing, the demagnetizing field also decreases.

De cette manière, on peut diminuer la hauteur totale des deux cellules superposées, on diminue ainsi le volume total du composant.In this way, the total height of the two superimposed cells can be reduced, thus reducing the total volume of the component.

La superposition décrite précédemment est réalisée à l'aide de la technologie de cofrittage multicouches.The superposition described above is carried out using multilayer cosintering technology.

Dans ce cas, les étapes de fabrication sont les suivantes :

  • réalisation de bandes de ferrite et de diélectrique par coulage ;
  • découpe desdites bandes ;
  • réalisation des vias par exemple par une opération de poinçonnage ;
  • remplissage des vias avec une encre métallique cofrittable ;
  • métallisation par sérigraphie des jonctions Y et des plans de masse ;
  • empilement des bandes par pressage à chaud ;
  • cofrittage de l'empilement.
In this case, the manufacturing steps are as follows:
  • production of ferrite and dielectric strips by casting;
  • cutting said strips;
  • production of the vias, for example by a punching operation;
  • filling the vias with a co-sinterable metallic ink;
  • metallization by screen printing of Y junctions and ground planes;
  • stacking of the strips by hot pressing;
  • cosintering of the stack.

Les éléments réalisés par sérigraphie peuvent également être réalisés par jet d'encre.Elements made by screen printing can also be made by inkjet.

Typiquement, les bandes coulées peuvent présenter une épaisseur d'une centaine de microns, l'épaisseur d'une structure présentant une épaisseur de quelques centaines de microns. Pour atteindre des épaisseurs de bandes de 500 microns, il est soit possible de disposer d'une unique bande de 500 microns d'épaisseur, soit de laminer 5 bandes de 100 microns.Typically, the cast strips can have a thickness of a hundred microns, the thickness of a structure having a thickness of a few hundred microns. To achieve strip thicknesses of 500 microns, it is either possible to have a single strip 500 microns thick, or to laminate 5 strips of 100 microns.

Afin de réduire l'encombrement des cellules, il est possible de prévoir des ruptures d'axe au niveau des pistes métalliques comme montré sur la figure 6 qui illustre vues de dessus les faces actives de chacune des cellules. Afin de favoriser les accès des ports, les ports d'accès d'une cellule ne sont pas positionnés en regard avec ceux de l'autre cellule, comme montré en figure 6 qui met en évidence les ports P1 et P2 de la première cellule C1 au niveau de deux côtés opposés et les ports P3 et P4 de la seconde cellule C2 sur un côté situé perpendiculairement aux côtés au niveau desquels sont positionnés les ports P1 et P2, les extrémités des voies référencées 5 et 5' étant connectables par un via reliant P5 et P5'
Afin de réaliser la connexion RF entre les deux cellules, il peut avantageusement être prévu de réaliser au moins un via conducteur.In order to reduce the size of the cells, it is possible to provide axis breaks at the level of the metal tracks as shown in the figure 6 which illustrates views from above of the active faces of each of the cells. In order to facilitate port access, the access ports of one cell are not positioned opposite those of the other cell, as shown in figure 6 which highlights the ports P 1 and P 2 of the first cell C 1 at the level of two opposite sides and the ports P 3 and P 4 of the second cell C 2 on a side located perpendicular to the sides at the level of which the ports P 1 and P 2 , the ends of the channels referenced 5 and 5' being connectable by a via connecting P5 and P5'
In order to make the RF connection between the two cells, provision may advantageously be made to make at least one conductive via.

Des exemples de structure sont donnés ci-après. Dans ces structures, les connexions verticales sont réalisées à l'aide de vias blindés constitués d'un via principal entouré de plusieurs autres vias périphériques de blindage. Le via principal connecte les jonctions Y alors que les vias périphériques sont reliés au plan de masse incorporé dans la superposition.Examples of structure are given below. In these structures, the vertical connections are made using shielded vias consisting of a main via surrounded by several other peripheral shielding vias. The main via connects the Y-junctions while the peripheral vias connect to the ground plane embedded in the overlay.

Un exemple de circulateur de type microstrip ou micro-ruban est ainsi illustré en figure 7 qui met en évidence la connexion réalisée entre les pistes de liaison. Cette connexion de cellules est assurée par un ensemble de via conducteurs comprenant un via central principal VP, entouré de vias périphériques ViB. Le plan de masse peut être réalisé par métallisation d'une des faces d'une cellule préalablement élaborée en ayant pris la précaution de laisser une ouverture OP de manière à ce que le via principal ne soit pas en contact avec ledit plan de mass PM. La figure 8 illustre le réglage du circulateur grâce à la présence de deux aimants 12, disposés de part et d'autres des jonctions Y, l'ensemble étant reporté sur un substrat S, présentant une partie diélectrique SD et une partie métallisée SM et comportant des pistes de connexion Pj.An example of a microstrip or micro-ribbon type circulator is thus illustrated in figure 7 which highlights the connection made between the connecting tracks. This cell connection is ensured by a set of conductor vias comprising a main central via V P , surrounded by peripheral vias V iB . The ground plane can be produced by metallization of one of the faces of a previously prepared cell, having taken the precaution of leaving an opening O P so that the main via is not in contact with said ground plane P M. The figure 8 illustrates the adjustment of the circulator thanks to the presence of two magnets 12, arranged on either side of the Y junctions, the assembly being transferred to a substrate S, having a dielectric part S D and a metallized part S M and comprising connecting tracks Pj.

Les variantes illustrées en figure 7 et en figure 8 concernent des structures de type microstrip ou micro-ruban, mais le concept peut aussi s'appliquer pour des structures de type triplaque. Il suffit pour cela de rajouter des parties symétriques comme indiqué en figure 9. Ainsi on réalise plus précisément la séquence suivante :

  • On réalise des bandes de ferrite et de diélectrique (ou ferrite faiblement magnétique) à l'épaisseur souhaitée. On peut pour des raisons pratiques préférer laminer des couches de ferrite et de diélectrique pour obtenir l'épaisseur souhaitée.
  • On découpe un disque de ferrite qu'on insère dans le diélectrique après l'avoir percé. On réalise ainsi 4 ensembles.
  • Sur l'ensemble C1', on métallise une face.
  • Sur l'ensemble C1, on métallise une face et on dépose une jonction Y1 sur l'autre face. On réalise un via au niveau de la piste 5 (perforation + remplissage d'encre métallique).
  • Sur l'ensemble C2, on réalise une jonction Y2 et un via au niveau de la piste 5'.
  • Sur l'ensemble C2', on métallise uniquement une face.
The variants illustrated in figure 7 and in figure 8 relate to structures of the microstrip or microstrip type, but the concept can also be applied to structures of the strip type. To do this, simply add symmetrical parts as indicated in figure 9 . Thus we achieve more precisely the following sequence:
  • Strips of ferrite and dielectric (or weakly magnetic ferrite) are made to the desired thickness. It may for practical reasons be preferred to laminate ferrite and dielectric layers to obtain the desired thickness.
  • A ferrite disc is cut and inserted into the dielectric after having drilled it. This makes 4 sets.
  • On the assembly C 1′ , one face is metallized.
  • On the assembly C 1 , one face is metallized and a junction Y1 is deposited on the other face. A via is made at track 5 (perforation + metallic ink filling).
  • On assembly C 2 , a junction Y2 and a via are made at the level of track 5'.
  • On the assembly C 2′ , only one side is metallized.

On empile les ensembles de façon à avoir du haut vers le bas la structure suivante : plan de masse PMS - ensemble C1' avec jonction Y1 - ensemble C1 - plan de masse PM - ensemble C2 avec jonction Y2 - ensemble C2' - plan de masse PMI, comme illustré en figure 9.The assemblies are stacked so as to have, from top to bottom, the following structure: ground plane P MS - assembly C 1' with junction Y1 - assembly C 1 - ground plane P M - assembly C 2 with junction Y2 - assembly C 2' - PMI ground plane, as shown in figure 9 .

Les ensembles C1 et C2 ont un via d'encre métallique.Sets C 1 and C 2 have a metallic ink via.

Le plan de masse 2 n'est pas métallisé sur toute la surface, pour laisser le passage du via reliant 5 et 5'. Pour les accès 1 2 3 4, la traversée des plans de masse est assurée en supprimant la métallisation autour des vias de connexion. Les accès 1 et 2 peuvent se trouver sur les faces perpendiculaires comme illustré en figure 10.The ground plane 2 is not metallized over the entire surface, to allow the passage of the via connecting 5 and 5'. For accesses 1 2 3 4, the crossing of the ground planes is ensured by removing the metallization around the connection vias. Accesses 1 and 2 can be on the perpendicular faces as illustrated in figure 10 .

Même si la hauteur du composant réalisé est augmentée, on parvient ainsi à réduire les dimensions dans le plan (diamètre du disque de matériau ferrite, largeur et longueur des pistes métalliques) et à améliorer les performances en termes d'isolation et de pertes d'insertion.Even if the height of the component produced is increased, it is thus possible to reduce the dimensions in the plane (diameter of the disc of ferrite material, width and length of the metal tracks) and to improve the performance in terms of insulation and losses of insertion.

Plus précisément, cette configuration triplaque comporte quatre ensembles de noyau de ferrite entouré de matériau diélectrique. On réalise sur deux d'entre eux des jonctions Y, pour réaliser les cellules C1 et C2, sur les faces opposées aux faces comportant les jonctions Y, l'une des faces au moins est métallisée pour constituer le plan de masse interne référencé en figure 9, plan de masse PM. La structure triplaque comporte de manière symétrique, deux autres ensembles C1' et C2' présentant également un noyau de ferrite entouré de matériau diélectrique non représenté. L'ensemble C1' est en regard de la cellule C1, l'ensemble C2' est en regard de la cellule C2'.Specifically, this three-plate configuration has four sets of ferrite core surrounded by dielectric material. Y junctions are made on two of them, to make the cells C 1 and C 2 , on the faces opposite the faces comprising the Y junctions, at least one of the faces is metallized to form the internal ground plane referenced in figure 9 , ground plane P M . The three-plate structure comprises, symmetrically, two other sets C 1 ' and C 2' also having a ferrite core surrounded by dielectric material, not shown. The assembly C 1′ faces the cell C 1 , the assembly C 2′ faces the cell C 2′ .

Un plan de masse supérieur est réalisé sur la face externe de l'ensemble C1', un plan de masse inférieur est réalisé sur la face externe de l'ensemble C2'. Les trois de plans de masse PMS, PM et PMi sont reliés entre eux par des vias conducteurs périphériques ViB , la connexion entre les jonctions Y des deux cellules est assurée par le via conducteur principal VP.An upper ground plane is produced on the external face of assembly C 1' , a lower ground plane is produced on the external face of assembly C 2' . The three ground planes P MS , P M and P Mi are interconnected by peripheral conductive vias V iB , the connection between the Y junctions of the two cells is ensured by the main conductive via V P .

Cette technologie de fabrication permet alors de réaliser des composants de type CMS : « Composant Monté en Surface » possédant des connexions Cxi sur une seule face qui peuvent être soudés de manière automatique.This manufacturing technology then makes it possible to produce SMT type components: “Surface Mounted Component” with Cxi connections on one side only, which can be soldered automatically.

Claims (15)

  1. A method for manufacturing a microwave circulator comprising:
    - stacking a first cell (C1)and a second cell (C2);
    - producing the first cell, comprising a core of ferrite material surrounded by dielectric or weakly magnetic material, and the second cell, comprising a core of ferrite material surrounded by dielectric or weakly magnetic material;
    - producing access tracks (1, 2) connected to two access ports (P1, P2), and a connection track (5) connected to a connection port (P5) on one of the faces, called active face, of said first cell,
    - producing access tracks (3, 4) connected to two access ports (P3, P4), and a connection track (5') connected to a connection port (P5') on one of the faces, called active face, of said second cell,
    - the two access ports (P1, P2) of the first cell (C1)being located on two opposite sides of said first cell and the two access ports (P3, P4) of the second cell (C2) being positioned on one side of the second cell located perpendicular to the sides on which the two ports (P1, P2) of the first cell are positioned;
    - producing a ground plane (PM) on one of the faces opposite one of the active faces of said cells;
    - assembling said first cell and said second cell;
    - producing a connection (C1-2) between the connection track (5) of said first cell and the connection track (5') of said second cell;
    - a step of co-sintering for securing the structure of the circulator in the three dimensions.
  2. The method according to claim 1, wherein the cells comprise one or more co-sintered layers of ferrite material or dielectric material or weakly magnetic material.
  3. The method according to one of claims 1 or 2, wherein said connection of cells comprises at least one main conductive via (VP) passing through said first cell and said second cell.
  4. The method according to any of the preceding claims, wherein the circulator has a co-sintered three-plate structure comprising:
    - an upper ground plane (PMS);
    - a first cell;
    - a second cell;
    - a lower ground plane (PMI).
  5. The method according to claim 4, wherein the first cell is covered by an assembly (C1') comprising a core of ferrite material surrounded by dielectric or weakly magnetic material, the second cell being covered by an assembly (C2') comprising a core of ferrite material surrounded by dielectric material.
  6. The method according to claim 3, or according to any of claims 4 to 5 when they are dependent on claim 3, wherein said cells further comprise secondary conductive vias (ViB) emerging at the ground plane(s) and distributed around said main conductive via.
  7. The method according to any of the preceding claims, wherein the circulator comprises at least one magnet (12) attached to at least one cell or one of the upper or lower ground planes.
  8. The method according to any of claims 1 to 7, wherein the ferrite material has a garnet structure.
  9. The method according to claim 8, wherein the ferrite material with a garnet structure corresponds to the following chemical formula:

            YaTRbBib'FecAldIneCafCugZrhViCojSikO12 ± γ,

    with TR being: a rare earth or a combination of rare earths and:
    -1 ≤ γ ≤ 1;
    3(a+b+b'+c+d+e) + 2 (f+g+j) + 4 (h+k) + 5i = 24+2γ;
    1 ≤ a ≤ 3.5;
    0 ≤ b ≤ 1.5;
    0 < b' ≤ 1;
    4 ≤ c ≤ 5;
    0 ≤ d ≤ 1.5;
    0 ≤ e ≤ 0.8;
    0 ≤ f ≤ 1;
    0 < g < 0.05;
    0 ≤ h ≤ 1;
    0 ≤ i ≤ 0.8;
    0 ≤ j ≤ 0.5;
    0 ≤ k ≤ 0.5;
    with b + d ≤ 1.
  10. The method according to any of the preceding claims, wherein the dielectric material is a material with a garnet structure with weak magnetic magnetization.
  11. The method according to claim 10, wherein the material with a garnet structure with weak magnetic magnetization corresponds to the following chemical formula:

            YaTRbBib'FecAldIneCafCugZrhViCojSikO12 ± γ,

    with TR being: a rare earth or a combination of rare earths and:
    -1 ≤ γ ≤ 1;
    3(a+b+b'+c+d+e) + 2 (f+g+j) + 4 (h+k) + 5i = 24+2γ;
    1 ≤ a ≤ 3.5;
    0 ≤ b ≤ 1.5;
    0 < b' ≤ 1;
    4 ≤ c ≤ 5;
    0 ≤ d ≤ 1.5;
    0 ≤ e ≤ 0.8;
    0 ≤ f ≤ 1;
    0 < g < 0.05;
    0 ≤ h ≤ 1;
    0 ≤ i ≤ 0.8;
    0 ≤ j ≤ 0.5;
    0 ≤ k ≤ 0.5;
    with b + d ≥ 1.2.
  12. The method for manufacturing a microwave circulator according to one of claims 1 to 11, comprising producing at least one conductive via in said assembly to obtain said connection between the connection track of said first cell and the connection track of said second cell.
  13. The method for manufacturing a microwave circulator according to one of claims 1 to 12, wherein the production of a first cell comprising a core of ferrite material surrounded by dielectric material and a second cell comprising a core of ferrite material surrounded by dielectric or weakly magnetic material is carried out by co-sintering a multilayer stack, with each of the layers comprising a core of ferrite material surrounded by dielectric or weakly magnetic material.
  14. The method for manufacturing a microwave circulator according to one of claims 1 to 13, comprising the following steps:
    - producing strips of ferrite material and of dielectric or weakly magnetic material by casting;
    - cutting said strips;
    - producing at least one via;
    - filling at least said via with a metal ink;
    - producing access and connection tracks joined together at the core of ferrite material on a sub-set of strips and ground planes on some other strips;
    - stacking said strips by hot pressing;
    - co-sintering said stack resulting in the joining together of the multilayer structure.
  15. A microwave circulator obtained according to the manufacturing method of any of claims 1 to 14.
EP17177380.7A 2016-06-23 2017-06-22 Compact double-cell hyperfrequency circulator and manufacturing method Active EP3261170B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1601002A FR3053162B1 (en) 2016-06-23 2016-06-23 DUAL-DIMENSIONAL CELLULAR HYPERFREQUENCY CIRCULATOR AND MANUFACTURING METHOD THEREOF

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EP3261170B1 true EP3261170B1 (en) 2022-04-06

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11843152B2 (en) 2020-12-04 2023-12-12 Skyworks Solutions, Inc. Surface mount microstrip circulators using a ferrite and ceramic dielectric assembly substrate
US11848472B2 (en) 2021-08-17 2023-12-19 Skyworks Solutions, Inc. Differential circulator

Citations (1)

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Publication number Priority date Publication date Assignee Title
US20020093392A1 (en) * 1998-10-23 2002-07-18 Keiichi Ohata Microwave-millimeter wave circuit apparatus and fabrication method thereof having a circulator or isolator

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US3781704A (en) * 1972-03-30 1973-12-25 Cutler Hammer Inc High isolation circulator arrangement for low noise reflection type amplifiers
SE0101042D0 (en) * 2001-03-23 2001-03-23 Ericsson Telefon Ab L M Circulator and network
DE10127359A1 (en) * 2001-06-06 2002-12-12 Siemens Ag Circulator-component e.g. for mobile telephone device, has circulator-conductor structures arranged over one another
US7256661B2 (en) * 2005-04-08 2007-08-14 The Boeing Company Multi-channel circulator/isolator apparatus and method
FR2965393B1 (en) * 2010-09-27 2012-09-14 Thales Sa FERRITE GRENAT D'YTTRIUM-FER, AND MANUFACTURING METHOD THEREOF, HYPERFREQUENCY COMPONENT INCLUDING THEM AND METHODS OF MAKING SAME
US9136572B2 (en) * 2013-07-26 2015-09-15 Raytheon Company Dual stripline tile circulator utilizing thick film post-fired substrate stacking

Patent Citations (1)

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Publication number Priority date Publication date Assignee Title
US20020093392A1 (en) * 1998-10-23 2002-07-18 Keiichi Ohata Microwave-millimeter wave circuit apparatus and fabrication method thereof having a circulator or isolator

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EP3261170A1 (en) 2017-12-27
FR3053162A1 (en) 2017-12-29
ES2913125T3 (en) 2022-05-31

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