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EP3043111B1 - Signalling device - Google Patents

Signalling device Download PDF

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Publication number
EP3043111B1
EP3043111B1 EP15150795.1A EP15150795A EP3043111B1 EP 3043111 B1 EP3043111 B1 EP 3043111B1 EP 15150795 A EP15150795 A EP 15150795A EP 3043111 B1 EP3043111 B1 EP 3043111B1
Authority
EP
European Patent Office
Prior art keywords
signalling
circuit board
elements
contact
signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP15150795.1A
Other languages
German (de)
French (fr)
Other versions
EP3043111A1 (en
EP3043111B2 (en
Inventor
Michael Auer
Thomas Fehringer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Auer Signal GmbH
Original Assignee
Auer Signal GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=52347167&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=EP3043111(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Auer Signal GmbH filed Critical Auer Signal GmbH
Priority to ES15150795.1T priority Critical patent/ES2631809T3/en
Priority to EP15150795.1A priority patent/EP3043111B2/en
Priority to EP17164549.2A priority patent/EP3205933A1/en
Priority to PL15150795T priority patent/PL3043111T3/en
Priority to US14/993,549 priority patent/US10127779B2/en
Publication of EP3043111A1 publication Critical patent/EP3043111A1/en
Publication of EP3043111B1 publication Critical patent/EP3043111B1/en
Application granted granted Critical
Priority to US16/189,235 priority patent/US10475304B2/en
Publication of EP3043111B2 publication Critical patent/EP3043111B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • GPHYSICS
    • G08SIGNALLING
    • G08BSIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B7/00Signalling systems according to more than one of groups G08B3/00 - G08B6/00; Personal calling systems according to more than one of groups G08B3/00 - G08B6/00
    • G08B7/06Signalling systems according to more than one of groups G08B3/00 - G08B6/00; Personal calling systems according to more than one of groups G08B3/00 - G08B6/00 using electric transmission, e.g. involving audible and visible signalling through the use of sound and light sources
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S10/00Lighting devices or systems producing a varying lighting effect
    • F21S10/02Lighting devices or systems producing a varying lighting effect changing colors
    • F21S10/023Lighting devices or systems producing a varying lighting effect changing colors by selectively switching fixed light sources
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00Lighting devices intended for fixed installation
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21WINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2131/00Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
    • F21W2131/40Lighting for industrial, commercial, recreational or military use
    • F21W2131/403Lighting for industrial, commercial, recreational or military use for machines
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Definitions

  • the invention relates to a signaling device, in particular for a signal tower, for displaying operating states, with at least one signal module having a printed circuit board element for at least one signal element for emitting a signal, in particular for a luminous element for emitting a signal light, wherein the signal module releasably with a further signal module is connectable and the signal modules are arranged one above the other in the connected state, wherein the signal module has a bayonet connection element for connection to a bayonet connection element of the further signal module and a connecting line extending through the signal module is provided for driving a printed circuit board element of the further signal module.
  • Such a signaling device with a plurality of signal modules is known from EP 1 460 332 A2
  • the signal modules each have a horizontally arranged printed circuit board element for at least one signal element ur output of a signal.
  • the signal modules have wires extending through the respective signal module as connecting lines for driving a printed circuit board element of the further signal module. For electrical connection between the wires of adjacent signal modules in the connected state and for contacting the printed circuit board element plate elements are mounted on the circuit boards.
  • the luminous column has a plurality of signal elements which are substantially identical in their design and are arranged one above the other and which are connected to one another by means of a closure connection.
  • the signal elements consist of a cylinder part for receiving an optical or acoustic signal transmitter and electrical connecting lines, which are used for individual power supply of the signal elements.
  • the electrical connection lines are formed as wires, each having at its one end an approximately U-shaped, lying in an approximately tangentially oriented plane connecting bridge and at its other end an angled connecting web.
  • the connecting bridge of a signal element acts during assembly of two adjacent Signal elements with the connecting web of the adjacent light-emitting element by a resilient wire connection non-positively together.
  • the electrical contact is made when the individual signal elements are mechanically connected to each other via a bayonet connection.
  • connection or feed lines disturb the optionally emitted by the signal element photo.
  • the assembly is time-consuming and costly.
  • the arrangement of the connection or feed lines within the signal elements requires a lot of space. As a result, the number of signal elements which can be arranged one above the other is limited for a given diameter of the cylindrical receiving part.
  • a signal tower has already been proposed in the prior art, in which the signal modules each have a printed circuit board.
  • the signal modules are plugged into each other in this embodiment, wherein the circuit boards are interconnected.
  • this embodiment is disadvantageous in that the contacting between two printed circuit boards and the connection between two adjoining signal modules must be made separately.
  • the object of the present invention is to provide a generic signaling device of the type mentioned, in which the contacting of the individual signal modules with structurally simple, small footprint-requiring means is accomplished, the signal modules can be further disassembled without the use of tools at any point and reassembled.
  • the printed circuit board element of the signal module for forming the connecting line to a signal element of the further signal module associated conductor track which is connected in the connected state of the signal modules via a contact element with a conductor on the circuit board element of the further signal module, wherein the circuit board elements in a mated, untwisted state of Bayonet connection elements are arranged in a non-contact position and in a mated, twisted state of the bayonet connection elements in a contact position to each other.
  • signal elements lighting elements, for example light-emitting diodes, or sound signal elements can be provided.
  • connection lines or feed lines running outside of the circuit board elements for example, in the form of wire or platelets.
  • Such connecting or feeding lines were arranged in the prior art at a distance from each other on the inside of the signal modules, extending in the axial direction, which - to keep optical defects within an acceptable range - the number superimposed on one another signal modules was virtually limited.
  • the assembly / Assemblieraufwand increased with the number of connecting or feed lines.
  • the printed circuit board element serves not only to control or supply the signal element located thereon, but also to forward control or supply signals to the signal elements overlying signal modules.
  • the printed circuit board element has at least one conductor track, which is set up to forward electrical control or supply signals to an overlying signal module.
  • each printed circuit board element has at least one conductor track connected to the signal element of this signal module in order in particular to set the luminous state of the luminous element on the respective signal module;
  • the circuit board element but also have several, supplied via different tracks signal elements.
  • the assembly / assembly effort is advantageously substantially independent of the number of tracks.
  • the printed circuit board elements are electrically conductively connected to one another via at least two contact elements.
  • at least the lowermost signal module has a plurality of interconnects for the forwarding of control or supply signals to a plurality of signal modules located above them on, with a corresponding number of contact elements is provided between the signal modules.
  • the signal device can, preferably at the lower end, have a base element, which is supplied with the control or supply signals for the individual signal modules via connection means known per se in the prior art.
  • the embodiment according to the invention has the particular advantage that the number of individually mountable or demountable signal modules that can be arranged one above the other can be increased (for a given diameter).
  • the contacting of the circuit board elements during assembly of the signaling device can be made more reliable.
  • the embodiment of the invention is particularly stable.
  • Another advantage of the invention is that the mounting of the signaling device can be carried out more simply and therefore more cost-effectively.
  • cost advantages can also be achieved by the partially-saving design.
  • it is advantageous that the light output of the signal modules to the environment is not hindered by feed lines.
  • the signal module has a bayonet connection element for connection to a bayonet connection element of the further signal module, wherein the circuit board elements are arranged in a mated, untwisted state of the bayonet connection elements in a non-contact position and in a mated, twisted state of the bayonet connection elements in a contact position to each other.
  • the signal modules via bayonet connections releasably connect to each other.
  • the signal modules have cooperating bayonet connection elements, which are formed by a bayonet projection on the one signal module and a bayonet opening on the other signal module.
  • the bayonet connection elements can be connected to one another via a plug-in rotary movement, wherein the bayonet projection is first inserted through an entrance region of the bayonet opening extending in the axial direction and then twisted along a securing section of the bayonet opening extending substantially at right angles thereto.
  • the mechanical connection via the bayonet connection elements is coupled to the electrical connection between the circuit board elements.
  • the contact elements of a signal module in the assembled, untwisted state of the bayonet connection elements are arranged in a non-contact position to the corresponding contact points of the other signal module.
  • the printed circuit board element extends substantially over the entire height of the signal module, wherein the contact element in the connected state of the signal modules between a top contact point of a printed circuit board element and a lower-side contact point of the other printed circuit board element is arranged.
  • This embodiment is preferably provided in a signal module with a luminous element.
  • the terms “up” and “down” refer to a substantially vertical operating position of the signaling device in which the signal modules are stacked.
  • the printed circuit board element is preferably arranged in a substantially vertical position within the signal module, wherein the printed circuit board element extends over substantially the entire height of the associated signal module.
  • the printed circuit board element extends over substantially the entire height of the associated signal module.
  • at least two interconnects of this signal module are connected via at least two contact elements with associated interconnects of the overlying signal module. Accordingly, the signal transmission takes place substantially over the entire height of the signal device along the conductor tracks of the printed circuit board elements, wherein the successive signal modules are contacted by the contact elements.
  • a resiliently deflectable contact spring is provided as the contact element, which connects the printed circuit board elements together in the connected state of the signal modules.
  • contact springs are provided which are created in the manufacture of the mechanical connection between the signal modules at the corresponding contact points of the respective printed circuit board element.
  • the printed circuit board element has contact points, protruding from the upper and the lower end side of the printed circuit board elements pin elements, wherein the lower or upper side pin elements with the contact elements are connected and the top and bottom pin elements are free of contact elements. Accordingly, the contact points of the printed circuit board element on one side, preferably on the underside, connected to contact elements and on the other side, preferably on the top, free of such contact elements.
  • the signal module has an attachment element connected to the printed circuit board element with a connecting element.
  • the installation of the signaling device can be made with little effort if the connecting element via a releasable connection, preferably a locking connection, in an outer housing, preferably with a cylindrical outer surface, is added.
  • the connecting element together with the circuit board element is snapped or latched in the outer housing.
  • the outer housing preferably has a cylindrical outer surface which is formed on one side with a lid or bottom part and on the other side with a holding opening for connection to the further signal module.
  • the bayonet connection elements in the form of the bayonet projections or the bayonet openings are preferably provided at opposite ends of the lateral surface, in each case adjacent to the cover / bottom part or the holding opening.
  • the printed circuit board element can be arranged essentially completely within an attachment element comprising the connecting element.
  • an attachment element in the manner of a housing, the printed circuit board element and in particular also the contact elements are substantially completely protected against mechanical influences, in particular when connecting the signal modules.
  • At least one protective element is provided at least partially enclosing the contact elements.
  • the protective element has a plurality of, preferably pin-shaped or peg-shaped projections, which are arranged adjacent to the contact elements.
  • two rows of such projections are provided, between which the contact elements are arranged, wherein a first row comparatively short projections and a second row are provided comparatively long projections.
  • the contact points, in particular pin elements, of a further printed circuit board element, with which a contact is to be made, are advantageously arranged when merging the signal modules such that they can be rotated over the short projections on closing the bayonet closure, without coming into contact with them.
  • the long projections can advantageously so be formed so that they cover the contact elements substantially over the entire length at the side on which the contact elements are not intended for contact with a contact point, so that access or damage to the contact elements is prevented as possible.
  • a cover / bottom element of the further signal module or an attachment element of another printed circuit board element has at least one arcuately curved passage opening.
  • Contact elements and possibly contact protection projections of a signal module can thus be inserted in the assembled, untwisted state in through holes of the other signal module.
  • the contact elements as well as the (protection against contact) projections are then guided in the arcuate through holes.
  • the stop position which is preferably defined by the bayonet connection, the electrical contact between the circuit board elements is made via the contact elements.
  • At least one optical element is connected to the printed circuit board element having at least one optical lens, wherein preferably the number of lenses substantially corresponds to a number of light emitting diodes provided as signal element.
  • a connecting element for an outer housing and a directed delivery of the generated light beams in a structurally simple and cost-effective manner it is advantageous if at least one attachment element comprising the connecting element, the protective element and the optical element is provided.
  • the assembly of the signaling device can be made particularly simple if the attachment element has two half-shells, which are connected to one another via a detachable connection, preferably a latching connection.
  • the printed circuit board element is arranged between the half-shells of the attachment element, wherein the printed-circuit board element, however, can protrude laterally beyond the composite half-shells.
  • At least one printed circuit board element has more than three, preferably at least five, in particular eight, printed conductors for the control of a corresponding number of signal modules.
  • At least two interconnected signal modules arranged one above the other in the connected state are provided.
  • at least two similar signal modules are provided as light signal modules with luminous elements.
  • a signal module may be provided with a sound signal element.
  • a signaling device 1 for displaying operating conditions of a machine or a plant component is shown.
  • the signaling device is designed as a signal tower with a plurality of signal modules 2, which, as will be explained in more detail below, are detachably connectable to each other.
  • the individual signal modules 2 are arranged one above the other.
  • the signal modules 2 'each have an outer housing 3, which with a cylindrical, partially transparent and each in another Color running lateral surface 4 and a lid 5 is formed (see. Fig. 4, 5 ).
  • the signal modules 2 are arranged in a known manner on a base element 6, which is connected via (schematically drawn) electrical connection means with the (not shown) machine. Accordingly, the control of all signal modules 2 takes place via the common connection means of the base element 6.
  • the optical signal modules 2 'each have at least one luminous element on the printed circuit boards 7.
  • a luminous element in particular at least one light-emitting diode (LED) is provided, wherein the in Fig. 8
  • Signal element 8 shown comprises a total of six LEDs (three on each side of the printed circuit board element).
  • the signal modules which in the embodiment shown as in Fig. 8 schematically apparent interconnects 10 are integrated into the circuit board elements 7.
  • each circuit board element 7 has a leading to the next signal module 2 "0" conductor track 10 '. Furthermore, in each case at least one conductor track 10 "is provided, which establishes a connection from the contact element” 1 "to the right of the" 0 "track via the respective signal element 8 to the" 0 "track, as well as further conductive tracks 10 '". , By applying voltage to the "0" conductor track and one of the connection terminals 9 '"1" to "7", a corresponding signal module 2 can thus be activated.
  • the signal modules 2 to the releasable connection bayonet connection elements 14 which are formed by bayonet projections 15 at an inwardly offset upper edge region of the lateral surface 4 of the outer housing 3 and corresponding bayonet openings 16 at the opposite lower edge region of the outer surface 3 of the outer housing ,
  • the bayonet connection elements 14 of signal modules 2 arranged one above the other can be connected to one another in a known manner via a plug-in rotary connection.
  • the bayonet projections 15 are guided on the lower signal module 2 in an axially extending input region 16a of the bayonet opening 16.
  • the signal modules 2 are rotated against each other, wherein the bayonet projections 15 are displaced along horizontal securing portions 16 b of the bayonet openings 16.
  • the contact elements 11 of the one (upper) signal module 2 are arranged in the mated, untwisted state of the bayonet connection elements 14 at a distance from the corresponding contact points of the other signal module 2.
  • the contact points 12, 13 superimposed signal modules 2 are brought into conductive contact.
  • the signal line can be released or separated by the successive signal modules 2 via the bayonet connection.
  • the lower-side pin elements 17 "are each connected to the contact elements 11, whereas the upper-side pin elements 17 'are free of such contact elements 11.
  • the signal modules 2 each have an attachment element 18 for the associated printed circuit board element 7, wherein in a first embodiment, the associated circuit board element 7 is substantially completely received within the attachment element 18.
  • the attachment element 18 has in a lower portion a protective element 25, with two rows of projections 19, one row being provided with longer projections 19 'and one row with shorter projections 19 ", the contact elements 11 each being between the projections serving as protection against contact 19 ', 19 "arranged.
  • the longer projections 19 ' cover the contact elements 11 on the side on which no contact is made, substantially entirely.
  • the shorter projections 19 '' release an end section of the contact elements 11 for contacting purposes.
  • the contact elements 11 as well as the projections 19 ', 19' are accommodated in corresponding passage openings 20 at the top of the attachment element 18 of the adjacent signal module 2 when two signal modules 2 are brought together.
  • the passage openings 20 of the attachment element 18 are arcuately curved.
  • the pin-shaped projections 19 of the one (upper) signal module 2 are therefore moved in the arcuately curved passage openings 20 of the other (lower) signal module 2. Accordingly, the procedure is for the respective number of signal modules 2.
  • the arrangement of the longer 19 'or shorter projections 19 is on the opposite radial sections of the attachment element 18 reversed.
  • a contacting of adjacent circuit board elements 7 is reliably produced.
  • the configuration of the shorter projections 19 assures that the contacting between the circuit board elements 7 when connecting the signal modules 2 is not hindered.
  • the attachment element 18 has two half-shells 22, which are connected to one another via a latching connection 23.
  • the attachment element 18 has a connection element 24, in which the passage openings 20 are provided, a protective element 25 with projections 19 ', 19 "and an optical element 26.
  • the optical element 26 has a number of lenses 27, with which of the light beams emitted by the respectively associated LED of the signal element 8 is expediently distributed or directed
  • the attachment element 18 itself is mounted in the outer housing 3 via a snap connection 29.
  • FIG. 11 to 13 is another embodiment can be seen in which the attachment element 18 is significantly reduced compared to the first embodiment. That is, this attachment element 18 does not enclose the printed circuit board element 7 in the manner of a protective housing, but rather a printed circuit board element 7 is provided with a substantially constant width, which extends clearly above the attachment element 18, in particular in the region of the optical element 26 and the connecting element 24. Moreover, the attachment element 18, as described in connection with the first embodiment, a connecting element 24 with locking projections 24 'for attachment to the housing 3 and a separately or integrally formed with the housing 3 cover 5.
  • the protective element 25 still encloses, in particular for the protection of contact elements 11, a lower end section of the printed circuit board element 7, the contact elements 11 between a row, as already described in detail in connection with the first exemplary embodiment short projections 19 "and long projections 19 'of the protective element 25 are received.
  • the attachment element 18 is essentially composed of two half-shells 22, wherein the circuit board element 7 openings 31, 32 through which structurally simple connection between the two half-shells 22 of the attachment element 18 and the printed circuit board element 7 Connecting elements of the respective half-shell, in particular latching hooks 34 or connecting pins 35, for the purpose of producing a plug connection with the opposite half-shell of the attachment element 18 can be passed.
  • the circuit board element 7 openings 31, 32 through which structurally simple connection between the two half-shells 22 of the attachment element 18 and the printed circuit board element 7 Connecting elements of the respective half-shell, in particular latching hooks 34 or connecting pins 35, for the purpose of producing a plug connection with the opposite half-shell of the attachment element 18 can be passed.
  • latching hooks 34 or connecting pins 35 for the purpose of producing a plug connection with the opposite half-shell of the attachment element 18 can be passed.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Description

Die Erfindung betrifft eine Signalvorrichtung, insbesondere für eine Signalsäule, zum Anzeigen von Betriebszuständen, mit zumindest einem Signalmodul, welches ein Leiterplattenelement für zumindest ein Signalelement zur Abgabe eines Signals, insbesondere für ein Leuchtelement zur Abgabe eines Signallichtes, aufweist, wobei das Signalmodul lösbar mit einem weiteren Signalmodul verbindbar ist und die Signalmodule im verbundenen Zustand übereinander angeordnet sind, wobei das Signalmodul ein Bajonettverbindungselement zur Verbindung mit einem Bajonettverbindungselement des weiteren Signalmoduls aufweist und eine durch das Signalmodul verlaufende Verbindungsleitung zur Ansteuerung eines Leiterplattenelements des weiteren Signalmoduls vorgesehen ist.The invention relates to a signaling device, in particular for a signal tower, for displaying operating states, with at least one signal module having a printed circuit board element for at least one signal element for emitting a signal, in particular for a luminous element for emitting a signal light, wherein the signal module releasably with a further signal module is connectable and the signal modules are arranged one above the other in the connected state, wherein the signal module has a bayonet connection element for connection to a bayonet connection element of the further signal module and a connecting line extending through the signal module is provided for driving a printed circuit board element of the further signal module.

Eine derartige Signalvorrichtung mit mehreren Signalmodulen ist aus der EP 1 460 332 A2 bekannt, wobei die Signalmodule jeweils ein horizontal angeordnetes Leiterplattenelement für zumindest ein Signalelement ur Abgabe eines Signals aufweisen. Zudem weisen die Signalmodule durch das jeweilige Signalmodul verlaufende Drähte als Verbindungsleitungen zur Ansteuerung eines Leiterplattenelements des weiteren Signalmoduls auf. Zur elektrischen Verbindungherstellung zwischen den Drähten benachbarter Signalmodule im verbundenen Zustand und zur Kontaktierung des Leiterplattenelements sind Plattenelementen auf den Leiterplatten aufgesteckt.Such a signaling device with a plurality of signal modules is known from EP 1 460 332 A2 The signal modules each have a horizontally arranged printed circuit board element for at least one signal element ur output of a signal. In addition, the signal modules have wires extending through the respective signal module as connecting lines for driving a printed circuit board element of the further signal module. For electrical connection between the wires of adjacent signal modules in the connected state and for contacting the printed circuit board element plate elements are mounted on the circuit boards.

Eine weitere Leuchtsäule zum Anzeigen von Betriebszuständen, beispielsweise von Fehlern an automatisch arbeitenden Maschinen, ist beispielsweise aus der DE 195 13 983 A1 bekannt. Die Leuchtsäule weist mehrere, ihrer Bauart nach im Wesentlichen gleiche, übereinander angeordnete Signalelementen auf, die mittels einer Verschlussverbindung miteinander verbunden sind. Die Signalelemente bestehen aus einem Zylinderteil zur Aufnahme eines optischen bzw. akustischen Signalgebers und aus elektrischen Verbindungsleitungen, die zur individuellen Stromversorgung der Signalelemente dienen. Die elektrischen Verbindungsleitungen sind als Drähte ausgebildet, die jeweils an ihrem einen Ende eine etwa U-förmige, in einer etwa tangential ausgerichteten Ebene liegende Verbindungsbrücke und an ihrem anderen Ende einen abgewinkelten Verbindungssteg aufweisen. Die Verbindungsbrücke des einen Signalelements wirkt beim Zusammenbau zweier benachbarter Signalelemente mit dem Verbindungssteg des benachbarten Leuchtelements durch eine federnde Drahtverbindung kraftschlüssig zusammen. Dadurch wird die elektrische Kontaktierung vorgenommen, wenn die einzelnen Signalelemente über eine Bajonettverbindung mechanisch miteinander verbunden werden.Another light column for displaying operating conditions, such as errors in automatic machines, for example, from DE 195 13 983 A1 known. The luminous column has a plurality of signal elements which are substantially identical in their design and are arranged one above the other and which are connected to one another by means of a closure connection. The signal elements consist of a cylinder part for receiving an optical or acoustic signal transmitter and electrical connecting lines, which are used for individual power supply of the signal elements. The electrical connection lines are formed as wires, each having at its one end an approximately U-shaped, lying in an approximately tangentially oriented plane connecting bridge and at its other end an angled connecting web. The connecting bridge of a signal element acts during assembly of two adjacent Signal elements with the connecting web of the adjacent light-emitting element by a resilient wire connection non-positively together. As a result, the electrical contact is made when the individual signal elements are mechanically connected to each other via a bayonet connection.

Auch aus der EP 1 650 489 A2 ist eine Signalvorrichutung mit mehreren lösbar miteinander verbundenen Signalmodulen bekannt, die außerhalb des eingesetzten Elektronikträgers geführte Drähte zur Herstellung einer elektrischen Verbindung zwischen den Signalmodulen beim Zusammenfügen der Signalmodule aufweist.Also from the EP 1 650 489 A2 a Signalvorrichutung with a plurality of detachably interconnected signal modules is known, the outside of the electronics carrier used guided wires for establishing an electrical connection between the signal modules in the assembly of the signal modules.

Nachteilig an diesem Stand der Technik ist insbesondere, dass Verbindungs- bzw. Speiseleitungen das vom Signalelement gegebenenfalls abgegebene Lichtbild stören. Zudem ist die Assemblierung zeit- und kostenaufwändig. Darüber hinaus bringt die Anordnung der Verbindungs- bzw. Speiseleitungen innerhalb der Signalelemente einen hohen Platzbedarf mit sich. Dadurch ist die Anzahl der übereinander anordenbaren Signalelemente bei gegebenem Durchmesser des zylindrischen Aufnahmeteils limitiert.A disadvantage of this prior art is in particular that connection or feed lines disturb the optionally emitted by the signal element photo. In addition, the assembly is time-consuming and costly. In addition, the arrangement of the connection or feed lines within the signal elements requires a lot of space. As a result, the number of signal elements which can be arranged one above the other is limited for a given diameter of the cylindrical receiving part.

Darüber hinaus ist aus der EP 1 347 233 A2 eine Signalsäule mit mehreren Segmenten unterschiedlicher Farbe bekannt geworden, bei welcher eine sich durch alle Segmente erstreckende Leiterplatte vorgesehen ist, die Leuchtdioden als Leuchtmittel trägt. Die Leuchtdioden sind jeweils einem Segment zugeordnet, wobei die Leuchtdioden verschiedener Segmente separat ansteuerbar sind. Bei dieser Ausführung ist jedoch nachteilig, dass die Variabilität der Leuchtsäule für verschiedene Anwendungen verloren geht.In addition, from the EP 1 347 233 A2 a signal tower with several segments of different color has become known, in which a through all segments extending circuit board is provided which carries light emitting diodes as a light source. The LEDs are each associated with a segment, the LEDs of different segments can be controlled separately. In this embodiment, however, is disadvantageous that the variability of the light column is lost for different applications.

Darüber hinaus wurde im Stand der Technik bereits eine Signalsäule vorgeschlagen, bei welchen die Signalmodule jeweils eine Leiterplatte aufweisen. Die Signalmodule werden bei dieser Ausführung ineinander gesteckt, wobei die Leiterplatten miteinander verbunden werden. Diese Ausführung ist jedoch dahingehend nachteilig, dass die Kontaktierung zwischen zwei Leiterplatten und die Verbindung zwischen zwei aneinander anschließenden Signalmodulen gesondert vorgenommen werden muss.In addition, a signal tower has already been proposed in the prior art, in which the signal modules each have a printed circuit board. The signal modules are plugged into each other in this embodiment, wherein the circuit boards are interconnected. However, this embodiment is disadvantageous in that the contacting between two printed circuit boards and the connection between two adjoining signal modules must be made separately.

Demnach besteht die Aufgabe der vorliegenden Erfindung darin, eine gattungsgemäße Signalvorrichtung der eingangs angeführten Art zu schaffen, bei welcher die Kontaktierung der einzelnen Signalmodule mit konstruktiv einfachen, geringen Platzbedarf benötigenden Mitteln bewerkstelligt wird, wobei die Signalmodule weiter ohne Verwendung von Werkzeugen an beliebiger Stelle auseinandergenommen und wieder zusammengesetzt werden können.Accordingly, the object of the present invention is to provide a generic signaling device of the type mentioned, in which the contacting of the individual signal modules with structurally simple, small footprint-requiring means is accomplished, the signal modules can be further disassembled without the use of tools at any point and reassembled.

Diese Aufgabe wird durch eine Signalvorrichtung mit den Merkmalen von Anspruch 1 gelöst. Bevorzugte Ausführungen sind in den abhängigen Ansprüchen angegeben.This object is achieved by a signaling device having the features of claim 1. Preferred embodiments are specified in the dependent claims.

Erfindungsgemäß weist das Leiterplattenelement des Signalmoduls zur Ausbildung der Verbindungsleitung eine dem Signalelement des weiteren Signalmoduls zugeordnete Leiterbahn auf, welche im verbundenen Zustand der Signalmodule über ein Kontaktelement mit einer Leiterbahn am Leiterplattenelement des weiteren Signalmoduls verbunden ist, wobei die Leiterplattenelemente in einem zusammengesteckten, unverdrehten Zustand der Bajonettverbindungselemente in einer kontaktfreien Stellung und in einem zusammengesteckten, verdrehten Zustand der Bajonettverbindungselemente in einer Kontaktstellung zueinander angeordnet sind.According to the invention, the printed circuit board element of the signal module for forming the connecting line to a signal element of the further signal module associated conductor track which is connected in the connected state of the signal modules via a contact element with a conductor on the circuit board element of the further signal module, wherein the circuit board elements in a mated, untwisted state of Bayonet connection elements are arranged in a non-contact position and in a mated, twisted state of the bayonet connection elements in a contact position to each other.

Vorteilhafterweise sind daher die Verbindungs- bzw. Speiseleitungen für die Versorgung der Signalelemente über mehrere Signalmodule hinweg in Form von Leiterbahnen in die Leiterplattenelemente integriert. Als Signalelemente können Leuchtelemente, beispielsweise Leuchtdioden, oder Tonsignalelemente vorgesehen sein. Dadurch kann auf außerhalb der Leiterplattenelemente verlaufende, beispielsweise draht- oder plättchenförmige Verbindungs- bzw. Speiseleitungen verzichtet werden. Solche Verbindungs- bzw. Speiseleitungen wurden beim Stand der Technik in Abstand zueinander an der Innenseite der Signalmodule, in axialer Richtung verlaufend angeordnet, wodurch - um optische Störstellen in einem akzeptablen Rahmen zu halten - die Anzahl übereinander anordenbarer Signalmodule faktisch begrenzt war. Zudem stieg der Montage-/Assemblieraufwand mit der Zahl der anzubringenden Verbindungs- bzw. Speiseleitungen. Bei der erfindungsgemäßen Signalvorrichtung dient das Leiterplattenelement nicht nur zur Ansteuerung bzw. Versorgung des darauf befindlichen Signalelements, sondern auch zur Weiterleitung von Steuer- bzw. Versorgungssignalen an die Signalelemente darüberliegender Signalmodule. Zu diesem Zweck weist das Leiterplattenelement zumindest eine Leiterbahn auf, welche zur Weiterleitung elektrischer Steuer- bzw. Versorgungssignale an ein darüberliegendes Signalmodul eingerichtet ist. Darüber hinaus weist jedes Leiterplattenelement zumindest eine mit dem Signalelement dieses Signalmoduls verbundene Leiterbahn auf, um insbesondere den Leuchtzustand des Leuchtelements am jeweiligen Signalmodul einzustellen; selbstverständlich kann das Leiterplattenelement aber auch mehrere, über unterschiedliche Leiterbahnen versorgte Signalelemente aufweisen. Der Montage-/Assemblieraufwand ist vorteilhafterweise von der Anzahl der Leiterbahnen im Wesentlichen unabhängig. Im mechanisch verbundenen Zustand der Signalmodule sind die Leiterplattenelemente über zumindest zwei Kontaktelemente elektrisch leitend miteinander verbunden. Bevorzugt weist zumindest das unterste Signalmodul mehrere Leiterbahnen zur Weiterleitung von Steuer- bzw. Versorgungssignalen an mehrere darüberliegende Signalmodule auf, wobei eine entsprechende Anzahl von Kontaktelementen zwischen den Signalmodulen vorgesehen ist. Beim Zusammenbau der Signalmodule wird somit zugleich die elektrische Kontaktierung der Leiterplattenelemente vorgenommen. Die Signalvorrichtung kann, bevorzugt am unteren Ende, ein Sockelelement aufweisen, welchem über im Stand der Technik an sich bekannte Anschlussmittel die Steuer- bzw. Versorgungssignale für die einzelnen Signalmodule zugeführt werden. Die erfindungsgemäße Ausführung bringt insbesondere den Vorteil mit sich, dass die Anzahl der übereinander anordenbaren, einzeln montierbaren bzw. demontierbaren Signalmodule (bei gegebenem Durchmesser) erhöht werden kann. Darüber hinaus kann die Kontaktierung der Leiterplattenelemente beim Zusammenbau der Signalvorrichtung zuverlässiger vorgenommen werden. Weiters ist die erfindungsgemäße Ausgestaltung besonders stabil. Ein weiterer Vorteil der Erfindung liegt darin, dass die Montage der Signalvorrichtung einfacher und daher kostengünstiger durchgeführt werden kann. Zudem können Kostenvorteile auch durch die teilesparende Ausführung erzielt werden. Schließlich ist von Vorteil, dass die Lichtabgabe der Signalmodule an die Umgebung nicht durch Speiseleitungen behindert wird.Advantageously, therefore, the connection or supply lines for the supply of the signal elements over several signal modules away in the form of interconnects in the printed circuit board elements integrated. As signal elements, lighting elements, for example light-emitting diodes, or sound signal elements can be provided. As a result, it is possible to dispense with connection lines or feed lines running outside of the circuit board elements, for example, in the form of wire or platelets. Such connecting or feeding lines were arranged in the prior art at a distance from each other on the inside of the signal modules, extending in the axial direction, which - to keep optical defects within an acceptable range - the number superimposed on one another signal modules was virtually limited. In addition, the assembly / Assemblieraufwand increased with the number of connecting or feed lines. In the case of the signal device according to the invention, the printed circuit board element serves not only to control or supply the signal element located thereon, but also to forward control or supply signals to the signal elements overlying signal modules. For this purpose, the printed circuit board element has at least one conductor track, which is set up to forward electrical control or supply signals to an overlying signal module. In addition, each printed circuit board element has at least one conductor track connected to the signal element of this signal module in order in particular to set the luminous state of the luminous element on the respective signal module; Of course, the circuit board element but also have several, supplied via different tracks signal elements. The assembly / assembly effort is advantageously substantially independent of the number of tracks. In the mechanically connected state of the signal modules, the printed circuit board elements are electrically conductively connected to one another via at least two contact elements. Preferably, at least the lowermost signal module has a plurality of interconnects for the forwarding of control or supply signals to a plurality of signal modules located above them on, with a corresponding number of contact elements is provided between the signal modules. When assembling the signal modules, the electrical contacting of the printed circuit board elements is thus at the same time made. The signal device can, preferably at the lower end, have a base element, which is supplied with the control or supply signals for the individual signal modules via connection means known per se in the prior art. The embodiment according to the invention has the particular advantage that the number of individually mountable or demountable signal modules that can be arranged one above the other can be increased (for a given diameter). In addition, the contacting of the circuit board elements during assembly of the signaling device can be made more reliable. Furthermore, the embodiment of the invention is particularly stable. Another advantage of the invention is that the mounting of the signaling device can be carried out more simply and therefore more cost-effectively. In addition, cost advantages can also be achieved by the partially-saving design. Finally, it is advantageous that the light output of the signal modules to the environment is not hindered by feed lines.

Darüber hinaus weist das Signalmodul ein Bajonettverbindungselement zur Verbindung mit einem Bajonettverbindungselement des weiteren Signalmoduls auf, wobei die Leiterplattenelemente in einem zusammengesteckten, unverdrehten Zustand der Bajonettverbindungselemente in einer kontaktfreien Stellung und in einem zusammengesteckten, verdrehten Zustand der Bajonettverbindungselemente in einer Kontaktstellung zueinander angeordnet sind. Im Stand der Technik ist es an sich bekannt, die Signalmodule über Bajonettverbindungen lösbar miteinander zu verbinden. Zu diesem Zweck weisen die Signalmodule zusammenwirkende Bajonettverbindungselemente auf, welche durch einen Bajonettvorsprung auf dem einen Signalmodul und eine Bajonettöffnung auf dem anderen Signalmodul gebildet sind. Die Bajonettverbindungselemente sind über eine Steck-Dreh-Bewegung miteinander verbindbar, wobei der Bajonettvorsprung zunächst durch einen in axialer Richtung verlaufenden Eingangsbereich der Bajonettöffnung gesteckt und danach entlang eines dazu im Wesentlichen rechtwinkelig verlaufenden Sicherungsabschnitts der Bajonettöffnung verdreht wird. Bei der vorliegenden Ausführung ist die mechanische Verbindung über die Bajonettverbindungselemente mit der elektrischen Verbindung zwischen den Leiterplattenelementen gekoppelt. Zu diesem Zweck sind die Kontaktelemente des einen Signalmoduls in dem zusammengesteckten, unverdrehten Zustand der Bajonettverbindungselemente in einer kontaktfreien Stellung zu den entsprechenden Kontaktstellen des anderen Signalmoduls angeordnet. Durch Anordnung der Bajonettverbindungselemente in der zusammengesteckten, verdrehten Stellung werden die Kontaktelemente des einen Signalmoduls in Kontakt mit den Kontaktstellen des anderen Signalmoduls gebracht. Somit kann die Signalleitung zwischen den aufeinanderfolgenden Signalmodulen über die Bajonettverbindung freigegeben bzw. getrennt werden.In addition, the signal module has a bayonet connection element for connection to a bayonet connection element of the further signal module, wherein the circuit board elements are arranged in a mated, untwisted state of the bayonet connection elements in a non-contact position and in a mated, twisted state of the bayonet connection elements in a contact position to each other. In the prior art, it is known per se, the signal modules via bayonet connections releasably connect to each other. For this purpose, the signal modules have cooperating bayonet connection elements, which are formed by a bayonet projection on the one signal module and a bayonet opening on the other signal module. The bayonet connection elements can be connected to one another via a plug-in rotary movement, wherein the bayonet projection is first inserted through an entrance region of the bayonet opening extending in the axial direction and then twisted along a securing section of the bayonet opening extending substantially at right angles thereto. In the present embodiment, the mechanical connection via the bayonet connection elements is coupled to the electrical connection between the circuit board elements. For this purpose, the contact elements of a signal module in the assembled, untwisted state of the bayonet connection elements are arranged in a non-contact position to the corresponding contact points of the other signal module. By arranging the bayonet connection elements in the mated, twisted position, the contact elements of a signal module are brought into contact with the contact points of the other signal module. Thus, the signal line between the successive signal modules can be released via the bayonet connection.

Um ein bestimmtes Signalmodul der Signalsäule mit einer Steuer- bzw. Versorgungsspannung beaufschlagen zu können, ist es günstig, wenn sich das Leiterplattenelement im Wesentlichen über die gesamte Höhe des Signalmoduls erstreckt, wobei das Kontaktelement im verbundenen Zustand der Signalmodule zwischen einer oberseitigen Kontaktstelle des einen Leiterplattenelements und einer unterseitigen Kontaktstelle des anderen Leiterplattenelements angeordnet ist. Diese Ausführung ist bevorzugt bei einem Signalmodul mit einem Leuchtelement vorgesehen. Für die Zwecke dieser Offenbarung beziehen sich die Bezeichnungen "oben" und "unten" auf eine im Wesentlichen vertikale Betriebsstellung der Signalvorrichtung, bei welcher die Signalmodule übereinander angeordnet sind. In dieser vertikalen bzw. stehenden Betriebsstellung der Signalvorrichtung ist das Leiterplattenelement bevorzugt in einer im Wesentlichen vertikalen Stellung innerhalb des Signalmoduls angeordnet, wobei sich das Leiterplattenelement jeweils über im Wesentlichen die gesamte Höhe des zugehörigen Signalmoduls erstreckt. Um die elektrische Steuer- bzw. Versorgungssignale durch ein Signalmodul hindurch zu einem darüberliegenden Signalmodul weiterzuleiten, ist zumindest zwei Leiterbahnen dieses Signalmoduls über zumindest zwei Kontaktelemente mit zugehörigen Leiterbahnen des darüberliegenden Signalmoduls verbunden. Demnach erfolgt die Signalweiterleitung im Wesentlichen über die gesamte Höhe der Signalvorrichtung entlang der Leiterbahnen der Leiterplattenelemente, wobei die aufeinanderfolgenden Signalmodule durch die Kontaktelemente kontaktiert werden.In order to be able to apply a control or supply voltage to a specific signal module of the signal tower, it is favorable if the printed circuit board element extends substantially over the entire height of the signal module, wherein the contact element in the connected state of the signal modules between a top contact point of a printed circuit board element and a lower-side contact point of the other printed circuit board element is arranged. This embodiment is preferably provided in a signal module with a luminous element. For the purposes of this disclosure, the terms "up" and "down" refer to a substantially vertical operating position of the signaling device in which the signal modules are stacked. In this vertical or stationary operating position of the signaling device, the printed circuit board element is preferably arranged in a substantially vertical position within the signal module, wherein the printed circuit board element extends over substantially the entire height of the associated signal module. In order to forward the electrical control or supply signals through a signal module to an overlying signal module, at least two interconnects of this signal module are connected via at least two contact elements with associated interconnects of the overlying signal module. Accordingly, the signal transmission takes place substantially over the entire height of the signal device along the conductor tracks of the printed circuit board elements, wherein the successive signal modules are contacted by the contact elements.

Um den elektrischen Kontakt zwischen den Signalmodulen zuverlässig herzustellen oder trennen zu können, ist es günstig, wenn als Kontaktelement eine elastisch auslenkbare Kontaktfeder vorgesehen ist, welche im verbundenen Zustand der Signalmodule deren Leiterplattenelemente miteinander verbindet. Zur Kontaktierung zwischen den Leiterplattenelementen übereinander angeordneter Signalmodule sind daher Kontaktfedern vorgesehen, welche beim Herstellen der mechanischen Verbindung zwischen den Signalmodulen an den entsprechenden Kontaktstellen des jeweiligen Leiterplattenelements angelegt werden. Durch Abnehmen eines Signalmoduls von der Signalvorrichtung wird zugleich die elektrische Verbindung über die Kontaktfedern getrennt. Zur zuverlässigen Durchkontaktierung der Signalmodule liegen die Kontaktfedern im verbundenen Zustand der Signalmodule mit einem Anpressdruck an den entsprechenden Kontaktstellen an.In order to reliably establish or disconnect the electrical contact between the signal modules, it is advantageous if a resiliently deflectable contact spring is provided as the contact element, which connects the printed circuit board elements together in the connected state of the signal modules. For contacting between the circuit board elements one above the other arranged signal modules therefore contact springs are provided which are created in the manufacture of the mechanical connection between the signal modules at the corresponding contact points of the respective printed circuit board element. By removing a signal module from the signaling device at the same time the electrical connection is separated via the contact springs. For reliable through-connection of the signal modules, the contact springs are in the connected state of the signal modules with a contact pressure at the corresponding contact points.

Um die Kontaktierung zwischen den Signalmodulen auf konstruktiv einfache, zuverlässige Weise zu bewerkstelligen, ist es von Vorteil, wenn das Leiterplattenelement Kontaktstellen aufweisende, von der ober- und der unterseitigen Stirnseite der Leiterplattenelemente abstehende Zapfenelemente aufweist, wobei die unter- oder oberseitigen Zapfenelemente mit den Kontaktelementen verbunden sind und die ober- bzw. unterseitigen Zapfenelemente frei von Kontaktelementen sind. Demnach sind die Kontaktstellen des Leiterplattenelements auf der einen Seite, vorzugsweise auf der Unterseite, mit Kontaktelementen verbunden und auf der anderen Seite, vorzugsweise auf der Oberseite, frei von solchen Kontaktelementen. Beim Verbinden der Signalmodule treten so stets die Kontaktelemente des einen Signalmoduls mit von Kontaktelementen freien Kontaktstellen des anderen Signalmoduls in Kontakt.In order to accomplish the contacting between the signal modules in a structurally simple, reliable manner, it is advantageous if the printed circuit board element has contact points, protruding from the upper and the lower end side of the printed circuit board elements pin elements, wherein the lower or upper side pin elements with the contact elements are connected and the top and bottom pin elements are free of contact elements. Accordingly, the contact points of the printed circuit board element on one side, preferably on the underside, connected to contact elements and on the other side, preferably on the top, free of such contact elements. When connecting the signal modules so always contact the contact elements of a signal module with contact elements free contact points of the other signal module in contact.

Zur stabilen Halterung der Leiterplattenelemente innerhalb der Signalmodule ist es vorteilhaft, wenn das Signalmodul ein mit dem Leiterplattenelement verbundenes Aufsatzelement mit einem Verbindungselement aufweist. Die Montage der Signalvorrichtung kann mit geringem Aufwand vorgenommen werden, wenn das Verbindungselement über eine lösbare Verbindung, vorzugsweise eine Rastverbindung, in einem äußeren Gehäuse, vorzugsweise mit einer zylindrischen Mantelfläche, aufgenommen ist. Bei dieser Ausführung wird daher das Verbindungselement samt dem Leiterplattenelement in dem äußeren Gehäuse verschnappt bzw. verrastet. Das äußere Gehäuse weist bevorzugt eine zylindrische Mantelfläche auf, welche auf der einen Seite mit einem Deckel- bzw. Bodenteil und auf der anderen Seite mit einer Halteöffnung zum Verbinden mit dem weiteren Signalmodul ausgebildet ist. Bevorzugt sind an gegenüberliegenden Enden der Mantelfläche, jeweils benachbart des Deckel-/Bodenteils bzw. der Halteöffnung, die Bajonettverbindungselemente in Form der Bajonettvorsprünge bzw. der Bajonettöffnungen vorgesehen.For stable mounting of the printed circuit board elements within the signal modules, it is advantageous if the signal module has an attachment element connected to the printed circuit board element with a connecting element. The installation of the signaling device can be made with little effort if the connecting element via a releasable connection, preferably a locking connection, in an outer housing, preferably with a cylindrical outer surface, is added. In this version Therefore, the connecting element together with the circuit board element is snapped or latched in the outer housing. The outer housing preferably has a cylindrical outer surface which is formed on one side with a lid or bottom part and on the other side with a holding opening for connection to the further signal module. The bayonet connection elements in the form of the bayonet projections or the bayonet openings are preferably provided at opposite ends of the lateral surface, in each case adjacent to the cover / bottom part or the holding opening.

Bei einer Ausführung kann das Leiterplattenelement im Wesentlichen vollständig innerhalb eines das Verbindungselement umfassenden Aufsatzelements angeordnet sein. Mit einem derartigen Aufsatzelement in der Art eines Gehäuses wird das Leiterplattenelement und insbesondere auch die Kontaktelemente im Wesentlichen vollständig vor mechanischen Einwirkungen, insbesondere beim Verbinden der Signalmodule, geschützt.In one embodiment, the printed circuit board element can be arranged essentially completely within an attachment element comprising the connecting element. With such an attachment element in the manner of a housing, the printed circuit board element and in particular also the contact elements are substantially completely protected against mechanical influences, in particular when connecting the signal modules.

Um die elektrische und mechanische Verbindung übereinander angeordneter Signalmodule ohne die Gefahr von Beschädigungen zuverlässig herstellen und trennen zu können, ist es günstig, wenn zum Schutz der Kontaktelemente zumindest ein die Kontaktelemente zumindest teilweise umschließendes Schutzelement vorgesehen ist. Bevorzugt weist das Schutzelement mehrere, vorzugsweise stift- oder zapfenförmige Vorsprünge auf, welche benachbart der Kontaktelemente angeordnet sind.In order to be able to reliably establish and disconnect the electrical and mechanical connection of signal modules arranged one above the other without the risk of damage, it is favorable if, for the protection of the contact elements, at least one protective element is provided at least partially enclosing the contact elements. Preferably, the protective element has a plurality of, preferably pin-shaped or peg-shaped projections, which are arranged adjacent to the contact elements.

Insbesondere sind hierbei zwei Reihen derartiger Vorsprünge vorgesehen, zwischen welchen die Kontaktelemente angeordnet sind, wobei eine erste Reihe vergleichsweise kurze Vorsprünge und eine zweite Reihe vergleichsweise lange Vorsprünge vorgesehen sind. Die Kontaktstellen, insbesondere Zapfenelemente, eines weiteren Leiterplattenelements, mit welchen eine Kontaktierung herzustellen ist, sind beim Zusammenführen der Signalmodule vorteilhafterweise derart angeordnet, dass sie beim Schließen des Bajonettverschlusses über den kurzen Vorsprünge hinweg gedreht werden können, ohne mit diesen in Berührung zu kommen.In particular, in this case two rows of such projections are provided, between which the contact elements are arranged, wherein a first row comparatively short projections and a second row are provided comparatively long projections. The contact points, in particular pin elements, of a further printed circuit board element, with which a contact is to be made, are advantageously arranged when merging the signal modules such that they can be rotated over the short projections on closing the bayonet closure, without coming into contact with them.

Die langen Vorsprünge hingegen können vorteilhafterweise derart ausgebildet sein, dass sie an jener Seite, an welcher die Kontaktelemente nicht zur Berührung mit einer Kontaktstelle vorgesehen sind, die Kontaktelemente im Wesentlichen über die gesamte Länge bedecken, so dass ein Zugriff bzw. eine Beschädigung der Kontaktelemente möglichst verhindert wird.The long projections, however, can advantageously so be formed so that they cover the contact elements substantially over the entire length at the side on which the contact elements are not intended for contact with a contact point, so that access or damage to the contact elements is prevented as possible.

Um eine Kontaktherstellung über die Drehbewegung bei Schließen der Bajonettverbindung ohne freiliegende, einem Zugriff ausgesetzte Kontaktstellen zu ermöglichen, ist es günstig, wenn ein Deckel-/Bodenelement des weiteren Signalmoduls oder ein Aufsatzelement eines weiteren Leiterplattenelements zumindest eine bogenförmig gekrümmte Durchgangsöffnung aufweist. Kontaktelemente sowie ggf. Berührungsschutz-Vorsprünge eines Singalmoduls können somit im zusammengesteckten, unverdrehten Zustand in Durchgangsöffnungen des anderen Signalmoduls eingeführt werden. Beim Verdrehen der Signalmodule gegeneinander werden die Kontaktelemente ebenso wie die (Berührungsschutz-) Vorsprünge sodann in den bogenförmigen Durchgangsöffnungen geführt. Mit Erreichen der Anschlagstellung, welche vorzugsweise über die Bajonettverbindung definiert ist, ist der elektrische Kontakt zwischen den Leiterplattenelementen über die Kontaktelemente hergestellt.In order to enable a contact via the rotational movement when closing the bayonet connection without exposed, exposed access points, it is advantageous if a cover / bottom element of the further signal module or an attachment element of another printed circuit board element has at least one arcuately curved passage opening. Contact elements and possibly contact protection projections of a signal module can thus be inserted in the assembled, untwisted state in through holes of the other signal module. When twisting the signal modules against each other, the contact elements as well as the (protection against contact) projections are then guided in the arcuate through holes. Upon reaching the stop position, which is preferably defined by the bayonet connection, the electrical contact between the circuit board elements is made via the contact elements.

Um den optischen Effekt des vom Signalelement abgesendeten Lichtsignals zu verbessern, d.h. insbesondere eine gerichtete Abstrahlung der erzeugten Lichtstrahlen zu erzielen, ist es günstig, wenn mit dem Leiterplattenelement zumindest ein Optikelement verbunden ist, das zumindest eine optische Linse aufweist, wobei vorzugsweise die Anzahl der Linsen im Wesentlichen einer Anzahl der als Signalelement vorgesehenen Leuchtdioden entspricht.In order to improve the optical effect of the light signal transmitted by the signal element, i. In particular, to achieve a directed radiation of the light beams generated, it is advantageous if at least one optical element is connected to the printed circuit board element having at least one optical lens, wherein preferably the number of lenses substantially corresponds to a number of light emitting diodes provided as signal element.

Um auf konstruktiv einfache und kostengünstige Weise einen Schutz der Kontaktelemente, ein Verbindungselement für ein äußeres Gehäuse und eine gerichtete Abgabe der erzeugten Lichtstrahlen zu bewirken, ist es vorteilhaft, wenn zumindest ein Aufsatzelement umfassend das Verbindungselement, das Schutzelement und das Optikelement vorgesehen ist. Durch die Zusammenfassung der drei vorstehend genannten unterschiedlichen Funktionen in einem einzigen Aufsatzelement kann sowohl die Teilezahl als auch der Assemblierungsaufwand gering gehalten werden.In order to effect a protection of the contact elements, a connecting element for an outer housing and a directed delivery of the generated light beams in a structurally simple and cost-effective manner, it is advantageous if at least one attachment element comprising the connecting element, the protective element and the optical element is provided. By combining the three above-mentioned different functions in a single attachment element, both the number of parts and the assembly effort can be kept low.

Der Zusammenbau der Signalvorrichtung kann besonders einfach gestaltet werden, wenn das Aufsatzelement zwei Halbschalen aufweist, welche über eine lösbare Verbindung, vorzugsweise eine Rastverbindung, miteinander verbunden sind. Im montierten Zustand ist daher das Leiterplattenelement zwischen den Halbschalen des Aufsatzelements angeordnet, wobei das Leiterplattenelement jedoch insbesondere seitlich über die zusammengesetzten Halbschalen hinausragen kann.The assembly of the signaling device can be made particularly simple if the attachment element has two half-shells, which are connected to one another via a detachable connection, preferably a latching connection. In the assembled state, therefore, the printed circuit board element is arranged between the half-shells of the attachment element, wherein the printed-circuit board element, however, can protrude laterally beyond the composite half-shells.

Zur Erzielung einer vielseitig verwendbaren Signalsäule ist es günstig, wenn zumindest ein Leiterplattenelement mehr als drei, vorzugsweise zumindest fünf, insbesondere acht, Leiterbahnen für die Ansteuerung einer entsprechenden Anzahl von Signalmodulen aufweist.In order to achieve a versatile signal tower, it is favorable if at least one printed circuit board element has more than three, preferably at least five, in particular eight, printed conductors for the control of a corresponding number of signal modules.

Zur Erzielung einer Signalsäule ist es günstig, wenn zumindest zwei miteinander verbundene, im verbundenen Zustand übereinander angeordnete Signalmodule vorgesehen sind. Bevorzugt sind zumindest zwei gleichartige Signalmodule als Lichtsignalmodule mit Leuchtelementen vorgesehen. Zudem kann ein Signalmodul mit einem Tonsignalelement vorgesehen sein.In order to achieve a signal tower, it is favorable if at least two interconnected signal modules arranged one above the other in the connected state are provided. Preferably, at least two similar signal modules are provided as light signal modules with luminous elements. In addition, a signal module may be provided with a sound signal element.

Die Erfindung wird nachstehend anhand von bevorzugten Ausführungsbeispielen, auf die sie jedoch nicht beschränkt sein soll, noch weiter erläutert. In der Zeichnung zeigen:

  • Fig. 1 eine Ansicht einer erfindungsgemäßen Signalsäule, welche mehrere lösbar miteinander verbundene Signalmodule zur optischen und akustischen Anzeige von Betriebszuständen einer Maschine aufweist;
  • Fig. 2 eine teilweise geschnittene, schaubildliche Ansicht eines Signalmoduls der Signalsäule gemäß Fig. 1, wobei das Signalmodul ein Leiterplattenelement mit einem LED-Leuchtelement aufweist;
  • Fig. 3 eine weitere teilweise geschnittene, schaubildliche Ansicht des Signalmoduls gemäß Fig. 1, 2;
  • Fig. 4, 5 weitere schaubildliche Ansichten des Signalmoduls gemäß Fig. 1 bis 3;
  • Fig. 6 und Fig. 7 schematische Ansichten der Leiterplattenelemente übereinander angeordneter Signalmodule, deren Leiterbahnen über Kontaktfedern durch Verdrehung zwischen der in Fig. 6 dargestellten Ruhestellung und der in Fig. 7 dargestellten Kontaktstellung miteinander verbindbar sind;
  • Fig. 8 eine schaubildliche Ansicht einer Halbschale eines Aufsatzelements mit eingesetztem Leiterplattenelement; und
  • Fig. 9 eine weitere schaubildliche Ansicht der Halbschale des Aufsatzelements für das Leiterplattenelement;
  • Fig. 10 eine schematische Ansicht von vier übereinander angeordneten Leiterplattenelementen;
  • Fig. 11 eine schaubildliche Ansicht eines zweiten Ausführungsbeispiels eines erfindungsgemäßen Leiterplattenelements mit einem Aufsatzelement;
  • Fig. 12 eine schaubildliche Ansicht des Ausführungsbeispiels gemäß Fig. 11 mit einer abgenommenen Halbschale des Aufsatzelements; und
  • Fig. 13 eine geschnittene schaubildliche Ansicht eines zweiten Ausführungsbeispiels eines erfindungsgemäßen Signalmoduls.
The invention will be explained below with reference to preferred embodiments, to which it should not be limited, however. In the drawing show:
  • Fig. 1 a view of a signal tower according to the invention, which has a plurality of releasably interconnected signal modules for optical and acoustic display of operating conditions of a machine;
  • Fig. 2 a partially sectioned, perspective view of a signal module of the signal tower according to Fig. 1 wherein the signal module comprises a printed circuit board element with an LED lighting element;
  • Fig. 3 a further partially sectioned, perspective view of the signal module according to Fig. 1 . 2 ;
  • Fig. 4, 5 further perspective views of the signal module according to Fig. 1 to 3 ;
  • Fig. 6 and Fig. 7 schematic views of the printed circuit board elements superimposed signal modules whose interconnects via contact springs by rotation between the in Fig. 6 illustrated rest position and the in Fig. 7 shown contact position are connected to each other;
  • Fig. 8 a perspective view of a half-shell of an attachment element with inserted circuit board element; and
  • Fig. 9 a further perspective view of the half-shell of the attachment element for the circuit board element;
  • Fig. 10 a schematic view of four superposed circuit board elements;
  • Fig. 11 a perspective view of a second embodiment of a printed circuit board element according to the invention with an attachment element;
  • Fig. 12 a perspective view of the embodiment according to Fig. 11 with a detached half-shell of the attachment element; and
  • Fig. 13 a sectional perspective view of a second embodiment of a signal module according to the invention.

In Fig. 1 ist eine Signalvorrichtung 1 zum Anzeigen von Betriebszuständen einer Maschine bzw. einer Anlagenkomponente gezeigt. Die Signalvorrichtung ist als Signalsäule mit mehreren Signalmodulen 2 ausgebildet, welche, wie nachstehend noch näher erläutert wird, lösbar miteinander verbindbar sind. Im verbundenen Zustand sind die einzelnen Signalmodule 2 übereinander angeordnet. In der gezeigten Ausführung sind drei optische Signalmodule 2' zur Abgabe verschiedenfarbiger Lichtsignale und ein (im Stand der Technik hinreichend bekanntes) akustisches Signalmodul 2'' zur Abgabe eines Tonsignals vorgesehen. Die Signalmodule 2' weisen jeweils ein äußeres Gehäuse 3 auf, welches mit einer zylindrischen, teilweise durchsichtigen und jeweils in einer anderen Farbe ausgeführten Mantelfläche 4 und einem Deckel 5 ausgebildet ist (vgl. Fig. 4, 5). Die Signalmodule 2 sind in bekannter Weise auf einem Sockelelement 6 angeordnet, welches über (schematisch eingezeichnete) elektrische Anschlussmittel mit der (nicht gezeigten) Maschine verbunden ist. Demnach erfolgt die Ansteuerung sämtlicher Signalmodule 2 über die gemeinsamen Anschlussmittel des Sockelelementes 6.In Fig. 1 a signaling device 1 for displaying operating conditions of a machine or a plant component is shown. The signaling device is designed as a signal tower with a plurality of signal modules 2, which, as will be explained in more detail below, are detachably connectable to each other. In the connected state, the individual signal modules 2 are arranged one above the other. In the embodiment shown, three optical signal modules 2 'are provided for emitting different colored light signals and an acoustic signal module 2 "(which is well known in the prior art) for emitting a sound signal. The signal modules 2 'each have an outer housing 3, which with a cylindrical, partially transparent and each in another Color running lateral surface 4 and a lid 5 is formed (see. Fig. 4, 5 ). The signal modules 2 are arranged in a known manner on a base element 6, which is connected via (schematically drawn) electrical connection means with the (not shown) machine. Accordingly, the control of all signal modules 2 takes place via the common connection means of the base element 6.

Wie aus Fig. 2, 3 ersichtlich, weist das Signalmodul 2 innerhalb des äußeren Gehäuses 3 ein Leiterplattenelement 7 auf, an welchem in bekannter Weise zumindest ein (in Fig. 8 schematisch eingezeichnetes) Signalelement 8 zur Abgabe eines Signals angeordnet ist. Die optischen Signalmodule 2' weisen auf den Leiterplatten 7 jeweils zumindest ein Leuchtelement auf. Als Leuchtelement ist insbesondere zumindest eine Leuchtdiode (LED) vorgesehen, wobei das in Fig. 8 gezeigte Signalelement 8 insgesamt sechs LEDs (drei auf jeder Seite des Leiterplattenelements) umfasst. Zur Ansteuerung der Leiterplattenelemente 7 sind durch die Signalmodule 2 verlaufende Verbindungsleitungen vorgesehen, welche in der gezeigten Ausführung als in Fig. 8 schematisch ersichtliche Leiterbahnen 10 in die Leiterplattenelemente 7 integriert sind.How out Fig. 2 . 3 can be seen, the signal module 2 within the outer housing 3 on a circuit board element 7, at which in a known manner at least one (in Fig. 8 schematically drawn) signal element 8 is arranged to output a signal. The optical signal modules 2 'each have at least one luminous element on the printed circuit boards 7. As a luminous element, in particular at least one light-emitting diode (LED) is provided, wherein the in Fig. 8 Signal element 8 shown comprises a total of six LEDs (three on each side of the printed circuit board element). For driving the printed circuit board elements 7 2 extending connecting lines are provided by the signal modules, which in the embodiment shown as in Fig. 8 schematically apparent interconnects 10 are integrated into the circuit board elements 7.

In Fig. 10 sind vier übereinander angeordnete Leiterplattenelemente 7 gezeigt sowie schematisch im Sockelelement 6 integriert eine Basis 9 mit Anschlussklemmen 9' ("0" bis "7"). Demnach weist jedes Leiterplattenelement 7 einen zum nächsten Signalmodul 2 führende "0"-Leiterbahn 10' auf. Weiters ist jeweils zumindest eine Leiterbahn 10'' vorgesehen, welche eine Verbindung von dem Kontaktelement "1" rechts von der "0"-Leiterbahn über das jeweilige Signalelement 8 zu der "0"-Leiterbahn herstellt, sowie weitere durchführende Leiterbahnen 10'''. Über Anlage von Spannung an der "0"-Leiterbahn und einer der Anschlussklemmen 9' "1" bis "7" kann somit ein entsprechendes Signalmodul 2 aktiviert werden. Im mechanisch verbundenen Zustand der Signalmodule 2 sind die Leiterbahnen 10', 10''' über Kontaktelemente 11 mit den entsprechenden Leiterbahnen 10'' am Leiterplattenelement 7 des darüber liegenden Signalmoduls 2 elektrisch verbunden. Sofern daher Spannung an die Anschlussklemme 9' "0" und "1" angelegt wird, leuchtet das Signalelement 8 des untersten Signalmoduls 2; sofern Spannung an die Anschlussklemme 9' "0" und "2" angelegt wird, leuchtet das Signalelement 8 des (von unten gesehen) zweiten Signalmoduls 2, etc.. Wie aus Fig. 2, 3 weiters ersichtlich, erstrecken sich die Leiterplattenelemente 7 im Wesentlichen über die gesamte Höhe bzw. axiale Erstreckung der Signalmodule 2. Im verbundenen Zustand der Signalmodule 2 sind die Kontaktelemente 11 zwischen einer oberseitigen Kontaktstelle 12 des einen (unteren) Leiterplattenelements 7' und einer unterseitigen Kontaktstelle 13 des anderen (oberen) Leiterplattenelements 7'' angeordnet (vgl. Fig. 7). Als Kontaktelemente 11 sind in der gezeigten Ausführung elastisch verformbare Kontaktfedern 11' vorgesehen, welche im verbundenen Zustand der Signalmodule 2 deren Leiterplattenelemente 7; 7', 7'' miteinander verbinden (vgl. Fig. 7).In Fig. 10 four superposed circuit board elements 7 are shown as well as schematically integrated in the base element 6 a base 9 with terminals 9 '("0" to "7"). Accordingly, each circuit board element 7 has a leading to the next signal module 2 "0" conductor track 10 '. Furthermore, in each case at least one conductor track 10 "is provided, which establishes a connection from the contact element" 1 "to the right of the" 0 "track via the respective signal element 8 to the" 0 "track, as well as further conductive tracks 10 '". , By applying voltage to the "0" conductor track and one of the connection terminals 9 '"1" to "7", a corresponding signal module 2 can thus be activated. In the mechanically connected state of the signal modules 2, the conductor tracks 10 ', 10''' via contact elements 11 to the corresponding conductor tracks 10 '' on the printed circuit board element 7 of the overlying signal module 2 electrically connected. Therefore, if voltage is applied to the terminal 9 '"0" and "1", the signal element 8 of the lowermost signal module lights up 2; if voltage is applied to the terminal 9 '"0" and "2", the signal element 8 of the (as seen from below) second signal module 2, etc. lights up Fig. 2 . 3 In the connected state of the signal modules 2, the contact elements 11 between a top-side contact point 12 of the one (lower) PCB element 7 'and a lower-side contact point thirteenth the other (upper) printed circuit board element 7 '' arranged (see. Fig. 7 ). As contact elements 11 elastically deformable contact springs 11 'are provided in the embodiment shown, which in the connected state of the signal modules 2 whose printed circuit board elements 7; 7 ', 7''interconnect (see. Fig. 7 ).

Wie aus Fig. 2 bis 5 ersichtlich, weisen die Signalmodule 2 zu deren lösbaren Verbindung Bajonettverbindungselemente 14 auf, welche durch Bajonettvorsprünge 15 an einem nach innen versetzten oberen Randbereich der Mantelfläche 4 des äußeren Gehäuses 3 und entsprechende Bajonettöffnungen 16 am gegenüberliegenden, unteren Randbereich der Mantelfläche 4 des äußeren Gehäuses 3 gebildet sind. Die Bajonettverbindungselemente 14 übereinander angeordneter Signalmodule 2 sind in bekannter Weise über eine Steck-Dreh-Verbindung miteinander verbindbar. Hierbei werden zunächst die Bajonettvorsprünge 15 am unteren Signalmodul 2 in einen in axialer Richtung verlaufenden Eingangsbereich 16a der Bajonettöffnung 16 geführt. Danach werden die Signalmodule 2 gegeneinander verdreht, wobei die Bajonettvorsprünge 15 entlang von horizontalen Sicherungsabschnitten 16b der Bajonettöffnungen 16 verschoben werden. Die Kontaktelemente 11 des einen (oberen) Signalmoduls 2 sind in dem zusammengesteckten, unverdrehten Zustand der Bajonettverbindungselemente 14 in Abstand zu den entsprechenden Kontaktstellen des anderen Signalmoduls 2 angeordnet. Durch Anordnung der Bajonettverbindungselemente 14 in der zusammengesteckten, verdrehten Stellung gemäß Fig. 1 werden die Kontaktstellen 12, 13 übereinander angeordneter Signalmodule 2 in leitenden Kontakt gebracht. Somit kann die Signalleitung durch die aufeinanderfolgenden Signalmodule 2 über die Bajonettverbindung freigegeben bzw. getrennt werden.How out Fig. 2 to 5 can be seen, the signal modules 2 to the releasable connection bayonet connection elements 14 which are formed by bayonet projections 15 at an inwardly offset upper edge region of the lateral surface 4 of the outer housing 3 and corresponding bayonet openings 16 at the opposite lower edge region of the outer surface 3 of the outer housing , The bayonet connection elements 14 of signal modules 2 arranged one above the other can be connected to one another in a known manner via a plug-in rotary connection. Here, first the bayonet projections 15 are guided on the lower signal module 2 in an axially extending input region 16a of the bayonet opening 16. Thereafter, the signal modules 2 are rotated against each other, wherein the bayonet projections 15 are displaced along horizontal securing portions 16 b of the bayonet openings 16. The contact elements 11 of the one (upper) signal module 2 are arranged in the mated, untwisted state of the bayonet connection elements 14 at a distance from the corresponding contact points of the other signal module 2. By arranging the bayonet connection elements 14 in the mated, twisted position according to Fig. 1 the contact points 12, 13 superimposed signal modules 2 are brought into conductive contact. Thus, the signal line can be released or separated by the successive signal modules 2 via the bayonet connection.

Wie insbesondere aus Fig. 6, 7 ersichtlich, weisen die Leiterplattenelemente 7 die Kontaktstellen 12, 13 ausbildende Zapfenelemente 17 auf, welche von der oberseitigen Stirnseite der Leiterplattenelemente 7 nach oben bzw. von der unterseitigen Stirnseite der Leiterplattenelemente 7 nach unten vorspringen. In der gezeigten Ausführung sind jeweils die unterseitigen Zapfenelemente 17'' mit den Kontaktelementen 11 verbunden, wohingegen die oberseitigen Zapfenelemente 17' frei von solchen Kontaktelementen 11 sind.As in particular from Fig. 6, 7 can be seen, the circuit board elements 7, the contact points 12, 13 forming pin members 17 which project from the top side of the printed circuit board elements 7 upwards or from the lower-side end side of the printed circuit board elements 7 down. In the embodiment shown, the lower-side pin elements 17 "are each connected to the contact elements 11, whereas the upper-side pin elements 17 'are free of such contact elements 11.

Wie aus Fig. 8, 9 ersichtlich, vgl. auch Fig. 2, 3, weisen die Signalmodule 2 jeweils ein Aufsatzelement 18 für das zugehörige Leiterplattenelement 7 auf, wobei bei einem ersten Ausführungsbeispiel das zugehörige Leiterplattenelement 7 im Wesentlichen vollständig innerhalb des Aufsatzelements 18 aufgenommen ist. Das Aufsatzelement 18 weist in einem unteren Abschnitt ein Schutzelement 25, mit zwei Reihen an Vorsprüngen 19 auf, wobei eine Reihe mit längeren Vorsprüngen 19' und eine Reihe mit kürzeren Vorsprüngen 19" vorgesehen ist. Die Kontaktelemente 11 sind jeweils zwischen den als Berührungsschutz dienenden Vorsprüngen 19', 19" angeordnet. Die längeren Vorsprünge 19' bedecken die Kontaktelemente 11 auf jener Seite, auf welcher keine Kontaktierung hergestellt wird, im Wesentlichen zur Gänze. Die kürzeren Vorsprünge 19" lassen hingegen einen Endabschnitt der Kontaktelemente 11 zwecks Kontaktierung frei. Die Kontaktelemente 11 ebenso wie die Vorsprünge 19', 19" werden beim Zusammenführen zweier Signalmodule 2 in entsprechenden Durchgangsöffnungen 20 an der Oberseite des Aufsatzelements 18 des benachbarten Signalmoduls 2 aufgenommen. Zur Anpassung an die Drehbewegung während des Schließens der Bajonettverbindung sind die Durchgangsöffnungen 20 des Aufsatzelements 18 bogenförmig gekrümmt. Beim Verdrehen der Signalmodule 2 zur Herstellung der Bajonettverbindung werden die stiftförmigen Vorsprünge 19 des einen (oberen) Signalmoduls 2 daher in der bogenförmig gekrümmten Durchgangsöffnungen 20 des anderen (unteren) Signalmoduls 2 bewegt. Entsprechend wird für die jeweilige Anzahl von Signalmodulen 2 vorgegangen.How out Fig. 8, 9 can be seen, cf. also Fig. 2 . 3 , The signal modules 2 each have an attachment element 18 for the associated printed circuit board element 7, wherein in a first embodiment, the associated circuit board element 7 is substantially completely received within the attachment element 18. The attachment element 18 has in a lower portion a protective element 25, with two rows of projections 19, one row being provided with longer projections 19 'and one row with shorter projections 19 ", the contact elements 11 each being between the projections serving as protection against contact 19 ', 19 "arranged. The longer projections 19 'cover the contact elements 11 on the side on which no contact is made, substantially entirely. On the other hand, the shorter projections 19 '' release an end section of the contact elements 11 for contacting purposes. The contact elements 11 as well as the projections 19 ', 19' are accommodated in corresponding passage openings 20 at the top of the attachment element 18 of the adjacent signal module 2 when two signal modules 2 are brought together. To adapt to the rotational movement during the closing of the bayonet connection, the passage openings 20 of the attachment element 18 are arcuately curved. When twisting the signal modules 2 for producing the bayonet connection, the pin-shaped projections 19 of the one (upper) signal module 2 are therefore moved in the arcuately curved passage openings 20 of the other (lower) signal module 2. Accordingly, the procedure is for the respective number of signal modules 2.

Die Anordnung der längeren 19' bzw. kürzeren Vorsprünge 19" ist auf den gegenüberliegenden radialen Abschnitten des Aufsatzelements 18 vertauscht. Somit wird eine bei Erreichen einer von der Bajonettverbindung definierten Anschlagstellung zuverlässig eine Kontaktierung benachbarter Leiterplattenelemente 7 hergestellt. Die Ausgestaltung der kürzeren Vorsprünge 19" stellt dabei zugleich sicher, dass die Kontaktierung zwischen den Leiterplattenelementen 7 beim Verbinden der Signalmodule 2 nicht behindert wird.The arrangement of the longer 19 'or shorter projections 19 "is on the opposite radial sections of the attachment element 18 reversed. Thus, upon reaching a stop position defined by the bayonet connection, a contacting of adjacent circuit board elements 7 is reliably produced. At the same time, the configuration of the shorter projections 19 "ensures that the contacting between the circuit board elements 7 when connecting the signal modules 2 is not hindered.

Wie aus Fig. 8, 9 weiters ersichtlich, vgl. auch Fig. 2, 3, weist das Aufsatzelement 18 zwei Halbschalen 22 auf, welche über eine Rastverbindung 23 miteinander verbunden sind. Im verbundenen Zustand der Halbschalen 22 weist das Aufsatzelement 18 ein Verbindungselement 24, in welchem die Durchgangsöffnungen 20 vorgesehen sind, ein Schutzelement 25 mit Vorsprüngen 19', 19" und ein Optikelement 26 auf. Das Optikelement 26 weist eine Anzahl an Linsen 27 auf, mit welchen der von der jeweils zugehörigen LED des Signalelements 8 abgegebenen Lichtstrahlen in zweckmäßiger Weise verteilt bzw. gerichtet wird. Das Aufsatzelement 18 selbst ist über eine Schnappverbindung 29 in dem äußeren Gehäuse 3 montiert.How out Fig. 8, 9 furthermore, cf. also Fig. 2 . 3 , the attachment element 18 has two half-shells 22, which are connected to one another via a latching connection 23. In the connected state of the half-shells 22, the attachment element 18 has a connection element 24, in which the passage openings 20 are provided, a protective element 25 with projections 19 ', 19 "and an optical element 26. The optical element 26 has a number of lenses 27, with which of the light beams emitted by the respectively associated LED of the signal element 8 is expediently distributed or directed The attachment element 18 itself is mounted in the outer housing 3 via a snap connection 29.

In den Fig. 11 bis 13 ist ein weiteres Ausführungsbeispiel ersichtlich, bei welchem das Aufsatzelement 18 gegenüber dem ersten Ausführungsbeispiel deutlich reduziert ist. D.h., dieses Aufsatzelement 18 schließt das Leiterplattenelement 7 nicht in der Art eines Schutzgehäuses ein, sondern vielmehr ist ein Leiterplattenelement 7 mit im Wesentlichen konstanter Breite vorgesehen, welches sich insbesondere im Bereich des Optikelements 26 und des Verbindungselements 24 deutlich über das Aufsatzelement 18 hinaus erstreckt. Im Übrigen weist das Aufsatzelement 18, ebenso wie im Zusammenhang mit dem ersten Ausführungsbeispiel beschrieben, ein Verbindungselement 24 mit Rastvorsprüngen 24' zwecks Befestigung an dem Gehäuse 3 bzw. einem gesondert oder einteilig mit dem Gehäuse 3 ausgebildeten Deckel 5 auf.In the Fig. 11 to 13 is another embodiment can be seen in which the attachment element 18 is significantly reduced compared to the first embodiment. That is, this attachment element 18 does not enclose the printed circuit board element 7 in the manner of a protective housing, but rather a printed circuit board element 7 is provided with a substantially constant width, which extends clearly above the attachment element 18, in particular in the region of the optical element 26 and the connecting element 24. Moreover, the attachment element 18, as described in connection with the first embodiment, a connecting element 24 with locking projections 24 'for attachment to the housing 3 and a separately or integrally formed with the housing 3 cover 5.

Bei dem zweiten Ausführungsbeispiel gemäß den Fig. 11 bis 13 sind die Durchgangsöffnungen 20 zudem ebenfalls in dem Deckel 5 ausgebildet und nicht im Aufsatzelement 18.In the second embodiment according to the Fig. 11 to 13 are the through holes 20 also also formed in the lid 5 and not in the attachment element 18th

Über die Rastnasen 24' kann das Leiterplattenelement 7, welches fest mit dem Aufsatzelement 18 verbunden ist, somit auf einfache Weise in dem Gehäuse 3 mittels einer Schnappverbindung, insbesondere mit einem mittigen Steg 30 des Deckels 5, verbunden werden.About the locking lugs 24 ', the circuit board element 7, which is firmly connected to the attachment element 18, thus in a simple manner in the housing 3 by means of a snap connection, in particular with a central web 30 of the lid 5, are connected.

Bei dem Aufsatzelement 18 des zweiten Ausführungsbeispiels umschließt das Schutzelement 25 jedoch, insbesondere zum Schutz von Kontaktelementen 11, nach wie vor einen unteren Endabschnitt des Leiterplattenelements 7, wobei - wie im Zusammenhang mit dem ersten Ausführungsbeispiel bereits im Detail beschrieben - die Kontaktelemente 11 zwischen einer Reihe kurzer Vorsprünge 19" und langer Vorsprünge 19' des Schutzelements 25 aufgenommen sind.In the attachment element 18 of the second exemplary embodiment, however, the protective element 25 still encloses, in particular for the protection of contact elements 11, a lower end section of the printed circuit board element 7, the contact elements 11 between a row, as already described in detail in connection with the first exemplary embodiment short projections 19 "and long projections 19 'of the protective element 25 are received.

In den Fig. 12 und 13 ist insbesondere ersichtlich, dass auch das Aufsatzelement 18 gemäß dem zweiten Ausführungsbeispiel im Wesentlichen aus zwei Halbschalen 22 zusammengesetzt ist, wobei zur konstruktiv einfachen Verbindung zwischen den beiden Halbschalen 22 des Aufsatzelements 18 und dem Leiterplattenelement 7 das Leiterplattenelement 7 Durchbrechungen 31, 32 aufweist, durch welche Verbindungselemente der jeweiligen Halbschale, insbesondere Rasthaken 34 oder Verbindungsstifte 35, zwecks Herstellung einer Steckverbindung mit der gegenüberliegenden Halbschale des Aufsatzelements 18 hindurchgeführt werden können. Wesentlich ist jedoch bei beiden Ausführungsbeispielen lediglich, dass bei der Verbindung zweier Signalmodule 2 über eine Bajonettverbindung in verdrehtem Zustand zugleich eine elektrische Verbindung zwischen übereinander angeordneten Leiterplattenelementen hergestellt wird.In the Fig. 12 and 13 In particular, it can be seen that the attachment element 18 according to the second embodiment is essentially composed of two half-shells 22, wherein the circuit board element 7 openings 31, 32 through which structurally simple connection between the two half-shells 22 of the attachment element 18 and the printed circuit board element 7 Connecting elements of the respective half-shell, in particular latching hooks 34 or connecting pins 35, for the purpose of producing a plug connection with the opposite half-shell of the attachment element 18 can be passed. However, it is essential in both embodiments only that when connecting two signal modules 2 via a bayonet connection in a twisted state at the same time an electrical connection between superimposed circuit board elements is made.

Claims (13)

  1. A signalling device (1), in particular for a signalling tower, for purposes of displaying operating states, with at least one signalling module (2), which has a circuit board element (7; 7') for at least one signalling element (8) for purposes of outputting a signal, in particular for a lighting element for purposes of outputting a signal light, wherein the signalling module (2) can be detachably connected with a further signalling module (2), and the signalling modules (2) in the connected state are arranged one above another, wherein the signalling module (2) has a bayonet coupling element (14) for purposes of connecting with a bayonet coupling element (14) of the further signalling module (2), and a connecting conductor (9), running through the signalling module (2), is provided for purposes of controlling a circuit board element (7'') of the further signalling module (2), characterised in that the circuit board element (7') of the signalling module (2) for purposes of forming the connecting conductor (9) has a conducting track (10') assigned to the signalling element (8) of the further signalling module (2), which conducting track (10') in the connected state of the signalling modules (2) is connected via a contact element (11) with a conducting track (10; 10', 10'') on the circuit board element (7'') of the further signalling module (2), wherein in an interconnected, non-rotated state of the bayonet coupling elements (14) the circuit board elements (7; 7', 7'') are arranged in a zero-contact position, and in an interconnected, rotated state of the bayonet coupling elements (14) they are arranged in a position to contact one another.
  2. The signalling device (1) in accordance with claim 1, characterised in that the circuit board element (7; 7', 7'') extends essentially over the whole height of the signalling module (2), wherein in the connected state of the signalling modules (2) the contact element (11) is arranged between an upper face contact point (12) of the one circuit board element (7') and a lower face contact point (13) of the other circuit board element (7'').
  3. The signalling device (1) in accordance with claim 1 or 2, characterised in that an elastically deflectable contact spring (11') is provided as the contact element (11), which contact spring in the connected state of the signalling modules (2) connects their circuit board elements (7; 7', 7'') with one another.
  4. The signalling device (1) in accordance with one of the claims 1 to 3, characterised in that the circuit board element (7; 7', 7'') has stud elements (17; 17', 17''), having contact points (12, 13), and projecting from the upper and lower face end faces of the circuit board elements (7; 7', 7''), wherein the lower or upper face stud elements (17; 17', 17'') are connected with the contact elements (11), and the upper or lower face stud elements (17; 17', 17'') respectively are free of contact elements (11).
  5. The signalling device (1) in accordance with one of the claims 1 to 4, characterised in that the signalling module (2) has a capping element (18) with a connecting element (24), the capping element (18) being connected with the circuit board element (7; 7', 7''), wherein the connecting element is accommodated via a detachable connection, preferably a snap connection (29), in an outer housing (3), preferably one with a cylindrical shell surface.
  6. The signalling device (1) in accordance with claims 1 to 5, characterised in that for purposes of protecting the contact elements (11) at least one protective element (25) is provided, at least partially enclosing the contact elements (11).
  7. The signalling device (1) in accordance with claim 6, characterised in that the protective element (25) has two rows of projections (19), between which the contact elements (11) are arranged, wherein a first row has comparatively short projections (19'') and a second row has comparatively long projections (19').
  8. The signalling device in accordance with one of the claims 5 to 7, characterised in that a cover/floor element (5) of the further signalling module (2) or the capping element (18) of a further circuit board element (7; 7', 7'') has at least one passage opening (20) curved in the shape of an arc.
  9. The signalling device (1) in accordance with one of the claims 1 to 8, characterised in that at least one optical element (26) is connected with the circuit board element (7; 7', 7''), which optical element has at least one optical lens (27), wherein the number of lenses (27) preferably corresponds essentially to a number of light-emitting diodes provided as a signalling element (8).
  10. The signalling device (1) in accordance with one of the claims 1 to 9, characterised in that at least one capping element (18) is provided, comprising the connecting element (24), the protective element (25) and the optical element (26).
  11. The signalling device (1) in accordance with one of the claims 5 to 10, characterised in that the capping element (18) has two half-shells (22), which are connected with one another via a detachable connection, preferably a latching connection (23).
  12. The signalling device (1) in accordance with one of the claims 1 to 11, characterised in that at least one circuit board element (7; 7', 7'') has more than three, preferably at least five, in particular eight, conducting tracks (10; 10', 10'', 10''') for the control of a corresponding number of signalling modules (2).
  13. The signalling device (1) in accordance with one of the claims 1 to 12, characterised in that at least two signalling modules (2) are provided, connected with one another, and in the connected state arranged one above another.
EP15150795.1A 2015-01-12 2015-01-12 Signalling device Active EP3043111B2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
ES15150795.1T ES2631809T3 (en) 2015-01-12 2015-01-12 Signaling device
EP15150795.1A EP3043111B2 (en) 2015-01-12 2015-01-12 Signalling device
EP17164549.2A EP3205933A1 (en) 2015-01-12 2015-01-12 Signalling device
PL15150795T PL3043111T3 (en) 2015-01-12 2015-01-12 Signalling device
US14/993,549 US10127779B2 (en) 2015-01-12 2016-01-12 Signalling device
US16/189,235 US10475304B2 (en) 2015-01-12 2018-11-13 Signalling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP15150795.1A EP3043111B2 (en) 2015-01-12 2015-01-12 Signalling device

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EP17164549.2A Division-Into EP3205933A1 (en) 2015-01-12 2015-01-12 Signalling device
EP17164549.2A Division EP3205933A1 (en) 2015-01-12 2015-01-12 Signalling device

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EP3043111A1 EP3043111A1 (en) 2016-07-13
EP3043111B1 true EP3043111B1 (en) 2017-04-05
EP3043111B2 EP3043111B2 (en) 2022-08-24

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EP17164549.2A Withdrawn EP3205933A1 (en) 2015-01-12 2015-01-12 Signalling device

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Also Published As

Publication number Publication date
US10475304B2 (en) 2019-11-12
US10127779B2 (en) 2018-11-13
EP3043111A1 (en) 2016-07-13
US20190080571A1 (en) 2019-03-14
EP3043111B2 (en) 2022-08-24
PL3043111T3 (en) 2017-09-29
US20160203686A1 (en) 2016-07-14
EP3205933A1 (en) 2017-08-16
ES2631809T3 (en) 2017-09-05

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