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EP1989796A4 - Discrete bootstrapping in an optical receiver to prevent signal feedback - Google Patents

Discrete bootstrapping in an optical receiver to prevent signal feedback

Info

Publication number
EP1989796A4
EP1989796A4 EP07757192.5A EP07757192A EP1989796A4 EP 1989796 A4 EP1989796 A4 EP 1989796A4 EP 07757192 A EP07757192 A EP 07757192A EP 1989796 A4 EP1989796 A4 EP 1989796A4
Authority
EP
European Patent Office
Prior art keywords
optical receiver
signal feedback
prevent signal
bootstrapping
discrete
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP07757192.5A
Other languages
German (de)
French (fr)
Other versions
EP1989796A2 (en
Inventor
Darrin James Douma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Finisar Corp
Original Assignee
Finisar Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Finisar Corp filed Critical Finisar Corp
Publication of EP1989796A2 publication Critical patent/EP1989796A2/en
Publication of EP1989796A4 publication Critical patent/EP1989796A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/60—Receivers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
    • H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by potential barriers, e.g. phototransistors
    • H01L31/101—Devices sensitive to infrared, visible or ultraviolet radiation
    • H01L31/102—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier
    • H01L31/107—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier the potential barrier working in avalanche mode, e.g. avalanche photodiodes
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/60—Receivers
    • H04B10/66—Non-coherent receivers, e.g. using direct detection
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/4823—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a pin of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48237—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Optics & Photonics (AREA)
  • Signal Processing (AREA)
  • Light Receiving Elements (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Optical Communication System (AREA)
  • Amplifiers (AREA)
EP07757192.5A 2006-02-17 2007-02-19 Discrete bootstrapping in an optical receiver to prevent signal feedback Withdrawn EP1989796A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US77478706P 2006-02-17 2006-02-17
PCT/US2007/062397 WO2007098433A2 (en) 2006-02-17 2007-02-19 Discrete bootstrapping in an optical receiver to prevent signal feedback

Publications (2)

Publication Number Publication Date
EP1989796A2 EP1989796A2 (en) 2008-11-12
EP1989796A4 true EP1989796A4 (en) 2013-10-23

Family

ID=38438082

Family Applications (1)

Application Number Title Priority Date Filing Date
EP07757192.5A Withdrawn EP1989796A4 (en) 2006-02-17 2007-02-19 Discrete bootstrapping in an optical receiver to prevent signal feedback

Country Status (7)

Country Link
US (2) US8059973B2 (en)
EP (1) EP1989796A4 (en)
JP (1) JP5081837B2 (en)
KR (1) KR100983563B1 (en)
CN (1) CN101384934B (en)
MY (1) MY157744A (en)
WO (1) WO2007098433A2 (en)

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JP5682152B2 (en) * 2010-06-18 2015-03-11 ソニー株式会社 Optical receiver and optical transmission system
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US9800350B2 (en) * 2012-01-23 2017-10-24 Intel Corporation Increased density SFP connector
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WO2014027991A1 (en) * 2012-08-13 2014-02-20 Hewlett-Packard Development Company, L.P. Trans-impedance amplifiers (tia) thermally isolated from optical modules
JP6127561B2 (en) * 2013-02-13 2017-05-17 三菱電機株式会社 Semiconductor photo detector
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CN105340199A (en) * 2013-06-26 2016-02-17 光速株式会社 Optical receiver using wavelength tunable filter
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CN105991196B (en) * 2015-02-17 2019-04-19 华为技术有限公司 A kind of data precoding device, system and coding method
US10073230B2 (en) * 2015-12-11 2018-09-11 Arista Networks, Inc. Pluggable optical module with heat sink
JP6600546B2 (en) * 2015-12-11 2019-10-30 日本ルメンタム株式会社 Optical module
CN105572816B (en) * 2015-12-23 2018-01-30 宁波环球广电科技有限公司 multi-channel parallel optical transceiver module
JP6676507B2 (en) * 2016-09-27 2020-04-08 日本ルメンタム株式会社 Optical sub-assembly and optical module
US10359572B2 (en) * 2016-10-31 2019-07-23 Electronics And Telecommunications Research Institute Device and method for detecting optical signal
CN107147448B (en) * 2017-04-21 2019-06-14 天津大学 A kind of broadband optical receiver front-end circuit of high sensitivity
CN109725391B (en) * 2017-10-27 2022-03-01 住友电工光电子器件创新株式会社 Receiver optical assembly and method of assembling the same
CN110635847B (en) * 2018-06-21 2021-08-03 华为技术有限公司 Optical network device and optical module
JP2020077956A (en) * 2018-11-07 2020-05-21 住友電気工業株式会社 Optical receiving circuit
CN114389712B (en) * 2019-06-21 2024-06-18 华为技术有限公司 Optical receiving module, optical transceiver module, optical module, and optical network device
JP7350646B2 (en) * 2019-12-17 2023-09-26 ＣＩＧ Ｐｈｏｔｏｎｉｃｓ Ｊａｐａｎ株式会社 optical module
US11340412B2 (en) * 2020-02-28 2022-05-24 CIG Photonics Japan Limited Optical module
US11953375B2 (en) * 2020-07-06 2024-04-09 Mitsubishi Electric Corporation Light receiving module comprising stem and block on an upper surface of the stem
CN114497330B (en) * 2022-04-18 2022-07-12 至芯半导体(杭州)有限公司 TO ultraviolet device packaging structure

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EP0406865A2 (en) * 1989-07-06 1991-01-09 Sumitomo Electric Industries, Ltd. Demodulation circuit
EP0684651A2 (en) * 1994-05-16 1995-11-29 Sumitomo Electric Industries, Limited Photodetector module and method of making same
US20040081473A1 (en) * 2002-10-25 2004-04-29 Imran Sherazi Direct attach optical receiver module and method of testing
US20060034621A1 (en) * 2004-08-12 2006-02-16 Finisar Corporation Transimpedance amplifier with integrated filtering and reduced parasitic capacitance

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Publication number Priority date Publication date Assignee Title
EP0177216A2 (en) * 1984-09-29 1986-04-09 International Standard Electric Corporation Optical receiver
EP0406865A2 (en) * 1989-07-06 1991-01-09 Sumitomo Electric Industries, Ltd. Demodulation circuit
EP0684651A2 (en) * 1994-05-16 1995-11-29 Sumitomo Electric Industries, Limited Photodetector module and method of making same
US20040081473A1 (en) * 2002-10-25 2004-04-29 Imran Sherazi Direct attach optical receiver module and method of testing
US20060034621A1 (en) * 2004-08-12 2006-02-16 Finisar Corporation Transimpedance amplifier with integrated filtering and reduced parasitic capacitance

Also Published As

Publication number Publication date
EP1989796A2 (en) 2008-11-12
CN101384934B (en) 2011-05-11
US20120057879A1 (en) 2012-03-08
MY157744A (en) 2016-07-15
US8059973B2 (en) 2011-11-15
JP5081837B2 (en) 2012-11-28
CN101384934A (en) 2009-03-11
KR100983563B1 (en) 2010-09-27
KR20080097431A (en) 2008-11-05
US8693879B2 (en) 2014-04-08
US20070201881A1 (en) 2007-08-30
WO2007098433A3 (en) 2008-05-15
WO2007098433A2 (en) 2007-08-30
JP2009527904A (en) 2009-07-30

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