CN114497330B - A TO UV device packaging structure - Google Patents

Abstract

The invention discloses a TO UV device packaging structure, which relates to the technical field of semiconductor packaging. A ceramic module is mounted on a base, a front pad and a bottom pad are respectively mounted on the upper and lower end faces of the ceramic module, and a plurality of side pads surround the ceramic module. It is installed on the outer side wall of the device, and different side pads can be connected to different parts corresponding to the front pads. It passes through the base, the bottom pad and the ceramic module in sequence, and conducts with different parts of the front pad. Different parts of the front pad can also conduct the deep ultraviolet emitting chip and the detection chip through the side pad respectively. The detection chip can receive the signal sent by the deep ultraviolet emission chip. The TO UV device packaging structure can meet the optical communication technical requirements that a single device has both deep UV emission and 360-degree reception.

Description

A TO UV device packaging structure

technical field

The invention relates to the technical field of semiconductor packaging, in particular to a packaging structure of a TO ultraviolet device.

Background technique

Deep ultraviolet light-emitting diodes (UVC LEDs) have the advantages of high reliability, long life, fast response, low power consumption, environmental protection, no pollution and small size, and are widely used in ultraviolet light communication, sterilization and other fields. Its ultraviolet light communication has the unique advantages of flexibility, low eavesdropping, omnidirectional and non-line-of-sight communication. Ultraviolet photons are mainly used in important communication fields such as short distance and high confidentiality. The scattering effect of deep ultraviolet photons in the atmosphere makes ultraviolet light The direction of energy transmission has changed, which also laid the communication foundation for ultraviolet light communication. However, at present, the deep ultraviolet light emitting diode emitting device and the deep ultraviolet signal receiving device are designed as separate devices, and the single deep ultraviolet signal receiving device receives the signal at an angle of 180 degrees, which cannot achieve 360 degree deep ultraviolet signal reception.

SUMMARY OF THE INVENTION

The purpose of the present invention is to provide a TO UV device packaging structure, so as to solve the problems existing in the above-mentioned prior art, and achieve the optical communication technical requirement that a single device has both deep UV emission and 360-degree reception.

For achieving the above object, the present invention provides the following scheme:

The invention provides a TO UV device packaging structure, comprising a base, a ceramic module, a bottom pad, a front pad, a side pad, a deep UV emission chip, a detection chip, a top lens and an electrode post. The ceramic module is installed On the base, the front-side pads and the bottom-side pads are respectively mounted on the upper end face and the lower end face of the ceramic module, and the side pads are multiple and surround the outer sidewall of the ceramic module Installation, the different side pads can be connected to different parts corresponding to the front pads, the deep ultraviolet emission chip is installed on the front pad, the detection chips are multiple, and they are respectively installed in On each of the side pads, there are a plurality of the electrode posts, and all of them pass through the base, the bottom pad and the ceramic module in sequence, and are connected to different parts of the front pad, Different parts of the front pad can also conduct the deep ultraviolet emitting chip and the detection chip through the side pad respectively, so that the detection chip can receive the light emitted by the deep ultraviolet emitting chip. signal, the top lens is located above the deep ultraviolet emitting chip.

Preferably, the front-side pads include a first front-side pad, a second front-side pad, a third front-side pad and a fourth front-side pad, and the deep ultraviolet emitting chip is mounted on the first front-side pad and the fourth front-side pad. The upper end surface of the second front-side pad, the third front-side pad and the fourth front-side pad can be connected to the probe chip through the side pad.

Preferably, the outer edge of the bottom end of the base is provided with an annular step, the base is provided with a plurality of first through holes, and the bottom end pad is provided with a first through hole at a position corresponding to each of the first through holes. Two through holes, the first through hole and the second through hole are both used for the passage of the electrode column.

Preferably, the inner diameter of the second through hole is larger than the inner diameter of the first through hole.

Preferably, an insulating sleeve is installed in each of the first through holes, both ends of the insulating sleeve are open, and one of the electrode posts is coaxially installed inside one of the insulating sleeves.

Preferably, it also includes an annular lens, the annular lens is sleeved on the base and the outer periphery of the ceramic module, the lower end of the annular lens is in contact with the upper end surface of the annular step, and the upper end of the annular lens is in contact with the upper end surface of the annular step. The lower end of the top lens is fixed, and the annular lens is located outside each of the detection chips.

Preferably, a tube cap is also included, the tube cap is sleeved on the outer circumference of the annular lens, the lower end of the tube cap is in contact with the upper end surface of the annular step, and the outer edge of the lower end of the tube cap is in contact with the The outer edge of the annular step is flush, the upper end of the cap is higher than the annular edge of the lower end of the top lens, and lower than the upper end of the top lens, and the cap corresponds to the position of each of the side pads All have light exits.

Preferably, the side wall of the ceramic module is provided with four plane structures, and the plane structures are evenly arranged around the side wall of the ceramic module, and the adjacent plane structures do not contact each other, and one plane structure A corresponding side pad is installed on the side pad, and the side pad is divided into a first side pad and a second side pad; the ceramic module is provided with a plurality of third through holes, and the third through holes It is used for the passage of the electrode column; it also includes a first metal column and a second metal column, and the first metal column and the second metal column are respectively fixed on the different plane structures, and the first metal column and the second metal column are respectively fixed on the different plane structures. The metal post can conduct the lower layer circuit of the side pad and the fourth front pad through the first side pad, and the second metal post can conduct the side surface through the second side pad the upper-layer wiring of the pad and the third front-side pad.

Preferably, the upper end surface of the ceramic module is further provided with front through-hole slots corresponding to the positions of the first metal pillar and the second metal pillar, and the two front through-hole slots can be respectively connected with the first metal pillar and the second metal pillar. A metal column is connected to the second metal column, each of the planar structures is provided with side through holes, and the inside of the side through holes can be electroplated with copper metal, and the metal column and the metal column are connected by electroplating copper metal. the side pads.

Preferably, the positive electrodes of the detection chips correspond to the positive electrodes, and the negative electrodes correspond to the negative electrodes.

The present invention has achieved the following technical effects with respect to the prior art:

In the packaging structure of the TO UV device provided by the present invention, the front pad and the bottom pad are respectively installed on the upper end face and the lower end face of the ceramic module, the side pads are multiple and are installed around the outer side wall of the ceramic module, and different side pads It can be connected to different parts corresponding to the front pads, so as to facilitate the circuit conduction of the deep ultraviolet emission chip mounted on the front pad and the detection chip mounted on the upper end of each side pad, and different parts of the front pad are also connected. It can turn on the deep ultraviolet emitting chip and the detection chip through the side pad respectively, so that the detection chip can receive the signal from the deep ultraviolet emitting chip. At the same time, the circumferentially arranged side pads and the detection chip can realize a single TO device The front side emits the deep ultraviolet photon signal, and the side receives the deep ultraviolet photon signal from 360°, which meets the requirements of the TO ultraviolet device that transmits the deep ultraviolet signal and receives the deep ultraviolet signal, and simplifies the system structure. The top lens is located above the deep ultraviolet emission chip. , and then can realize the light-gathering function.

Description of drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the accompanying drawings required in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some of the present invention. In the embodiments, for those of ordinary skill in the art, other drawings can also be obtained according to these drawings without any creative effort.

Fig. 1 is the structural representation of the TO UV device packaging structure provided by the present invention;

Fig. 2 is the sectional view of Fig. 1;

Fig. 3 is the exploded view of Fig. 1;

4 is a schematic diagram of the internal structure of the TO UV device packaging structure provided by the present invention;

5 is a schematic diagram of the external circuit of the ceramic module in the present invention;

Fig. 6 is the structural representation of the ceramic module in the present invention;

Fig. 7 is the structural representation of the cap in the present invention;

8 is a schematic structural diagram of an annular lens in the present invention;

In the picture: 100-TO UV device package structure, 1-cap, 2-top lens, 3-ring lens, 4-deep UV emission chip, 5-front pad, 6-ceramic module, 7-detection chip, 8 -Side Pad, 9- Bottom Pad, 10- Base, 11- Insulation Sleeve, 12- Electrode Post, 13- Light Exit, 14- Ring Edge, 15- Third Through Hole, 16- Front Through Hole Slot, 17-first metal pillar, 18-side through hole, 19-second through hole, 20-first through hole, 21-ring step, 22-planar structure, 23-first front side pad, 24-second front side Pad, 25-third front side pad, 26-fourth front side pad, 27-first side pad, 28-second side pad, 29-cap brim, 30-second metal post.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

The purpose of the present invention is to provide a TO UV device packaging structure, in order to solve the existing TO UV device as a separate design, it is impossible to realize the technology that a single TO UV device can both emit deep UV signals and receive deep UV signals, and has a complex structure question.

In order to make the above objects, features and advantages of the present invention more clearly understood, the present invention will be described in further detail below with reference to the accompanying drawings and specific embodiments.

As shown in FIGS. 1-8 , the present invention provides a TO UV device packaging structure 100 , including a base 10 , a ceramic module 6 , a bottom pad 9 , a front pad 5 , a side pad 8 , and a deep UV emission chip 4 , the detection chip 7, the top lens 2 and the electrode column 12, the ceramic module 6 is mounted on the base 10, and the base 10 is made of metal material, as the support carrier of the whole package structure, the front pad 5 and the bottom pad 9 are respectively It is installed on the upper and lower end surfaces of the ceramic module 6 to facilitate the conduction of the circuit, and the front pad 5, the bottom pad 9 and the side pad 8 are formed of electroplated copper metal to form a metal circuit pad structure, and It is integrated with the ceramic module 6 by metal solder welding. There are multiple side pads 8 and are installed around the outer side wall of the ceramic module 6. Different side pads 8 can be connected to different parts corresponding to the front pads 5, which is convenient for Realize the circuit conduction of the deep ultraviolet emission chip 4 installed on the front pad 5 and the detection chip 7 installed on the upper end of each side pad 8, and the electrode posts 12 are multiple, and all pass through the base 10 and the bottom in turn. The pad 9 and the ceramic module 6 are connected to different parts of the front pad 5. Different parts of the front pad 5 can also conduct the deep ultraviolet emission chip 4 and the detection chip 7 through the side pad 8 respectively. The detection chip 7 can receive the signal sent by the deep ultraviolet emission chip 4, and the side pads 8 and the detection chip 7 arranged in the circumferential direction can realize the front side of a single TO device emits deep ultraviolet photon signals, and the side receives the deep ultraviolet light from 360° The photon signal meets the requirements of the TO ultraviolet device integrating the emission of deep ultraviolet signals and the reception of deep ultraviolet signals, and the system structure is simplified. An annular rim 14 is provided on the outer periphery.

Specifically, as shown in FIG. 5 , the front-side pads 5 include a first front-side pad 23 , a second front-side pad 24 , a third front-side pad 25 and a fourth front-side pad 26 , and each of the front-side pads 5 There is no direct contact between adjacent pads, the deep ultraviolet emitting chip 4 is mounted on the upper end surfaces of the first front pad 23 and the second front pad 24, and is fixed by welding at high temperature, the third front pad 25 and the fourth The front pads 26 can be connected to the detection chip 7 through the side pads 8 , thereby facilitating the front-side emission of the deep-ultraviolet signal through the deep-ultraviolet emitting chip 4 , and the side reception of the deep-ultraviolet signal through the detection chip 7 .

The outer edge of the bottom end of the base 10 is provided with an annular step 21, which can facilitate the installation of other components. The base 10 is provided with a plurality of first through holes 20, and the bottom end pad 9 corresponds to each first through hole. The position 20 is provided with a second through hole 19, and both the first through hole 20 and the second through hole 19 are used for the passage of the electrode post 12, so as to realize the conduction of the circuit. Preferably, the base 10 is integrally stamped and formed by a die, and the production process is simple.

The inner diameter of the second through hole 19 is larger than the inner diameter of the first through hole 20 , thereby preventing an abnormal short circuit between the electrode post 12 and the bottom pad 9 during installation.

An insulating sleeve 11 is installed in each first through hole 20, the inner diameter of the first through hole 20 is equal to the outer diameter of the insulating sleeve 11, and the inner wall of the first through hole 20 is coated with a high-temperature adhesive to realize the insulating sleeve 11 and the base. 10 is bonded and fixed at high temperature, both ends of the insulating sleeve 11 are open, and an electrode column 12 is coaxially installed inside an insulating sleeve 11, and the upper end of the electrode column 12 protrudes from the insulating sleeve 11, and the electrode column 12 is subjected to the insulation sleeve 11. Fixed and insulated.

The TO UV device packaging structure 100 provided by the present invention further includes an annular lens 3, the annular lens 3 is sleeved on the base 10 and the outer periphery of the ceramic module 6, and the lower end of the annular lens 3 is in contact with the upper end surface of the annular step 21, and passes through the metal solder High temperature welding and fixing, the upper end of the annular lens 3 is fixed with the lower end of the top lens 2, and the annular lens 3 is located outside each detection chip 7, which is used to protect the detection chip 7, prolong the overall service life, and improve the overall appearance. sex.

The TO UV device packaging structure 100 provided by the present invention further includes a tube cap 1, the tube cap 1 is sleeved on the outer periphery of the annular lens 3, and the lower end of the tube cap 1 is in contact with the upper end surface of the annular step 21, and the outer edge of the lower end of the tube cap 1 It is flush with the outer edge of the annular step 21, which not only realizes the installation of the cap 1, but also ensures the overall aesthetics, and at the same time avoids the exposure of electronic devices to affect the aesthetics. The upper end of the cap 1 is higher than the annular edge 14 at the lower end of the top lens 2 , and is lower than the upper end of the top lens 2, preferably, as shown in FIG. 7, a ring of cap rim 29 is provided at the lower end of the cap 1, and the lower end face of the cap rim 29 is in contact with the upper end face of the annular edge 14 of the top lens 2 and To achieve stable installation, light outlets 13 are provided on the cap 1 at positions corresponding to the side pads 8 to avoid affecting the detection chip 7's reception of deep ultraviolet signals. Preferably, the cap 1 is integrally extruded through a die.

As shown in FIG. 4 , the side wall of the ceramic module 6 is provided with four planar structures 22 , each of which is parallel to the axial direction of the ceramic module 6 , and the planar structures 22 are evenly arranged around the side wall of the ceramic module 6 , thereby facilitating the The side pads 8 and the detection chip 7 are installed without contact between the adjacent plane structures 22. One side pad 8 is correspondingly installed on one plane structure 22, and the side pads 8 are divided into a first side pad 27 and a second side pad 27. Two side pads 28, the first side pad 27 is used to conduct the lower layer circuit, and the second side pad 28 is used to conduct the upper layer circuit; the ceramic module 6 is provided with a plurality of third through holes 15, and the third through holes 15 is used for the passage of the electrode column 12, the third through hole 15 is filled with metal solder, and the ceramic module 6 and the electrode column 12 are welded together at high temperature to form a stable connection. The first through hole 20, the second through hole 19 and The positions of the third through holes 15 correspond one by one, and there are four, and there are also four electrode columns 12. The electrode columns 12 can pass through the first through hole 20, the second through hole 19 and the third through hole 15 in sequence and connect with Different pads in the front pads 5 are turned on, that is, the four electrode posts 12 are respectively turned on to the first front pad 23, the second front pad 24, the third front pad 25 and the fourth front pad 26; also It includes a first metal column 17 and a second metal column 30, and the first metal column 17 and the second metal column 30 are respectively fixed on different plane structures 22, and the first metal column 17 can be conductive through the first side pad 27 The lower layer circuit of the side pad 8 and the fourth front pad 26, the second metal pillar 30 can conduct the upper layer circuit of the side pad 8 and the third front pad 25 through the second side pad 28, and then pass through the third side pad 25. The front-side pads 25 and the fourth front-side pads 26 conduct the probe chip 7 . Preferably, the planar structure 22 of the ceramic module 6 is processed by a milling cutter.

The upper end surface of the ceramic module 6 is also provided with a front through hole slot 16 at the position corresponding to the first metal column 17 and the second metal column 30 , and the two front through hole slots 16 can be respectively connected with the first metal column 17 and the second metal column 17 . The column 30 is turned on. In the actual manufacturing process, the planar structure 22 of the ceramic module 6 is electroplated with copper metal in turn through the circuit design structure to form a parallel circuit layer structure, and the front through-hole groove 16 is filled with electroplated copper metal. Each plane structure 22 is provided with side through holes 18, and the inside of the side through holes 18 can be electroplated with copper metal, and the metal pillars and the side pads 8 are connected through the electroplated copper metal, so as to facilitate the conduction of the circuit. Preferably, each of the side through holes 18 , the front through hole grooves 16 and the third through holes 15 are formed by laser drilling at designated positions of the planar structure 22 of the ceramic module 6 by laser.

The positive electrode of each detection chip 7 corresponds to the positive electrode, and the negative electrode corresponds to the negative electrode to form a parallel circuit structure of multiple detection chips 7, so as to achieve higher deep ultraviolet signal receiving sensitivity.

In the actual processing process, the nickel-palladium-gold material metal is electroplated on the outside of the overall structure in turn by means of electroplating.

In this specification, specific examples are used to illustrate the principles and implementations of the present invention, and the descriptions of the above embodiments are only used to help understand the method and the core idea of the present invention; There will be changes in the specific implementation manner and application scope of the idea of the invention. In conclusion, the contents of this specification should not be construed as limiting the present invention.

Claims (6)

1. A TO ultraviolet device packaging structure is characterized in that: the deep ultraviolet radiation detection device comprises a base, a ceramic module, a bottom pad, a front pad, side pads, a deep ultraviolet radiation chip, a detection chip, a top lens and electrode columns, wherein the ceramic module is installed on the base, the front pad and the bottom pad are respectively installed on the upper end face and the lower end face of the ceramic module, the side pads are multiple and are installed around the outer side wall of the ceramic module, different side pads can be conducted with different parts corresponding to the front pad, the deep ultraviolet radiation chip is installed on the front pad, the detection chips are multiple and are respectively installed on the side pads, the electrode columns are multiple, sequentially penetrate through the base, the bottom pad and the ceramic module and are conducted with different parts of the front pad, different parts of the front pad can also be respectively conducted with the deep ultraviolet radiation chip and the detection chip through the side pad, the detection chip can receive signals sent by the deep ultraviolet emission chip, and the top end lens is positioned above the deep ultraviolet emission chip;

the front bonding pads comprise a first front bonding pad, a second front bonding pad, a third front bonding pad and a fourth front bonding pad, the deep ultraviolet emission chip is mounted on the upper end faces of the first front bonding pad and the second front bonding pad, and the third front bonding pad and the fourth front bonding pad can be conducted with the detection chip through the side bonding pads;

an annular step is arranged at the outer edge of the bottom end of the base, a plurality of first through holes are formed in the base, second through holes are formed in positions, corresponding to the first through holes, of the bottom end bonding pad, and the first through holes and the second through holes are used for the electrode column to pass through;

the annular lens is sleeved on the peripheries of the base and the ceramic module, the lower end of the annular lens is in contact with the upper end face of the annular step, the upper end of the annular lens is fixed with the lower end of the top end lens, and the annular lens is positioned outside each detection chip;

the side wall of the ceramic module is provided with four planar structures, the planar structures are uniformly arranged around the side wall of the ceramic module, adjacent planar structures are not in contact with each other, one planar structure is correspondingly provided with one side surface bonding pad, and the side surface bonding pads are divided into a first side surface bonding pad and a second side surface bonding pad; a plurality of third through holes are formed in the ceramic module and used for the electrode columns to pass through; still include first metal post and second metal post, just first metal post with the second metal post is fixed respectively different on the planar structure, first metal post can pass through first side pad switches on the lower floor's circuit of side pad with the positive pad of fourth, the second metal post can pass through second side pad switches on the upper strata circuit of side pad with the positive pad of third.

2. The TO ultraviolet device package structure of claim 1, wherein: the inner diameter of the second through hole is larger than that of the first through hole.

3. The TO ultraviolet device package structure of claim 1, wherein: and each first through hole is internally provided with an insulating sleeve, two ends of each insulating sleeve are opened, and one electrode column is coaxially arranged in one insulating sleeve.

4. The TO ultraviolet device package structure of claim 1, wherein: the LED lamp tube is characterized by further comprising a tube cap, the tube cap is sleeved on the periphery of the annular lens, the lower end of the tube cap is in contact with the upper end face of the annular step, the outer edge of the lower end of the tube cap is flush with the outer edge of the annular step, the upper end of the tube cap is higher than the annular edge of the lower end of the top end lens and lower than the upper end of the top end lens, and light outlets are formed in positions, corresponding to the side surface welding discs, on the tube cap.

5. The TO ultraviolet device package structure of claim 1, wherein: the upper end face of the ceramic module is provided with front through hole grooves corresponding to the positions of the first metal column and the second metal column, the two front through hole grooves can be respectively communicated with the first metal column and the second metal column, each plane structure is provided with side through holes, copper metal can be electroplated inside the side through holes, and the metal columns and the side pads are communicated through the electroplated copper metal.

6. The TO ultraviolet device package structure of claim 1, wherein: the positive pole and the positive pole of each detection chip correspond to each other, and the negative pole of each detection chip correspond to each other.

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