[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

EP1897425A1 - Hardware protection system for sensitive electronic-data modules protecting against external manipulations - Google Patents

Hardware protection system for sensitive electronic-data modules protecting against external manipulations

Info

Publication number
EP1897425A1
EP1897425A1 EP05761153A EP05761153A EP1897425A1 EP 1897425 A1 EP1897425 A1 EP 1897425A1 EP 05761153 A EP05761153 A EP 05761153A EP 05761153 A EP05761153 A EP 05761153A EP 1897425 A1 EP1897425 A1 EP 1897425A1
Authority
EP
European Patent Office
Prior art keywords
circuit board
circuit
printed circuit
interior
conductor structures
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP05761153A
Other languages
German (de)
French (fr)
Inventor
Anton Wimmer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of EP1897425A1 publication Critical patent/EP1897425A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
    • G06F21/70—Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer
    • G06F21/86—Secure or tamper-resistant housings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0275—Security details, e.g. tampering prevention or detection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor

Definitions

  • Electronic assemblies for highly sensitive data processing and data protection should be hardware-based against external manipulation, such as chemical or physical attacks (for example, mechanical, laser, fire, etc.), so that data can not be manipulated.
  • Bohrschutzfolie Such a protection film is available, for example, from the company Gore as a finished product or it is offered by the company Freudenberg as a film with Silberleitpas- pressure.
  • the foil is electrically connected inwardly to the assembly. After the electronics assembly has been packaged three-dimensionally, it is then poured into a container of synthetic resin. When attempting to open the packaging, where the attacks occur, the electrical traces or resistance lines on the foils are forcibly damaged and broken, causing the electronic assembly to immediately erase the stored data. As a result, the data can not be manipulated and the attack from the outside is thus recognizable by appropriate control bodies.
  • the object of the invention is to provide a hardware contactor for electronic assemblies, which can be integrated into an electronics-compatible production.
  • hardware protection in the form of a circuit carrier surrounding an interior for components of a circuit to be protected includes conductor structures surrounding the interior space, for example in the form of a net-like structure or a cage, for detecting unauthorized external manipulations of the circuit.
  • the conductor structures for detecting accesses to the circuit are thus integrated directly into the circuit carrier of the circuit.
  • the the. Interior surrounding conductor structures for example, as a conductor surfaces and / or as a closely structured structure in the form of a grid, in the form of a network, with meanders and / or with sectors in which the conductor structures extend in different geometric shapes.
  • the form of conductor tracks or interconnects should correspond to conventional HDI (High Density Interconnection) structures. The same applies to the breadth of the gradients of the conductor structures. In the event of unauthorized access to the circuit, the conductor structures are violated so that a contact is closed or interrupted and the access to the circuit is thus detected.
  • HDI High Density Interconnection
  • the hardware protection overall assembly preferably has circuit carriers in the form of one or more printed circuit boards.
  • This printed circuit board (s) may or may have at least some of the construction elements on and / or in their side facing the interior. te the circuit to be protected. In addition, they can or may have on and / or in their side facing away from the interior part of the surrounding the interior conductor structures.
  • the printed circuit board is advantageously a multilayer printed circuit board or a multilayer ceramic substrate with layers for the conductor structures surrounding the interior and layers for wiring some of the components of the circuit to be protected.
  • the layers for wiring the some of the components of the circuit to be protected are arranged in particular on and / or in the interior facing side of the circuit board.
  • Through-contacts in the printed circuit board can be embodied as buried vias and / or micro vias (micro blind hole) of a wide variety of technologies (plasma etching, photo-definable or laser-drilled).
  • the hardware protection module has a further multi-layer printed circuit board and / or multilayer ceramic substrate, which is arranged opposite the first printed circuit board, carries on and / or in its side facing away from the interior, a further part of the conductor structures surrounding the interior and in particular on and / or in its side facing the interior further comprising the components of the circuit to be protected.
  • Circuit board arranged a frame circuit board, which spaces the two circuit boards and thereby between itself and the circuit boards generated the interior.
  • the frame circuit board is constructed in multi-layer circuit board technology or multilayer ceramic substrate, for example by arranging dielectric layers and electrically conductive layers over one another in layers.
  • the interior can be a cavity, but it does not have to be.
  • the interior is filled with a casting resin.
  • the circuit carrier has connections for connecting detector means for detecting a violation of the conductor structures.
  • the entire circuit carrier is thus at least substantially embodied in multi-layer printed circuit board and / or multilayer ceramic technology.
  • the entire assembly with the circuit carriers is used, in particular, in a tachograph, a travel data recorder and / or a rail-bound or non-rail-bound vehicle. However, it can also be used, for example, in ATMs, devices for financial institutions and aircraft. In particular, the use of the overall assembly with the circuit carriers is always advantageous when school-to-business cryptographic keys (RSA, DES) are used.
  • RSA school-to-business cryptographic keys
  • a device with a circuit carrier of one of the types described above preferably contains detector means for detecting a violation of the conductor structures due to unauthorized access and / or unauthorized manipulation. So that the detector means themselves are protected, they can be designed as part of the circuit to be protected.
  • Figure 1 is a schematic representation of an integrated circuit
  • Figure 2 is a schematic partial view of the hardware protection of Figure 1;
  • FIG. 3 shows a detail of the printed circuit board structure of the hardware protection according to FIG. 1;
  • FIG. 4 shows a frame circuit board of the hardware protection according to FIG. 1.
  • FIG. 1 shows a circuit carrier 1 with a first subassembly in the form of a printed circuit board 2 with some components 3 of a circuit to be protected.
  • the printed circuit board 2 has conductor structures 4 in the form of a protection layer as part of a multilayer wiring for detecting accesses to the circuit to be protected.
  • it has feedthroughs 5 for signal lines and power supply of the circuit to be protected to the outside of the circuit carrier. These bushings 5 run through the conductor structures surrounding the interior and end at a plug installation location 6.
  • the circuit carrier 1 furthermore has a further printed circuit board 7 which has further components 8 of the circuit to be protected.
  • the further components 8 of the further printed circuit board 7 are arranged on the side of the further printed circuit board, which points to the side of the printed circuit board 2, on which are the some components 3 of the circuit to be protected. All components of the circuit to be protected are thus located between the printed circuit board 2 and the further printed circuit board 7 in an interior 9 formed between the printed circuit boards.
  • the printed circuit board 2 and the further printed circuit board 7 are spaced by a frame printed circuit board 10, which is arranged between the two printed circuit boards and surrounds the interior 9 together with the printed circuit board 2 and the further printed circuit board 7.
  • the printed circuit board 2, the further printed circuit board 7 and the frame printed circuit board 10 are each designed so that wiring and components 3, 8 of the circuit to be protected in and / or on the interior 9 facing sides and / or areas of the circuit board 2, the further circuit board 7 and the frame circuit board 10 are arranged. These wirings and components 3, 8 and thus the entire circuit to be protected are completely surrounded by a structure of conductor structures 4 of the printed circuit board 2, conductor structures 11 of the further printed circuit board 7 and conductor structures 12 of the frame circuit board 10, which are each electrically connected to each other.
  • the conductor structures are coupled to detector means designed as a special electronic circuit for detecting a violation of the conductor structures.
  • the conductor structures can be regarded as belonging to the detector means.
  • Outer circumferential connection frames 13 are electrically coupled to the special electronics assembly, providing additional protection.
  • Circumferential conductor structures 35, 37 which are electrically coupled to the detector means, are provided between the peripheral connection frame 13 and the terminals 14 connecting the different printed circuit boards.
  • FIG. 3 shows the structure of the printed circuit board 2. It contains a grounding layer 21, at least one hardware protection network layer 22 for the conductor structures 4, at least one hardware protection rewiring layer 23, at least one power supply layer 24, at least one grounding layer 25, a plurality of signal layers 26, 27, 28.
  • the arrangement of the layers is selected so that the outer layers of protection and inside the signal and supply layers are arranged.
  • the frame circuit board 10 consists of a multi-layer board or - multi-layer ceramic substrate consisting of n-line layers with conductor structures 15, wherein the spacing of two conductor planes is less than 500 ⁇ m.
  • the frame circuit board 10 through holes 16 in the form of Piated Through Holes, which extend perpendicular to the layers of the circuit board 2 to the other circuit board.
  • the hardware-based manipulation protection is thus integrated directly into the electronic module, that is, in the printed circuit boards used for the assembly 2, 7.
  • the design of the module is designed to the effect that it has two sub-assemblies, wherein both sub-assemblies are equipped only on one side with components in the form of components 3, 8 of the circuit to be protected.
  • the printed circuit boards 2, 7 for these sub-assemblies are designed so that they are designed as multi-layer printed circuit boards, the necessary for wiring the components 3, 8 inner and outer layers of Be cafeseite and no outward leading electrical feedthroughs on the back of the circuit board, so the Be Schossen opposite side, have.
  • the vias necessary for the function of the assemblies of the circuit to be protected are designed as buried vias or the necessary assembly positions for the sub-assembly wiring are SBU structures (sequential build-up) with plasma-etched, photolithographic or laser drilling generated micro via vias performed.
  • sequential build-up layers are applied to an existing core and provided with micro-vias.
  • the sub-assembly printed circuit boards have contact pads in array outside the placement area.
  • the printed circuit boards 2, 7 of the sub-assemblies include on the opposite side of the Be Divisionseite, ie the side facing away from the interior 9, also a plurality of conductive layers.
  • These are, for example, designed as multi-layered copper layers with conductor structures 4, 11, which are each realized as very finely structured conductor tracks, which once cover the entire layer surface in close-meshed fashion and but are also extend from layer to layer, due to the design of the conductor tracks.
  • the conductor widths of one layer cover the insulation spacings and a part of the associated interconnects of the layers underneath and separated by the dielectric.
  • the design of the ultra-fine conductors can also be carried out in resistance paste pressure (integrated resistors with defined resistance values) as conductive paste (ceramic thick-film technology) or as ink print with carbon ink (integrated resistors with defined resistance values) in all imaginable structures, which cover a large area generate at least one layer a close-meshed structure and which are electrically connected to the inside of the module.
  • resistance paste pressure integrated resistors with defined resistance values
  • conductive paste ceramic thick-film technology
  • ink print with carbon ink integrated resistors with defined resistance values
  • At least one of the printed circuit boards 2, 7 of the subassemblies can also be designed as a flex-rigid printed circuit board or it can be attached to a rigid printed circuit board, a flex line for data transmission.
  • the dielectric distance of the hardware protective layers in the printed circuit boards of the subassemblies is selected so that damage to the overlying and the underlying protective layers also takes place at the face-side drilling and thus the protective mechanism is triggered.
  • the frame circuit board 10 may be rigid and the two printed circuit boards 2, 7 of the sub-assemblies as a flexible circuit.
  • This circuit board is constructed as a frame circuit board 10 and designed as a multilayer, which prevents it due to its Bauwei- se, later attacking the entire assembly on the front side. As a rule, this is achieved with a spacing of the individual layers smaller than 500 ⁇ m.
  • the electrical through-contacts 16 which electrically connect the two subassemblies in the assembled state.
  • the hidden vias for the individual layers of the protective circuits are distributed irregularly. Both via types or types are performed on top and bottom of the frame-like multilayer printed circuit board of the frame circuit board 10 in connection pads, which serve the subsequent contacting of the individual sub-assemblies with each other.
  • the electrical connection and mechanical connection of the subassemblies to the frame circuit board may be accomplished by soldering followed by sealing of the solder gap by adhesive, by lamination, by bond bonding or the like.
  • the described manner results in a sensor system integrated in the circuit carrier in the form of printed circuit boards, which can be manufactured using conventional "high-tech” printed circuit board technology and can be equipped and processed on conventional assembly lines of electronic assembly productions. Furthermore, there is the advantage of providing and integrating a secure, cost-effective safety system to be processed for mounting without additional effort directly in the electronic module, which reliably detects hardware attacks.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Security & Cryptography (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Software Systems (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Storage Device Security (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Emergency Protection Circuit Devices (AREA)

Abstract

A hardware protection system is integrated into a circuit carrier. As a result, a sensor system, which is integrated into the circuit carrier in the form of printed circuit boards, which can be produced by means of the traditional high-tech' printed circuit board technology and can be equipped with and processed on traditional insertion lines of electronic module installations, is obtained.

Description

Beschreibungdescription
Hardwareschütz für sensible Elektronik-Datenbaugruppen gegen externe ManipulationenHardware contactor for sensitive electronic data modules against external manipulation
Elektronikbaugruppen für hochsensible Datenverarbeitung und Datensicherung, wie sie zum Beispiel in Fahrtenschreibern für Nutzfahrzeuge aber auch in Geldinstituten, Geldautomaten, Flugzeugen und überall dort, wo sensible Daten gehandhabt werden, zum Einsatz kommen, sollen hardwaremäßig gegen Manipulation von außen, wie beispielsweise chemische oder physikalische Angriffe (zum Beispiel mechanisch, Laser, Feuer usw.), geschützt werden, so dass Daten nicht manipuliert werden können.Electronic assemblies for highly sensitive data processing and data protection, as used for example in tachographs for commercial vehicles but also in financial institutions, ATMs, airplanes and wherever sensitive data is handled, should be hardware-based against external manipulation, such as chemical or physical attacks (for example, mechanical, laser, fire, etc.), so that data can not be manipulated.
Bisher existiert eine Lösung, bei der die zu schützende Elektronikbaugruppe mittels einer so genannten Bohrschutzfolie rundum verpackt wird. Eine solche Bohrschutzfolie gibt es zum Beispiel von der Firma Gore als Fertigprodukt oder sie wird von der Firma Freudenberg als Folie mit Silberleitpas- tendruck angeboten. Die Folie ist nach innen zur Baugruppe elektrisch verbunden. Nachdem die Elektronikbaugruppe dreidimensional verpackt wurde, wird sie anschließend in einem Behälter mit Kunstharz eingegossen. Beim Versuch, die Verpa- ckung zu öffnen, werden an den Stellen, an denen die Angriffe erfolgen, die elektrischen Leiterzüge oder Widerstandsleitungen auf den Folien zwangsweise geschädigt und unterbrochen, was in der Elektronikbaugruppe dazu führt, dass die gespeicherten Daten unmittelbar gelöscht werden. Dadurch können die Daten nicht manipuliert werden und der Angriff von außen ist somit von entsprechenden Kontrollorganen erkennbar.So far, there is a solution in which the electronic assembly to be protected is packed all around by means of a so-called Bohrschutzfolie. Such a protection film is available, for example, from the company Gore as a finished product or it is offered by the company Freudenberg as a film with Silberleitpas- pressure. The foil is electrically connected inwardly to the assembly. After the electronics assembly has been packaged three-dimensionally, it is then poured into a container of synthetic resin. When attempting to open the packaging, where the attacks occur, the electrical traces or resistance lines on the foils are forcibly damaged and broken, causing the electronic assembly to immediately erase the stored data. As a result, the data can not be manipulated and the attack from the outside is thus recognizable by appropriate control bodies.
Bei diesem aus dem Stand der Technik bekannten Verfahren ergeben sich zwei Probleme. Einmal entspricht die Verwendung von Folie keinem elektronikgerechten Montageverfahren. Zum anderen wird die Folie auch oft schon beim Montieren beschädigt, so dass sich ein hoher Ausschuss ergibt. Davon ausgehend liegt der Erfindung die Aufgabe zugrunde, einen Hardwareschütz für Elektronikbaugruppen bereitzustellen, der in eine elektronikgerechte Fertigung integriert werden kann .In this known from the prior art, there are two problems. On the one hand, the use of film does not correspond to an electronics-compatible assembly process. On the other hand, the film is often damaged already during assembly, so that there is a high reject rate. Based on this, the object of the invention is to provide a hardware contactor for electronic assemblies, which can be integrated into an electronics-compatible production.
Diese Aufgabe wird durch die in den unabhängigen Ansprüchen angegebenen Erfindungen gelöst. Vorteilhafte Ausgestaltungen ergeben sich aus den abhängigen Ansprüchen.This object is achieved by the inventions specified in the independent claims. Advantageous embodiments emerge from the dependent claims.
Dementsprechend weist ein Hardwareschutz in Form eines Schaltungsträgers, der einen Innenraum für Bauelemente einer zu schützenden Schaltung umgibt, den Innenraum umgebende Leiterstrukturen, beispielsweise in Form eines netzartigen Gebildes oder eines Käfigs, zum Detektieren von unautorisierten externen Manipulationen der Schaltung auf. Die Leiterstrukturen zum Detektieren von Zugriffen auf die Schaltung werden also direkt in den Schaltungsträger der Schaltung integriert.Accordingly, hardware protection in the form of a circuit carrier surrounding an interior for components of a circuit to be protected includes conductor structures surrounding the interior space, for example in the form of a net-like structure or a cage, for detecting unauthorized external manipulations of the circuit. The conductor structures for detecting accesses to the circuit are thus integrated directly into the circuit carrier of the circuit.
Die den. Innenraum umgebenden Leiterstrukturen können beispielsweise als Leiterflächen und/oder als eng strukturiertes Gebilde in Form eines Gitters, in Form eines Netzes, mit Mäandern und/oder mit Sektoren, in denen die Leiterstrukturen in unterschiedlichen Geometrieformen verlaufen. Der Isolati- onsabstand zwischen zwei Verläufen der Leiterstrukturen inThe the. Interior surrounding conductor structures, for example, as a conductor surfaces and / or as a closely structured structure in the form of a grid, in the form of a network, with meanders and / or with sectors in which the conductor structures extend in different geometric shapes. The isolation distance between two curves of the conductor structures in
Form von Leiterzügen oder Leiterbahnen soll dabei herkömmlichen HDI (High Density Interconnection) - Strukturen entsprechen. Gleiches gilt für die Breite der Verläufe der Leiterstrukturen. Bei einem unautorisierten Zugriff auf die Schal- tung werden die Leiterstrukturen verletzt, so dass ein Kontakt geschlossen oder unterbrochen und der Zugriff auf die Schaltung damit detektiert wird.The form of conductor tracks or interconnects should correspond to conventional HDI (High Density Interconnection) structures. The same applies to the breadth of the gradients of the conductor structures. In the event of unauthorized access to the circuit, the conductor structures are violated so that a contact is closed or interrupted and the access to the circuit is thus detected.
Vorzugsweise weist die Hardwareschutz-Gesamtbaugruppe Schal- tungsträger in Form einer oder mehrerer Leiterplatten auf. Diese Leiterplatte/n kann oder können an und/oder in ihrer zum Innenraum zeigenden Seite zumindest einige der Bauelemen- te der zu schützenden Schaltung aufweisen. Darüber hinaus kann oder können sie an und/oder in ihrer dem Innenraum abgewandten Seite einen Teil der den Innenraum umgebenden Leiterstrukturen aufweisen.The hardware protection overall assembly preferably has circuit carriers in the form of one or more printed circuit boards. This printed circuit board (s) may or may have at least some of the construction elements on and / or in their side facing the interior. te the circuit to be protected. In addition, they can or may have on and / or in their side facing away from the interior part of the surrounding the interior conductor structures.
Vorteilhaft ist die Leiterplatte eine Mehrlagenleiterplatte oder ein Mehrlagen-Keramiksubstrat mit Lagen (Schichten) für die den Innenraum umgebenden Leiterstrukturen und Lagen zum Verdrahten der einigen der Bauelemente der zu schützenden Schaltung.The printed circuit board is advantageously a multilayer printed circuit board or a multilayer ceramic substrate with layers for the conductor structures surrounding the interior and layers for wiring some of the components of the circuit to be protected.
Die Lagen zum Verdrahten der einigen der Bauelemente der zu schützenden Schaltung sind insbesondere an und/oder in der zum Innenraum weisenden Seite der Leiterplatte angeordnet. Durchkontaktierungen in der Leiterplatte können als vergrabene Durchkontaktierungen und/oder Micro-Vias (Micro- Sackloch) unterschiedlichster Technologien (plasmageätzt, photo defi- nable oder lasergebohrt) ausgeführt sein.The layers for wiring the some of the components of the circuit to be protected are arranged in particular on and / or in the interior facing side of the circuit board. Through-contacts in the printed circuit board can be embodied as buried vias and / or micro vias (micro blind hole) of a wide variety of technologies (plasma etching, photo-definable or laser-drilled).
Alternativ oder ergänzend sind für eine Verdrahtung der einigen der Bauelemente der zu schützenden Schaltung in der Leiterplatte zu erzeugende Aufbaulagen als Sequential-Build-Up- Aufbaulagen mit, insbesondere Micro-Vias unterschiedlichster Technologien als Durchkontaktierungen ausgeführt.Alternatively or additionally, for a wiring of some of the components of the circuit to be protected in the circuit board to be generated build-up positions as sequential build-up build-up with, in particular micro vias of different technologies designed as vias.
Vorzugsweise weist die Hardwareschutz-Baugruppe eine weitere Mehrlagen- Leiterplatte und/ oder Mehrlagen-Keramik-Substrat auf, die gegenüber der ersten Leiterplatte angeordnet ist, an und/oder in ihrer dem Innenraum abgewandten Seite einen wei- teren Teil der den Innenraum umgebenden Leiterstrukturen trägt und insbesondere an und/oder j.n ihrer zum Innenraum weisenden Seite weitere der Bauelemente der zu schützenden Schaltung aufweist.Preferably, the hardware protection module has a further multi-layer printed circuit board and / or multilayer ceramic substrate, which is arranged opposite the first printed circuit board, carries on and / or in its side facing away from the interior, a further part of the conductor structures surrounding the interior and in particular on and / or in its side facing the interior further comprising the components of the circuit to be protected.
Vorteilhaft ist zwischen der Leiterplatte und der weiterenIt is advantageous between the circuit board and the other
Leiterplatte eine Rahmenleiterplatte angeordnet, der die beiden Leiterplatten beabstandet und dadurch zwischen sich und den Leiterplatten den Innenraum erzeugt. Die Rahmenleiterplatte ist insbesondere in Mehrlagenleiterplatten-Technolocjie oder Mehrlagen-Keramik- Substrat aufgebaut, beispielsweise indem dielektrische Lagen und elektrisch leitende Lagen Ia— genweise übereinander angeordnet sind.Circuit board arranged a frame circuit board, which spaces the two circuit boards and thereby between itself and the circuit boards generated the interior. In particular, the frame circuit board is constructed in multi-layer circuit board technology or multilayer ceramic substrate, for example by arranging dielectric layers and electrically conductive layers over one another in layers.
Der Innenraum kann ein Hohlraum sein, muss es aber nicht. Beispielsweise wenn die Bauelemente im Innenraum vergossen werden, ist der Innenraum mit einem Gießharz ausgefüllt.The interior can be a cavity, but it does not have to be. For example, if the components are cast in the interior, the interior is filled with a casting resin.
Der Schaltungsträger weist insbesondere Anschlüsse zum Anschließen von Detektormitteln zum Detektieren von einer Ve _r- letzung der Leiterstrukturen auf.In particular, the circuit carrier has connections for connecting detector means for detecting a violation of the conductor structures.
Vorzugsweise ist so der gesamte Schaltungsträger zumindest im Wesentlichen in Mehrlagen- Leiterplatten- und/oder Mehrlagen- Keramiktechnologie ausgeführt.Preferably, the entire circuit carrier is thus at least substantially embodied in multi-layer printed circuit board and / or multilayer ceramic technology.
Die Gesamtbaugruppe mit den Schaltungsträgern findet insbe — sondere in einem Tachograph, einem Fahrdatenrecorder und/ocler einem schienen- oder nichtschienen- gebundenen Fahrzeug Anwendung. Sie kann beispielsweise aber auch in Geldautomaten, Vorrichtungen für Geldinstitute und Flugzeugen zum Einsatz kommen. Insbesondere ist der Einsatz der Gesamtbaugruppe iαit den Schaltungsträgern immer dann von Vorteil, wenn zu schul;- zende kryptographische Schlüssel (RSA, DES) zum Einsatz koin- men.The entire assembly with the circuit carriers is used, in particular, in a tachograph, a travel data recorder and / or a rail-bound or non-rail-bound vehicle. However, it can also be used, for example, in ATMs, devices for financial institutions and aircraft. In particular, the use of the overall assembly with the circuit carriers is always advantageous when school-to-business cryptographic keys (RSA, DES) are used.
Bei einem Verfahren zum Herstellen eines Schaltungsträger, der einen Innenraum für Bauelemente einer zu schützendenIn a method for manufacturing a circuit carrier, the interior space for components of a to be protected
Schaltung umgibt, wird dieser Schaltungsträger mit den Innenraum umgebenden Leiterstrukturen zum Detektieren von Zugri ±- fen auf die Schaltung hergestellt. Vorteilhafte Ausgestaltnαn- gen des Verfahrens ergeben sich aus den vorteilhaften Ausg~es- taltungen des Schaltungsträgers und umgekehrt. Eine Vorrichtung mit einem Schaltungsträger einer der zuvor geschilderten Arten enthält bevorzugt Detektormittel zum De- tektieren einer Verletzung der Leiterstrukturen durch einen unerlaubten Zugriff und/oder eine unautorisierte Manipulati- on. Damit auch die Detektormittel selbst geschützt sind, können sie als Bestandteil der zu schützenden Schaltung ausgeführt sein.Circuit surrounds, this circuit carrier is produced with the surrounding conductor structures for detecting access to the circuit. Advantageous Ausgestaltnαn- gene of the method emerge from the es- advantageous ed ~ taltungen of the circuit carrier and vice versa. A device with a circuit carrier of one of the types described above preferably contains detector means for detecting a violation of the conductor structures due to unauthorized access and / or unauthorized manipulation. So that the detector means themselves are protected, they can be designed as part of the circuit to be protected.
Weitere Merkmale und Vorteile der Erfindungen ergeben sich aus der Beschreibung von Ausführungsbeispielen anhand der Zeichnung. Dabei zeigt:Further features and advantages of the invention will become apparent from the description of embodiments with reference to the drawings. Showing:
Figur 1 eine schematische Darstellung eines integriertenFigure 1 is a schematic representation of an integrated
Hardwareschutzes für Elektronikbaugruppen;Hardware protection for electronic assemblies;
Figur 2 eine schematische Teildarstellung des Hardwareschutzes nach Figur 1;Figure 2 is a schematic partial view of the hardware protection of Figure 1;
Figur 3 eine ausschnittsweise Darstellung des Leiterplatten- aufbaus des Hardwareschutzes nach Figur 1;FIG. 3 shows a detail of the printed circuit board structure of the hardware protection according to FIG. 1;
Figur 4 eine Rahmenleiterplatte des Hardwareschutzes nach Figur 1.FIG. 4 shows a frame circuit board of the hardware protection according to FIG. 1.
In Figur 1 erkennt man einen Schaltungsträger 1 mit einer erste Subbaugruppe in Form einer Leiterplatte 2 mit einigen Bauelementen 3 einer zu schützenden Schaltung. Die Leiterplatte 2 weist Leiterstrukturen 4 in Form eines Protection- Layer als Teil einer Mehrlagenverdrahtung zum Detektieren von Zugriffen auf die zu schützende Schaltung auf. Darüber hinaus verfügt sie über Durchführungen 5 für Signalleitungen und Spannungsversorgung der zu schützenden Schaltung nach außerhalb des Schaltungsträgers . Diese Durchführungen 5 verlaufen durch die den Innenraum umgebenden Leiterstrukturen hindurch und enden an einem Steckereinbauplatz 6. Der Schaltungsträger 1 verfügt weiterhin über eine weitere Leiterplatte 7, die weitere Bauelemente 8 der zu schützenden Schaltung aufweist.FIG. 1 shows a circuit carrier 1 with a first subassembly in the form of a printed circuit board 2 with some components 3 of a circuit to be protected. The printed circuit board 2 has conductor structures 4 in the form of a protection layer as part of a multilayer wiring for detecting accesses to the circuit to be protected. In addition, it has feedthroughs 5 for signal lines and power supply of the circuit to be protected to the outside of the circuit carrier. These bushings 5 run through the conductor structures surrounding the interior and end at a plug installation location 6. The circuit carrier 1 furthermore has a further printed circuit board 7 which has further components 8 of the circuit to be protected.
Die weiteren Bauelemente 8 der weiteren Leiterplatte 7 sind auf der Seite der weiteren Leiterplatte angeordnet, die zu der Seite der Leiterplatte 2 weist, auf der die einigen Bauelemente 3 der zu schützenden Schaltung sind. Sämtliche Bauelemente der zu schützenden Schaltung befinden sich damit zwischen der Leiterplatte 2 und der weiteren Leiterplatte 7 in einem zwischen den Leiterplatten gebildeten Innenraum 9.The further components 8 of the further printed circuit board 7 are arranged on the side of the further printed circuit board, which points to the side of the printed circuit board 2, on which are the some components 3 of the circuit to be protected. All components of the circuit to be protected are thus located between the printed circuit board 2 and the further printed circuit board 7 in an interior 9 formed between the printed circuit boards.
Die Leiterplatte 2 und die weitere Leiterplatte 7 werden durch eine Rahmenleiterplatte 10 beabstandet, die zwischen den beiden Leiterplatten angeordnet ist und zusammen mit der Leiterplatte 2 und der weiteren Leiterplatte 7 den Innenraum 9 umgibt. Die Leiterplatte 2, die weitere Leiterplatte 7 und die Rahmenleiterplatte 10 sind jeweils so ausgeführt, dass Verdrahtungen und Bauelemente 3, 8 der zu schützenden Schal- tung in und/oder an den dem Innenraum 9 zugewandten Seiten und/oder Bereichen der Leiterplatte 2, der weiteren Leiterplatte 7 und der Rahmenleiterplatte 10 angeordnet sind. Diese Verdrahtungen und Bauelemente 3, 8 und damit die gesamte zu schützende Schaltung werden vollständig von einem Gebilde von Leiterstrukturen 4 der Leiterplatte 2, Leiterstrukturen 11 der weiteren Leiterplatte 7 und Leiterstrukturen 12 der Rahmenleiterplatte 10 umgeben, die jeweils miteinander elektrisch verbunden sind. Die Verbindung der Leiterstrukturen 11, 12, 4 untereinander zwischen den verschiedenen Leiterplatten 1,2,10 erfolgt durch Anschlüsse 14. Diese Anschlüsse 14 sind unregelmäßig angeordnet. Die Leiterstrukturen sind mit als spezielle Elektronikschaltung ausgeführten Detektormitteln zum Detektieren einer Verletzung der Leiterstrukturen gekoppelt. Die Leiterstrukturen können als dem Detektormittel zu- gehörig betrachtet werden. Außen umlaufende Verbindungsrahmen 13 sind elektrisch mit der speziellen Elektronikbaugruppe gekoppelt, sodass eine zusätzliche Schutzfunktion entsteht. Zwischen dem umlaufenden Verbindungsrahmen 13 und den der Verbindung verschiedenener Leiterplatten dienenden Anschlüssen 14 sind umlaufende Leiterstrukturen 35, 37 vorgesehen, die elektrisch mit den Detektormitteln gekoppelt sind.The printed circuit board 2 and the further printed circuit board 7 are spaced by a frame printed circuit board 10, which is arranged between the two printed circuit boards and surrounds the interior 9 together with the printed circuit board 2 and the further printed circuit board 7. The printed circuit board 2, the further printed circuit board 7 and the frame printed circuit board 10 are each designed so that wiring and components 3, 8 of the circuit to be protected in and / or on the interior 9 facing sides and / or areas of the circuit board 2, the further circuit board 7 and the frame circuit board 10 are arranged. These wirings and components 3, 8 and thus the entire circuit to be protected are completely surrounded by a structure of conductor structures 4 of the printed circuit board 2, conductor structures 11 of the further printed circuit board 7 and conductor structures 12 of the frame circuit board 10, which are each electrically connected to each other. The connection of the conductor structures 11, 12, 4 with each other between the various circuit boards 1,2,10 carried by terminals 14. These terminals 14 are arranged irregularly. The conductor structures are coupled to detector means designed as a special electronic circuit for detecting a violation of the conductor structures. The conductor structures can be regarded as belonging to the detector means. Outer circumferential connection frames 13 are electrically coupled to the special electronics assembly, providing additional protection. Circumferential conductor structures 35, 37, which are electrically coupled to the detector means, are provided between the peripheral connection frame 13 and the terminals 14 connecting the different printed circuit boards.
Figur 3 zeigt den Aufbau der Leiterplatte 2. Diese enthält eine Erdungslage bzw. Erdungsschicht 21, wenigstens eine Hardwareschutz-Netzlage 22 für die Leiterstrukturen 4, we- nigstens eine Hardwareschutz-Umverdrahtungslage 23, wenigstens eine Leistungsversorgungslage 24, wenigstens eine Erdungslage 25, eine Mehrzahl von Signallagen 26, 27, 28. Die Anordnung der Lagen ist so gewählt, dass Außen die Schutzlagen und Innen die Signal- und Versorgungslagen angeordnet sind.FIG. 3 shows the structure of the printed circuit board 2. It contains a grounding layer 21, at least one hardware protection network layer 22 for the conductor structures 4, at least one hardware protection rewiring layer 23, at least one power supply layer 24, at least one grounding layer 25, a plurality of signal layers 26, 27, 28. The arrangement of the layers is selected so that the outer layers of protection and inside the signal and supply layers are arranged.
In Figur 4 erkennt man den Aufbau der Leiterplatte für die Rahmenleiterplatte 10. Die Rahmenleiterplatte 10 besteht aus einer Mehrlagenleiterplatte oder - Mehrlagen-Keramiksubstrat bestehend aus n-Leitungslagen mit Leiterstrukturen 15, wobei die Beabstandung zweier Leiterebenen kleiner 500μm ist. Zur Kontaktierung der einzelnen Lagen untereinander sowie der Leiterplatte 2 und der weiteren Leiterplatte 7 enthält die Rahmenleiterplatte 10 Durchgangslöcher 16 in Form von Piated Through Holes, die senkrecht zu den Lagen von der Leiterplatte 2 zur weiteren Leiterplatte verlaufen.4 shows the structure of the circuit board for the frame circuit board 10. The frame circuit board 10 consists of a multi-layer board or - multi-layer ceramic substrate consisting of n-line layers with conductor structures 15, wherein the spacing of two conductor planes is less than 500μm. For contacting the individual layers with each other and the printed circuit board 2 and the other circuit board 7, the frame circuit board 10 through holes 16 in the form of Piated Through Holes, which extend perpendicular to the layers of the circuit board 2 to the other circuit board.
Der hardwaremäßige Manipulationsschutz wird also direkt in die Elektronikbaugruppe integriert, das heißt in die für die Baugruppe verwendeten Leiterplatten 2, 7. Dadurch ergibt sich ein integrierter Hardwareschutz für Elektronikbaugruppen in Form eines Schaltungsträgers 1 mit Leiterstrukturen zur De- tektion von Zugriffen auf eine im Innenraum 9 des Schaltungs- trägers 1 befindliche Schaltung. Dazu ist die Ausgestaltung der Baugruppe dahingehend ausgeführt, dass sie zwei Subbaugruppen aufweist, wobei beide Sub- baugruppen nur einseitig mit Komponenten in Form von Bauelementen 3, 8 der zu schützenden Schaltung bestückt sind.The hardware-based manipulation protection is thus integrated directly into the electronic module, that is, in the printed circuit boards used for the assembly 2, 7. This results in an integrated hardware protection for electronic assemblies in the form of a circuit substrate 1 with conductor structures for detecting accesses to a in the interior 9 the circuit carrier 1 located circuit. For this purpose, the design of the module is designed to the effect that it has two sub-assemblies, wherein both sub-assemblies are equipped only on one side with components in the form of components 3, 8 of the circuit to be protected.
Die Leiterplatten 2, 7 für diese Subbaugruppen sind so gestaltet, dass sie als Mehrlagenleiterplatten ausgeführt sind, wobei die zur Verdrahtung der Bauelemente 3, 8 notwendigen Innen- und Außenlagen der Bestückseite zugewandt sind und keine nach außen führenden elektrischen Durchkontaktierungen auf die Leiterplattenrückseite, also die der Bestückseite gegenüber liegenden Seite, aufweisen.The printed circuit boards 2, 7 for these sub-assemblies are designed so that they are designed as multi-layer printed circuit boards, the necessary for wiring the components 3, 8 inner and outer layers of Bestückseite and no outward leading electrical feedthroughs on the back of the circuit board, so the the Bestückseite opposite side, have.
Dazu sind die für die Funktion der Baugruppen der zu schüt- zenden Schaltung notwendigen Durchkontaktierungen als vergrabene Durchkontaktierungen (Burried Vias) ausgeführt oder die notwendigen Aufbaulagen für die Subbaugruppenverdrahtung sind als SBU-Aufbauten (Sequential Build Up) mit Plasma-geätzten, photolitograpisch oder durch Laserbohren erzeugten Micro- Via-Durchkontaktierungen ausgeführt. Dafür werden auf einen vorhandenen Kern sequentiell Aufbaulagen aufgebracht und mit Micro-Vias versehen.For this purpose, the vias necessary for the function of the assemblies of the circuit to be protected are designed as buried vias or the necessary assembly positions for the sub-assembly wiring are SBU structures (sequential build-up) with plasma-etched, photolithographic or laser drilling generated micro via vias performed. For this purpose, sequential build-up layers are applied to an existing core and provided with micro-vias.
Auf der Bestückseite weisen die Subbaugruppen-Leiterplatten außerhalb des Bestückbereichs Kontaktierpads in Array-On the placement side, the sub-assembly printed circuit boards have contact pads in array outside the placement area.
Anordnung auf, welche dazu dienen, später die beiden einseitig bestückten Subbaugruppen "Face to Face" über die Rahmenleiterplatte 10 in Form einer Mehrlagenschaltung elektrisch miteinander zu verbinden .Arrangement, which serve to later electrically connect the two single-sided sub-assemblies "Face to Face" on the frame circuit board 10 in the form of a multi-layer circuit with each other.
Die Leiterplatten 2, 7 der Subbaugruppen beinhalten auf der der Bestückseite gegenüberliegenden Seite, also der dem Innenraum 9 abgewandten Seite, ebenfalls mehrere leitende Lagen. Diese sind beispielsweise als mehrlagige Kupferlagen mit Leiterstrukturen 4, 11 ausgeführt, welche jeweils als sehr fein strukturierte Leiterzüge realisiert sind, die einmal in engmaschig die gesamte Lagenfläche überdecken und sich aber auch von Lage zu Lage erstrecken, bedingt durch die Ausgestaltung der Leiterzüge.The printed circuit boards 2, 7 of the sub-assemblies include on the opposite side of the Bestückseite, ie the side facing away from the interior 9, also a plurality of conductive layers. These are, for example, designed as multi-layered copper layers with conductor structures 4, 11, which are each realized as very finely structured conductor tracks, which once cover the entire layer surface in close-meshed fashion and but are also extend from layer to layer, due to the design of the conductor tracks.
Die Leiterbreiten der einen Lage überdecken die Isolationsab- stände und einen Teil der zugehörigen Leiterbahnen der darunter liegenden und durch das Dielektrikum getrennten Lagen.The conductor widths of one layer cover the insulation spacings and a part of the associated interconnects of the layers underneath and separated by the dielectric.
Sie sind ebenfalls wieder über Burried Vias oder Micro-Vias zur Baugruppe nach innen durchverdrahtet .They are also wired through Burried vias or micro-vias to the module inside.
Die Ausgestaltung eines Layers zum Beispiel in x-Richtung mit einer derartigen Mäanderstruktur aus dünnen Kupfer-Leiterbahnen und des darunter oder darüber liegenden Layers in y-Richtung mit einer derartigen Struktur getrennt durch eine Dielektrikumslage ergibt einen Hardwareschutz der Baugruppe gegen mechanische Manipulationen, dadurch dass diese Leiterzüge 4f 11 nach innen mit der Baugruppe verschaltet sind und somit bedingt durch die ultrafeine Strukturierung bei Zugriff von außen beschädigt werden. Dadurch erfolgt eine Unterbre- chung und/oder Kurzschluss von Leiterstrukturen 4, 11, welche in der Schaltung bzw. Baugruppe registriert wird.The configuration of a layer, for example, in the x-direction with such a meander structure of thin copper interconnects and the layer below or above in the y-direction with such a structure separated by a dielectric layer results in a hardware protection of the assembly against mechanical manipulation, thereby Conductors 4 f 11 are connected to the inside of the module and thus are damaged due to the ultrafine structuring when accessed from the outside. This results in an interruption and / or short circuit of conductor structures 4, 11, which is registered in the circuit or assembly.
Die Ausführung der Feinstleiter kann auch in Widerstandspastendruck (integrierte Widerstände mit definierten Wider- Stands-Werten) als Leitpaste (Keramik-Dickschicht- Technologie) oder als Tintendruck mit Karbontinte (integrierte Widerstände mit definierten Widerstands-Werten) in allen erdenklichen Strukturen erfolgen, welche großflächig über mindestens eine Lage ein engmaschiges Gebilde erzeugen und welche nach innen an die Baugruppe elektrisch angeschlossen werden.The design of the ultra-fine conductors can also be carried out in resistance paste pressure (integrated resistors with defined resistance values) as conductive paste (ceramic thick-film technology) or as ink print with carbon ink (integrated resistors with defined resistance values) in all imaginable structures, which cover a large area generate at least one layer a close-meshed structure and which are electrically connected to the inside of the module.
Wenigstens eine der Leiterplatten 2, 7 der Subbaugruppen kann auch als Flex-Rigid-Leiterplatte ausgeführt sein bzw. es kann an einer starren Leiterplatte eine Flex-Leitung zur Datenübertragung angebracht sein. Der Dielektrikumsabstand der Hardwareschutzlagen in den Leiterplatten der Subbaugruppen ist so gewählt, dass auch bei stirnseitigem Anbohren eine Schädigung der darüber und der darunter liegenden Schutzlagen erfolgt und somit der Schutz- mechanismus ausgelöst wird. Beispielsweise könnte die Rahmenleiterplatte 10 starr ausgeführt sein und die beiden Leiterplatten 2, 7 der Subbaugruppen auch als flexible Schaltung.At least one of the printed circuit boards 2, 7 of the subassemblies can also be designed as a flex-rigid printed circuit board or it can be attached to a rigid printed circuit board, a flex line for data transmission. The dielectric distance of the hardware protective layers in the printed circuit boards of the subassemblies is selected so that damage to the overlying and the underlying protective layers also takes place at the face-side drilling and thus the protective mechanism is triggered. For example, the frame circuit board 10 may be rigid and the two printed circuit boards 2, 7 of the sub-assemblies as a flexible circuit.
Zur Verbindung der beiden "Face-to-Face" angeordneten Subbaugruppen kommt ebenfalls eine Leiterplattenkonstruktion in ähnlicher Ausführung wie oben beschrieben zur Anwendung. Diese Leiterplatte ist als Rahmenleiterplatte 10 konstruiert und als Multilayer ausgeführt, der es bedingt durch seine Bauwei- se verhindert, später stirnseitig die gesamte Baugruppe zu attackieren. In der Regel wird dies mit einer Beabstandung der einzelnen Lagen kleiner 500μm erreicht. Innerhalb des Layouts der Schutzschaltungen liegen die elektrischen Durch- kontaktierungen 16, welche in montiertem Zustand die beiden Subbaugruppen elektrisch verbinden. In den Layoutbereichen, welche die Leiterstrukturen 12 in Form von Leiterzügen oder gedruckten Widerständen oder ähnlichem für die Schutzfunktion beinhalten, liegen unregelmäßig verteilt die verborgenen Durchkontaktierungen für die einzelnen Lagen der Schutκschal- tungen. Beide Durchkontaktierungstypen oder Arten werden auf Ober- und Unterseite der rahmenartigen Mehrlagenleiterplatte der Rahmenleiterplatte 10 in Anschlusspads ausgeführt, welche der späteren Kontaktierung der einzelnen Subbaugruppen untereinander dienen .To connect the two "face-to-face" arranged sub-assemblies also comes a printed circuit board construction in a similar design as described above for use. This circuit board is constructed as a frame circuit board 10 and designed as a multilayer, which prevents it due to its Bauwei- se, later attacking the entire assembly on the front side. As a rule, this is achieved with a spacing of the individual layers smaller than 500 μm. Within the layout of the protective circuits are the electrical through-contacts 16, which electrically connect the two subassemblies in the assembled state. In the layout areas which contain the conductor structures 12 in the form of conductor tracks or printed resistors or the like for the protective function, the hidden vias for the individual layers of the protective circuits are distributed irregularly. Both via types or types are performed on top and bottom of the frame-like multilayer printed circuit board of the frame circuit board 10 in connection pads, which serve the subsequent contacting of the individual sub-assemblies with each other.
Die elektrische Verbindung und die mechanische Verbindung der Subbaugruppen mit der Rahmenleiterplatte können durch Löten mit anschließender Versiegelung des Lötspaltes durch Kleber, durch Laminieren, durch Kontaktierklebung oder in ähnlicher Weise erfolgen. Auf die beschriebene Weise ergibt sich ein in den Schaltungsträger in Form von Leiterplatten integriertes Sensorsystem, welches mit herkömmlicher "Hightech"-Leiterplattentechnologie gefertigt werden kann und auf herkömmlichen Bestücklinien von Elektronikbaugruppenfertigungen bestückt und verarbeitet werden kann. Weiterhin ergibt sich der Vorteil, ein sicheres, kostengünstiges und für die Montage ohne Mehraufwand zu verarbeitendes Sicherheitssystem direkt in der Elektronikbaugruppe bereitzustellen und zu integrieren, welches zuverläs- sig Hardwareattacken detektiert. The electrical connection and mechanical connection of the subassemblies to the frame circuit board may be accomplished by soldering followed by sealing of the solder gap by adhesive, by lamination, by bond bonding or the like. The described manner results in a sensor system integrated in the circuit carrier in the form of printed circuit boards, which can be manufactured using conventional "high-tech" printed circuit board technology and can be equipped and processed on conventional assembly lines of electronic assembly productions. Furthermore, there is the advantage of providing and integrating a secure, cost-effective safety system to be processed for mounting without additional effort directly in the electronic module, which reliably detects hardware attacks.

Claims

Patentansprüche claims
1. Schaltungsträger, der einen Innenraum (9) für Bauelemente (3, 8) einer zu schützenden Schaltung umgibt und der den In- nenraum (9) umgebende Leiterstrukturen (4, 11, 12) zur Detek- tion von Zugriffen auf die Schaltung aufweist, dadurch gekennzeichnet, dass die Bauelemente (3, 8) und deren Verdrahtungen vollständig von Leiterstrukturen (4) einer Leiterplatte (2) , Leiterstrukturen (11) einer weiteren Leiterplatte (7) und Leiterstrukturen (12) einer Rahmenleiterplatte (10) umgeben sind, wobei die Leiterplatten (2, 7, 10) jeweils miteinander durch einen umlaufenden Verbindungsrahmen (13) verbunden sind.1. Circuit carrier which surrounds an interior space (9) for components (3, 8) of a circuit to be protected and has the inner space (9) surrounding conductor structures (4, 11, 12) for detecting accesses to the circuit , characterized in that the components (3, 8) and their wiring are completely surrounded by conductor structures (4) of a printed circuit board (2), conductor structures (11) of a further printed circuit board (7) and conductor structures (12) of a frame printed circuit board (10), wherein the circuit boards (2, 7, 10) are each connected to each other by a peripheral connecting frame (13).
2. Schaltungsträger nach Anspruch 1, dadurch gekennzeichnet, dass der Schaltungsträger (1) eine Leiterplatte (2) aufweist, die an und/oder in ihrer zum Innenraum (9) zeigenden Seite zumindest einige der Bauelemente (3) der zu schützenden Schaltung aufweist und an und/oder in ihrer dem Innenraum (9) abgewandten Seite einen Teil der den Innenraum umgebenden Leiterstrukturen (4) aufweist.2. The circuit carrier as claimed in claim 1, characterized in that the circuit carrier (1) has a printed circuit board (2) which has at least one of the components (3) of the circuit to be protected on and / or in its side facing the interior (9) and At and / or in its the interior (9) facing away from a part of the interior surrounding conductor structures (4).
3. Schaltungsträger nach Anspruch 2, dadurch gekennzeichnet, dass die Leiterplatte (2) eine Mehrlagenleiterplatte oder Mehrlagen Keramik-Substrat ist mit Lagen für den Teil, der den Innenraum umgebenden Leiterstrukturen (4) und Lagen zum Verdrahten der einigen der Bauelemente (3) der zu schützenden Schaltung.3. The circuit board according to claim 2, characterized in that the circuit board (2) is a multilayer printed circuit board or multilayer ceramic substrate with layers for the part surrounding the interior conductor structures (4) and layers for wiring of some of the components (3) circuit to be protected.
4. Schaltungsträger nach einem der Ansprüche 2 oder 3, dadurch gekennzeichnet, dass die Lagen zum Verdrahten der einigen der Bauelemente (3) der zu schützenden Schaltung an und/oder in der zum Innenraum (9) weisenden Seite der Leiterplatte (2) angeordnet sind. 4. circuit carrier according to one of claims 2 or 3, characterized in that the layers for wiring of some of the components (3) of the circuit to be protected on and / or in the interior (9) facing side of the printed circuit board (2) are arranged ,
5. Schaltungsträger nach einem der Ansprüche 2 bis 4, dadurch gekennzeichnet, dass Durchkontaktierungen der zu schützenden Schaltung in der Leiterplatte (2) als vergrabene Durchkon~taktierungen ausge- führt sind.5. The circuit carrier according to one of claims 2 to 4, characterized in that the plated-through holes excluded leads taktierungen circuit to be protected in the circuit board (2) as a buried Durchkon ~ are.
6. Schaltungsträger nach einem der Ansprüche 3 bis 5, dadurch gekennzeichnet, dass für eine Verdrahtung für die einigen der Bauelemente (3) der zu schützenden Schaltung in der Leiterplatte (2) zu erzeugende Aufbaulagen als Sequential-Buil d.-Up-Aufbaulagen ausgeführt sind.6. Circuit carrier according to one of claims 3 to 5, characterized in that for a wiring for some of the components (3) of the circuit to be protected in the printed circuit board (2) to be generated build-up positions as Sequential-Buil executed d.-Up-Aufbaulagen are.
7. Schaltungsträger nach einem der Ansprüche 3 bis 6, dadurch gekennzeichnet, dass der Schaltungsträger (1) eine weitere Leiterplatte (7) aufweist, die gegenüber der Leiterplatte (2) angeordnet ist, an und/oder in ihrer dem Innenraum (9) a-bgewandten Seite einen Teil der den Innenraum umgebenden Leiterstrukturen (11) trägt und insbesondere an und/oder in ilrrer zum Innenraum (9) weisenden Seite weitere der Bauelemente (8) der zu schützenden Schaltung aufweist.7. The circuit board according to one of claims 3 to 6, characterized in that the circuit carrier (1) has a further printed circuit board (7) which is arranged opposite the printed circuit board (2), and / or in their the interior (9) a -bgewandten side carries a part of the interior surrounding conductor structures (11) and in particular on and / or in ilrrer to the interior (9) facing side further of the components (8) of the circuit to be protected.
8. Schaltungsträger nach Anspruch 7, dadurch gekennzeichnet, dass zwischen der Leiterplatte (2) und der weiteren Leiterplatte (7) die Rahmenleiterplatte (10) angeordnet ist.8. circuit carrier according to claim 7, characterized in that between the printed circuit board (2) and the further printed circuit board (7), the frame circuit board (10) is arranged.
9. Schaltungsträger nach Anspruch 8, dadurch gekennzeichnet, dass die Rahmenleiterplatte (10) in Leiterplattentechnologie aufgebaut ist.9. circuit carrier according to claim 8, characterized in that the frame circuit board (10) is constructed in printed circuit board technology.
10. Schaltungsträger nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass der Schaltungsträger (1) in Leiterjplattentechnologie aufgebaut ist. 10. The circuit carrier according to one of the preceding claims, characterized in that the circuit carrier (1) is constructed in Leiterjplattentechnologie.
11. Schaltungsträger nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass der Schaltungsträger (l)in unregelmäßiger Anordnung An- Schlüsse (14) zum Anschließen von Detektormittel zum Detek- tieren einer Verletzung der Leiterstrukturen (4, 11, 12) aufweist.11. The circuit carrier according to one of the preceding claims, characterized in that the circuit carrier (l) in an irregular arrangement of terminals (14) for connecting detector means for detecting a violation of the conductor structures (4, 11, 12).
12. Fahrtenschreiber, Fahrzeug, Flugzeug, Datenrekorder und/oder Geldautomat mit einem Schaltungsträger nach einem der Ansprüche 1 bis 11.12. tachograph, vehicle, aircraft, data recorder and / or ATM with a circuit carrier according to one of claims 1 to 11.
13. Verfahren, bei dem ein Schaltungsträger nach einem der Ansprüche 1 bis 11 hergestellt wird. 13. Method in which a circuit carrier according to one of claims 1 to 11 is produced.
EP05761153A 2005-06-30 2005-06-30 Hardware protection system for sensitive electronic-data modules protecting against external manipulations Withdrawn EP1897425A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2005/053111 WO2007003228A1 (en) 2005-06-30 2005-06-30 Hardware protection system for sensitive electronic-data modules protecting against external manipulations

Publications (1)

Publication Number Publication Date
EP1897425A1 true EP1897425A1 (en) 2008-03-12

Family

ID=35841712

Family Applications (1)

Application Number Title Priority Date Filing Date
EP05761153A Withdrawn EP1897425A1 (en) 2005-06-30 2005-06-30 Hardware protection system for sensitive electronic-data modules protecting against external manipulations

Country Status (6)

Country Link
US (1) US8270174B2 (en)
EP (1) EP1897425A1 (en)
JP (1) JP4891994B2 (en)
BR (1) BRPI0520346A2 (en)
RU (1) RU2382531C2 (en)
WO (1) WO2007003228A1 (en)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2938953B1 (en) * 2008-11-21 2011-03-11 Innova Card DEVICE FOR PROTECTING AN ELECTRONIC INTEGRATED CIRCUIT BOX FROM PHYSICAL OR CHEMICAL INTRUSIONS.
JP5378076B2 (en) * 2009-06-11 2013-12-25 東プレ株式会社 Data safety case
KR20120035673A (en) * 2010-10-06 2012-04-16 삼성전기주식회사 Package substrate
GB2484742B (en) 2010-10-22 2013-06-12 Murata Power Solutions Milton Keynes Ltd Electronic component for surface mounting
CH704884B1 (en) * 2011-04-29 2015-04-30 Suisse Electronique Microtech Substrate for receiving electrical contacts.
JP5455250B2 (en) * 2011-06-20 2014-03-26 東芝テック株式会社 Information processing device
JP4914530B1 (en) * 2011-09-06 2012-04-11 パナソニック株式会社 Terminal device
JP5622341B2 (en) * 2013-09-25 2014-11-12 東プレ株式会社 Data safety case
US9108841B1 (en) * 2014-03-05 2015-08-18 Freescale Semiconductor, Inc. Microelectronic packages having stacked accelerometer and magnetometer die and methods for the production thereof
JP5703453B1 (en) * 2014-03-28 2015-04-22 パナソニックＩｐマネジメント株式会社 Information processing device
JP5656303B1 (en) * 2014-03-28 2015-01-21 パナソニック株式会社 Information processing device
GB2529622A (en) * 2014-08-22 2016-03-02 Johnson Electric Sa Improvements in or relating to an anti-tamper device
JP6572820B2 (en) * 2016-04-25 2019-09-11 富士通株式会社 Power supply structure
JP6771849B2 (en) * 2017-03-30 2020-10-21 モレックス エルエルシー Tamper-proof payment leader
US10638608B2 (en) * 2017-09-08 2020-04-28 Apple Inc. Interconnect frames for SIP modules
CN108156756B (en) * 2018-02-06 2024-05-10 国蓉科技有限公司 Heterogeneous rigid-coiled board and manufacturing method of multi-layer board card based on same
DE102021200770A1 (en) 2021-01-28 2022-07-28 Continental Automotive Gmbh ARRANGEMENT HAVING A MULTI-LAYER CIRCUIT BOARD AND METHODS OF OPERATING A MULTI-LAYER CIRCUIT BOARD
US11765816B2 (en) 2021-08-11 2023-09-19 International Business Machines Corporation Tamper-respondent assemblies with pressure connector assemblies
FR3128090B1 (en) * 2021-10-08 2024-08-16 St Microelectronics Grenoble 2 Electronic device

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2195478B (en) * 1986-09-24 1990-06-13 Ncr Co Security device for sensitive data
US5269378A (en) * 1990-05-19 1993-12-14 Bayer Aktiengesellschaft Housing arrangement for fire-endangered installations
GB9115972D0 (en) 1991-07-24 1991-09-11 Gore W L & Ass Uk Improvements in security enclosures
US5233505A (en) * 1991-12-30 1993-08-03 Yeng-Ming Chang Security device for protecting electronically-stored data
JP2541487B2 (en) * 1993-11-29 1996-10-09 日本電気株式会社 Semiconductor device package
DE19512266C2 (en) 1994-09-23 1998-11-19 Rainer Jacob Anti-theft system for vehicles
FR2758935B1 (en) * 1997-01-28 2001-02-16 Matra Marconi Space France MULTI-LEVEL MICRO-ELECTRONIC BOX
US6100113A (en) * 1998-07-13 2000-08-08 Institute Of Microelectronics Very thin multi-chip-package and method of mass producing the same
US6075700A (en) * 1999-02-02 2000-06-13 Compaq Computer Corporation Method and system for controlling radio frequency radiation in microelectronic packages using heat dissipation structures
CN1246730A (en) 1999-09-13 2000-03-08 后健慈 Protecting structure for package of integrated circuit
GB2358957B (en) * 1999-10-27 2004-06-23 Ibm Ball grid array module
US6404043B1 (en) * 2000-06-21 2002-06-11 Dense-Pac Microsystems, Inc. Panel stacking of BGA devices to form three-dimensional modules
DE10047436A1 (en) 2000-09-21 2002-08-29 Giesecke & Devrient Gmbh security module
DE60130154T2 (en) 2001-08-31 2008-06-19 Verifone Systems Ireland Ltd. A CARD READER
JP2003229510A (en) 2001-11-30 2003-08-15 Ngk Spark Plug Co Ltd Wiring board
US20040089943A1 (en) * 2002-11-07 2004-05-13 Masato Kirigaya Electronic control device and method for manufacturing the same
JP2004158700A (en) * 2002-11-07 2004-06-03 Denso Corp Electronic controller and method for manufacturing the same
US6853093B2 (en) 2002-12-20 2005-02-08 Lipman Electronic Engineering Ltd. Anti-tampering enclosure for electronic circuitry
JP4342174B2 (en) * 2002-12-27 2009-10-14 新光電気工業株式会社 Electronic device and manufacturing method thereof
US7170155B2 (en) * 2003-06-25 2007-01-30 Intel Corporation MEMS RF switch module including a vertical via
US7368808B2 (en) * 2003-06-30 2008-05-06 Intel Corporation MEMS packaging using a non-silicon substrate for encapsulation and interconnection
JP2005116897A (en) * 2003-10-09 2005-04-28 Matsushita Electric Ind Co Ltd Circuit board, apparatus and method for supporting design thereof, design support program and recording medium thereof
ATE393423T1 (en) 2003-10-24 2008-05-15 Verifone Systems Ireland Ltd CIRCUIT SAFETY
US7576426B2 (en) * 2005-04-01 2009-08-18 Skyworks Solutions, Inc. Wafer level package including a device wafer integrated with a passive component

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO2007003228A1 *

Also Published As

Publication number Publication date
US20080278922A1 (en) 2008-11-13
WO2007003228A1 (en) 2007-01-11
JP4891994B2 (en) 2012-03-07
US8270174B2 (en) 2012-09-18
JP2008547240A (en) 2008-12-25
RU2008103343A (en) 2009-08-10
BRPI0520346A2 (en) 2009-05-05
RU2382531C2 (en) 2010-02-20

Similar Documents

Publication Publication Date Title
WO2007003228A1 (en) Hardware protection system for sensitive electronic-data modules protecting against external manipulations
EP0756244B1 (en) Electronic unit and method of producing that unit
DE69331511T2 (en) Double-sided printed circuit board, multilayer printed circuit board and manufacturing method
DE102011077206B4 (en) Printed circuit board and control unit for a transmission of a vehicle with the printed circuit board
DE102013108016A1 (en) containment
DE112016003031T5 (en) Printed circuit boards and electronic components with integrated, tamper-sensitive sensor
DE102006021765A1 (en) Electronic component-embedded printed circuit board (PCB) manufacture for e.g. mobile telephones, involves pressing metal foils against B-stage thermosetting layer to form core layer in which electronic components are embedded
DE102013108017A1 (en) Multilayered safety cover
DE112016003211T5 (en) Tamper-evident sensors with one or more shaped, flexible layers
DE102007029713A1 (en) Printed circuit board and method for its production
DE102021129176A1 (en) TAMPER-RESPONSIVE ASSEMBLY WITH STRUCTURAL MATERIAL IN A SEALED INTERIOR
EP1804557A1 (en) Electronic safety module
WO2007003226A1 (en) Sensor for a hardware protection system for sensitive electronic-data modules protecting against external manipulations
EP0219627B1 (en) Multilayer printed-circuit board
DE102012105488A1 (en) Printed wiring board with improved corrosion resistance and yield
DE102008057887A1 (en) Cryptographic module i.e. postal safety module, for use in franking machine, has access-protection unit consisting of printed circuit boards, where conductor paths of boards are changed from one layer to another layer
DE19940480C2 (en) Conductor carrier layer for lamination into a chip card, chip card with a conductor carrier carrier layer and method for producing a chip card
EP1804559A2 (en) Electronic safety module
DE102007040876A1 (en) Multilayer printed circuit board, has substrate made of isolation material, and switching structures made of conducting material and laminated on top of each other by substrate in lamination direction
EP1897017A1 (en) Hardware protection system in the form of deep-drawn printed circuit boards as half-shells
DE102017202329A1 (en) Multilayer printed circuit board and electronic arrangement with such
EP3480164A1 (en) Method for the preparation of planar thin packages for semiconductor devices and planar thin packages
EP2195760B1 (en) Protective arrangement and method for producing a protective arrangement
DE10330754B4 (en) Method for producing an electrical circuit
DE4129835A1 (en) POWER ELECTRONIC SUBSTRATE AND METHOD FOR THE PRODUCTION THEREOF

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20071219

RBV Designated contracting states (corrected)

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR

DAX Request for extension of the european patent (deleted)
17Q First examination report despatched

Effective date: 20091209

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: SIEMENS AKTIENGESELLSCHAFT

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: SIEMENS AKTIENGESELLSCHAFT

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20150106