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EP1897017A1 - Hardware protection system in the form of deep-drawn printed circuit boards as half-shells - Google Patents

Hardware protection system in the form of deep-drawn printed circuit boards as half-shells

Info

Publication number
EP1897017A1
EP1897017A1 EP05756864A EP05756864A EP1897017A1 EP 1897017 A1 EP1897017 A1 EP 1897017A1 EP 05756864 A EP05756864 A EP 05756864A EP 05756864 A EP05756864 A EP 05756864A EP 1897017 A1 EP1897017 A1 EP 1897017A1
Authority
EP
European Patent Office
Prior art keywords
circuit
hardware
hardware protection
protected
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP05756864A
Other languages
German (de)
French (fr)
Inventor
Karl Weidner
Anton Wimmer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of EP1897017A1 publication Critical patent/EP1897017A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0275Security details, e.g. tampering prevention or detection
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F21/00Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
    • G06F21/70Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer
    • G06F21/86Secure or tamper-resistant housings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0266Marks, test patterns or identification means
    • H05K1/0268Marks, test patterns or identification means for electrical inspection or testing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0284Details of three-dimensional rigid printed circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/144Stacked arrangements of planar printed circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10151Sensor

Definitions

  • Electronic assemblies for highly sensitive data processing and data protection should be hardware-based against external manipulation, such as chemical or physical attacks (for example, mechanical, laser, fire, etc.), so that data can not be manipulated.
  • the object of the invention is to specify a hardware protection for electronic assemblies, which can be integrated into an electronics-compatible production.
  • hardware protection for a circuit to be protected includes a conductive or non-conductive planar substrate.
  • the planar substrate is not flat, but has a recessed central area, which is preferably completely surrounded by protruding areas.
  • Conductor structures for detecting access to the circuit to be protected are arranged on and / or in the substrate. In the event of unauthorized access to the circuit, the conductor structures are violated, so that a contact is made or interrupted and the access to the circuit is thus detected.
  • the projecting portions have an edge which is parallel to the recessed central portion.
  • the hardware contactor can be arranged on a circuit carrier, where it can be glued or soldered or generally contacted.
  • the substrate is designed in the form of a half-shell.
  • the substrate is preferably a deep-drawn circuit board and / or a film.
  • the conductor structures and the insulation spacings of the area sensor form a close-meshed structure in the form of a grid, in the form of a network, with meanders and / or with sectors in which the conductor structures, for example in the form of geometricalb structures run.
  • the insulation distance between two paths of the conductor structures in the form of conductor tracks or interconnects corresponds to conventional HDI (High Density Interconnection) structures. The same applies to the breadth of the gradients of the conductor structures.
  • the conductor structures can be produced by printing. This preferably takes place as long as the planar substrate is still flat, ie not deep-drawn yet.
  • the hardware contactor has connections for connecting detector means for detecting a violation of the conductor structures.
  • a planar substrate is provided with conductor patterns for detecting access to a circuit to be protected. Before or preferably after the two-dimensional substrate is placed in a mold, it comprises in the ⁇ a recessed central area, which is surrounded by projecting portions.
  • Advantageous embodiments of the method result from the advantageous embodiments of the hardware protection and vice versa.
  • a device comprises a hardware contactor of one of the previously described types and a circuit carrier for a circuit to be protected.
  • the hardware contactor is arranged with the projecting areas of its substrate on the circuit carrier, so that a space for the circuit to be protected results between the recessed central area and the circuit carrier.
  • the circuit carrier is or preferably includes a
  • Circuit-carrier board This is often also to protect on its back.
  • the device has in particular In particular, a second hardware protection according to one of the previously described types, which is arranged on the first hardware contactor opposite side of the circuit substrate.
  • the device preferably contains detector means for detecting a violation of the ladder structures by unauthorized access and / or unauthorized manipulation. So that the detector means are also protected, they can be designed as part of the circuit to be protected.
  • the overall assembly with the circuit lengths xn is used in particular in a tachograph, a driving data recorder and / or a rail or non-rail vehicle. However, it can also be used, for example, in ATMs, devices for financial institutions and aircraft. In particular, the use of the overall assembly with the circuit carriers is always advantageous when cryptographic keys to be protected (RSA, DES) are used. •: .-
  • Figure 1 shows an embodiment of a device with a
  • Circuit carrier on one side of which a hardware protection is arranged and on whose one side opposite side. second hardware protection is arranged;
  • FIG. 2 shows an alternative exemplary embodiment of a device with a circuit carrier, on the one side of which a hardware protection is arranged and on whose side opposite a second hardware contactor is arranged; 3 shows a substrate with conductor structures, from which a hardware protection is produced.
  • FIG. 1 shows a hardware protection 10 having a planar substrate 11, 12 which has a recessed central region 11 which is completely surrounded by projecting regions 12.
  • the substrate 11, 12 contains two prepregs 15, 16.
  • the first prepreg 15 forms the side of the substrate 11, 12 which points in the direction in which the central region 11 springs back.
  • the first conductor structure 13 of the two already mentioned conductor structures 13, 14 is arranged.
  • the second prepreg 16 is arranged on it, at the opposite side of the first conductor structure 13; the second conductor pattern 14 is arranged.
  • the hardware contactor 10 has connections 17 for contacting the conductor structures 13, 14 with further hardware protection conductor structures and with detector means for detecting injuries to the conductor structures 13, 14.
  • the hardware contactor 10 is arranged with its projecting areas 12, in particular with its edges, on a circuit carrier 20 for a circuit 21 to be protected.
  • the circuit substrate 20 is designed as a multilayer printed circuit board.
  • the circuit carrier 20 In the region in which the edges of the projecting regions 12, which run parallel to the central region, are arranged on the circuit carrier 20, the circuit carrier 20 in turn has circuit carrier conductor structures 22 for protecting the circuit to be protected, by means of which a front end - tiger drilling of the circuit substrate 20 is registrable. These are connected via the terminals 17 to the conductor structures 13, 14 of the hardware protection 10.
  • circuit carrier 20 has input and output terminals 23 outside the protected area, which are connected via lines to the circuit to be protected 21, which pass through the layers of the circuit carrier conductor structures 22 therethrough.
  • a second hardware protection 30 is arranged on the circuit carrier 20.
  • the second hardware protection 30 is constructed analogously to the first hardware protection 10 and also has a receding central region 31, which is surrounded by projecting regions 32.
  • Its substrate is e.g. is arranged with prepregs 35, 36, between which a first conductor structure 33 is arranged, which is connected via terminals 37 to a second conductor structure 34, which is arranged on the prepreg 35 and the conductor structure 33 opposite side of the prepreg 36.
  • the second hardware device 30 is rotated relative to the first hardware protector 10 by a defined angle.
  • the embodiment according to FIG. 2 differs from that according to FIG. 1 in that the two hardware protectors 10, 30 are not arranged on the multilayer printed circuit board of the circuit carrier 20, but directly against one another.
  • the circuit carrier 20 also contains, via its multilayer printed circuit board, in this case carriers 24 with which the circuit 21 to be protected and the multilayer printed circuit board of the circuit carrier 20 are held in space, which is located between the recessed central regions 11, 31 of the hardware protectors 10, 30 results.
  • FIG. 3 shows a planar substrate 41, 42, 44 with a rectangular, central area 41, which at its four Edges of areas 42, 44 is surrounded.
  • the regions 42, 44 in turn each have an area adjacent to the central area 41, which is angled towards it in a deep-drawing process, and an edge remote from the central area 41, which in turn is opposite the area of the area 42 adjacent to the central area 41 is angled so that it runs parallel to the central area 41 again.
  • Recesses 43 are provided between the regions 42 surrounding the central region 41, which openings open by deep drawing of the regions 42, 44, so that they can be welded together at their abutting edges.
  • the entire substrate 41, 42, 44 in the form of pre-structured and then deep-drawn Bohrtiklagen is printed with a meandering conductor structure.
  • the hardware manipulation protection is thus integrated into one or two three-dimensional half-shells which are formed, for example, as a deep-drawn part or deep-drawn parts and the circuit to be supported with their assembly either completely enclose .. ( Figure 2) or on the circuit board 20 to be protected assembly of the circuit 21st be mounted ( Figure 1).
  • planar printed circuit board 20 can be used as a replacement for the second half-shell. Then the electronic components are arranged on the side facing the first half shell and the hardware protection with its conductor structures is arranged on the opposite side.
  • circuit board 20 used for the assembly such as itself having a ladder structure network 22 in the areas where it is connected to the hardware protection by soldering or gluing.
  • the circuit board 20 is designed as a multi-layer circuit board, which contains a plurality of superimposed conductor layers in the areas mentioned, which protect against a frontal drilling.
  • the embodiment of the half-shells 11, 12; 31, 32 of the hardware protector 10 can be made to be made of a thermoformed printed circuit board material such as glass fiber reinforced FR4 prepreg, which is not yet cured in the initial state.
  • a thermoformed printed circuit board material such as glass fiber reinforced FR4 prepreg
  • films are possible, in particular RCC films (Resin Coatet Copper, partially pre-structured copper) or otherwise thermoformable films with or without MetallbeSichtung.
  • a close-meshed line or resistor network is structured on one or both sides.
  • the design of the protective network of conductor structures 13, 14; 33, 34 may once be done as a patterned metallic conduit network, for example photolithographically by etching or other suitable methods.
  • it can also be designed as a resistance network with conductor structures, in which case preferably carbon-filled resin systems are applied in one or both sides in screen or resistance pressure, thus producing the protective structure.
  • resistor network can also be applied by direct printing with carbon ink or similar suitable methods.
  • the design of the deep-drawn parts 11, 12; 31, 32 for the hardware protection may on the one hand be such that they are similar to multi-layer printed circuit boards, with the cables required for the protective wiring facing the module side and no outwardly leading electrical through-contacts. have on the outside of the half-shells.
  • all through-connections necessary for the functions of the hardware protective shells and of the module can lie within the protective network and be carried out either as buried through-contacts (burried vias).
  • And / or the necessary sub-assembly wiring layouts are implemented as SBU (Sequential Build Up) assemblies with laser drilled or otherwise created micro via vias.
  • the conductor structures of the cup-shaped hardware protection have Maisierpads in array arrangement, which serve later electrically either one of the two electronics assembly of the circuit to be protected hardware protective shells together with the circuit carrier of the circuit to be protected or on the multi-layer board of the circuit carrier of the circuit to be protected - to connect others.
  • the hardware gun shells include one or more conductive layers. These are, for example, designed as multilayer copper layers, each of which has very finely structured conductor tracks of the conductor structures 13, 14; 33, 34 included, which once closely mesh over the entire layer surface and also extend from layer to layer due to the configuration of the conductor tracks.
  • the conductor widths of one layer thereby cover isolation distances and a part of the associated conductor tracks of the associated layers separated by the dielectric. They are also wired through Burried Vias or ⁇ m vias to the module inside.
  • the configuration of a layer, for example, in the X-direction with such a meandering structure of thin copper interconnects and the underlying or overlying layer in the Y direction with such a structure separated by the dielectric layer results in a hardware protection of the circuit against mechanical manipulation in that these conductor tracks are interconnected to the inside of the module and thus are damaged due to the ultra-fine structuring. This is a line interruption, which is registered in the circuit.
  • two networks can be used and a generated by a manipulation short circuit of the two networks can be registered.
  • the embodiment of the conductor structures 13, 14; 33, 34 as the ultrafine conductor can be carried out preferably in carbon pressure (resistor paste pressure), as conductive paste 4Silberleitplaste) or ink printing with carbon ink in all imaginable structures which generate a dense mesh over a large area over at least one layer and which are electrically connected to the inside of the circuit ,
  • At least one of the two hardware gun shells 11, 12; 31, 32 can also be implemented in "flex-rigid" technology or a flex line for data transmission can be attached.
  • the dielectric distance of the hardware protective layers in the hardware protective shells should be selected such that, even with face-side drilling, the protective layer above and the underlying protective layer is damaged and thus the protective mechanism is triggered.
  • the electrical connection and mechanical connection of the hardware protective shells with each other or with the circuit carrier of the circuit to be protected can be done by soldering with subsequent sealing of the soldering gap by adhesive, laminating, by Maisierklebung or a similar method. Conventional connection methods are also usable.
  • the described hardware contactor has the advantage of a sensor system integrated into the hardware protective shells and optionally into the multilayer printed circuit board of the circuit carrier of the circuit to be protected, which can be manufactured with almost conventional "high-tech” printed circuit board technology and equipped on conventional assembly lines and electronic component manufacturing can be processed.
  • a sensor system integrated into the hardware protective shells and optionally into the multilayer printed circuit board of the circuit carrier of the circuit to be protected, which can be manufactured with almost conventional "high-tech” printed circuit board technology and equipped on conventional assembly lines and electronic component manufacturing can be processed.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Computer Security & Cryptography (AREA)
  • Theoretical Computer Science (AREA)
  • Software Systems (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Storage Device Security (AREA)

Abstract

The invention relates to hardware protection system for a circuit, which is to be protected, and which contains a substrate which comprises a recoiling area which is surrounded by protruding areas. Said hardware protection system is embodied, in particular, as half-shells. Said hardware protection system also comprises conductor structures which are arranged on and/or in the substrate in order to detect access to the circuit which is to be protected.

Description

Beschreibung description
Hardwareschutz in Form von zu Halbschalen tiefgezogenen LeiterplattenHardware protection in the form of circuit boards deep-drawn into half-shells
Elektronikbaugruppen für hochsensible Datenverarbeitung und Datensicherung, wie sie zum Beispiel in Fahrtenschreibern für Nutzfahrzeuge aber auch in Geldinstituten, Geldautomaten, Flugzeugen und überall dort, wo sensible Daten gehandhabt werden, zum Einsatz kommen, sollen hardwaremäßig gegen Manipulation von außen, wie beispielsweise chemische oder physikalische Angriffe (zum Beispiel mechanisch, Laser, Feuer usw.), geschützt werden, so dass Daten nicht manipuliert werden können.Electronic assemblies for highly sensitive data processing and data protection, as used for example in tachographs for commercial vehicles but also in financial institutions, ATMs, airplanes and wherever sensitive data is handled, should be hardware-based against external manipulation, such as chemical or physical attacks (for example, mechanical, laser, fire, etc.), so that data can not be manipulated.
Bisher existiert eine Lösung, bei der die zuschützende Elektronikbaugruppe mittels einer so genannten Bohrschutzfolie rundum verpackt wird. Eine solche Bohrschutzfolie gibt es zum Beispiel von der Firma Gore als Fertigprodukt oder sie wird von der Firma Freudenberg als Folie mit Silberleitpastendruck J.\ angeboten. Die Folie ist nach innen zur Baugruppe elektrisch verbunden. Nachdem die Elektronikbaugruppe dreidimensional verpackt wurde, wird sie anschließend in einem Behälter mit Kunstharz eingegossen. Beim Versuch, die Verpackung zu öff- nen, werden an den Stellen, an denen die Angriffe erfolgen, die elektrischen Leiterzüge oder Widerstandsleitungen auf den Folien zwangsweise geschädigt und unterbrochen, was in der Elektronikbaugruppe dazu führt, dass die gespeicherten Daten unmittelbar gelöscht werden. Dadurch können die Daten nicht manipuliert werden und der Angriff von außen ist somit von entsprechenden Kontrollorganen erkennbar.So far, there is a solution in which the electronic circuit to be protected is packed all around by means of a so-called drilling protection foil. Such a protection film is available, for example, from the Gore company as a finished product or it is offered by Freudenberg as a film with Silberleitpastendruck J. \. The foil is electrically connected inwardly to the assembly. After the electronics assembly has been packaged three-dimensionally, it is then poured into a container of synthetic resin. When attempting to open the packaging, where the attacks occur, the electrical traces or resistance lines on the foils are forcibly damaged and broken, causing the electronic assembly to immediately erase the stored data. As a result, the data can not be manipulated and the attack from the outside is thus recognizable by appropriate control bodies.
Bei diesem aus dem Stand der Technik bekannten Verfahren ergeben sich zwei Probleme. Einmal entspricht die Verwendung von Folie keinem elektronikgerechten Montageverfahren. Zum anderen wird die Folie auch oft schon beim Montieren beschädigt, so dass sich ein hoher Ausschuss ergibt. Davon ausgehend liegt der Erfindung die Aufgabe zugrunde, einen Hardwareschutz für Elektronikbaugruppen anzugeben, der in eine elektronikgerechte Fertigung integriert werden kann.In this known from the prior art, there are two problems. On the one hand, the use of film does not correspond to an electronics-compatible assembly process. On the other hand, the film is often damaged already during assembly, so that there is a high reject rate. Based on this, the object of the invention is to specify a hardware protection for electronic assemblies, which can be integrated into an electronics-compatible production.
Diese Aufgabe wird durch die in den unabhängigen Ansprüchen angegebenen Erfindungen gelöst. Vorteilhafte Ausgestaltungen ergeben sich aus den abhängigen Ansprüchen.This object is achieved by the inventions specified in the independent claims. Advantageous embodiments emerge from the dependent claims.
Dementsprechend weist ein Hardwareschutz für eine zu schützende Schaltung ein leitendes oder nicht leitendes, flächiges Substrat auf. Das flächige Substrat verläuft allerdings nicht eben, sondern verfügt über einen zurückspringenden zentralen Bereich, der, vorzugsweise vollständig, von vorspringenden Bereichen umgeben ist. An und/oder in dem Substrat sind Leiterstrukturen zum Detektieren eines Zugriffs auf die zu schützende Schaltung angeordnet. Bei einem unautorisierten Zugriff auf die Schaltung werden die Leiterstrukturen verletzt, so dass ein Kontakt hergestellt oder unterbrochen und der Zugriff auf die Schaltung damit detektiert wird.Accordingly, hardware protection for a circuit to be protected includes a conductive or non-conductive planar substrate. However, the planar substrate is not flat, but has a recessed central area, which is preferably completely surrounded by protruding areas. Conductor structures for detecting access to the circuit to be protected are arranged on and / or in the substrate. In the event of unauthorized access to the circuit, the conductor structures are violated, so that a contact is made or interrupted and the access to the circuit is thus detected.
Vorzugsweise verfügen die vorspringenden Bereiche über einen Rand, der parallel zum zurückspringenden zentralen Bereich verläuft. Mit diesem Rand lässt sich der Hardwareschütz flä- chig auf einem Schaltungsträger anordnen und dort verkleben oder verlöten bzw. allgemein kontaktieren.Preferably, the projecting portions have an edge which is parallel to the recessed central portion. With this edge, the hardware contactor can be arranged on a circuit carrier, where it can be glued or soldered or generally contacted.
Insbesondere ist das Substrat in Form einer Halbschale ausgestaltet.In particular, the substrate is designed in the form of a half-shell.
Das Substrat ist vorzugsweise eine tiefgezogene Leiterplatte und/oder eine Folie.The substrate is preferably a deep-drawn circuit board and / or a film.
Vorteilhaft bilden die Leiterstrukturen und die Isolationsab- stände des Flächensensors ein engmaschiges Gebilde in Form eines Gitters, in Form eines Netzes, mit Mäandern und/oder mit Sektoren , in denen die Leiterstrukturen z.B. in Form von geometrischenb Strukturen verlaufen. Der Isolationsabstand zwischen zwei Verläufen der Leiterstrukturen in Form von Leiterzügen oder Leiterbahnen (die Maschenweite) entsprechen dabei herkömmlichen HDI (High Density Interconnection) - Struk- turen. Gleiches gilt für die Breite der Verläufe der Leiterstrukturen.Advantageously, the conductor structures and the insulation spacings of the area sensor form a close-meshed structure in the form of a grid, in the form of a network, with meanders and / or with sectors in which the conductor structures, for example in the form of geometricalb structures run. The insulation distance between two paths of the conductor structures in the form of conductor tracks or interconnects (the mesh size) corresponds to conventional HDI (High Density Interconnection) structures. The same applies to the breadth of the gradients of the conductor structures.
Besonders einfach und kostengünstig lassen sich die Leiterstrukturen durch Drucken herstellen. Dies erfolgt vorzugswei- se, solange das flächige Substrat noch eben, also noch nicht tiefgezogen ist.Particularly simple and inexpensive, the conductor structures can be produced by printing. This preferably takes place as long as the planar substrate is still flat, ie not deep-drawn yet.
Der Hardwareschütz weist insbesondere Anschlüsse zum Anschließen von Detektormitteln zum Detektieren von einer Ver- letzung der Leiterstrukturen auf.In particular, the hardware contactor has connections for connecting detector means for detecting a violation of the conductor structures.
Bei einem Verfahren zum Herstellen eines Hardwareschutzes einer der zuvor geschilderten Arten wird ein flächiges Substrat mit Leiterstrukturen zum Detektieren eines Zugriffs auf eine zu schützende Schaltung versehen. Zuvor oder bevorzugt danach wird das flächige Substrat in eine Form gebracht, in der es Λ einen zurückspringenden zentralen Bereich aufweist, der von vorspringenden Bereichen umgeben ist. Vorteilhafte Ausgestaltungen des Verfahrens ergeben sich aus den vorteilhaften Aus- gestaltungen des Hardwareschutzes und umgekehrt.In a method of fabricating a hardware protector of any of the types previously described, a planar substrate is provided with conductor patterns for detecting access to a circuit to be protected. Before or preferably after the two-dimensional substrate is placed in a mold, it comprises in the Λ a recessed central area, which is surrounded by projecting portions. Advantageous embodiments of the method result from the advantageous embodiments of the hardware protection and vice versa.
Eine Vorrichtung weist einen Hardwareschütz einer der zuvor geschilderten Arten und einen Schaltungsträger für eine zu schützende Schaltung auf. Der Hardwareschütz ist mit den vor- springenden Bereichen seines Substrats auf dem Schaltungsträger angeordnet, so dass sich zwischen dem zurückspringenden zentralen Bereich und dem Schaltungsträger ein Raum für die zu schützende Schaltung ergibt.A device comprises a hardware contactor of one of the previously described types and a circuit carrier for a circuit to be protected. The hardware contactor is arranged with the projecting areas of its substrate on the circuit carrier, so that a space for the circuit to be protected results between the recessed central area and the circuit carrier.
Der Schaltungsträger ist oder enthält vorzugsweise eineThe circuit carrier is or preferably includes a
Schaltungsträger-Leiterplatte. Diese ist oftmals auch an ihrer Rückseite zu schützen. Dazu weist die Vorrichtung insbe- sondere einen zweiten Hardwareschutz nach einer der zuvor geschilderten Arten auf, der auf der dem ersten Hardwareschütz gegenüber liegenden Seite des Schaltungsträgers angeordnet ist.Circuit-carrier board. This is often also to protect on its back. For this purpose, the device has in particular In particular, a second hardware protection according to one of the previously described types, which is arranged on the first hardware contactor opposite side of the circuit substrate.
Weiterhin enthält die Vorrichtung bevorzugt Detektormittel zum Detektieren einer Verletzung der Leiter strukturen durch einen unerlaubten Zugriff und/oder eine unautorisierte Manipulation. Damit auch die Detektormittel geschützt sind, kön- nen sie als Bestandteil der zu schützenden Schaltung ausgeführt sein.Furthermore, the device preferably contains detector means for detecting a violation of the ladder structures by unauthorized access and / or unauthorized manipulation. So that the detector means are also protected, they can be designed as part of the circuit to be protected.
Die Gesamtbaugruppe mit den Schaltungsträge xn findet insbesondere in einem Tachograph, einem Fahrdatenrecorder und/oder einem schienen- oder nichtschienen- gebundenen Fahrzeug Anwendung. Sie kann beispielsweise aber auch in Geldautomaten, Vorrichtungen für Geldinstitute und Flugzeugen zum Einsatz kommen. Insbesondere ist der Einsatz der Ge samtbaugruppe mit den Schaltungsträgern immer dann von Vorteil, wenn zu schüt- zende kryptographische Schlüssel (RSA, DES) zum Einsatz kommen . •: .-The overall assembly with the circuit lengths xn is used in particular in a tachograph, a driving data recorder and / or a rail or non-rail vehicle. However, it can also be used, for example, in ATMs, devices for financial institutions and aircraft. In particular, the use of the overall assembly with the circuit carriers is always advantageous when cryptographic keys to be protected (RSA, DES) are used. •: .-
Weitere Vorteile und Merkmale der Erfindung- ergeben sich aus der Beschreibung von Ausführungsbeispielen anhand der Zeich- nung. Dabei zeigt:Further advantages and features of the invention will become apparent from the description of embodiments with reference to the drawing. Showing:
Figur 1 eine Ausführungsform einer Vorrichtung mit einemFigure 1 shows an embodiment of a device with a
Schaltungsträger, auf dessen einer Seite ein Hardwareschutz angeordnet ist und auf dessen der einen Seite gegenüber liegenden Seite ein. zweiter Hardwareschutz angeordnet ist;Circuit carrier, on one side of which a hardware protection is arranged and on whose one side opposite side. second hardware protection is arranged;
Figur 2 ein alternatives Ausführungsbeispiel einer Vorrichtung mit einem Schaltungsträger, auf dessen einer Seite ein Hardwareschutz angeordnet ist und auf dessen der einen Seite gegenüber liegenden Seite ein zweiter Hardwareschütz angeordnet iL st; Figur 3 ein Substrat mit Leiterstrukturen, aus dem ein Hardwareschutz hergestellt wird.FIG. 2 shows an alternative exemplary embodiment of a device with a circuit carrier, on the one side of which a hardware protection is arranged and on whose side opposite a second hardware contactor is arranged; 3 shows a substrate with conductor structures, from which a hardware protection is produced.
In Figur 1 erkennt man einen Hardwareschutz 10 mit einem flächigen Substrat 11, 12, das einen zurückspringenden zentrralen Bereich 11 aufweist, der vollständig von vorspringenden Bereichen 12 umgeben ist. An und in dem Substrat 11, 12 sirxd Leiterstrukturen 13, 14 angeordnet. Dazu enthält das Substrat 11, 12 zwei Prepregs 15, 16. Das erste Prepreg 15 bildet die Seite des Substrats 11, 12, die in die Richtung weist, int die der zentrale Bereich 11 zurück springt. An der Seite des Prepregs 15, die in die Richtung weist, in die die den zentralen Bereich 11 umgebenden Bereiche 12 vorspringen, ist die erste Leiterstruktur 13 der beiden bereits erwähnten Leiterstrukturen 13, 14 angeordnet.FIG. 1 shows a hardware protection 10 having a planar substrate 11, 12 which has a recessed central region 11 which is completely surrounded by projecting regions 12. At and in the substrate 11, 12 sirxd conductor structures 13, 14 are arranged. For this purpose, the substrate 11, 12 contains two prepregs 15, 16. The first prepreg 15 forms the side of the substrate 11, 12 which points in the direction in which the central region 11 springs back. On the side of the prepreg 15, which points in the direction in which project the regions 12 surrounding the central region 11, the first conductor structure 13 of the two already mentioned conductor structures 13, 14 is arranged.
An ihr ist wiederum das zweite Prepreg 16 angeordnet, an dessen der ersten Leiterstruktur 13 gegenüberliegenden Seite; die zweite Leiterstruktur 14 angeordnet ist.In turn, the second prepreg 16 is arranged on it, at the opposite side of the first conductor structure 13; the second conductor pattern 14 is arranged.
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Der Hardwareschütz 10 verfügt über Anschlüsse 17 zum Kontaktieren der Leiterstrukturen 13, 14 mit weiteren Hardwareschutz-Leiterstrukturen und mit Detektormitteln zum Detekitie- ren von Verletzungen der Leiterstrukturen 13, 14.The hardware contactor 10 has connections 17 for contacting the conductor structures 13, 14 with further hardware protection conductor structures and with detector means for detecting injuries to the conductor structures 13, 14.
Der Hardwareschütz 10 ist mit seinen vorspringenden Bereichen 12, insbesondere mit deren Rändern, an einem Schaltungsträger 20 für eine zu schützende Schaltung 21 angeordnet. Im in Fi- gur 1 dargestellten Ausführungsbeispiel ist der Schaltung-s- träger 20 als Mehrlagenleiterplatte ausgestaltet.The hardware contactor 10 is arranged with its projecting areas 12, in particular with its edges, on a circuit carrier 20 for a circuit 21 to be protected. In the exemplary embodiment illustrated in FIG. 1, the circuit substrate 20 is designed as a multilayer printed circuit board.
Im Bereich, in dem die zum zentralen Bereich parallel verlaufenden Ränder der vorspringenden Bereiche 12 am Schaltung-s- träger 20 angeordnet sind, weist der Schaltungsträger 20 seinerseits zum Schutz der zu schützenden Schaltung 21 Schal— tungsträger-Leiterstrukturen 22 auf, durch die ein stirnsei- tiges Anbohren des Schaltungsträgers 20 registrierbar ist. Diese sind über die Anschlüsse 17 mit den Leiterstrukturen 13, 14 des Hardwareschutzes 10 verbunden.In the region in which the edges of the projecting regions 12, which run parallel to the central region, are arranged on the circuit carrier 20, the circuit carrier 20 in turn has circuit carrier conductor structures 22 for protecting the circuit to be protected, by means of which a front end - tiger drilling of the circuit substrate 20 is registrable. These are connected via the terminals 17 to the conductor structures 13, 14 of the hardware protection 10.
Weiterhin verfügt der Schaltungsträger 20 über Ein- und Ausgabeanschlüsse 23 außerhalb des Schutzbereiches, die über Leitungen mit der zu schützenden Schaltung 21 verbunden sind, die durch die Lagen der Schaltungsträger-Leiterstrukturen 22 hindurch führen .Furthermore, the circuit carrier 20 has input and output terminals 23 outside the protected area, which are connected via lines to the circuit to be protected 21, which pass through the layers of the circuit carrier conductor structures 22 therethrough.
Auf der dem Hardwareschutz gegenüber liegenden Seite ist am Schaltungsträger 20 ein zweiter Hardwareschutz 30 angeordnet. Der zweite Hardwareschutz 30 ist analog dem ersten Hardwareschutz 10 aufgebaut und verfügt ebenso über einen zurück- springenden zentralen Bereich 31, der von vorspringenden Bereichen 32 umgeben ist. Sein Substrat ist z.B. mit Prepregs 35, 36 aufgebaut, zwischen denen eine erste Leiterstruktur 33 angeordnet ist, die über Anschlüsse 37 mit einer zweiten Leiterstruktur 34 verbunden ist, die an der dem Prepreg 35 und der Leiterstruktur 33 abgewandten Seite des Prepregs 36 angeordnet ist. Der zweite Hardwareschufcz 30 ist gegenüber dem ersten Hardwareschutz 10 um einen definierten Winkel gedreht angeordnet .On the side facing the hardware protection side, a second hardware protection 30 is arranged on the circuit carrier 20. The second hardware protection 30 is constructed analogously to the first hardware protection 10 and also has a receding central region 31, which is surrounded by projecting regions 32. Its substrate is e.g. is arranged with prepregs 35, 36, between which a first conductor structure 33 is arranged, which is connected via terminals 37 to a second conductor structure 34, which is arranged on the prepreg 35 and the conductor structure 33 opposite side of the prepreg 36. The second hardware device 30 is rotated relative to the first hardware protector 10 by a defined angle.
Die Ausführungsform nach Figur 2 unterscheidet sich von der nach Figur 1 dadurch, dass die beiden Hardwareschutze 10, 30 nicht an der Mehrlagenleiterplatte des Schaltungsträgers 20, sondern direkt aneinander angeordnet sind. Der Schaltungsträger 20 enthält über seine Mehrlageneiterplatte hinaus in die- sem Fall noch Träger 24, mit denen die zu schützende Schaltung 21 und die Mehrlagenleiterplatte des Schaltungsträgers 20 im Raum gehalten werden, der sich zwischen den zurückspringenden zentralen Bereichen 11, 31 der Hardwareschutze 10, 30 ergibt.The embodiment according to FIG. 2 differs from that according to FIG. 1 in that the two hardware protectors 10, 30 are not arranged on the multilayer printed circuit board of the circuit carrier 20, but directly against one another. In this case, the circuit carrier 20 also contains, via its multilayer printed circuit board, in this case carriers 24 with which the circuit 21 to be protected and the multilayer printed circuit board of the circuit carrier 20 are held in space, which is located between the recessed central regions 11, 31 of the hardware protectors 10, 30 results.
In Figur 3 erkennt man ein flächiges Substrat 41, 42, 44 mit einem rechteckigen, zentralen Bereich 41, der an seinen vier Kanten von Bereichen 42, 44 umgeben ist. Die Bereiche 42, 44 weisen ihrerseits jeweils einen dem zentralen Bereich 41 benachbarten Bereich auf, der gegenüber diesem in einem Tiefziehverfahren angewinkelt wird, und einen vom zentralen Be- reich 41 entfernten Rand, der seinerseits gegenüber dem dem zentralen Bereich 41 benachbarten Bereich des Bereiches 42 so angewinkelt wird, dass er wieder parallel zum zentralen Bereich 41 verläuft. Zwischen dem den zentralen Bereich 41 umgebenden Bereichen 42 sind Aussparungen 43 vorgesehen, die sich über ein Tiefziehen der Bereiche 42, 44 erschließen, so dass diese an ihren aufeinander stoßenden Kanten miteinander verschweißt werden können. Das gesamte Substrat 41, 42, 44 in Form von vorstrukturierten und anschließend tiefgezogenen Bohrschutzlagen ist mit einer mäandrierenden Leiterstruktur bedruckt.FIG. 3 shows a planar substrate 41, 42, 44 with a rectangular, central area 41, which at its four Edges of areas 42, 44 is surrounded. The regions 42, 44 in turn each have an area adjacent to the central area 41, which is angled towards it in a deep-drawing process, and an edge remote from the central area 41, which in turn is opposite the area of the area 42 adjacent to the central area 41 is angled so that it runs parallel to the central area 41 again. Recesses 43 are provided between the regions 42 surrounding the central region 41, which openings open by deep drawing of the regions 42, 44, so that they can be welded together at their abutting edges. The entire substrate 41, 42, 44 in the form of pre-structured and then deep-drawn Bohrschutzlagen is printed with a meandering conductor structure.
Der hardwaremäßiger Manipulationsschutz wird also in ein oder zwei dreidimensionale Halbschalen integriert, welche beispielsweise als Tiefziehteil oder Tiefziehteile ausgeformt sind und die zu stützende Schaltung mit ihrer Baugruppe entweder ganz umschließen.. (Figur 2) oder auf der Leiterplatte 20 der zu schützenden Baugruppe der Schaltung 21 montiert werden (Figur 1) .The hardware manipulation protection is thus integrated into one or two three-dimensional half-shells which are formed, for example, as a deep-drawn part or deep-drawn parts and the circuit to be supported with their assembly either completely enclose .. (Figure 2) or on the circuit board 20 to be protected assembly of the circuit 21st be mounted (Figure 1).
Wird in einer besonderen Ausführungsform nur eine dreidimensionale Halbschale verwendet, kann anstelle der zweiten Halbschale die ebene Leiterplatte 20 als Ersatz für die zweite Halbschale verwendet werden. Dann werden auf der der ersten Halbschale zugewandten Seite die Elektronikbauelemente ange- ordnet und auf der abgewandten Seite wird der Hardwareschutz mit seinen Leiterstrukturen angeordnet.If only a three-dimensional half-shell is used in a particular embodiment, instead of the second half-shell, the planar printed circuit board 20 can be used as a replacement for the second half-shell. Then the electronic components are arranged on the side facing the first half shell and the hardware protection with its conductor structures is arranged on the opposite side.
Für den letztgenannten Fall ist auch ein zusätzlicher Hardwareschutz in die für die Baugruppe verwendete Leiterplatte 20 zu integrieren, etwa indem diese in dem Bereichen, in denen sie mit dem Hardwareschutz durch Löten oder Kleben verbunden ist, selbst ein Leiterstrukturnetz 22 aufweist. Dies lässt sich beispielsweise dadurch realisieren, dass die Leiterplatte 20 als Mehrlagenleiterplatte ausgeführt ist, die in den angesprochenen Bereichen mehrere, übereinander angeordnete Leiterlagen enthält, die vor einem stirnseitigen Anbohren schützen.In the latter case, additional hardware protection must also be integrated into the circuit board 20 used for the assembly, such as itself having a ladder structure network 22 in the areas where it is connected to the hardware protection by soldering or gluing. This can be realized for example by the fact that the circuit board 20 is designed as a multi-layer circuit board, which contains a plurality of superimposed conductor layers in the areas mentioned, which protect against a frontal drilling.
Die Ausgestaltung der Halbschalen 11, 12; 31, 32 des Hardwareschutzes 10 kann einmal dahingehend ausgeführt werden, dass sie aus einem tiefgezogenen Leiterplattenmaterial wie zum Beispiel glasfaserverstärktem FR4-Prepreg gefertigt sind, welches im Ausgangszustand noch nicht ausgehärtet ist. Andererseits ist die Verwendung von Folien möglich, insbesondere RCC-Folien (Resin Coatet Copper, teilweise Kupfer vorstrukturiert) oder anderweitig tiefziehgeeigneten Folien mit oder ohne MetallbeSchichtung.The embodiment of the half-shells 11, 12; 31, 32 of the hardware protector 10 can be made to be made of a thermoformed printed circuit board material such as glass fiber reinforced FR4 prepreg, which is not yet cured in the initial state. On the other hand, the use of films is possible, in particular RCC films (Resin Coatet Copper, partially pre-structured copper) or otherwise thermoformable films with or without MetallbeSichtung.
Vor dem Tiefziehen mit anschließendem Aushärten wird ein- oder beidseitig ein engmaschiges Leitungs- bzw. Widerstandsnetzwerk strukturiert. Die Ausgestaltung des Schutznetzwerkes aus Leiterstrukturen 13, 14; 33, 34 kann einmal als strukturiertes metallisches Leitungsnetzwerk zum Beispiel fotolithographisch durch Ätzen oder andere geeignete Verfahren erfolgen. Es kann andererseits auch als Widerstandsnetzwerk mit Leiterstrukturen ausgeführt werden, wobei vorzugsweise Kar- bon-gefüllte HarzSysteme in Sieb- oder Widerstandsdruck ein- oder beidseitig aufgebracht werden und so die Schutzstruktur erzeugt wird.Before thermoforming followed by curing, a close-meshed line or resistor network is structured on one or both sides. The design of the protective network of conductor structures 13, 14; 33, 34 may once be done as a patterned metallic conduit network, for example photolithographically by etching or other suitable methods. On the other hand, it can also be designed as a resistance network with conductor structures, in which case preferably carbon-filled resin systems are applied in one or both sides in screen or resistance pressure, thus producing the protective structure.
Ein derartiges Widerstandsnetzwerk kann aber auch durch Di- rektprinting mit Karbontinte oder ähnliche geeignete Verfahren aufgebracht werden.However, such a resistor network can also be applied by direct printing with carbon ink or similar suitable methods.
Die Gestaltung der Tiefziehteile 11, 12; 31, 32 für den Hardwareschutz kann zum einen so sein, dass diese ähnlich Mehrla- genleiterplatten ausgeführt sind, wobei die zur Schutzverdrahtung notwendigen Leitungen der Baugruppenseite zugewandt sind und keine nach außen führenden elektrischen Durchkontak- tierungen auf die Außenseite der Halbschalen aufweisen. Dazu können alle für die Funktionen der Hardwareschutzschalen und der Baugruppe notwendigen Durchkontaktierungen innerhalb des Schutznetzwerkes liegen und entweder als vergrabene Durchkon- taktierungen (Burried Vias) ausgeführt werden. Und/oder die notwendigen Aufbaulagen für die Subbaugruppenverdrahtung werden als SBU-Aufbauten {Sequential Build Up) mit lasergebohrten oder anderweitig erzeugten Micro-Via-Durchkontaktierungen ausgeführt .The design of the deep-drawn parts 11, 12; 31, 32 for the hardware protection may on the one hand be such that they are similar to multi-layer printed circuit boards, with the cables required for the protective wiring facing the module side and no outwardly leading electrical through-contacts. have on the outside of the half-shells. For this purpose, all through-connections necessary for the functions of the hardware protective shells and of the module can lie within the protective network and be carried out either as buried through-contacts (burried vias). And / or the necessary sub-assembly wiring layouts are implemented as SBU (Sequential Build Up) assemblies with laser drilled or otherwise created micro via vias.
Für den Fall, dass die Hardwareschutz-Tiefziehschalen direkt ein- oder beidseitig auf die Leiterplatte 20 des Schaltungsträgers der zu schützenden Schaltung aufgebracht werden, ist diese entsprechend den obigen Ausführungen als Mehrlagenlei- terplatte mit einem entsprechenden Hardwareschutznetz 22 gegen stirnseitige Angriffe zu gestalten.In the event that the hardware protection thermoforming trays are applied directly on one or both sides of the circuit board 20 of the circuit carrier of the circuit to be protected, this is in accordance with the above statements as Mehrlagenlei- terplatte with a corresponding hardware protection net 22 to make frontal attacks.
Die Leiterstrukturen des schalenförmigen Hardwareschutzes weisen Kontaktierpads in Array-Anordnung auf, welche dazu dienen, später entweder die beiden die Elektronikbaugruppe der zu schützenden Schaltung umhüllenden Hardwareschutzschalen untereinander, mit dem Schaltungsträger der zu schützenden Schaltung oder auf der Mehrlagenleiterplatte des Schaltungsträgers der zu schützenden Schaltung elektrisch mitein- ander zu verbinden.The conductor structures of the cup-shaped hardware protection have Kontaktierpads in array arrangement, which serve later electrically either one of the two electronics assembly of the circuit to be protected hardware protective shells together with the circuit carrier of the circuit to be protected or on the multi-layer board of the circuit carrier of the circuit to be protected - to connect others.
Die Hardwareschützschalen beinhalten eine oder mehrere leitende Lagen (Schichten) . Diese sind beispielsweise als mehrlagige Kupferlagen ausgeführt, welche jeweils sehr fein strukturierte Leiterzüge der Leiterstrukturen 13, 14; 33, 34 enthalten, welche einmal engmaschig die gesamte Lagenfläche überdecken und sich aber auch von Lage zu Lage bedingt durch die Ausgestaltung der Leiterzüge erstrecken.The hardware gun shells include one or more conductive layers. These are, for example, designed as multilayer copper layers, each of which has very finely structured conductor tracks of the conductor structures 13, 14; 33, 34 included, which once closely mesh over the entire layer surface and also extend from layer to layer due to the configuration of the conductor tracks.
Die Leiterbreiten der einen Lage überdecken dabei Isolations- abstände und einen Teil der zugehörigen Leiterbahnen der dazugehörigen und durch das Dielektrikum getrennten Lagen. Sie sind ebenfalls wieder über Burried Vias oder μm-Vias zur Baugruppe nach Innen durchverdrahtet .The conductor widths of one layer thereby cover isolation distances and a part of the associated conductor tracks of the associated layers separated by the dielectric. They are also wired through Burried Vias or μm vias to the module inside.
Die Ausgestaltung einer Lage zum Beispiel in X-Richtung mit einer derartigen Mäanderstruktur aus dünnen Kupfer- Leiterbahnen und der darunter oder darüber liegenden Lage in Y-Richtung mit einer derartigen Struktur getrennt durch die Dielektrikumslage ergibt einen hardwaremäßigen Schutz der Schaltung gegen mechanische Manipulation dadurch, dass diese Leiterzüge nach innen mit der Baugruppe verschaltet sind und somit bedingt durch die ultrafeine Strukturierung beschädigt werden. Damit erfolgt eine Leitungsunterbrechung, welche in der Schaltung registriert wird. Alternativ können auch zwei Netzwerke verwendet werden und ein durch eine Manipulation erzeugter Kurzschluss der beiden Netzwerke registriert werden.The configuration of a layer, for example, in the X-direction with such a meandering structure of thin copper interconnects and the underlying or overlying layer in the Y direction with such a structure separated by the dielectric layer results in a hardware protection of the circuit against mechanical manipulation in that these conductor tracks are interconnected to the inside of the module and thus are damaged due to the ultra-fine structuring. This is a line interruption, which is registered in the circuit. Alternatively, two networks can be used and a generated by a manipulation short circuit of the two networks can be registered.
Die Ausführung der Leiterstrukturen 13, 14; 33, 34 als Feinstleiter kann vorzugsweise in Karbondruck (Widerstandspastendruck) , als Leitpaste 4Silberleitplaste) oder als Tintendruck mit Karbontinte in allen erdenklichen Strukturen erfolgen, welche großflächig über mindestens eine Lage ein engmaschiges Netz erzeugen und welche nach innen an die Schal- tung elektrisch angeschlossen werden.The embodiment of the conductor structures 13, 14; 33, 34 as the ultrafine conductor can be carried out preferably in carbon pressure (resistor paste pressure), as conductive paste 4Silberleitplaste) or ink printing with carbon ink in all imaginable structures which generate a dense mesh over a large area over at least one layer and which are electrically connected to the inside of the circuit ,
Wenigstens eine der beiden Hardwareschützschalen 11, 12; 31, 32 kann auch in "Flex-Rigid"-Technologie ausgeführt sein bzw. es kann eine Flex-Leitung zur Datenübertragung angebracht sein.At least one of the two hardware gun shells 11, 12; 31, 32 can also be implemented in "flex-rigid" technology or a flex line for data transmission can be attached.
Der Dielektrikumsabstand der Hardwareschutzlagen in den Hardwareschutzschalen soll so gewählt sein, dass auch bei stirnseitigem Anbohren eine Schädigung der darüber und der darun- ter liegenden Schutzlage erfolgt und somit der Schutzmechanismus ausgelöst wird. Die elektrische Verbindung und mechanische Verbindung der Hardwareschutzschalen untereinander bzw. mit dem Schaltungsträger der zu schützenden Schaltung kann durch Löten mit anschließender Versiegelung des Lötspaltes durch Kleber, Lami- nieren, durch Kontaktierklebung oder ein ähnliches Verfahren erfolgen. Herkömmliche Verbindungsverfahren sind ebenso verwendbar .The dielectric distance of the hardware protective layers in the hardware protective shells should be selected such that, even with face-side drilling, the protective layer above and the underlying protective layer is damaged and thus the protective mechanism is triggered. The electrical connection and mechanical connection of the hardware protective shells with each other or with the circuit carrier of the circuit to be protected can be done by soldering with subsequent sealing of the soldering gap by adhesive, laminating, by Kontaktierklebung or a similar method. Conventional connection methods are also usable.
Der beschriebene Hardwareschütz weist den Vorteil eines in die Hardwareschutzschalen und gegebenenfalls in die Mehrlagenleiterplatte des Schaltungsträgers der zu schützenden Schaltung integrierten Sensorsystems auf, welches mit nahezu herkömmlicher "High Tech"-Leiterplattentechnologie gefertigt werden kann und auf herkömmlichen Bestücklinien und Elektro- nikbaugruppen-Fertigungen bestückt und verarbeitet werden kann. Zum anderen liegt ein Vorteil darin, ein sicheres, kostengünstiges und für die Montage ohne Mehraufwand zu verarbeitendes Sicherheitssystem direkt in der Elektronikbaugruppe bereitzustellen und zu integrieren, das zuverlässig Hardware- attacken detektiert.The described hardware contactor has the advantage of a sensor system integrated into the hardware protective shells and optionally into the multilayer printed circuit board of the circuit carrier of the circuit to be protected, which can be manufactured with almost conventional "high-tech" printed circuit board technology and equipped on conventional assembly lines and electronic component manufacturing can be processed. On the other hand, there is an advantage in providing and integrating a secure, cost-effective safety system to be processed for assembly without additional effort directly in the electronic assembly, which reliably detects hardware attacks.
3- A- 3- A-

Claims

Patentansprüche claims
1. Hardwareschutz für eine zu schützenden Schaltung (21) mit zwei flächigen Substraten (11, 12; 31, 32), von denen we- nigstens eines einen zurückspringenden zentralen Bereich (11, 31) aufweist, der von vorspringenden Bereichen (12, 32) umgeben ist, an und/oder in dem Substrat (11, 12; 31, 32) angeordneten Leiterstrukturen (13, 14; 33, 34) zum Detektieren eines Zugriffs auf die zu schützenden Schaltung (21) .A hardware protector for a circuit (21) to be protected comprising two flat substrates (11, 12, 31, 32), at least one of which has a recessed central region (11, 31) protruding from (12, 32 ), at and / or in the substrate (11, 12, 31, 32) arranged conductor structures (13, 14, 33, 34) for detecting an access to the circuit to be protected (21).
2. Hardwareschutz nach Anspruch 1, dadurch gekennzeichnet, dass auf einem der flächigen Substrate (11, 12) auf der dem anderen Substrat (31, 32) zugewandten Seite die zu schützende Schaltung angeordnet ist.2. Hardwareschutz according to claim 1, characterized in that on one of the flat substrates (11, 12) on the other substrate (31, 32) side facing the circuit to be protected is arranged.
3. Hardwareschütz nach Anspruch 1, dadurch gekennzeichnet, dass zwischen zwei Substraten (11, 12; 31, 32) mit zurückspringendem zentralen Bereich eine auf einer Leiterplatte an- geordnete zu schützende Schaltung vorgesehen ist.3. Hardware contactor according to claim 1, characterized in that between two substrates (11, 12, 31, 32) with a recessed central region a circuit on a printed circuit board is provided to be protected circuit.
4. Hardwareschütz nach Anspruch 3, dadurch gekennzeichnet, dass die Leiterplatte aus flexiblem Material oder aus Keramik gefertigt ist.4. hardware contactor according to claim 3, characterized in that the printed circuit board is made of flexible material or of ceramic.
5. Hardwareschutz nach Anspruch 1, dadurch gekennzeichnet, dass die vorspringenden Bereiche (12, 32) einen Rand aufweisen, der parallel zum zurückspringenden zentralen Bereich (11, 31) verläuft.5. Hardware protection according to claim 1, characterized in that the projecting portions (12, 32) have an edge which is parallel to the recessed central portion (11, 31).
6. Hardwareschütz nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das Substrat (11, 12; 31, 32) in Form einer Halbschale ausgestaltet ist. 6. Hardwareschütz according to one of the preceding claims, characterized in that the substrate (11, 12, 31, 32) is designed in the form of a half-shell.
7. Hardwareschutz nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das Substrat (11, 12; 31, 32) tiefgezogen ist.7. Hardware protection according to one of the preceding claims, characterized in that the substrate (11, 12, 31, 32) is deep-drawn.
8. Hardwareschutz nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das Substrat (11, 12; 31, 32) eine Leiterplatte und/oder eine Folie enthält.8. Hardware protection according to one of the preceding claims, characterized in that the substrate (11, 12, 31, 32) contains a printed circuit board and / or a film.
9. Hardwareschutz nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die Leiterstrukturen (13, 14; 33, 34) ein Netz bilden.9. Hardware protection according to one of the preceding claims, characterized in that the conductor structures (13, 14, 33, 34) form a network.
10. Hardwareschütz nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die Leiterstrukturen (13, 14; 33, 34) gedruckt, geätzt, fotostrukturiert, laserstrukturiert oder auf ähnliche Weise erzeugt sind.10. Hardware protection according to one of the preceding claims, characterized in that the conductor structures (13, 14, 33, 34) printed, etched, photo-structured, laser-structured or generated in a similar manner.
11. Hardwareschutz nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, Λ. dass der Hardwareschütz (10; 30) Anschlüsse (17; 37) zum Anschließen von Detektormittel zum Detektieren einer Verletzung der Leiterstrukturen (13, 14; 33, 34) aufweist.11. Hardware protection according to one of the preceding claims, characterized in that. in that the hardware contactor (10; 30) has connections (17; 37) for connecting detector means for detecting a violation of the conductor structures (13, 14; 33, 34).
12. Verfahren zum Herstellen eines Hardwareschutzes nach einem der vorhergehenden Ansprüche.12. A method for producing a hardware protection according to one of the preceding claims.
13. Vorrichtung mit einem Hardwareschutz (10) nach einem der Ansprüche 1 bis 11, einem Schaltungsträger (20) für die zu schützende Schaltung (21).13. Device with a hardware protection (10) according to one of claims 1 to 11, a circuit carrier (20) for the circuit to be protected (21).
14. Vorrichtung nach Anspruch 13, dadurch gekennzeichnet, dass der Hardwareschutz (10) mit den vorspringenden Bereichen (12) seines Substrat (11, 12) auf dem Schaltungsträger (20) angeordnet ist, so dass sich zwischen dem zurückspringenden zentralen Bereich (11) und dem Schaltungsträger (20) ein Raum für die zu schützende Schaltung (21) ergibt.14. The device according to claim 13, characterized in that the hardware protection (10) with the projecting areas (12) of its substrate (11, 12) on the circuit carrier (20). is arranged so that between the recessed central region (11) and the circuit substrate (20) results in a space for the circuit to be protected (21).
15. Vorrichtung nach einem der Ansprüche 13 oder 14, dadurch gekennzeichnet, dass die Vorrichtung einen zweiten Hardwareschutz (30) nach einem der Ansprüche 1 bis 8 aufweist, der auf der dem ersten Hardwareschütz (10 gegenüber liegenden Seite des Schaltungs- trägers (20) angeordnet ist.15. Device according to one of claims 13 or 14, characterized in that the device comprises a second hardware protection (30) according to one of claims 1 to 8, which on the first hardware contactor (10 opposite side of the circuit carrier (20) is arranged.
16. Vorrichtung nach einem der Ansprüche 13 bis 15, dadurch gekennzeichnet, dass die Vorrichtung Detektormittel (21) zum Detektieren ei- ner Unterbrechung der Leiterstrukturen (13, 14; 33, 34) aufweist.16. Device according to one of claims 13 to 15, characterized in that the device comprises detector means (21) for detecting an interruption of the conductor structures (13, 14, 33, 34).
17. Vorrichtung nach Anspruch 16, dadurch gekennzeichnet, dass die zu schützende Schaltung (21) die Detektormittel enthält.17. The apparatus according to claim 16, characterized in that the circuit to be protected (21) contains the detector means.
18. Vorrichtung nach einem der Ansprüche 16 oder 17, dadurch gekennzeichnet, dass die Vorrichtung in einen Fahrtenschreiber, ein Fahrzeug, ein Flugzeug, einen Datenrekorder und/oder einen Geldautomaten integriert ist. 18. Device according to one of claims 16 or 17, characterized in that the device is integrated in a tachograph, a vehicle, an aircraft, a data recorder and / or an ATM.
EP05756864A 2005-06-30 2005-06-30 Hardware protection system in the form of deep-drawn printed circuit boards as half-shells Withdrawn EP1897017A1 (en)

Applications Claiming Priority (1)

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PCT/EP2005/053110 WO2007003227A1 (en) 2005-06-30 2005-06-30 Hardware protection system in the form of deep-drawn printed circuit boards as half-shells

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EP1897017A1 true EP1897017A1 (en) 2008-03-12

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US (1) US20090109024A1 (en)
EP (1) EP1897017A1 (en)
JP (1) JP4740326B2 (en)
CN (1) CN101248436B (en)
BR (1) BRPI0520405A2 (en)
RU (1) RU2382404C2 (en)
WO (1) WO2007003227A1 (en)

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BRPI0520405A2 (en) 2009-05-05
CN101248436B (en) 2012-08-22
WO2007003227A1 (en) 2007-01-11
RU2008103340A (en) 2009-08-10
RU2382404C2 (en) 2010-02-20
JP4740326B2 (en) 2011-08-03
JP2008545259A (en) 2008-12-11
US20090109024A1 (en) 2009-04-30
CN101248436A (en) 2008-08-20

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