[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

EP1610177B1 - Lichtempfindlicher harzfilm und daraus hergestellter ausgehärteter film - Google Patents

Lichtempfindlicher harzfilm und daraus hergestellter ausgehärteter film Download PDF

Info

Publication number
EP1610177B1
EP1610177B1 EP04723323A EP04723323A EP1610177B1 EP 1610177 B1 EP1610177 B1 EP 1610177B1 EP 04723323 A EP04723323 A EP 04723323A EP 04723323 A EP04723323 A EP 04723323A EP 1610177 B1 EP1610177 B1 EP 1610177B1
Authority
EP
European Patent Office
Prior art keywords
weight
photosensitive resin
acrylate
resin film
radiation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP04723323A
Other languages
English (en)
French (fr)
Japanese (ja)
Other versions
EP1610177A1 (de
EP1610177A4 (de
Inventor
Shin-Ichiro Iwanaga
Tooru Kimura
Kouji Nishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JSR Corp
Original Assignee
JSR Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JSR Corp filed Critical JSR Corp
Publication of EP1610177A1 publication Critical patent/EP1610177A1/de
Publication of EP1610177A4 publication Critical patent/EP1610177A4/de
Application granted granted Critical
Publication of EP1610177B1 publication Critical patent/EP1610177B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
    • C09D133/04—Homopolymers or copolymers of esters
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
    • Y10S430/111—Polymer of unsaturated acid or ester
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y10S430/12—Nitrogen compound containing
    • Y10S430/121—Nitrogen in heterocyclic ring
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y10S430/124—Carbonyl compound containing

Definitions

  • the constituent units (d) derived from a radical polymerizable compound having a polycyclic aliphatic group, which constitute the alkali-soluble copolymer (A), are preferably those derived from isobornyl (meth)acrylate and tricyclo[5.2.1.0 2,6 ]decanyl (meth) acrylate.
  • radical polymerizable compounds employable include tricyclo[5.2.1.0 2,6 ]decanyloxyethyl (meth)acrylate, isobornyl (meth)acrylate and tricyclo[5.2.1.0 2,6 ]decanyl (meth)acrylate. These compounds can be used singly or in combination of two or more kinds.
  • Examples of the ethylenically unsaturated compounds (B) include:
  • a radiation-sensitive radical polymerization initiator (C) of such a type in such an amount that when a coating film having a dry film thickness of 70 ⁇ m in an uncured state is formed, the coating film has a 365 nm radiation transmittance of not less than a specific value and a 405 nm radiation transmittance of not less than a specific value.
  • the radiation-sensitive radical polymerization initiators include acylphosphine oxides, such as 2,4,6-trimethylbenzoyldiphenylphosphine oxide and bis-(2,6-dimethoxybenzoyl)-2,4,4-trimethylpentylphosphine oxide; 2,2-dimethoxy-1,2-diphenylethane-1-one, benzyl dimethyl ketal, benzyl- ⁇ -methoxyethyl acetal, and 1-phenyl-1,2-propanedione-2-(o-ethoxycarbonyl)oxime.
  • Examples of commercial products thereof include Lucirin TPO (available from BASF Japan Ltd.) and Irgacure 651 (available from Ciba Specialty Chemicals K.K.). These compounds can be used singly or in combination of two or more kinds.
  • the radiation-sensitive radical polymerization initiator is used in an amount of usually 20 to 40 parts by weight, preferably 20 to 30 parts by weight, more preferably 22 to 27 parts by weight, based on 100 parts by weight of the alkali-soluble copolymer (A).
  • alkyl ethers of polyhydric alcohols such as ethylene glycol monoethyl ether and diethylene glycol monomethyl ether
  • alkyl ether acetates of polyhydric alcohols such as ethyl cellosolve acetate and propylene glycol monomethyl ether acetate
  • esters such as ethyl 3-ethoxypropionate, methyl 3-methoxypropionate, ethyl 2-hydroxypropionate and ethyl lactate
  • ketones such as diacetone alcohol
  • thermal polymerization inhibitor can be added to the photosensitive resin film of the invention.
  • thermal polymerization inhibitors include pyrogallol, benzoquinone, hydroquinone, methylene blue, tert-butyl catechol, monobenzyl ether, methylhydroquinone, amylquinone, amyloxyhydroquinone, n-butylphenol, phenol, hydroquinone monopropyl ether, 4,4'-(1-methylethylidene)bis(2-methylphenol), 4,4'-(1-methylethylidene)bis(2,6-dimethylphenol), 4,4'-[1-[4-(1-(4-hydroxyphenyl)-1-methylethyl)phenyl]ethylidene]bisphenol, 4,4',4"-ethylidenetris(2-methylphenol), 4,4',4"-ethylidenetrisphenol and 1,1,3-tris(2,5-dimethyl
  • the photosensitive resin film of the invention can be added fillers, colorants, viscosity modifiers, etc., when needed.
  • the photosensitive resin film of the invention is formed.
  • the components are mixed to prepare a radiation-sensitive resin composition first.
  • the photosensitive resin film of the invention is formed.
  • the photosensitive resin composition may be applied onto a chip substrate and heated to remove the solvent, whereby a desired photosensitive resin film is formed on the chip substrate, or the photosensitive resin composition may be applied in advance onto a flexible base film and dried to form a photosensitive resin film, and the thus formed photosensitive resin film may be bonded onto a chip substrate when it is used.
  • a low pressure mercury lamp, a high pressure mercury lamp, an extra-high pressure mercury lamp, a metal halide lamp, an argon gas laser or the like is employable.
  • the light irradiation dose varies depending upon the type of each component in the composition, amount thereof, thickness of the coating film, etc., but in case of using, for example, a high pressure mercury lamp, the irradiation dose is in the range of 100 to 1500 mJ/cm 2 .
  • the photosensitive resin film of the invention can be sufficiently cured even by the above-described light irradiation only, but depending upon the purpose, the film may be further cured by additional light irradiation (referred to as "post exposure” hereinafter) or heating.
  • the post exposure can be carried out in the same manner as in the above-mentioned radiation irradiation.
  • the irradiation dose is not specifically restricted, but in case of using, for example, a high pressure mercury lamp, the irradiation dose is preferably in the range of 100 to 2000 mJ/cm 2 .
  • the photosensitive resin film obtained above was exposed to an ultraviolet radiation of 1000 mJ/cm 2 through a pattern mask for resolution measurement by means of an extra-high pressure mercury lamp (OSRAM HBO-1000W/D). Then, the resin film was developed with a 2.38 wt% aqueous solution of tetramethylammonium hydroxide, washed with running water and spin-dried to obtain a patterned cured film as a test specimen.
  • OSRAM HBO-1000W/D extra-high pressure mercury lamp
  • the test specimen was observed by a scanning electron microscope to measure a resolution.
  • the "resolution” was judged by resolving a square pattern of 75 ⁇ m x 75 ⁇ m. A case where the pattern was resolved without any residual resist and an angle of the side was 85 to 95° was evaluated as "A”, and a case where the resulting image deviated from the above range was evaluated as "B".
  • Adhesion to the substrate was evaluated by observing a section of the resist-cured film after development by means of a scanning electron microscope. A film in which lifting of resist was not observed at the periphery of the opening or the edge of the wafer was evaluated as "A”, and a film in which lifting of resist or peeling of resist was observed was evaluated as "B”.
  • the residual film ratio was determined by measuring a film thickness after development.
  • the residual film ratio is a value obtained by dividing a film thickness after development by a film thickness after prebaking and multiplying the obtained value by 100.
  • a film having a residual film ratio of not less than 90% was evaluated as "A”
  • a film having a residual film ratio of less than 90% was evaluated as "B”.

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Polymerisation Methods In General (AREA)

Claims (6)

  1. Photosensitiver Harzfilm in einem ungehärteten Zustand, der umfasst:
    (A) ein alkali-lösliches Copolymer, das umfasst:
    (a) Bestandteilseinheiten, die von α-Methyl-p-hydroxystyrol abgeleitet sind, in Mengen von 1 bis 30 Gew.-%,
    (b) Bestandteilseinheiten, die von einer radikalisch polymerisierbaren Verbindung mit einer Carboxylgruppe abgeleitet sind, in Mengen von 5 bis 20 Gew.-%,
    (c) Bestandteilseinheiten, die von einem Acrylsäurealiphatischen-Ester abgeleitet sind, in Mengen von 20 bis 40 Gew.-%, und
    (d) Bestandteilseinheiten, die von einer radikalisch polymerisierbaren Verbindung mit einer polyzyklischen aliphatischen Gruppe abgleitet sind, in Mengen von 30 bis 60 Gew.-%,
    (B) eine Verbindung mit zumindest einer ethylenisch ungesättigten Doppelbindung, und
    (C) einen strahlungssensitiven Radikalpolymerisationsinitiator durch dessen Verwendung ein Beschichtungsfilm mit einer Trockenfilmdickte von 70 µm in einem ungehärteten Zustand eine Strahlungsdurchlässigkeit bei 365 nm von nicht weniger als 10% und eine Strahlungsdurchlässigkeit bei 405 nm von nicht weniger als 60% aufweist,
    wobei der strahlungssensitive Radikalpolymerisationsinitiator (C) in einer Menge von 20 bis 40 Gewichtsteilen basierend auf 100 Gewichtsteilen des Bestandteils (A) enthalten ist, und eine Trockenfilmdicke des photosensitiven Harzfilms nicht weniger als 50 µm beträgt.
  2. Photosensitiver Harzfilm nach Anspruch 1, wobei die Verbindung (B) mit zumindest einer ethylenisch ungesättigten Doppelbindung in einer Menge von 30 bis 80 Gewichtsteilen basierend auf 100 Gewichtsteilen des alkali-löslichen Copolymers (A) enthalten ist.
  3. Photosensitiver Harzfilm nach Anspruch 1, wobei das alkali-lösliche Copolymer (A) eine Glasübergangstemperatur von nicht geringer als 60°C aufweist.
  4. Photosensitiver Harzfilm nach Anspruch 1, wobei die Bestandteilseinheiten (d) die von einer radikalisch polymerisierbaren Verbindung mit einer polyzyklischen aliphatischen Gruppe abgeleitet sind, welche das alkali-lösliche Copolymer (A) aufbauen, von Isobornyl (meth) acrlyat und Tricyclo[5.2.1.02,6]dekanyl (meth) acrylat abgeleitet sind.
  5. Photosensitiver Harzfilm nach einem der Ansprüche 1 bis 4, wobei der strahlungssensitive Radikalpolymerisationsinitiator (C) (e) 2,2-Dimethoxy-1,2-diphenylethan-1-on und (f) 2,4,6-Trimethylbenzoyldiphenylphosphinoxid umfasst, und
    das 2,2-Dimethoxy-1,2-diphenylethan-1-on (e) in einer Menge von 17 bis 30 Gewichtsteilen enthalten ist und das 2,4,6-Trimethylbenzoyldiphenylphosphinoxid (f) in einer Menge von 3 bis 10 Gewichtsteilen enthalten ist, basierend auf 100 Gewichtsteilen des alkali-löslichen Copolymers (A).
  6. Gehärteter Film, der durch Photohärten eines photosensitiven Harzfilms in einem ungehärteten Zustand gebildet ist, wobei der photosensitive Harzfilm umfasst:
    (A) ein alkali-lösliches Copolymer, das umfasst:
    (a) Bestandteilseinheiten, die von α-methyl-p-pyroxystyrol abgeleitet sind, in Mengen von 1 bis 30 Gew.-%,
    (b) Bestandteilseinheiten, die von einer radikalisch polymerisierbaren Verbindung mit einer Carboxylgruppe abgeleitet sind, in Mengen von 5 bis 20 Gew.-%,
    (c) Bestandteilseinheiten, die von einem Acrylsäurealiphatischem-Ester abgeleitet sind, in Mengen von 20 bis 40 Gew.-%, und
    (d) Bestandteilseinheiten, die von einer radikalisch polymerisierbaren Verbindung mit einer polyzyklischen aliphatischen Gruppe abgleitet sind, in Mengen von 30 bis 60 Gew.-%,
    (B) eine Verbindung mit zumindest einer ethylenisch ungesättigten Doppelbindung, und
    (C) einen strahlungssensitiven Radikalpolymerisationsinitiator durch dessen Verwendung ein Beschichtungsfilm mit einer Trockenfilmdichte von 70 µm in einem ungehärteten Zustand eine Strahlungsdurchlässigkeit bei 365 nm von nicht weniger als 10% und eine Strahlungsdurchlässigkeit bei 405 nm von nicht weniger als 60% aufweist,
    wobei bei dem photosensitiven Harzfilm der strahlungssensitive Radikalpolymerisationsinitiator (C) in einer Menge von 20 bis 40 Gewichtsteilen basierend auf 100 Gewichtsteilen des Bestandteils (A) enthalten ist, und eine Trockenfilmdicke des photosensitiven Harzfilms nicht weniger als 50 µm beträgt.
EP04723323A 2003-04-01 2004-03-25 Lichtempfindlicher harzfilm und daraus hergestellter ausgehärteter film Expired - Lifetime EP1610177B1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2003098392 2003-04-01
JP2003098392A JP4300847B2 (ja) 2003-04-01 2003-04-01 感光性樹脂膜およびこれからなる硬化膜
PCT/JP2004/004155 WO2004090637A1 (ja) 2003-04-01 2004-03-25 感光性樹脂膜およびこれからなる硬化膜

Publications (3)

Publication Number Publication Date
EP1610177A1 EP1610177A1 (de) 2005-12-28
EP1610177A4 EP1610177A4 (de) 2010-07-07
EP1610177B1 true EP1610177B1 (de) 2011-03-09

Family

ID=33156670

Family Applications (1)

Application Number Title Priority Date Filing Date
EP04723323A Expired - Lifetime EP1610177B1 (de) 2003-04-01 2004-03-25 Lichtempfindlicher harzfilm und daraus hergestellter ausgehärteter film

Country Status (8)

Country Link
US (1) US7214471B2 (de)
EP (1) EP1610177B1 (de)
JP (1) JP4300847B2 (de)
KR (1) KR101042777B1 (de)
CN (1) CN100589032C (de)
DE (1) DE602004031718D1 (de)
TW (1) TW200500796A (de)
WO (1) WO2004090637A1 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7951522B2 (en) * 2004-12-29 2011-05-31 Tokyo Ohka Kogyo Co., Ltd. Chemically amplified positive photoresist composition for thick film, thick-film photoresist laminated product, manufacturing method for thick-film resist pattern, and manufacturing method for connection terminal
US7927778B2 (en) * 2004-12-29 2011-04-19 Tokyo Ohka Kogyo Co., Ltd. Chemically amplified positive photoresist composition for thick film, thick-film photoresist laminated product, manufacturing method for thick-film resist pattern, and manufacturing method for connection terminal
WO2007026520A1 (ja) * 2005-08-30 2007-03-08 Jsr Corporation 感放射線性樹脂組成物およびメッキ造形物の製造方法
WO2007029871A1 (ja) * 2005-09-08 2007-03-15 Jsr Corporation 感放射線性樹脂組成物およびカラーフィルタ
TWI480698B (zh) * 2006-03-30 2015-04-11 Jsr Corp 負型敏輻射線性樹脂組成物
JP4765974B2 (ja) * 2006-03-30 2011-09-07 Ｊｓｒ株式会社 ネガ型感放射線性樹脂組成物
CA2676796C (en) 2007-01-29 2016-02-23 Eisai R & D Management Co., Ltd. Composition for treatment of undifferentiated gastric cancer
JP5093226B2 (ja) * 2007-03-20 2012-12-12 Ｊｓｒ株式会社 感放射線性樹脂組成物
TW200919085A (en) * 2007-09-18 2009-05-01 Asahi Kasei Emd Corp Photosensitive resin composition and laminate thereof
JP5076945B2 (ja) * 2008-02-12 2012-11-21 Ｊｓｒ株式会社 ネガ型感放射線性樹脂組成物
JP2011132349A (ja) * 2009-12-24 2011-07-07 Jnc Corp インクジェット用インク
WO2013108716A1 (ja) 2012-01-19 2013-07-25 日産化学工業株式会社 ネガ型感光性樹脂組成物
JP5968007B2 (ja) * 2012-03-30 2016-08-10 太陽インキ製造株式会社 光硬化性樹脂組成物、ドライフィルムおよびプリント配線板
JP6315204B2 (ja) 2012-10-02 2018-04-25 日産化学工業株式会社 ネガ型感光性樹脂組成物
KR102468581B1 (ko) 2013-10-21 2022-11-18 닛산 가가쿠 가부시키가이샤 네가티브형 감광성 수지 조성물
JP6524972B2 (ja) * 2015-09-28 2019-06-05 Jsr株式会社 対象物の処理方法、仮固定用組成物、半導体装置及びその製造方法
JP7067470B2 (ja) * 2016-03-31 2022-05-16 昭和電工マテリアルズ株式会社 感光性樹脂組成物、感光性樹脂フィルム、硬化物の製造方法、積層体、及び電子部品
WO2017168700A1 (ja) * 2016-03-31 2017-10-05 日立化成株式会社 感光性樹脂組成物、感光性樹脂フィルム、硬化物の製造方法、積層体、及び電子部品
JP2016139150A (ja) * 2016-04-04 2016-08-04 太陽インキ製造株式会社 光硬化性樹脂組成物、ドライフィルムおよびプリント配線板
US20200012191A1 (en) * 2017-03-28 2020-01-09 Toray Industries, Inc. Photosensitive resin composition, cured film, element equipped with cured film, organic el display device equipped with cured film, cured film production method, and organic el display device production method
JP2020076945A (ja) * 2018-09-21 2020-05-21 旭化成株式会社 感光性樹脂組成物
TWI791224B (zh) * 2021-05-26 2023-02-01 達興材料股份有限公司 鹼可溶性樹脂、保護層組成物、保護層、積層體以及光阻圖案的形成方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4786569A (en) * 1985-09-04 1988-11-22 Ciba-Geigy Corporation Adhesively bonded photostructurable polyimide film
US5217847A (en) * 1989-10-25 1993-06-08 Hercules Incorporated Liquid solder mask composition
CA2025198A1 (en) * 1989-10-25 1991-04-26 Daniel F. Varnell Liquid solder mask composition
JPH0878318A (ja) * 1994-09-08 1996-03-22 Japan Synthetic Rubber Co Ltd アルカリ現像型フォトレジスト組成物
JP3011864B2 (ja) * 1994-12-09 2000-02-21 日本ペイント株式会社 水現像性感光性樹脂組成物
JPH10161310A (ja) * 1996-12-04 1998-06-19 Jsr Corp 感放射線性樹脂組成物
US6338936B1 (en) * 1998-02-02 2002-01-15 Taiyo Ink Manufacturing Co., Ltd. Photosensitive resin composition and method for formation of resist pattern by use thereof
JPH11271974A (ja) * 1998-03-23 1999-10-08 Nippon Zeon Co Ltd 新規アクリルモノマー、新規アクリルポリマー、レジスト組成物及びそれを用いたパターン形成方法
JP3832099B2 (ja) * 1998-07-24 2006-10-11 Ｊｓｒ株式会社 バンプ形成用材料および配線形成用材料
US6312867B1 (en) * 1998-11-02 2001-11-06 Shin-Etsu Chemical Co., Ltd. Ester compounds, polymers, resist compositions and patterning process
JP2000336121A (ja) 1998-11-02 2000-12-05 Shin Etsu Chem Co Ltd 新規なエステル化合物、高分子化合物、レジスト材料、及びパターン形成方法
JP2002182381A (ja) * 2000-12-11 2002-06-26 Hitachi Chem Co Ltd 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの製造法及びプリント配線板の製造法
JP2002303973A (ja) * 2001-04-06 2002-10-18 Asahi Kasei Corp 厚膜導体回路用液状感光性樹脂組成物
JP2003029604A (ja) * 2001-07-19 2003-01-31 National Institute Of Advanced Industrial & Technology ホログラム記録材料用組成物、ホログラム記録媒体およびその製造方法
JP2003113174A (ja) * 2001-07-30 2003-04-18 Mitsubishi Chemicals Corp ラクトン構造を有する多環式化合物
JP4048791B2 (ja) * 2002-02-18 2008-02-20 Ｊｓｒ株式会社 感放射線性樹脂組成物

Also Published As

Publication number Publication date
US7214471B2 (en) 2007-05-08
TWI336813B (de) 2011-02-01
KR20050120771A (ko) 2005-12-23
DE602004031718D1 (de) 2011-04-21
WO2004090637A1 (ja) 2004-10-21
KR101042777B1 (ko) 2011-06-20
JP2004302389A (ja) 2004-10-28
US20060210912A1 (en) 2006-09-21
TW200500796A (en) 2005-01-01
CN1768304A (zh) 2006-05-03
CN100589032C (zh) 2010-02-10
JP4300847B2 (ja) 2009-07-22
EP1610177A1 (de) 2005-12-28
EP1610177A4 (de) 2010-07-07

Similar Documents

Publication Publication Date Title
EP1610177B1 (de) Lichtempfindlicher harzfilm und daraus hergestellter ausgehärteter film
US7482111B2 (en) Negative radiation-sensitive resin composition
JP4048791B2 (ja) 感放射線性樹脂組成物
JP4677967B2 (ja) ガラスエッチング用放射線硬化性レジスト樹脂組成物およびこれを用いたガラス基板の製造方法
JP4765974B2 (ja) ネガ型感放射線性樹脂組成物
JP3575109B2 (ja) バンプ形成用材料
JP5360059B2 (ja) ネガ型感放射線性樹脂組成物
JP5093226B2 (ja) 感放射線性樹脂組成物
JP4655726B2 (ja) ネガ型感放射線性樹脂組成物
JP2009163080A (ja) ガラスエッチング用放射線硬化性レジスト樹脂組成物およびこれを用いたガラス基板の製造方法
EP1840654B1 (de) Strahlungsempfindliche negative Harzzusammensetzung
KR101177128B1 (ko) 층간 절연막 형성용 감방사선성 수지 조성물 및 층간절연막
KR100497445B1 (ko) 감방사선성수지조성물
JP2010026431A (ja) ネガ型感放射線性樹脂組成物

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20050920

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL LT LV MK

DAX Request for extension of the european patent (deleted)
RBV Designated contracting states (corrected)

Designated state(s): DE FR IT

A4 Supplementary search report drawn up and despatched

Effective date: 20100607

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

RIC1 Information provided on ipc code assigned before grant

Ipc: C09D 133/04 20060101ALI20100818BHEP

Ipc: G03F 7/033 20060101AFI20100818BHEP

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): DE FR IT

REF Corresponds to:

Ref document number: 602004031718

Country of ref document: DE

Date of ref document: 20110421

Kind code of ref document: P

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 602004031718

Country of ref document: DE

Effective date: 20110421

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed

Effective date: 20111212

REG Reference to a national code

Ref country code: FR

Ref legal event code: ST

Effective date: 20120210

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 602004031718

Country of ref document: DE

Effective date: 20111212

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20110509

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20190321

Year of fee payment: 16

Ref country code: IT

Payment date: 20190325

Year of fee payment: 16

REG Reference to a national code

Ref country code: DE

Ref legal event code: R119

Ref document number: 602004031718

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20201001

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20200325