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EP1443755A3 - Image pickup device and image pickup lens - Google Patents

Image pickup device and image pickup lens Download PDF

Info

Publication number
EP1443755A3
EP1443755A3 EP04010162A EP04010162A EP1443755A3 EP 1443755 A3 EP1443755 A3 EP 1443755A3 EP 04010162 A EP04010162 A EP 04010162A EP 04010162 A EP04010162 A EP 04010162A EP 1443755 A3 EP1443755 A3 EP 1443755A3
Authority
EP
European Patent Office
Prior art keywords
image pickup
section
pickup element
contact
peripheral surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP04010162A
Other languages
German (de)
French (fr)
Other versions
EP1443755A2 (en
EP1443755B1 (en
Inventor
Susumu Yamaguchi
Hiroyuki Hattori
Kazuo Tansho
Yasushi Hoshino
Yuichi Honda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Konica Minolta Opto Inc
Original Assignee
Konica Minolta Opto Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Minolta Opto Inc filed Critical Konica Minolta Opto Inc
Publication of EP1443755A2 publication Critical patent/EP1443755A2/en
Publication of EP1443755A3 publication Critical patent/EP1443755A3/en
Application granted granted Critical
Publication of EP1443755B1 publication Critical patent/EP1443755B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/022—Mountings, adjusting means, or light-tight connections, for optical elements for lenses lens and mount having complementary engagement means, e.g. screw/thread
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
    • G02B1/041—Lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0015—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design
    • G02B13/002—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface
    • G02B13/0025—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface having one lens only
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0015—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design
    • G02B13/002—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface
    • G02B13/003—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface having two lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0055—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing a special optical element
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/003—Alignment of optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/021—Mountings, adjusting means, or light-tight connections, for optical elements for lenses for more than one lens
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/026—Mountings, adjusting means, or light-tight connections, for optical elements for lenses using retaining rings or springs
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B30/00—Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Studio Devices (AREA)
  • Lens Barrels (AREA)
  • Wire Bonding (AREA)
  • Cameras In General (AREA)

Abstract

An image pickup device provided on a base board, comprises an image pickup element provided on the base board and including a photoelectrically converting section in which pixels are arranged, a peripheral surface formed around the photoelectrically converting section and a side surface crossing the peripheral surface; an optical member including a lens section to form an image of an object onto the photoelectrically converting section of the image pickup element, a leg section to support the lens section and a contact surface to be brought in contact with the image pickup element, wherein the lens section, the leg section and the contact surface are made in a single body. The optical member is mounted on the image pickup element such that the cont'act surface is brought in contact with the peripheral surface or with a surface member when the surface member is provided on the peripheral surface.
EP04010162A 2001-01-12 2002-01-07 Image pickup device and image pickup lens Expired - Lifetime EP1443755B1 (en)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
JP2001004706 2001-01-12
JP2001004706 2001-01-12
JP2001033111 2001-02-09
JP2001033111 2001-02-09
JP2001148912 2001-05-18
JP2001148912 2001-05-18
JP2001155083 2001-05-24
JP2001155083 2001-05-24
EP02250063A EP1223749B1 (en) 2001-01-12 2002-01-07 Image pickup device and image pickup lens

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
EP02250063A Division EP1223749B1 (en) 2001-01-12 2002-01-07 Image pickup device and image pickup lens

Publications (3)

Publication Number Publication Date
EP1443755A2 EP1443755A2 (en) 2004-08-04
EP1443755A3 true EP1443755A3 (en) 2005-11-16
EP1443755B1 EP1443755B1 (en) 2008-06-25

Family

ID=27481967

Family Applications (2)

Application Number Title Priority Date Filing Date
EP02250063A Expired - Lifetime EP1223749B1 (en) 2001-01-12 2002-01-07 Image pickup device and image pickup lens
EP04010162A Expired - Lifetime EP1443755B1 (en) 2001-01-12 2002-01-07 Image pickup device and image pickup lens

Family Applications Before (1)

Application Number Title Priority Date Filing Date
EP02250063A Expired - Lifetime EP1223749B1 (en) 2001-01-12 2002-01-07 Image pickup device and image pickup lens

Country Status (7)

Country Link
US (2) US7528880B2 (en)
EP (2) EP1223749B1 (en)
KR (2) KR100864557B1 (en)
CN (1) CN100473074C (en)
AT (2) ATE272922T1 (en)
DE (2) DE60227275D1 (en)
TW (1) TW523924B (en)

Families Citing this family (99)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4698874B2 (en) * 2001-04-24 2011-06-08 ローム株式会社 Image sensor module and method of manufacturing image sensor module
US7092174B2 (en) * 2001-05-18 2006-08-15 Konica Corporation Image pickup lens, image pickup apparatus and method for forming image pickup lens
TW540157B (en) * 2001-05-31 2003-07-01 Konishiroku Photo Ind CMOS image sensor
JP4061936B2 (en) * 2002-03-22 2008-03-19 コニカミノルタホールディングス株式会社 Imaging device
EP1357606A1 (en) * 2002-04-22 2003-10-29 Scientek Corporation Image sensor semiconductor package
JP2003318585A (en) * 2002-04-24 2003-11-07 Toshiba Corp Electronic device
US7127793B2 (en) * 2002-04-24 2006-10-31 Fuji Photo Film Co., Ltd. Method of producing solid state pickup device
WO2004003618A1 (en) * 2002-07-01 2004-01-08 Rohm Co., Ltd. Image sensor module
JP4397819B2 (en) * 2002-09-17 2010-01-13 アンテルヨン、ベスローテン、フェンノートシャップ CAMERA DEVICE AND METHOD FOR MANUFACTURING CAMERA DEVICE AND WAFER SCALE PACKAGE
US20040061799A1 (en) 2002-09-27 2004-04-01 Konica Corporation Image pickup device and portable terminal equipped therewith
JP3915683B2 (en) * 2002-12-05 2007-05-16 ソニー株式会社 Lens barrel and imaging device
JP2004194223A (en) * 2002-12-13 2004-07-08 Konica Minolta Holdings Inc Imaging apparatus and portable terminal
JP4300811B2 (en) * 2003-02-03 2009-07-22 コニカミノルタホールディングス株式会社 Imaging device and portable terminal
JP2004296453A (en) * 2003-02-06 2004-10-21 Sharp Corp Solid-state imaging device, semiconductor wafer, optical device module, method of manufacturing the solid-state imaging device, and method of manufacturing the optical device module
JP4204368B2 (en) * 2003-03-28 2009-01-07 シャープ株式会社 Optical device module and method of manufacturing optical device module
JP4223851B2 (en) * 2003-03-31 2009-02-12 ミツミ電機株式会社 Small camera module
FR2854496B1 (en) * 2003-04-29 2005-09-16 St Microelectronics Sa SEMICONDUCTOR HOUSING
US7453516B2 (en) * 2003-06-04 2008-11-18 Aptina Imaging Corporation Flexible camera lens barrel
EP1643282A4 (en) * 2003-07-08 2009-06-03 Konica Minolta Opto Inc Imaging device, portable terminal using the same, and image device producing method
KR100532287B1 (en) * 2003-09-17 2005-11-29 삼성전자주식회사 Partcle removing apparatus for camera module and method thereof
JP3921467B2 (en) * 2003-12-11 2007-05-30 シャープ株式会社 CAMERA MODULE, CAMERA MODULE MANUFACTURING METHOD, ELECTRONIC DEVICE, AND ELECTRONIC DEVICE MANUFACTURING METHOD
KR100617680B1 (en) * 2003-12-31 2006-08-28 삼성전자주식회사 Lens holder apparatus for camera lens module
KR100800705B1 (en) * 2004-03-26 2008-02-01 삼성전자주식회사 Device for controlling reflection wave of inputted light in camera device
TWM271321U (en) * 2004-09-10 2005-07-21 Aiptek Int Inc Flip-chip packaging device
US7486240B2 (en) * 2004-10-12 2009-02-03 Qualcomm Incorporated Devices and methods for retaining an antenna
US7133222B2 (en) * 2004-10-12 2006-11-07 Qualcomm, Inc. Devices and methods for retaining a lens in a mobile electronic device
JP2006148710A (en) * 2004-11-22 2006-06-08 Sharp Corp Imaging module and method of manufacturing the same
JP2006195331A (en) * 2005-01-17 2006-07-27 Matsushita Electric Ind Co Ltd Photographic lens
CN100520472C (en) * 2005-01-25 2009-07-29 柯尼卡美能达精密光学株式会社 Imaging device and portable terminal with the imaging device
JP2006276463A (en) * 2005-03-29 2006-10-12 Sharp Corp Module for optical device and method of manufacturing module for optical device
KR100691157B1 (en) 2005-04-07 2007-03-09 삼성전기주식회사 A camera module for focusing unadjustable type
US8085318B2 (en) * 2005-10-11 2011-12-27 Apple Inc. Real-time image capture and manipulation based on streaming data
CN100470349C (en) * 2005-06-28 2009-03-18 华硕电脑股份有限公司 Image pick-up module
JP4382030B2 (en) 2005-11-15 2009-12-09 富士通マイクロエレクトロニクス株式会社 Semiconductor device and manufacturing method thereof
US7554599B2 (en) * 2006-03-02 2009-06-30 Kingpak Technology, Inc. Image sensor module with air escape hole and a method for manufacturing the same
KR101200573B1 (en) * 2006-06-28 2012-11-13 삼성전자주식회사 Structure for mounting photographing device, and method for mounting the photographing device
JP4189769B2 (en) * 2006-10-18 2008-12-03 進展産業株式会社 Imaging device
JP5060767B2 (en) * 2006-11-06 2012-10-31 富士フイルム株式会社 Lens device
JP4923967B2 (en) * 2006-11-14 2012-04-25 凸版印刷株式会社 Solid-state imaging device and electronic apparatus
JP4339883B2 (en) * 2006-11-17 2009-10-07 オリンパスメディカルシステムズ株式会社 Imaging module, imaging lens for imaging module, and endoscope using imaging module
EP1944640A1 (en) 2007-01-11 2008-07-16 STMicroelectronics (Research & Development) Limited Lens assembly
JP2008175991A (en) 2007-01-17 2008-07-31 Fujinon Corp Optical element and optical unit
US8456560B2 (en) * 2007-01-26 2013-06-04 Digitaloptics Corporation Wafer level camera module and method of manufacture
KR100843300B1 (en) * 2007-04-12 2008-07-03 삼성전기주식회사 Camera module and method of manufacturing the same
WO2008133943A1 (en) * 2007-04-24 2008-11-06 Flextronics Ap Llc Small form factor modules using wafer level optics with bottom cavity and flip chip assembly
JP5047679B2 (en) * 2007-04-26 2012-10-10 オリンパスメディカルシステムズ株式会社 Imaging unit and method for manufacturing the imaging unit
CN101339282A (en) 2007-07-06 2009-01-07 鸿富锦精密工业（深圳）有限公司 Camera module group
US7825985B2 (en) * 2007-07-19 2010-11-02 Flextronics Ap, Llc Camera module back-focal length adjustment method and ultra compact components packaging
JP2009069588A (en) * 2007-09-14 2009-04-02 Konica Minolta Opto Inc Optical unit and imaging apparatus
US20090206431A1 (en) * 2008-02-20 2009-08-20 Micron Technology, Inc. Imager wafer level module and method of fabrication and use
EP2094000A3 (en) 2008-02-22 2013-06-05 Silicon Micro Sensors GmbH Imaging device of a camera
US9118825B2 (en) * 2008-02-22 2015-08-25 Nan Chang O-Film Optoelectronics Technology Ltd. Attachment of wafer level optics
JP5295875B2 (en) * 2008-11-06 2013-09-18 シャープ株式会社 Camera module, electronic device including the same, and lens positioning method for camera module
US8184195B2 (en) * 2009-04-01 2012-05-22 Aptina Imaging Corporation Lens shielding structures for digital image sensors
TW201104747A (en) * 2009-07-29 2011-02-01 Kingpak Tech Inc Image sensor package structure
US9419032B2 (en) 2009-08-14 2016-08-16 Nanchang O-Film Optoelectronics Technology Ltd Wafer level camera module with molded housing and method of manufacturing
CN102025899B (en) * 2009-09-11 2013-11-06 鸿富锦精密工业（深圳）有限公司 Camera module and assembling method thereof
JP5299188B2 (en) * 2009-09-16 2013-09-25 富士通株式会社 Imaging device, electronic device including the same, and manufacturing method of imaging device
KR101051533B1 (en) * 2009-09-28 2011-07-22 삼성전기주식회사 Camera module
CN102036004B (en) * 2009-09-30 2013-07-03 鸿富锦精密工业（深圳）有限公司 Imaging module
WO2011050497A1 (en) * 2009-10-30 2011-05-05 晶睿通讯股份有限公司 Photographic device
DE202009014837U1 (en) 2009-11-03 2010-02-18 Basler Ag Holding device for an optical filter element of a camera
JP5521649B2 (en) 2010-03-05 2014-06-18 株式会社リコー Imaging device and in-vehicle camera
TWI426311B (en) * 2010-04-13 2014-02-11 Himax Tech Ltd Wafer level lens module, method for forming wafer level lens module and wafer level camera
FR2965103B1 (en) * 2010-09-17 2013-06-28 Commissariat Energie Atomique OPTICAL IMAGING SYSTEM WITH IMPROVED FTM
US10009528B2 (en) 2011-02-24 2018-06-26 Nan Chang O-Film Optoelectronics Technology Ltd Autofocus camera module packaging with circuitry-integrated actuator system
US8545114B2 (en) 2011-03-11 2013-10-01 Digitaloptics Corporation Auto focus-zoom actuator or camera module contamination reduction feature with integrated protective membrane
JP5821242B2 (en) * 2011-03-31 2015-11-24 ソニー株式会社 SOLID-STATE IMAGING DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE
WO2013015929A1 (en) * 2011-07-22 2013-01-31 Alex Ning Lens mount
TW201307980A (en) * 2011-08-10 2013-02-16 Hon Hai Prec Ind Co Ltd Camera module
TW201307982A (en) * 2011-08-11 2013-02-16 Hon Hai Prec Ind Co Ltd Camera module
TW201310075A (en) * 2011-08-18 2013-03-01 Hon Hai Prec Ind Co Ltd Lens and camera module having same
CN103988062B (en) * 2011-12-14 2017-09-22 松下知识产权经营株式会社 Infrared sensor
JP5984378B2 (en) * 2011-12-22 2016-09-06 キヤノン株式会社 Imaging device
KR20130083249A (en) * 2012-01-12 2013-07-22 삼성전자주식회사 Semiconductor apparatus, image sensor package using the same
CN103293626A (en) * 2012-02-27 2013-09-11 鸿富锦精密工业（深圳）有限公司 Lens module and assembly method thereof
US20130258474A1 (en) * 2012-04-03 2013-10-03 Cheng-Ta Chen Optoelectronic device with improved lens cap
US20130270426A1 (en) * 2012-04-13 2013-10-17 Global Microptics Company Lens module
EP2653917B1 (en) * 2012-04-17 2017-02-08 Basler AG Lens adapter for cameras
JP5962235B2 (en) * 2012-06-07 2016-08-03 オムロン株式会社 Object fixing structure and optical device using the structure
US9307128B2 (en) 2012-06-26 2016-04-05 Alex Ning Lens mount
TWI534494B (en) * 2012-07-12 2016-05-21 鴻海精密工業股份有限公司 Lens module assembling platform and assembling device and method of the same
CN103543534B (en) * 2012-07-17 2017-09-26 鸿富锦精密工业（深圳）有限公司 Camera lens module assembly platform, assembling device and assemble method
JP5998962B2 (en) * 2013-01-31 2016-09-28 三菱電機株式会社 Semiconductor optical device
US20140132815A1 (en) * 2014-01-27 2014-05-15 Meizhou XiuYing Enterprise Company Limited Digital camera structure capable of selectively mounting a camera lens
KR20150116019A (en) * 2014-04-03 2015-10-15 삼성디스플레이 주식회사 Light source package and liquid crystal display device including the same
EP3226535A4 (en) 2014-11-26 2017-11-22 Panasonic Intellectual Property Management Co., Ltd. Image pickup apparatus
CN107525805A (en) * 2016-06-20 2017-12-29 亿观生物科技股份有限公司 Sample testing apparatus and pattern detection system
TWI600928B (en) * 2016-09-30 2017-10-01 光寶電子（廣州）有限公司 Filter assembly and camera module having the same
US10306114B2 (en) * 2017-02-10 2019-05-28 Google Llc Camera module mounting in an electronic device
US20180315894A1 (en) * 2017-04-26 2018-11-01 Advanced Semiconductor Engineering, Inc. Semiconductor device package and a method of manufacturing the same
US11662541B2 (en) * 2017-11-07 2023-05-30 Ams Sensors Singapore Pte. Ltd. Optoelectronic modules having locking assemblies and methods for manufacturing the same
JP7129654B2 (en) * 2018-04-04 2022-09-02 パナソニックＩｐマネジメント株式会社 Infrared detector
CN109348104B (en) * 2018-10-30 2021-01-08 维沃移动通信（杭州）有限公司 Camera module, electronic equipment and shooting method
WO2021009634A1 (en) * 2019-07-16 2021-01-21 Ricoh Company, Ltd. Capturing unit and method of manufacturing capturing unit
TWI702433B (en) 2019-07-25 2020-08-21 大立光電股份有限公司 Imaging lens assembly module, camera module and electronic device
FR3103056B1 (en) * 2019-11-08 2022-07-08 St Microelectronics Grenoble 2 Electronic device comprising a support substrate and an encapsulation cover mounted on the support substrate, and corresponding mounting method
TWI714518B (en) 2020-08-12 2020-12-21 大立光電股份有限公司 Imaging lens assembly, image capturing device and electronic device
CN114501253B (en) * 2022-01-25 2023-10-03 青岛歌尔智能传感器有限公司 Vibration sensor and electronic device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5274456A (en) * 1987-12-28 1993-12-28 Hitachi, Ltd. Semiconductor device and video camera unit using it and their manufacturing method
EP0773673A1 (en) * 1995-05-31 1997-05-14 Sony Corporation Image pickup device, method of manufacturing the device, image pickup adapter, signal processor, signal processing method, information processor, and information processing method
JPH09284617A (en) * 1995-05-31 1997-10-31 Sony Corp Image pickup device and its production, image pickup adapter device, device and method for processing signal and device and method for processing information
US5783815A (en) * 1995-10-24 1998-07-21 Sony Corporation Light receiving device having lens fitting element

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3140378A1 (en) * 1981-10-10 1983-04-28 Fa. Carl Zeiss, 7920 Heidenheim PHOTOGRAPHIC LENS WITH CHANGEABLE Focal Length
JPS59177506A (en) * 1983-03-28 1984-10-08 Olympus Optical Co Ltd Lens holder
JPS61134187A (en) * 1984-12-04 1986-06-21 Toshiba Corp Solid-state image pickup device
JPS63308375A (en) * 1987-06-10 1988-12-15 Hitachi Ltd Solid-state image sensing device
US5400072A (en) * 1988-12-23 1995-03-21 Hitachi, Ltd. Video camera unit having an airtight mounting arrangement for an image sensor chip
US5040069A (en) * 1989-06-16 1991-08-13 Fuji Photo Optical Co., Ltd. Electronic endoscope with a mask bump bonded to an image pick-up device
US5302778A (en) * 1992-08-28 1994-04-12 Eastman Kodak Company Semiconductor insulation for optical devices
JP3380949B2 (en) * 1995-10-25 2003-02-24 ソニー株式会社 Semiconductor optical device
JP3547869B2 (en) * 1995-11-07 2004-07-28 コニカミノルタホールディングス株式会社 Imaging device
JPH09312809A (en) * 1996-05-24 1997-12-02 Sony Corp Ccd chip and its formation
JPH09312808A (en) * 1996-05-24 1997-12-02 Sony Corp Ccd camera and method for positioning its ccd chip and lens
JPH10321827A (en) * 1997-05-16 1998-12-04 Sony Corp Image-pickup device and camera
KR100312495B1 (en) * 1998-07-04 2002-02-19 구자홍 Compact Diffractive Optical Lens
EP1122945A4 (en) * 1999-08-19 2004-06-23 Mitsubishi Electric Corp Image pickup device and camera
US7088397B1 (en) * 2000-11-16 2006-08-08 Avago Technologies General Ip Pte. Ltd Image sensor packaging with imaging optics
US6683298B1 (en) * 2000-11-20 2004-01-27 Agilent Technologies Inc. Image sensor packaging with package cavity sealed by the imaging optics

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5274456A (en) * 1987-12-28 1993-12-28 Hitachi, Ltd. Semiconductor device and video camera unit using it and their manufacturing method
EP0773673A1 (en) * 1995-05-31 1997-05-14 Sony Corporation Image pickup device, method of manufacturing the device, image pickup adapter, signal processor, signal processing method, information processor, and information processing method
JPH09284617A (en) * 1995-05-31 1997-10-31 Sony Corp Image pickup device and its production, image pickup adapter device, device and method for processing signal and device and method for processing information
US5783815A (en) * 1995-10-24 1998-07-21 Sony Corporation Light receiving device having lens fitting element

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EP1443755A2 (en) 2004-08-04
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ATE399437T1 (en) 2008-07-15
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US7528880B2 (en) 2009-05-05
EP1223749A1 (en) 2002-07-17
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US20080143864A1 (en) 2008-06-19
DE60200840T2 (en) 2005-08-04
CN100473074C (en) 2009-03-25
US20020131782A1 (en) 2002-09-19
US7880796B2 (en) 2011-02-01
EP1443755B1 (en) 2008-06-25
ATE272922T1 (en) 2004-08-15

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