JPH09312809A - Ccd chip and its formation - Google Patents

Abstract

PROBLEM TO BE SOLVED: To evade the influence of stress in mounting and obtain reliability and excellent precision by fixing the fitting leg part of a lens structure in contact with a position outside an effective pixel area of the step surface of a CCD chip on a substrate. SOLUTION: A solid-state image pickup element CCD chip 2 is fixed on the substrate 1, and on the peripheral surface having clearance with the effective pixel area 2a, a step surface 5 which is one stage lower is formed. Further, an abutting surface 6a to be made to abut against the step surface 5 is formed in side the fitting leg part 6 of the lens structure 4. Here, the abutting surface 6a of the lens structure 4 is positioned abutting the step surface 5, and fixed by applying an adhesive 7. Thus, the lens structure is fitted at the position outside the effective pixel area of the CCD chip and then even when stress at the time of the mounting of the lens structure or stress due to strain stress due to environmental changes after the mounting is applied, its influence does not extend to the surface of the part where the effective pixel area is provided, thereby obtaining the device which is reliable and highly precise.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a CCD chip used for a small camera or the like and a method for molding the CCD chip.

[0002]

2. Description of the Related Art In recent years, CCDs (Charge Coupled Device) have been adopted because of their small size, light weight, long life, vibration resistance, and low power consumption.
) A camera using a solid-state image sensor (commonly called "CC
"D camera" is popular. In this system, an image of a subject is formed on a CCD by a photographing lens, a signal presented by the CCD is taken out, and image processing is performed. Therefore, this CCD camera can be realized by disposing the taking lens in front of the CCD chip. In this case, although the structure is small and inexpensive, the CCD chip and the taking lens are positioned so that the taking lens is brought into contact with the surface of the CCD chip with the surface of the CCD chip as a reference. The method may be adopted.

FIG. 6 is a sectional view showing an example of the main structure of a conventional CCD camera in which a taking lens is attached with the surface of the CCD chip as a reference. In FIG. 6, C
On the substrate 51 on the CD camera side, a CCD chip 52,
A lens structure 54 having a taking lens 53 is arranged. Of these, the CCD chip 52 is fixed and mounted on the substrate 51 with an adhesive. On the other hand, in the lens structure 54, the contact surface 55 is brought into contact with the upper surface of the CCD chip 52, and the taking lens 5 is attached to the CCD chip 52.
Then, the leg portion 56 is fixed to the substrate 51 with the adhesive 57. FIG. 7 is a cross-sectional view showing an enlarged part C of FIG.

A conventional method for molding the CCD chip 52 will be described with reference to FIG. 1) First, a plurality of CCD chips 52 are regularly formed in a grid pattern on a single wafer 60 having a sheet 61 attached to the back surface thereof (step 1). The wafer 60 serves as a substrate, and a scribe line 58 for dicing is provided between the wafer 60 and each CCD chip 52.
The width S2 is prepared in the XY direction. 2) Next, with the rotary cutter 63 made of a cutting grindstone or the like, along the scribe line 58, the kerf 6 is formed in each of the XY directions.
Insert 4 (step 2). The kerf 64 is formed until it reaches the sheet 61.
0 is divided into individual CCD chips 52, and each CCD chip 52 is simply connected by the sheet 61 (step 3). 3) Next, each CCD chip 52 is peeled off from the sheet 61 (step 4). Then, each can be handled as an independent CCD chip 52. The CCD chip 52 shown in FIG. 6 is formed in this manner. The side surface of the CCD chip 52 is in a state of being cut straight at a right angle from the front surface side to the back surface side. Therefore, when the lens structure 54 is attached,
The contact surface 55 on the side of the lens structure 54 is attached to the portion outside the effective pixel area on the same plane as the surface of the CCD chip 52 on which the effective pixel area is provided.

[0005]

However, when the contact surface 55 of the lens structure 54 is processed with high precision, as shown in FIGS. 6 and 7, the contact surface 55 is formed.
Is brought into contact with the surface of the CCD chip 52 while being in surface contact, but if there is an error in processing accuracy, for example, as shown in FIG.
Also, as shown in FIG. 10, line contact occurs, and positioning is likely to be unstable. For this reason, it is necessary to strengthen the contact, but the contact surface 55 on the lens structure 54 side is strongly pushed to a portion outside the effective pixel area on the same plane as the surface of the CCD chip 52 on which the effective pixel area is provided. If it is attached in a state of being applied, stress is applied to the entire surface of the CCD chip 52 including the effective pixel area, which has a problem that the CCD chip 52 is adversely affected. In addition, there is a problem that stress is applied to the entire surface of the CCD chip 52 including the effective pixel area due to the stress at the time of mounting the component and the strain stress due to the environmental change after the mounting, which adversely affects the CCD chip 52. .

The present invention has been made in view of the above problems, and an object of the present invention is to provide a CCD chip in which stress is not applied to the chip surface including an effective pixel area, and the C chip.
It is to provide a method of forming a CD chip. Another object of the present invention is to provide a CCD chip having a structure capable of simplifying the positioning of attached parts in the XY directions.

[0007]

In order to achieve the above object, the present invention is characterized in that the following technical means is taken as a structure of a CCD chip. That is, in a CCD chip to which a component is attached with the surface as a reference, a step surface formed lower than the effective pixel area for abutting and positioning the contact surface on the component side is provided outside the effective pixel area. It is configured. According to this, CC
By utilizing the step surface of the D chip, it is possible to abut and position the component. Moreover, since this step surface is provided outside the effective pixel area and at a position lower than the effective pixel area, stress due to stress at the time of component mounting and strain stress due to environmental change after mounting is applied to this step surface. However, it does not affect the portion where the effective pixel region is provided. Further, when the step surfaces are formed in a scattered manner, the step surfaces are used to make XY in the CCD chip.
It is also possible to perform directional positioning.

In order to achieve the above object, a CCD
The method of forming the chip is characterized by taking the following technical means. That is, in the CCD chip molding method in which parts are mounted on the basis of the surface, a groove having a flat bottom surface is formed along a scribe line that divides a plurality of CCD chips formed on the wafer into individual CCD chips. And a step of making a split between the CCD chip and the CCD chip with the center of the groove as a boundary. According to this, a CCD chip having a stepped surface for abutting the abutting surface on the component side can be easily manufactured.

[0009]

1 is a sectional view showing the structure of a main part of a CCD camera shown as an example of an embodiment of the present invention. In FIG. 1, on the substrate 1 on the CCD camera side,
A CCD chip 2 of the present invention and a lens structure 4 having a taking lens 3 are arranged.

More specifically, the CCD chip 2 is fixed and mounted on the substrate 1 with an adhesive, and CC
A step surface 5 is formed on the peripheral surface of the D chip 2 where the effective pixel area is formed so as to be one step lower than the surface 2a on which the effective pixel area is formed. Are formed.

The lens structure 4 is formed with an abutting surface 6a inside the mounting leg 6 for abutting against the step surface 5 for positioning. The lens structure 4 is arranged on the substrate 1 with the contact surface 6a positioned in contact with the step surface 5, and then the adhesive 7 is applied between the mounting leg 6 and the substrate 1,
Attached by fixing. FIG. 2 shows the portion A of FIG. 1 in an enlarged manner.

That is, in this structure, the CCD chip 2
The contact surface 6a is abutted against the stepped surface 5 and positioned and attached. Moreover, since the step surface 5 is provided outside the effective pixel area and at a position lower than the surface 2a on which the effective pixel area is provided, stress when mounting the lens structure 4 on the step surface 5 is caused. Even if stress due to strain stress due to environmental changes after mounting or is added,
Since it does not affect the surface 2a of the portion where the effective pixel region is provided, it is possible to realize a device with high reliability and accuracy.

FIG. 3 is a view for explaining one method of molding the CCD chip 2 shown in FIG. Next, the above CC
A method of molding the D chip 2 will be described in order of 1) to 4) with reference to FIG. 1) First, a plurality of CCD chips 2 are prepared by regularly arranging them in a grid pattern on a single wafer 10 having a sheet 11 attached to its back surface (step 1). The wafer 10 serves as a substrate, and a portion serving as a scribe line 8 for dicing (this portion later serves as a kerf 14 and further serves as a step surface 5) has a width S1 between the wafer 10 and the CCD chip 2. It is prepared in the XY directions. 2) Next, with the rotary cutter 13 made of a cutting grindstone or the like, along the scribe line 8, the kerf 14 is formed in each of the XY directions.
(Step 2). The cutting here has the same width as the width S1 of the scribe line 8 and the depth of the wafer 10
The thickness can be stopped at about half of the thickness t of (1/2) · t. That is, the bottom surface of the kerf 14 is stopped before reaching the sheet 11. The bottom surface of the kerf 14 is made flat. 3) Next, the cracks 15 are inserted by breaking substantially the center of the bottom surface in the kerf 14 (step 3), and the sheet 11 is further extended to separate the wafers 10 (step 4). 4) Next, each CCD chip 2 is peeled off from the sheet 11 (step 5). Then, each independent CCD chip 2
Can be treated as The CCD chip 2 shown in FIG. 1 is formed in this manner. In this CCD chip 2, the kerf 14 outside the effective pixel area is lower than the surface 2a on which the effective pixel area is formed by (1/2) · t.
The step surface 5 which is the mark of is formed over the entire circumference.

In the above embodiment, the structure in which the step surface 5 of the CCD chip 2 is formed over the entire circumference of the CCD chip 2 is disclosed. For example, as a sectional view taken along the line BB of FIG. 4 and FIG. As shown in FIG. 5, with the recesses being scattered, the recesses are partially formed to provide the step surface 5, and a part 6b of the mounting leg portion 6 is engaged in the recess, When the contact surface 6a provided on 6b is brought into contact with the step surface 5 in the recess, the lens structure 4 is attached to the CCD chip 2 by the engagement of the part 6b of the mounting leg portion 6 and the recess. It can be positioned in the XY directions. Further, in the above embodiment, the case where the lens structure 4 is positioned with respect to the CCD chip 2 has been described, but a general component other than the lens structure 4 may be used.

[0015]

As described above, according to the present invention,
The parts can be brought into contact with each other by utilizing the step surface of the CCD chip. Moreover, this step surface is outside the effective pixel area,
In addition, since it is provided at a position lower than the effective pixel area, even if stress due to component mounting or strain stress due to environmental changes after mounting is applied to this step surface, the portion where the effective pixel area is provided It does not affect to. Therefore, it is possible to realize a CCD camera or the like with high reliability and accuracy. Further, if the step surfaces are formed in a scattered manner, it is expected that the step surfaces can be used to position the CCD chip in the XY directions.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a main structure of a CCD camera to which the present invention is applied.

FIG. 2 is an enlarged cross-sectional view of part A in FIG.

FIG. 3 is a process drawing explaining a method for molding a CCD chip of the present invention.

FIG. 4 is a top view showing a modified example of the CCD chip according to the present invention.

FIG. 5 is a schematic sectional view taken along the line BB of FIG. 4;

FIG. 6 is a cross-sectional view showing a main part structure in a conventional CCD camera.

FIG. 7 is an enlarged cross-sectional view of a C part of FIG.

FIG. 8 is a process chart illustrating an example of a conventional CCD chip molding method.

FIG. 9 is a diagram for explaining a problem of the conventional structure.

FIG. 10 is a diagram for explaining a problem of the conventional structure.

[Explanation of symbols]

1 substrate 2 CCD chip 2a surface on which an effective pixel area is formed 3 photographing lens 4 lens structure 5 step surface
6a contact surface 8 scribe line 10 wafer 11 sheet 13 rotary cutter 14 kerf 15 crack

Claims (7)

[Claims] 1. A CCD chip to which a component is attached on the basis of the surface, has a stepped surface formed outside the effective pixel region and lower than the effective pixel region for abutting and positioning the contact surface on the component side. A CCD chip characterized by being provided. 2. The CCD chip according to claim 1, wherein the step surface is provided at a scribe line portion during molding of the CCD chip. 3. The CCD chip according to claim 1, wherein the step surface is formed over the entire circumference. 4. The CCD chip according to claim 1, wherein the step surfaces are formed in a scattered manner. 5. The CCD chip according to claim 1, wherein the component is a lens structure of a CCD camera. 6. A method of molding a CCD chip in which parts are mounted on the basis of the surface, wherein a bottom surface is flat along a scribe line that divides a plurality of CCD chips formed on a wafer into individual CCD chips. A method of forming a CCD chip, comprising: a step of forming a groove; and a step of making a split between the CCD chip and the CCD chip with the center of the groove as a boundary to separate the groove. 7. The method of forming a CCD chip according to claim 6, wherein the groove is formed by making a line-like cut in the middle of the scribe line with a cutter.