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EP1220739B1 - Method and device for isolating plate-like substrates - Google Patents

Method and device for isolating plate-like substrates Download PDF

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Publication number
EP1220739B1
EP1220739B1 EP00972741A EP00972741A EP1220739B1 EP 1220739 B1 EP1220739 B1 EP 1220739B1 EP 00972741 A EP00972741 A EP 00972741A EP 00972741 A EP00972741 A EP 00972741A EP 1220739 B1 EP1220739 B1 EP 1220739B1
Authority
EP
European Patent Office
Prior art keywords
plate
substrate
baseplate
substrates
gripper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP00972741A
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German (de)
French (fr)
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EP1220739A1 (en
Inventor
Josef Gentischer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schmid Technology Systems GmbH
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Schmid Technology Systems GmbH
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Filing date
Publication date
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Publication of EP1220739A1 publication Critical patent/EP1220739A1/en
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Publication of EP1220739B1 publication Critical patent/EP1220739B1/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type

Definitions

  • the present invention relates to a method and a device for separating and detaching thin, fracture-sensitive disc-shaped substrates consisting of a preferably fixed on a base plate by means of gluing held substrate block have been cut, according to the The preamble of claim 1 or that of claim 8 (see e.g. JP-A-11-054462).
  • disc-shaped substrates as they are For example, be used for solar cells, one uses Substrate blocks or columns of, for example, silicon, in thin Slices are sawed.
  • the substrate block or the Substrate column adhered to a base plate and thereby there fixed. After sawing sticks each disc-shaped Substrate on its underside still on the glue line or Sides on the base plate, whose top is usually off Glass exists and has been sawn with.
  • the object of the present invention is to provide a method or to provide a device of the type mentioned, with or with such thin fragile ones disc-shaped substrates automatically and thereby damage-free individually from the sawn substrate block of the adhesive seam can be removed.
  • a preferred embodiment of the oscillating Movement results in accordance with the features of claim 2 or those of claim 11. In this way, a oscillating pivoting movement around the adhesive seam or Glue line, causing a fatigue break this adhesive seam leads. In addition, this results in a minimum limited application of force to the disk-shaped substrate even.
  • a preferred embodiment of the gripper device results by the features of claim 12.
  • adjacent disc-shaped substrates also isolated and as a result, can be detached from the base plate, if they are due to moisture, which is process-related Reasons is unavoidable, and / or in a tilted state at least partially adhere to each other.
  • the device 10 shown in the drawing serves for Separation and detachment of thin, fracture-sensitive disc-shaped substrates 11, which consist of a on a Base plate 12 fixedly held substrate block 13 cut have been.
  • a substrate block is, for example, an off Polycrystalline silicon produced silicon block, the For example, with the help of a two-component adhesive on a Glass pane part of the base plate 12 is glued.
  • aid parallel cutting wires is under supply of liquid Cutting the silicon block in individual, eg. As Cut silicon wafers serving solar wafers. This Cutting or sawing the substrate block 13 into individual thin disk-shaped substrates or wafers will be up in the a steel plate part resting glass plate part of Base plate 12 made in it.
  • the single ones disc-shaped substrates 11 are particularly in the field of Adhesive seam 15 in one of the width of the saw cut 14th appropriate distance from each other. Due to the Use of the liquid cutting agent, for example, it is possible that individual adjacent disk-shaped substrates 11 in parallel or oblique position to each other adhere to each other.
  • the disk-shaped substrates 11 have semiconductor wafers a thickness of about 0.7 to 0.8 mm and as a solar wafer one Thickness in the range of 0.2 to 0.3 mm, as well Substrate thicknesses in the range of 0.15 mm are possible.
  • the device 10 With the device 10 according to the invention, it is such thin disk-shaped substrates 11 from the adjacent to dissect disc-shaped substrate and from the Base plate 12 unbroken in an automatic way and also otherwise undamaged to replace in a simple manner and the further storage and / or processing.
  • the device 10 has a gripper device 20, which in Direction of the double arrow B oscillating back and forth is driven swivel and on the one hand the peeling the disc-shaped substrates 11 of the base plate 12 and on the other hand, the removal and continuation of the disc-shaped Substrates 11 is used.
  • the gripper device 20 is for this purpose and for biasing in the direction of arrow C1 on a Gripper holder 30 attached.
  • the gripper device 20 has a gripper plate 21, from the gripper arms 22 in a matrix-like arrangement perpendicular protrude.
  • a matrix-like arrangement of the gripper arms 22 results, for example, in a modification shown in FIG. 1 from Fig. 3.
  • the gripper arms 22 are above the gripper plate 21, whose areal dimension approximately the flat dimension of disc-shaped substrates 11 corresponds, arranged such that they are partially or pointwise essentially about the entire outer surface 16 to be grasped disc-shaped substrate 11 are distributed.
  • the gripper arms 22 have at their the gripper plate 21 facing away from free Ends sucker 23, which, as will be shown, with a Vacuum device 50 are connected.
  • the gripper plate 21 is at its base plate 12 facing away from the upper end and at her the gripper arms 22 facing away from back with a arcuate slider 24 connected in a receptacle 32nd a holder 31 of the gripper holder 30 in the direction of Double Arrows B kept kept.
  • the rear end 26 of the Slider 24 has a link opening 25 in the an eccentric 33 is immersed, which has a Eccentric axis 34 mounted on a holder 31 projecting Mounted flange 35 and a motor, not shown is driven in rotation. Due to the rotational movement of Eccentric 33, the slider 24 in the direction of Double arrow B oscillating curved back and forth, whereby the gripper plate 21 with the gripper arms 22nd is oscillated.
  • the orientation of the holder 31 is such that the imaginary extension of his Central axis 36, the adhesive seam 15 intersects. In this way is using the eccentric 33, 34, the gripper plate 21st oscillating around the adhesive seam 15 between disk-shaped Substrate 11 and base plate 12 is pivoted.
  • the holder 31 is fixed to a holder plate 37, the relative to a support web 38 according to double arrow C linear is movable.
  • the support web 38 is at a distance arranged bolt 39 fixedly connected to the holder plate 37th penetrate axially movable and at its end a Investment disc 41 own. Between the contact washer 41 and the underside of the holding plate 37 are compression springs 40th arranged.
  • the support web 38 is not shown in Way in the direction of arrow C1 upwardly movable or raised, which stroke movement connected to the holder 31 Holder plate 37, as will be shown, follow or can not follow.
  • the support web 38 is provided with a laterally projecting angle 42 connected to the down protruding end a movement detection sensor 43 is mounted, the one area between holder plate 37 and contact washer 41 of the bolt 39 opposite.
  • a Spray nozzle 45 is fixedly arranged, which in not shown Way is connected to a fluid pressure vessel and whose slot-like nozzle opening 46 in the region of Saw cut 14 between two adjacent disk-shaped Substrates 11 is directed.
  • the base plate 12 with the cut substrate block 13 in the direction of Arrows A and thus in the direction of the oscillating swivel Gripper device 20 movable toward.
  • the process or the process of separating and detaching of thin, fragile disc-shaped substrates 11 from one another or from one on the base plate 12 sticking fixedly held substrate block 13, which in the disc-shaped substrates 11 has been cut, runs as follows.
  • the base plate 12 is in the direction of arrow A so far moves until the positioning sensor 27 the correct position for Docking of the foremost disc-shaped substrate 11 to the Gripper device 20 has detected, this Positioning sensor 27 in a lower region near the Adhesive seam 15 is provided.
  • the Spray nozzle device 45 is applied, so that over the Slot mouth 46 a liquid flat stream in the Saw cut 14 between the foremost and the afterwards following disk-shaped substrate 11 is brought, wherein the liquid jet causes a possible sticking of the subsequent disk-shaped substrate 11 dissolved is, and / or that the disc-shaped to be taken Substrate (vertical) sets up.
  • With connecting the Vacuum device 50 will be the foremost one to take disc-shaped substrate 11 of the gripper arms 22nd attached suckers 23 detected.
  • the eccentric 33, 34 in operation set resulting in an oscillating pivoting movement of the Gripper device 20 results.
  • Has the oscillation oscillation a small amplitude in the range between 2 and 6 °, preferably of 3 ° at a frequency range of about 5 to 10 Hz.
  • This oscillation oscillation is applied to that of the Gripper device 20 grasped disk-shaped substrate 11th transfer.
  • the oscillation oscillation of the disk-shaped Substrate 11 takes place until cracks in the adhesive seam 15 between the disc-shaped substrate 11 and the Base plate 12 as far as the damage-free Lifting the disc-shaped substrate 11 allow.
  • the support web 38 of Gripper holder 30 slightly upwards in the direction of arrow C1 moves, wherein the holder plate 37, with the Gripper device 20 is firmly connected, in its position remains.
  • the Compressive springs 40 acted upon in the direction of arrow C1 and the Movement of the spring coils and / or the contact washer 41st is detected by the motion detection sensor 43.
  • the isolated and detached disc-shaped substrate 11 can then in a manner not shown a memory or a be fed to further processing.
  • Gripper arms 22 and their suckers 23 in a certain way wired. All suckers 23 are constantly with a Vacuum generator 51, for example. In the form of an ejector, connected. In addition to the n suckers 23 associated n ejector nozzles 51, n transducers 52 are provided with which to be evaluated can, if and which suckers 23 a corresponding surface of the associated disc-shaped substrate 11 have taken. This allows conclusions to be drawn as to whether the relevant disc-shaped substrate 11 in total or only fragmentary is available. This leaves, for example, a good / bad sorting to.
  • the suckers 23 are in two (or more) format dependent circles 53, 54 summarized and corresponding connected.
  • disk-shaped substrates 11 different outer surface or format 16 ', 16' ', 16 '' ', 16' '' 'handled and recorded. It is possible, this format-dependent circles differentiated with Apply vacuum so that it is also possible To detect fragments of disc-shaped substrates and to remove.
  • the gripper device with only one and possibly larger suction cups to equip.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Manipulator (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)

Abstract

The invention relates to a method for isolating and detaching thin, fragile, plate-like substrates (11). Said plate-like substrates (11) are cut from a substrate block (13), which is preferably mounted on a baseplate (12) by means of adhesive, are gripped at evenly distributed points on the free outer surface thereof (16) and are displaced in an oscillating manner, such that the plate-like substrates (11) are automatically and individually removed free of damage from the sawn substrate block and from the layer of adhesive.

Description

Die vorliegende Erfindung bezieht sich auf ein Verfahren und eine Einrichtung zum Vereinzeln und Ablösen von dünnen, bruchempfindlichen scheibenförmigen Substraten, die aus einem auf einer Basisplatte vorzugsweise mittels Klebung fixiert gehaltenen Substratblock geschnitten worden sind, gemäß dem Oberbegriff des Anspruchs 1 bzw. dem des Anspruchs 8 (siehe z.B. die JP-A-11-054462).The present invention relates to a method and a device for separating and detaching thin, fracture-sensitive disc-shaped substrates consisting of a preferably fixed on a base plate by means of gluing held substrate block have been cut, according to the The preamble of claim 1 or that of claim 8 (see e.g. JP-A-11-054462).

Bei der Herstellung von scheibenförmigen Substraten, wie sie bspw. für Solarzellen eingesetzt werden, verwendet man Substratblöcke oder -säulen aus bspw. Silizium, die in dünne Scheiben zersägt werden. Dazu wird der Substratblock bzw. die Substratsäule auf eine Basisplatte aufgeklebt und dadurch dort fixiert. Nach dem Aufsägen haftet jedes scheibenförmige Substrat an seiner Unterseite noch über die Klebelinie bzw. - naht auf der Basisplatte, deren Oberteil normalerweise aus Glas besteht und mit angesägt worden ist. Damit entsteht nach dem vollständigen Zerteilen des Substratblockes bzw. der Substratsäule ein kammartiges Gebilde, von dem die sehr bruchempfindlichen scheibenförmigen Substrate an der Klebestelle von Hand abgebrochen werden. Da solche scheibenförmigen Substrate sehr dünn sind, bspw. im Bereich von 0,3 mm, und auch der Sägespalt ebenfalls kaum größer ist, werden bei diesem Ablösevorgang von Hand viele Scheiben beschädigt oder zerbrocnen. Außerdem ist abhängig von der Sorgfalt beim Ablösen auch der Zeitaufwand hierfür erheblich.In the production of disc-shaped substrates, as they are For example, be used for solar cells, one uses Substrate blocks or columns of, for example, silicon, in thin Slices are sawed. For this purpose, the substrate block or the Substrate column adhered to a base plate and thereby there fixed. After sawing sticks each disc-shaped Substrate on its underside still on the glue line or Sides on the base plate, whose top is usually off Glass exists and has been sawn with. This creates after the complete division of the substrate block or the Substrate column a comb-like structure, of which the very fracture-sensitive disc-shaped substrates at the Splice to be broken off by hand. Because such disc-shaped substrates are very thin, eg. In the field of 0.3 mm, and also the crevice is also hardly larger, In this detachment process many slices are made by hand damaged or broken. It also depends on the Care when detaching the time required for this considerably.

Aufgabe der vorliegenden Erfindung ist es, ein Verfahren bzw. eine Einrichtung der eingangs genannten Art zu schaffen, mit dem bzw. mit der solche dünnen bruchempfindlichen scheibenförmigen Substrate automatisch und dabei beschädigungsfrei einzeln aus dem gesägten Substratblock von der Klebenaht abgenommen werden können.The object of the present invention is to provide a method or to provide a device of the type mentioned, with or with such thin fragile ones disc-shaped substrates automatically and thereby damage-free individually from the sawn substrate block of the adhesive seam can be removed.

Zur Lösung dieser Aufgabe sind bei einem Verfahren der genannten Art die im Anspruch 1 angegebenen Merkmale und bei einer Einrichtung der genannten Art die im Anspruch 10 angegebenen Merkmale vorgesehen.To solve this problem are in a method of mentioned type the features specified in claim 1 and in a device of the type mentioned in claim 10 specified features provided.

Durch die erfindungsgemäßen Maßnahmen ist es möglich, die dünnen bruchempfindlichen scheibenförmigen Substrate über einen wesentlichen Flächenbereich abschnittsweise zu erfassen und von der Klebenaht loszurütteln und dadurch gefahrlos abzunehmen. Eine bevorzugte Ausgestaltung der oszillierenden Bewegung ergibt sich dabei gemäß den Merkmalen des Anspruchs 2 bzw. denen des Anspruchs 11. Auf diese Weise erfolgt eine oszillierende Schwenkbewegung um die Klebenaht bzw. Klebelinie, was zu einem Ermüdungsbruch dieser Klebenaht führt. Außerdem ergibt sich dadurch eine auf ein Minimum begrenzte Kraftausübung auf das scheibenförmige Substrat selbst.By the measures according to the invention, it is possible to thin fracture-sensitive disc-shaped substrates to record a significant surface area in sections and shake off the adhesive seam and thus safe to decrease. A preferred embodiment of the oscillating Movement results in accordance with the features of claim 2 or those of claim 11. In this way, a oscillating pivoting movement around the adhesive seam or Glue line, causing a fatigue break this adhesive seam leads. In addition, this results in a minimum limited application of force to the disk-shaped substrate even.

Eine bevorzugte Ausgestaltung der Greifervorrichtung ergibt sich durch die Merkmale nach Anspruch 12.A preferred embodiment of the gripper device results by the features of claim 12.

Um den Zeitpunkt erfassen zu können, zu dem das vollständige Abnehmen bzw. Abheben des scheibenförmigen Substrats von der Basisplatte bzw. von der aufgebrochenen Klebenaht erreicht wird, sind die Merkmale gemäß Anspruch 3 bzw. die gemäß Anspruch 13 vorgesehen. Durch die auf das scheibenförmige Substrat ausgeübte Vorspannung in Richtung des Abhebens von der Basisplatte, deren Größe in jedem Falle einen Bruch des scheibenförmigen Substrats verhindert, ist der Zeitpunkt, zu dem die Klebenaht ausreichend brüchig ist, in schneller und einfacher Weise erfassbar bzw. erkennbar. Das scheibenförmige Substrat kann dann gefahrlos zur weiteren Bearbeitung und/oder Speicherung entfernt werden.To capture the time to which the full Removing or lifting the disc-shaped substrate of the Base plate or achieved by the broken adhesive seam are the features according to claim 3 or according to Claim 13 is provided. Through the on the disk-shaped Substrate applied bias in the direction of lifting off the base plate, whose size in any case a fraction of the disk-shaped substrate prevents is the time, too the adhesive seam is sufficiently brittle, in faster and easily detectable or recognizable. The disk-shaped Substrate can then safely for further processing and / or Storage will be removed.

Vorteilhafte Ausgestaltungen der Greiferhalterung ergeben sich aus den Merkmalen einzelner oder mehrerer der Ansprüche 14 bis 16.Advantageous embodiments of the gripper holder arise from the features of one or more of claims 14 to 16th

Mit den Merkmalen des Anspruchs 4 bzw. 17 ist erreicht, dass benachbarte scheibenförmige Substrate auch dann vereinzelt und infolge davon von der Basisplatte abgelöst werden können, wenn sie aufgrund von Feuchtigkeit, die aus prozesstechnischen Gründen unvermeidbar ist, und/oder in schräggestelltem Zustand zumindest teilweise aneinander haften.With the features of claim 4 or 17 it is achieved that adjacent disc-shaped substrates also isolated and as a result, can be detached from the base plate, if they are due to moisture, which is process-related Reasons is unavoidable, and / or in a tilted state at least partially adhere to each other.

Vorteilhafte Ausgestaltungen hierzu ergeben sich aus den Merkmalen einzelner oder mehrerer der Ansprüche 5, 6 bzw. 18. Um scheibenförmige Substrate unterschiedlicher Fläche bzw. Form und Größe vereinzeln und ablösen zu können, sind die Merkmale gemäß Anspruch 7 bzw. 19 vorgesehen. Auf diese Weise ist es nicht nur möglich, unterschiedliche Formatgrößen zu handhaben, sondern auch Reste abgebrochener scheibenförmiger Substrate abzulösen und abzunehmen. Entsprechendes gilt für beim Sägen des Substratblockes bzw. -säule abgelöste Scheiben.Advantageous embodiments of this result from the Features of one or more of claims 5, 6 and 18, respectively. To disk-shaped substrates of different surface or To separate and detach shape and size are the Features provided according to claim 7 or 19. In this way It is not only possible to use different format sizes handle, but also remains of broken disc-shaped Detach and remove substrates. The same applies to when sawing the substrate block or column detached slices.

Vorteilhafte Ausführungen hierzu ergeben sich aus den Merkmalen des Anspruchs 20 und/oder 21.Advantageous embodiments of this result from the Features of claim 20 and / or 21.

Mit den Merkmalen gemäß einem oder mehreren der Ansprüche 8, 9 bzw. 22, 23 ist in ablauftechnisch vorteilhafter Weise erreicht, dass die scheibenförmigen Substrate der Greifervorrichtung zugeführt und von der Greifervorrichtung aufgrund der gleichzeitig stattfindenden Vereinzelung sicher ergriffen werden können. Dabei wird die Zuführung des zu ergreifenden scheibenförmigen Substrats zur Greifervorrichtung in genauer Weise von einem Positionssensor erfasst.With the features according to one or more of claims 8, 9 or 22, 23 is in an operationally advantageous manner achieved that the disc-shaped substrates of the Gripper device supplied and from the gripper device safe due to the simultaneous separation can be taken. In this case, the supply of the gripping disc-shaped substrate to the gripper device accurately detected by a position sensor.

Weitere Einzelheiten der Erfindung sind der folgenden Beschreibung zu entnehmen, in der die Erfindung anhand des in der Zeichnung dargestellten Ausführungsbeispieles näher beschrieben und erläutert ist. Es zeigen:

Figur 1
in schematischer teilweiser aufgebrochener und geschnittener Seitenansicht eine Einrichtung zum Vereinzeln und Ablösen scheibenförmiger Substrate aus einem geschnittenen Substratblock gemäß einem bevorzugten Ausführungsbeispiel vorliegender Erfindung,
Figur 2
eine Teildraufsicht gemäß Pfeil II der Fig. 1,
Figur 3
eine Stirnansicht der Greifervorrichtung mit Saugermatrix gemäß Pfeil III der Fig. 2, gemäß einer Variante, und
Figur 4
in schematischer Darstellung eine Schaltungsanordnung für die Saugermatrix nach Fig. 3.
Further details of the invention can be found in the following description in which the invention with reference to the embodiment shown in the drawing is described and explained in more detail. Show it:
FIG. 1
in a schematic partially sectioned and sectioned side view, a device for separating and detaching disk-shaped substrates from a cut substrate block according to a preferred embodiment of the present invention,
FIG. 2
a partial plan view according to arrow II of Fig. 1,
FIG. 3
an end view of the gripper device with suction matrix according to arrow III of Fig. 2, according to a variant, and
FIG. 4
a schematic representation of a circuit arrangement for the suction matrix of FIG. 3rd

Die in der Zeichnung dargestellte Einrichtung 10 dient zum Vereinzeln und Ablösen von dünnen, bruchempfindlichen scheibenförmigen Substraten 11, die aus einem auf einer Basisplatte 12 fixiert gehaltenen Substratblock 13 geschnitten worden sind. Ein derartiger Substratblock ist bspw. ein aus polykristallinem Silizium hergestellter Siliziumblock, der bspw. mithilfe eines Zweikomponentenklebers auf ein Glasscheibenteil der Basisplatte 12 aufgeklebt ist. Mithilfe paralleler Schneiddrähte wird unter Zuführung von flüssigem Schneidmittel der Siliziumblock in einzelne, bspw. als Solarwafer dienende Siliziumscheiben geschnitten. Dieses Zerschneiden bzw. Zersägen des Substratblockes 13 in einzelne dünne scheibenförmige Substrate bzw. Wafer wird bis in den auf einem Stahlplattenteil aufliegenden Glasplattenteil der Basisplatte 12 hinein vorgenommen. Danach sind alle scheibenförmigen Substrate 11 an ihrer Unterkante auf der Basisplatte 12 bzw. deren Glasscheibenteil über eine in Fig. 1 angedeutete Klebenaht 15 fixiert gehalten. Die einzelnen scheibenförmigen Substrate 11 sind insbesondere im Bereich der Klebenaht 15 in einem der Breite des Sägeschnitts 14 entsprechenden Abstand zueinander angeordnet. Aufgrund der Verwendung des flüssigen Schneidmittels bspw. ist es möglich, dass einzelne benachbarte scheibenförmige Substrate 11 in paralleler oder schräger Lage zueinander aneinander haften. Die scheibenförmigen Substrate 11 besitzen als Halbleiterwafer eine Dicke von etwa 0,7 bis 0,8 mm und als Solarwafer eine Dicke im Bereich von 0,2 bis 0,3 mm, wobei auch Substratscheibendicken im Bereich von 0,15 mm möglich sind. Mit der erfindungsgemäßen Einrichtung 10 gilt es, derartige dünne scheibenförmige Substrate 11 vom benachbarten scheibenförmigen Substrat zu vereinzeln und von der Basisplatte 12 in automatischer Weise ungebrochen und auch ansonsten unbeschädigt in einfacher Weise abzulösen und der weiteren Lagerung und/oder Bearbeitung zuzuführen.The device 10 shown in the drawing serves for Separation and detachment of thin, fracture-sensitive disc-shaped substrates 11, which consist of a on a Base plate 12 fixedly held substrate block 13 cut have been. Such a substrate block is, for example, an off Polycrystalline silicon produced silicon block, the For example, with the help of a two-component adhesive on a Glass pane part of the base plate 12 is glued. aid parallel cutting wires is under supply of liquid Cutting the silicon block in individual, eg. As Cut silicon wafers serving solar wafers. This Cutting or sawing the substrate block 13 into individual thin disk-shaped substrates or wafers will be up in the a steel plate part resting glass plate part of Base plate 12 made in it. After that, everyone is disc-shaped substrates 11 at its lower edge on the Base plate 12 and its glass pane part via a in Fig. 1st indicated adhesive seam 15 kept fixed. The single ones disc-shaped substrates 11 are particularly in the field of Adhesive seam 15 in one of the width of the saw cut 14th appropriate distance from each other. Due to the Use of the liquid cutting agent, for example, it is possible that individual adjacent disk-shaped substrates 11 in parallel or oblique position to each other adhere to each other. The disk-shaped substrates 11 have semiconductor wafers a thickness of about 0.7 to 0.8 mm and as a solar wafer one Thickness in the range of 0.2 to 0.3 mm, as well Substrate thicknesses in the range of 0.15 mm are possible. With the device 10 according to the invention, it is such thin disk-shaped substrates 11 from the adjacent to dissect disc-shaped substrate and from the Base plate 12 unbroken in an automatic way and also otherwise undamaged to replace in a simple manner and the further storage and / or processing.

Die Einrichtung 10 besitzt eine Greifervorrichtung 20, die in Richtung des Doppelpfeiles B oszillierend hin- und herschwenkbar angetrieben ist und die zum einen dem Ablösen der scheibenförmigen Substrate 11 von der Basisplatte 12 und zum anderen dem Abnehmen und Weiterführen der scheibenförmigen Substrate 11 dient. Die Greifervorrichtung 20 ist hierzu und zur Vorspannung in Richtung des Pfeiles C1 an einer Greiferhalterung 30 befestigt.The device 10 has a gripper device 20, which in Direction of the double arrow B oscillating back and forth is driven swivel and on the one hand the peeling the disc-shaped substrates 11 of the base plate 12 and on the other hand, the removal and continuation of the disc-shaped Substrates 11 is used. The gripper device 20 is for this purpose and for biasing in the direction of arrow C1 on a Gripper holder 30 attached.

Die Greifervorrichtung 20 besitzt eine Greiferplatte 21, von der in matrixartiger Anordnung Greiferarme 22 senkrecht abstehen. Eine matrixartige Anordnung der Greiferarme 22 ergibt sich bspw. in einer zu Fig. 1 dargestellten Abwandlung aus Fig. 3. Die Greiferarme 22 sind über die Greiferplatte 21, deren flächige Abmessung etwa der flächigen Abmessung der scheibenförmigen Substrate 11 entspricht, derart angeordnet, dass sie abschnittsweise bzw. punktweise im Wesentlichen über die gesamte zu ergreifende Außenfläche 16 eines scheibenförmigen Substrats 11 verteilt sind. Die Greiferarme 22 besitzen an ihren der Greiferplatte 21 abgewandten freien Enden Sauger 23, die, wie noch zu zeigen sein wird, mit einer Vakuumvorrichtung 50 verbunden sind. Die Greiferplatte 21 ist an ihrem der Basisplatte 12 abgewandten oberen Ende und an ihrer den Greiferarmen 22 abgewandten Rückseite mit einem bogenförmigen Schieber 24 verbunden, der in einer Aufnahme 32 eines Halters 31 der Greiferhalterung 30 in Richtung des Doppelpfeiles B geführt gehalten ist. Das hintere Ende 26 des Schiebers 24 besitzt eine Kulissendurchbrechung 25, in der eine Exzenterscheibe 33 eingetaucht ist, die über eine Exzenterachse 34 an einem am Halter 31 abstehend angebrachten Flansch 35 gelagert und über einen nicht dargestellten Motor rotierend angetrieben ist. Durch die Rotationsbewegung der Exzenterscheibe 33 wird der Schieber 24 in Richtung des Doppelpfeils B oszillierend bogenförmig hin- und herbewegt, wodurch die Greiferplatte 21 mit den Greiferarmen 22 oszillierend verschwenkt wird. Die Ausrichtung des Halters 31 ist derart, dass die gedachte Verlängerung von dessen Mittelachse 36 die Klebenaht 15 schneidet. Auf diese Weise wird mithilfe des Exzenterantriebs 33, 34 die Greiferplatte 21 oszillierend um die Klebenaht 15 zwischen scheibenförmigem Substrat 11 und Basisplatte 12 verschwenkt.The gripper device 20 has a gripper plate 21, from the gripper arms 22 in a matrix-like arrangement perpendicular protrude. A matrix-like arrangement of the gripper arms 22 results, for example, in a modification shown in FIG. 1 from Fig. 3. The gripper arms 22 are above the gripper plate 21, whose areal dimension approximately the flat dimension of disc-shaped substrates 11 corresponds, arranged such that they are partially or pointwise essentially about the entire outer surface 16 to be grasped disc-shaped substrate 11 are distributed. The gripper arms 22 have at their the gripper plate 21 facing away from free Ends sucker 23, which, as will be shown, with a Vacuum device 50 are connected. The gripper plate 21 is at its base plate 12 facing away from the upper end and at her the gripper arms 22 facing away from back with a arcuate slider 24 connected in a receptacle 32nd a holder 31 of the gripper holder 30 in the direction of Double Arrows B kept kept. The rear end 26 of the Slider 24 has a link opening 25 in the an eccentric 33 is immersed, which has a Eccentric axis 34 mounted on a holder 31 projecting Mounted flange 35 and a motor, not shown is driven in rotation. Due to the rotational movement of Eccentric 33, the slider 24 in the direction of Double arrow B oscillating curved back and forth, whereby the gripper plate 21 with the gripper arms 22nd is oscillated. The orientation of the holder 31 is such that the imaginary extension of his Central axis 36, the adhesive seam 15 intersects. In this way is using the eccentric 33, 34, the gripper plate 21st oscillating around the adhesive seam 15 between disk-shaped Substrate 11 and base plate 12 is pivoted.

Der Halter 31 ist an einer Halterplatte 37 befestigt, die relativ zu einem Halterungssteg 38 gemäß Doppelpfeil C linear bewegbar ist. Hierzu ist der Halterungssteg 38 mit im Abstand angeordneten Bolzen 39 fest verbunden, die die Halterplatte 37 axial beweglich durchdringen und an ihrem Ende eine Anlagescheibe 41 besitzen. Zwischen der Anlagescheibe 41 und der Unterseite der Halteplatte 37 sind Druckfedern 40 angeordnet. Der Halterungssteg 38 ist in nicht dargestellter Weise in Richtung des Pfeiles C1 nach oben bewegbar bzw. anhebbar, welcher Hubbewegung die mit dem Halter 31 verbundene Halterplatte 37, wie noch zu zeigen sein wird, folgen oder nicht folgen kann. Der Halterungssteg 38 ist mit einem seitlich abstehenden Winkel 42 verbunden, an dessen nach unten ragendem Ende ein Bewegungserfassungssensor 43 angebracht ist, der einem Bereich zwischen Halterplatte 37 und Anlagescheibe 41 des Bolzens 39 gegenüberliegt. The holder 31 is fixed to a holder plate 37, the relative to a support web 38 according to double arrow C linear is movable. For this purpose, the support web 38 is at a distance arranged bolt 39 fixedly connected to the holder plate 37th penetrate axially movable and at its end a Investment disc 41 own. Between the contact washer 41 and the underside of the holding plate 37 are compression springs 40th arranged. The support web 38 is not shown in Way in the direction of arrow C1 upwardly movable or raised, which stroke movement connected to the holder 31 Holder plate 37, as will be shown, follow or can not follow. The support web 38 is provided with a laterally projecting angle 42 connected to the down protruding end a movement detection sensor 43 is mounted, the one area between holder plate 37 and contact washer 41 of the bolt 39 opposite.

Gemäß den Figuren 1 und 2 ist die Greifervorrichtung 20 mit einem Positionierungssensor 27 versehen, der dem jeweils zu ergreifenden scheibenförmigen Substrat 11 gegenüberliegt. Außerdem ist in einem Seitenbereich der Basisplatte 12 in einem Höhenlagenbereich knapp oberhalb der Klebenaht 15 zwischen scheibenförmigem Substrat 11 und Basisplatte 12 eine Sprühdüse 45 ortsfest angeordnet, die in nicht dargestellter Weise mit einem Flüssigkeitsdruckbehälter verbunden ist und deren schlitzartige Düsenmündung 46 in den Bereich des Sägeschnitts 14 zwischen zwei benachbarten scheibenförmigen Substraten 11 gerichtet ist. Demgegenüber ist die Basisplatte 12 mit dem geschnittenen Substratblock 13 in Richtung des Pfeiles A und damit in Richtung zur oszillierend schwenkbaren Greifervorrichtung 20 hin bewegbar.According to Figures 1 and 2, the gripper device 20 with a positioning sensor 27 provided to each opposite to the engaging disk-shaped substrate 11. In addition, in a side area of the base plate 12 in FIG an altitude range just above the adhesive seam 15th between disk-shaped substrate 11 and base plate 12 a Spray nozzle 45 is fixedly arranged, which in not shown Way is connected to a fluid pressure vessel and whose slot-like nozzle opening 46 in the region of Saw cut 14 between two adjacent disk-shaped Substrates 11 is directed. In contrast, the base plate 12 with the cut substrate block 13 in the direction of Arrows A and thus in the direction of the oscillating swivel Gripper device 20 movable toward.

Der Vorgang bzw. das Verfahren des Vereinzelns und Ablösens von dünnen, bruchempfindlichen scheibenförmigen Substraten 11 voneinander bzw. von einem auf der Basisplatte 12 klebend fixiert gehaltenen Substratblock 13, der in die scheibenförmigen Substrate 11 geschnitten worden ist, läuft folgendermaßen ab.The process or the process of separating and detaching of thin, fragile disc-shaped substrates 11 from one another or from one on the base plate 12 sticking fixedly held substrate block 13, which in the disc-shaped substrates 11 has been cut, runs as follows.

Die Basisplatte 12 wird in Richtung des Pfeils A so weit bewegt, bis der Positionierungssensor 27 die richtige Lage zum Andocken des vordersten scheibenförmigen Substrats 11 an die Greifervorrichtung 20 erkannt hat, wobei dieser Positionierungssensor 27 in einem unteren Bereich unweit der Klebenaht 15 vorgesehen ist. Gleichzeitig wird die Sprühdüsenvorrichtung 45 beaufschlagt, so dass über die Schlitzmündung 46 ein Flüssigkeitsflachstrahl in den Sägeschnitt 14 zwischen dem vordersten und dem danach folgenden scheibenförmigen Substrat 11 gebracht wird, wobei der Flüssigkeitsstrahl bewirkt, dass ein mögliches Anhaften des nachfolgenden scheibenförmigen Substrats 11 aufgelöst wird, und/oder, dass sich das zu ergreifende scheibenförmige Substrat (senkrecht) aufstellt. Mit Zuschalten der Vakuumvorrichtung 50 wird das vorderste zu ergreifende scheibenförmige Substrat 11 von den an den Greiferarmen 22 angebrachten Saugern 23 erfasst.The base plate 12 is in the direction of arrow A so far moves until the positioning sensor 27 the correct position for Docking of the foremost disc-shaped substrate 11 to the Gripper device 20 has detected, this Positioning sensor 27 in a lower region near the Adhesive seam 15 is provided. At the same time the Spray nozzle device 45 is applied, so that over the Slot mouth 46 a liquid flat stream in the Saw cut 14 between the foremost and the afterwards following disk-shaped substrate 11 is brought, wherein the liquid jet causes a possible sticking of the subsequent disk-shaped substrate 11 dissolved is, and / or that the disc-shaped to be taken Substrate (vertical) sets up. With connecting the Vacuum device 50 will be the foremost one to take disc-shaped substrate 11 of the gripper arms 22nd attached suckers 23 detected.

Daraufhin wird die Exzentervorrichtung 33, 34 in Betrieb gesetzt, wodurch sich eine oszillierende Schwenkbewegung der Greifervorrichtung 20 ergibt. Die Schwenkoszillation besitzt eine kleine Amplitude im Bereich zwischen 2 und 6°, vorzugsweise von 3° bei einem Frequenzbereich von etwa 5 bis 10 Hz. Diese Schwenkoszillation wird auf das von der Greifervorrichtung 20 ergriffene scheibenförmige Substrat 11 übertragen. Die Schwenkoszillation des scheibenförmigen Substrats 11 erfolgt so lange, bis sich Risse in der Klebenaht 15 zwischen dem scheibenförmigen Substrat 11 und der Basisplatte 12 soweit ergeben, die ein beschädigungsfreies Abheben des scheibenförmigen Substrats 11 ermöglichen.Then the eccentric 33, 34 in operation set, resulting in an oscillating pivoting movement of the Gripper device 20 results. Has the oscillation oscillation a small amplitude in the range between 2 and 6 °, preferably of 3 ° at a frequency range of about 5 to 10 Hz. This oscillation oscillation is applied to that of the Gripper device 20 grasped disk-shaped substrate 11th transfer. The oscillation oscillation of the disk-shaped Substrate 11 takes place until cracks in the adhesive seam 15 between the disc-shaped substrate 11 and the Base plate 12 as far as the damage-free Lifting the disc-shaped substrate 11 allow.

Vor bzw. während der Schwenkoszillation, jedoch nach dem Ergreifen des betreffenden scheibenförmigen Substrats 11 von der Greifervorrichtung 20 wird der Halterungssteg 38 der Greiferhalterung 30 in Richtung des Pfeiles C1 etwas nach oben bewegt, wobei die Halterplatte 37, die mit der Greifervorrichtung 20 fest verbunden ist, in ihrer Position verbleibt. Dies bedeutet eine der Federspannung entsprechende Vorspannung der Greiferhalterung 30 in Richtung des Pfeiles C1, so dass sich eine Zugbeanspruchung innerhalb der Klebenaht 15 ergibt, die jedoch nur so groß gewählt ist, dass nach wie vor ein beschädigungsfreies Handhaben des scheibenförmigen Substrats 11 gewährleistet ist. Mit der Relativbewegung zwischen Halterungssteg 38 und Halterplatte 37 werden die Druckfedern 40 in Richtung des Pfeiles C1 beaufschlagt und die Bewegung der Federwindungen und/oder die der Anlagescheibe 41 wird vom Bewegungserfassungssensor 43 erfasst.Before or during the oscillation oscillation, but after the Grasping the respective disc-shaped substrate 11 of the gripper device 20 is the support web 38 of Gripper holder 30 slightly upwards in the direction of arrow C1 moves, wherein the holder plate 37, with the Gripper device 20 is firmly connected, in its position remains. This means one of the spring tension corresponding Preload the gripper holder 30 in the direction of the arrow C1, so that a tensile stress within the adhesive seam 15 results, but which is only chosen so large that after how before damage-free handling of the disc-shaped Substrate 11 is guaranteed. With the relative movement between support web 38 and holder plate 37 are the Compressive springs 40 acted upon in the direction of arrow C1 and the Movement of the spring coils and / or the contact washer 41st is detected by the motion detection sensor 43.

Unter dieser Zugbeanspruchung wird die oszillierende Schwenk- bzw. Rüttelbewegung des scheibenförmigen Substrats 11 fortgesetzt, und zwar so lange, bis die Klebenaht 15 so weit gerissen oder zermürbt ist, dass das scheibenförmige Substrat 11 unter der genannten Vorspannung bzw. Zugkraft in Richtung des Pfeiles C1 von der Basisplatte 12 abgelöst und abgehoben wird. Die Halterplatte 37 wird in Richtung des Pfeiles C nach oben bewegt und die Druckfedern 40 werden entspannt. Dies wird vom Bewegungserfassungssensor 43 ermittelt.Under this tensile stress, the oscillating pivoting or shaking movement of the disk-shaped substrate 11 continued, until the adhesive seam 15 so far cracked or worn is that the disk-shaped substrate 11 under the said bias or tensile force in the direction of the arrow C1 detached from the base plate 12 and lifted becomes. The holder plate 37 is in the direction of arrow C after moved up and the compression springs 40 are relaxed. this will determined by the motion detection sensor 43.

Das vereinzelte und abgelöste scheibenförmige Substrat 11 kann dann in nicht dargestellter Weise einem Speicher oder einer weiteren Bearbeitung zugeführt werden.The isolated and detached disc-shaped substrate 11 can then in a manner not shown a memory or a be fed to further processing.

Gemäß den Figuren 3 und 4 ist die Matrixanordnung der Greiferarme 22 bzw. deren Sauger 23 in bestimmter Weise beschaltet. Sämtliche Sauger 23 sind ständig mit einem Vakuumerzeuger 51, bspw. in Form einer Ejektordüse, verbunden. Zusätzlich zu den den n Saugern 23 zugeordneten n Ejektordüsen 51 sind n Wandler 52 vorgesehen, mit denen ausgewertet werden kann, ob und welche Sauger 23 eine entsprechende Fläche des zugeordneten scheibenförmigen Substrats 11 ergriffen haben. Dies lässt Rückschlüsse darauf zu, ob das betreffende scheibenförmige Substrat 11 insgesamt oder nur bruchstückhaft vorhanden ist. Dies lässt bspw. auch eine Gut/Schlecht-Sortierung zu.According to Figures 3 and 4, the matrix arrangement of Gripper arms 22 and their suckers 23 in a certain way wired. All suckers 23 are constantly with a Vacuum generator 51, for example. In the form of an ejector, connected. In addition to the n suckers 23 associated n ejector nozzles 51, n transducers 52 are provided with which to be evaluated can, if and which suckers 23 a corresponding surface of the associated disc-shaped substrate 11 have taken. This allows conclusions to be drawn as to whether the relevant disc-shaped substrate 11 in total or only fragmentary is available. This leaves, for example, a good / bad sorting to.

Gemäß Fig. 3 sind die Sauger 23 in zwei (oder mehr) formatabhängige Kreise 53, 54 zusammengefasst und entsprechend verschaltet. Auf diese Weise können scheibenförmige Substrate 11 unterschiedlicher Außenfläche bzw. Formats 16', 16'', 16''', 16'''' gehandhabt und auch erfasst werden. Es ist möglich, diese formatabhängigen Kreise differenziert mit Vakuum zu beaufschlagen, so dass es auch möglich ist, Bruchstücke von scheibenförmigen Substraten zu erfassen und zu entfernen.3, the suckers 23 are in two (or more) format dependent circles 53, 54 summarized and corresponding connected. In this way, disk-shaped substrates 11 different outer surface or format 16 ', 16' ', 16 '' ', 16' '' 'handled and recorded. It is possible, this format-dependent circles differentiated with Apply vacuum so that it is also possible To detect fragments of disc-shaped substrates and to remove.

Gemäß einem nicht dargestellten Ausführungsbeispiel ist es auch möglich, die Greifervorrichtung mit nur einem und ggf. flächengrößeren Sauger zu bestücken.According to an embodiment not shown, it is also possible, the gripper device with only one and possibly larger suction cups to equip.

Claims (19)

  1. A method for isolating and detaching thin, fragile, plate-like substrates which have been cut from a substrate block mounted fixed, preferably by means of adhesive, on a baseplate, in regard to which the plate-like substrate is gripped at one or more points of its free outer surface which are spaced apart and is caused to oscillate, characterized in that the plate-like substrate is pivoted to oscillate about an axis contained within the substrate's seat on the baseplate and approximately parallel to the seating surface and, during its oscillating movement, is held biased in a direction away from the baseplate.
  2. A method according to claim 1, characterized in that adjacent plate-like substrates are isolated, preferably in the region thereof that faces the baseplate, by means of a pressure jet.
  3. A method according to claim 2, characterized in that the isolation of adjacent plate-like substrates is carried out between the plate-like substrate to be gripped and the succeeding substrate.
  4. A method according to claim 2 or 3, characterized in that a fan jet of liquid is directed into the cut slit between two adjacent plate-like substrates.
  5. A method according to at least one of the preceding claims, characterized in that the plate-like substrate is gripped by suction in a format-dependent matrix.
  6. A method according to at least one of claims 2 to 5, characterized in that the isolation of adjacent plate-like substrates and the gripping of the appropriate substrate by suction is effected at the same time.
  7. A method according to at least one of the preceding claims, characterized in that the baseplate provided with the cut substrate block is displaced by steps in order to grip the respective plate-like substrate.
  8. A device (10) for isolating and detaching thin, fragile, plate-like substrates (11) which have been cut from a substrate block (13) mounted fixed, preferably by means of adhesive, on a baseplate (12), having a gripping apparatus (20) by means of which the plate-like substrate (11) can be gripped at adjacent points of its free outer surface (16) and which is driveable to move oscillatingly, characterized in that several gripper arms (22) protrude rigidly from a gripper plate (21) of the gripping apparatus (20), in that the gripper plate (21) can be pivoted to oscillate about an axis (15) which is approximately parallel to the outer surface (16) of the gripped plate-like substrate (11) and which extends within the seating region of the plate-like substrate (11) on the baseplate (12), and in that the gripper plate (21) has an arcuate slide (24) guided in a recess (32), which slide can be moved backward and forward by a rotatingly driven eccentric apparatus (33, 34).
  9. A device according to claim 8, characterized in that the gripping apparatus (20) is joined to a gripper mounting (30) in such a way that the gripping apparatus (20) is biased in a direction lifting the plate-like substrate (11) off the baseplate (12).
  10. A device according to claim 9, characterized in that the gripper mounting (30) has a tension element (38) joined to a lifting drive, and a holding plate (37) which is relatively moveable by spring bias in opposition to the tension element (38) and on which the gripping apparatus (20) is mounted.
  11. A device according to claim 8 and 10, characterized in that a lever arm (31) is fastened to the relatively moveable holding plate (37), which lever arm has a recess (32) for guidance of the arcuate slide (24) of the gripping apparatus (20).
  12. A device according to at least one of claims 9 to 11, characterized in that a sensor (43) is provided on the gripper mounting (30) for the purpose of recording the relative movement between the tension element (38) and the holding plate (37).
  13. A device according to at least one of claims 8 to 12, characterized in that a pressure-jet nozzle (45) is provided disposed on one side of the baseplate (12) adjacent to the seat (15) of the plate-like substrate (11) on the baseplate (12) and directed between two adjoining plate-like substrates (11), the pressure-jet nozzle (45) and the baseplate (12) being displaceable in relation to one another along the substrate block (13).
  14. A device according to claim 13, characterized in that the pressure-jet nozzle (45) has as slit-like outlet (46).
  15. A device according to at least one of claims 8 to 14, characterized in that the gripper arms (22) of the gripping apparatus (20) are provided with suction cups (23) which are arranged in a matrix and can be controlled as a function of format.
  16. A device according to claim 15, characterized in that the suction-cup matrix is subdivided into several switching circuits.
  17. A device according to claim 15 or 16, characterized in that a vacuum generator (51) and a transducer (52) to record the applied vacuum is associated with each suction cup (23).
  18. A device according to at least one of claims 8 to 17, characterized in that the pressure-jet nozzle (45) is stationary and the baseplate (12) can be displaced stepwise towards the gripping apparatus (20).
  19. A device according to at least one of claims 8 to 18, characterized in that a positioning sensor (27) for the substrate block (13) is provided in the region of the gripping apparatus (20).
EP00972741A 1999-10-16 2000-10-12 Method and device for isolating plate-like substrates Expired - Lifetime EP1220739B1 (en)

Applications Claiming Priority (3)

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DE19950068 1999-10-16
DE19950068A DE19950068B4 (en) 1999-10-16 1999-10-16 Method and device for separating and detaching substrate disks
PCT/EP2000/010036 WO2001028745A1 (en) 1999-10-16 2000-10-12 Method and device for isolating plate-like substrates

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EP1220739A1 EP1220739A1 (en) 2002-07-10
EP1220739B1 true EP1220739B1 (en) 2005-04-27

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JP (1) JP4731077B2 (en)
CN (1) CN1160177C (en)
AT (1) ATE294056T1 (en)
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DE (2) DE19950068B4 (en)
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ES2240189T3 (en) 2005-10-16
AU1136801A (en) 2001-04-30
CN1379708A (en) 2002-11-13
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DE19950068A1 (en) 2001-04-26
ATE294056T1 (en) 2005-05-15
WO2001028745A1 (en) 2001-04-26
DE50010186D1 (en) 2005-06-02
AU777067B2 (en) 2004-09-30
DE19950068B4 (en) 2006-03-02
CN1160177C (en) 2004-08-04
JP2003512196A (en) 2003-04-02
JP4731077B2 (en) 2011-07-20

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