[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

EP0884783A3 - A micromagnetic device for power processing applications and method of manufacture therefor - Google Patents

A micromagnetic device for power processing applications and method of manufacture therefor Download PDF

Info

Publication number
EP0884783A3
EP0884783A3 EP98304525A EP98304525A EP0884783A3 EP 0884783 A3 EP0884783 A3 EP 0884783A3 EP 98304525 A EP98304525 A EP 98304525A EP 98304525 A EP98304525 A EP 98304525A EP 0884783 A3 EP0884783 A3 EP 0884783A3
Authority
EP
European Patent Office
Prior art keywords
power processing
manufacture therefor
processing applications
micromagnetic device
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP98304525A
Other languages
German (de)
French (fr)
Other versions
EP0884783A2 (en
Inventor
Dean Paul Kossives
Ashraf Wagih Lotfi
Lynn Frances Schneemeyer
Michael Louis Steigerwald
Robert Bruce Van Dover
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nokia of America Corp
Original Assignee
Lucent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lucent Technologies Inc filed Critical Lucent Technologies Inc
Publication of EP0884783A2 publication Critical patent/EP0884783A2/en
Publication of EP0884783A3 publication Critical patent/EP0884783A3/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/645—Inductive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/80—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors
    • H10D86/85—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors characterised by only passive components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/642—Capacitive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Hall/Mr Elements (AREA)
  • Thin Magnetic Films (AREA)

Abstract

The present invention provides a power micromagnetic integrated circuit (400) having a ferromagnetic core (490), a method of manufacture therefor, and a power processing circuit employing the same, that includes: a substrate (410), an insulator (430) coupled to the substrate, and a metallic adhesive (480,485) that forms a bond between the insulator (430) and the ferromagnetic core (490) to secure the ferromagnetic core to the substrate.
EP98304525A 1997-06-10 1998-06-09 A micromagnetic device for power processing applications and method of manufacture therefor Withdrawn EP0884783A3 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/872,250 US6118351A (en) 1997-06-10 1997-06-10 Micromagnetic device for power processing applications and method of manufacture therefor
US872250 1997-06-10

Publications (2)

Publication Number Publication Date
EP0884783A2 EP0884783A2 (en) 1998-12-16
EP0884783A3 true EP0884783A3 (en) 1999-08-18

Family

ID=25359170

Family Applications (1)

Application Number Title Priority Date Filing Date
EP98304525A Withdrawn EP0884783A3 (en) 1997-06-10 1998-06-09 A micromagnetic device for power processing applications and method of manufacture therefor

Country Status (8)

Country Link
US (4) US6118351A (en)
EP (1) EP0884783A3 (en)
JP (1) JPH1174126A (en)
KR (1) KR100305070B1 (en)
CN (1) CN1203446A (en)
CA (1) CA2237819C (en)
SG (1) SG64491A1 (en)
TW (1) TW373196B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8178435B2 (en) 1998-12-21 2012-05-15 Megica Corporation High performance system-on-chip inductor using post passivation process
US8421158B2 (en) 1998-12-21 2013-04-16 Megica Corporation Chip structure with a passive device and method for forming the same

Families Citing this family (124)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4442994A1 (en) * 1994-12-02 1996-06-05 Philips Patentverwaltung Planar inductance
US6440750B1 (en) * 1997-06-10 2002-08-27 Agere Systems Guardian Corporation Method of making integrated circuit having a micromagnetic device
US6118351A (en) * 1997-06-10 2000-09-12 Lucent Technologies Inc. Micromagnetic device for power processing applications and method of manufacture therefor
DE69930134T2 (en) * 1998-09-17 2006-12-21 Koninklijke Philips Electronics N.V. METHOD FOR PRODUCING A SEMICONDUCTOR BODY AT THE SURFACE OF WHICH IS A COIL WITH A MAGNETIC CORE
US6303423B1 (en) * 1998-12-21 2001-10-16 Megic Corporation Method for forming high performance system-on-chip using post passivation process
US6255714B1 (en) * 1999-06-22 2001-07-03 Agere Systems Guardian Corporation Integrated circuit having a micromagnetic device including a ferromagnetic core and method of manufacture therefor
US6563721B1 (en) * 1999-11-10 2003-05-13 Thomas & Betts International, Inc. Power supply with multiple AC input voltages
US6870456B2 (en) 1999-11-23 2005-03-22 Intel Corporation Integrated transformer
US6891461B2 (en) 1999-11-23 2005-05-10 Intel Corporation Integrated transformer
US6815220B2 (en) 1999-11-23 2004-11-09 Intel Corporation Magnetic layer processing
US6856228B2 (en) 1999-11-23 2005-02-15 Intel Corporation Integrated inductor
US6452247B1 (en) 1999-11-23 2002-09-17 Intel Corporation Inductor for integrated circuit
US6342778B1 (en) * 2000-04-20 2002-01-29 Robert James Catalano Low profile, surface mount magnetic devices
US6597593B1 (en) 2000-07-12 2003-07-22 Sun Microsystems, Inc. Powering IC chips using AC signals
KR100403918B1 (en) * 2001-05-29 2003-10-30 타임스페이스시스템(주) Timepiece Having Lunar Calender
US6759275B1 (en) 2001-09-04 2004-07-06 Megic Corporation Method for making high-performance RF integrated circuits
KR100590525B1 (en) * 2003-01-15 2006-06-15 삼성전자주식회사 Inkjet printheads and ink ejection methods
US7852185B2 (en) 2003-05-05 2010-12-14 Intel Corporation On-die micro-transformer structures with magnetic materials
US8253196B2 (en) 2004-01-29 2012-08-28 Enpirion, Inc. Integrated circuit with a laterally diffused metal oxide semiconductor device and method of forming the same
US7330017B2 (en) * 2004-01-29 2008-02-12 Enpirion, Inc. Driver for a power converter and a method of driving a switch thereof
US8212317B2 (en) 2004-01-29 2012-07-03 Enpirion, Inc. Integrated circuit with a laterally diffused metal oxide semiconductor device and method of forming the same
US7019505B2 (en) * 2004-01-29 2006-03-28 Enpirion, Inc. Digital controller for a power converter employing selectable phases of a clock signal
US8253195B2 (en) 2004-01-29 2012-08-28 Enpirion, Inc. Integrated circuit with a laterally diffused metal oxide semiconductor device and method of forming the same
US8212315B2 (en) 2004-01-29 2012-07-03 Enpirion, Inc. Integrated circuit with a laterally diffused metal oxide semiconductor device and method of forming the same
US8212316B2 (en) 2004-01-29 2012-07-03 Enpirion, Inc. Integrated circuit with a laterally diffused metal oxide semiconductor device and method of forming the same
US8253197B2 (en) 2004-01-29 2012-08-28 Enpirion, Inc. Integrated circuit with a laterally diffused metal oxide semiconductor device and method of forming the same
US7230302B2 (en) * 2004-01-29 2007-06-12 Enpirion, Inc. Laterally diffused metal oxide semiconductor device and method of forming the same
US7038438B2 (en) * 2004-01-29 2006-05-02 Enpirion, Inc. Controller for a power converter and a method of controlling a switch thereof
US7195981B2 (en) * 2004-08-23 2007-03-27 Enpirion, Inc. Method of forming an integrated circuit employable with a power converter
US7186606B2 (en) * 2004-08-23 2007-03-06 Enpirion, Inc. Method of forming an integrated circuit employable with a power converter
US7214985B2 (en) * 2004-08-23 2007-05-08 Enpirion, Inc. Integrated circuit incorporating higher voltage devices and low voltage devices therein
US7335948B2 (en) * 2004-08-23 2008-02-26 Enpirion, Inc. Integrated circuit incorporating higher voltage devices and low voltage devices therein
US7229886B2 (en) * 2004-08-23 2007-06-12 Enpirion, Inc. Method of forming an integrated circuit incorporating higher voltage devices and low voltage devices therein
US7190026B2 (en) * 2004-08-23 2007-03-13 Enpirion, Inc. Integrated circuit employable with a power converter
US7015544B2 (en) 2004-08-23 2006-03-21 Enpirion, Inc. Intergrated circuit employable with a power converter
US7232733B2 (en) * 2004-08-23 2007-06-19 Enpirion, Inc. Method of forming an integrated circuit incorporating higher voltage devices and low voltage devices therein
US7355282B2 (en) 2004-09-09 2008-04-08 Megica Corporation Post passivation interconnection process and structures
US8008775B2 (en) 2004-09-09 2011-08-30 Megica Corporation Post passivation interconnection structures
US7256674B2 (en) * 2004-11-10 2007-08-14 Enpirion, Inc. Power module
US7276998B2 (en) * 2004-11-10 2007-10-02 Enpirion, Inc. Encapsulated package for a magnetic device
US7180395B2 (en) * 2004-11-10 2007-02-20 Enpirion, Inc. Encapsulated package for a magnetic device
US7462317B2 (en) * 2004-11-10 2008-12-09 Enpirion, Inc. Method of manufacturing an encapsulated package for a magnetic device
US7426780B2 (en) 2004-11-10 2008-09-23 Enpirion, Inc. Method of manufacturing a power module
US8384189B2 (en) * 2005-03-29 2013-02-26 Megica Corporation High performance system-on-chip using post passivation process
US8134548B2 (en) 2005-06-30 2012-03-13 Micron Technology, Inc. DC-DC converter switching transistor current measurement technique
CN1901162B (en) 2005-07-22 2011-04-20 米辑电子股份有限公司 Method for manufacturing circuit assembly by continuous electroplating and circuit assembly structure
US8139362B2 (en) 2005-10-05 2012-03-20 Enpirion, Inc. Power module with a magnetic device having a conductive clip
US8701272B2 (en) 2005-10-05 2014-04-22 Enpirion, Inc. Method of forming a power module with a magnetic device having a conductive clip
US7688172B2 (en) * 2005-10-05 2010-03-30 Enpirion, Inc. Magnetic device having a conductive clip
US8631560B2 (en) 2005-10-05 2014-01-21 Enpirion, Inc. Method of forming a magnetic device having a conductive clip
US7521907B2 (en) * 2006-03-06 2009-04-21 Enpirion, Inc. Controller for a power converter and method of operating the same
US7893676B2 (en) * 2006-07-20 2011-02-22 Enpirion, Inc. Driver for switch and a method of driving the same
US7948280B2 (en) * 2006-10-20 2011-05-24 Enpirion, Inc. Controller including a sawtooth generator and method of operating the same
US9197132B2 (en) 2006-12-01 2015-11-24 Flextronics International Usa, Inc. Power converter with an adaptive controller and method of operating the same
US7675759B2 (en) 2006-12-01 2010-03-09 Flextronics International Usa, Inc. Power system with power converters having an adaptive controller
US7468649B2 (en) 2007-03-14 2008-12-23 Flextronics International Usa, Inc. Isolated power converter
JP5045219B2 (en) * 2007-04-27 2012-10-10 富士電機株式会社 Manufacturing method of microtransformer
US8106739B2 (en) * 2007-06-12 2012-01-31 Advanced Magnetic Solutions United Magnetic induction devices and methods for producing them
US7920042B2 (en) 2007-09-10 2011-04-05 Enpirion, Inc. Micromagnetic device and method of forming the same
US8133529B2 (en) 2007-09-10 2012-03-13 Enpirion, Inc. Method of forming a micromagnetic device
US7544995B2 (en) * 2007-09-10 2009-06-09 Enpirion, Inc. Power converter employing a micromagnetic device
US7952459B2 (en) * 2007-09-10 2011-05-31 Enpirion, Inc. Micromagnetic device and method of forming the same
US7955868B2 (en) 2007-09-10 2011-06-07 Enpirion, Inc. Method of forming a micromagnetic device
US8018315B2 (en) 2007-09-10 2011-09-13 Enpirion, Inc. Power converter employing a micromagnetic device
US7876080B2 (en) * 2007-12-27 2011-01-25 Enpirion, Inc. Power converter with monotonic turn-on for pre-charged output capacitor
US7795700B2 (en) * 2008-02-28 2010-09-14 Broadcom Corporation Inductively coupled integrated circuit with magnetic communication path and methods for use therewith
US9246390B2 (en) 2008-04-16 2016-01-26 Enpirion, Inc. Power converter with controller operable in selected modes of operation
US8692532B2 (en) 2008-04-16 2014-04-08 Enpirion, Inc. Power converter with controller operable in selected modes of operation
US8686698B2 (en) 2008-04-16 2014-04-01 Enpirion, Inc. Power converter with controller operable in selected modes of operation
US8541991B2 (en) * 2008-04-16 2013-09-24 Enpirion, Inc. Power converter with controller operable in selected modes of operation
US7679342B2 (en) * 2008-04-16 2010-03-16 Enpirion, Inc. Power converter with power switch operable in controlled current mode
US8410769B2 (en) * 2008-04-16 2013-04-02 Enpirion, Inc. Power converter with controller operable in selected modes of operation
US8339802B2 (en) 2008-10-02 2012-12-25 Enpirion, Inc. Module having a stacked magnetic device and semiconductor device and method of forming the same
US8266793B2 (en) 2008-10-02 2012-09-18 Enpirion, Inc. Module having a stacked magnetic device and semiconductor device and method of forming the same
US8153473B2 (en) 2008-10-02 2012-04-10 Empirion, Inc. Module having a stacked passive element and method of forming the same
US9054086B2 (en) 2008-10-02 2015-06-09 Enpirion, Inc. Module having a stacked passive element and method of forming the same
US8488355B2 (en) 2008-11-14 2013-07-16 Power Systems Technologies, Ltd. Driver for a synchronous rectifier and power converter employing the same
US9548714B2 (en) 2008-12-29 2017-01-17 Altera Corporation Power converter with a dynamically configurable controller and output filter
US8698463B2 (en) 2008-12-29 2014-04-15 Enpirion, Inc. Power converter with a dynamically configurable controller based on a power conversion mode
WO2010083514A1 (en) 2009-01-19 2010-07-22 Flextronics International Usa, Inc. Controller for a power converter
WO2010083511A1 (en) 2009-01-19 2010-07-22 Flextronics International Usa, Inc. Controller for a power converter
WO2010114914A1 (en) 2009-03-31 2010-10-07 Flextronics International Usa, Inc. Magnetic device formed with u-shaped core pieces and power converter employing the same
US8643222B2 (en) 2009-06-17 2014-02-04 Power Systems Technologies Ltd Power adapter employing a power reducer
US8514593B2 (en) * 2009-06-17 2013-08-20 Power Systems Technologies, Ltd. Power converter employing a variable switching frequency and a magnetic device with a non-uniform gap
US9077248B2 (en) 2009-06-17 2015-07-07 Power Systems Technologies Ltd Start-up circuit for a power adapter
US8638578B2 (en) 2009-08-14 2014-01-28 Power System Technologies, Ltd. Power converter including a charge pump employable in a power adapter
US8976549B2 (en) 2009-12-03 2015-03-10 Power Systems Technologies, Ltd. Startup circuit including first and second Schmitt triggers and power converter employing the same
US8520420B2 (en) 2009-12-18 2013-08-27 Power Systems Technologies, Ltd. Controller for modifying dead time between switches in a power converter
US8787043B2 (en) 2010-01-22 2014-07-22 Power Systems Technologies, Ltd. Controller for a power converter and method of operating the same
US9246391B2 (en) 2010-01-22 2016-01-26 Power Systems Technologies Ltd. Controller for providing a corrected signal to a sensed peak current through a circuit element of a power converter
US8767418B2 (en) 2010-03-17 2014-07-01 Power Systems Technologies Ltd. Control system for a power converter and method of operating the same
US8130067B2 (en) * 2010-05-11 2012-03-06 Texas Instruments Incorporated High frequency semiconductor transformer
US8867295B2 (en) 2010-12-17 2014-10-21 Enpirion, Inc. Power converter for a memory module
US8792257B2 (en) 2011-03-25 2014-07-29 Power Systems Technologies, Ltd. Power converter with reduced power dissipation
US8792256B2 (en) 2012-01-27 2014-07-29 Power Systems Technologies Ltd. Controller for a switch and method of operating the same
US9190898B2 (en) 2012-07-06 2015-11-17 Power Systems Technologies, Ltd Controller for a power converter and method of operating the same
US9214264B2 (en) 2012-07-16 2015-12-15 Power Systems Technologies, Ltd. Magnetic device and power converter employing the same
US9379629B2 (en) 2012-07-16 2016-06-28 Power Systems Technologies, Ltd. Magnetic device and power converter employing the same
US9099232B2 (en) 2012-07-16 2015-08-04 Power Systems Technologies Ltd. Magnetic device and power converter employing the same
US9106130B2 (en) 2012-07-16 2015-08-11 Power Systems Technologies, Inc. Magnetic device and power converter employing the same
US10244633B2 (en) 2012-09-11 2019-03-26 Ferric Inc. Integrated switched inductor power converter
US11197374B2 (en) 2012-09-11 2021-12-07 Ferric Inc. Integrated switched inductor power converter having first and second powertrain phases
US11064610B2 (en) 2012-09-11 2021-07-13 Ferric Inc. Laminated magnetic core inductor with insulating and interface layers
US11116081B2 (en) 2012-09-11 2021-09-07 Ferric Inc. Laminated magnetic core inductor with magnetic flux closure path parallel to easy axes of magnetization of magnetic layers
US11058001B2 (en) 2012-09-11 2021-07-06 Ferric Inc. Integrated circuit with laminated magnetic core inductor and magnetic flux closure layer
US10893609B2 (en) 2012-09-11 2021-01-12 Ferric Inc. Integrated circuit with laminated magnetic core inductor including a ferromagnetic alloy
US9844141B2 (en) * 2012-09-11 2017-12-12 Ferric, Inc. Magnetic core inductor integrated with multilevel wiring network
EP2738807A3 (en) 2012-11-30 2017-01-11 Enpirion, Inc. An apparatus including a semiconductor device coupled to a decoupling device
US9240712B2 (en) 2012-12-13 2016-01-19 Power Systems Technologies Ltd. Controller including a common current-sense device for power switches of a power converter
US9300206B2 (en) 2013-11-15 2016-03-29 Power Systems Technologies Ltd. Method for estimating power of a power converter
US9536938B1 (en) 2013-11-27 2017-01-03 Altera Corporation Semiconductor device including a resistor metallic layer and method of forming the same
US10020739B2 (en) 2014-03-27 2018-07-10 Altera Corporation Integrated current replicator and method of operating the same
US9673192B1 (en) 2013-11-27 2017-06-06 Altera Corporation Semiconductor device including a resistor metallic layer and method of forming the same
US9647053B2 (en) 2013-12-16 2017-05-09 Ferric Inc. Systems and methods for integrated multi-layer magnetic films
US10629357B2 (en) 2014-06-23 2020-04-21 Ferric Inc. Apparatus and methods for magnetic core inductors with biased permeability
US11302469B2 (en) 2014-06-23 2022-04-12 Ferric Inc. Method for fabricating inductors with deposition-induced magnetically-anisotropic cores
US10103627B2 (en) 2015-02-26 2018-10-16 Altera Corporation Packaged integrated circuit including a switch-mode regulator and method of forming the same
US9509217B2 (en) 2015-04-20 2016-11-29 Altera Corporation Asymmetric power flow controller for a power converter and method of operating the same
JP6582183B2 (en) * 2015-09-03 2019-10-02 ローム株式会社 Magnetic device and power module
US20180061569A1 (en) * 2016-08-26 2018-03-01 Analog Devices Global Methods of manufacture of an inductive component and an inductive component
US11404197B2 (en) 2017-06-09 2022-08-02 Analog Devices Global Unlimited Company Via for magnetic core of inductive component
US10892230B2 (en) * 2018-07-30 2021-01-12 Taiwan Semiconductor Manufacturing Co., Ltd. Magnetic shielding material with insulator-coated ferromagnetic particles
CN112967879B (en) * 2021-02-01 2022-12-06 新昌县新明实业有限公司 Forming processing technology for insulating material electroceramic of transformer
US12125713B2 (en) 2022-03-22 2024-10-22 Ferric Inc. Method for manufacturing ferromagnetic-dielectric composite material

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0618595A1 (en) * 1993-04-01 1994-10-05 General Electric Company Magnetic and electromagnetic circuit components having embedded magnetic material in a high density interconnect structure

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1374626A (en) 1970-10-30 1974-11-20 Matsushita Electronics Corp Method of making a semiconductor device
US3873944A (en) * 1973-03-01 1975-03-25 Varian Associates Bonding of ferrite to metal for high-power microwave applications
US4016050A (en) * 1975-05-12 1977-04-05 Bell Telephone Laboratories, Incorporated Conduction system for thin film and hybrid integrated circuits
US4740657A (en) * 1986-02-14 1988-04-26 Hitachi, Chemical Company, Ltd Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained
JP2559700B2 (en) 1986-03-18 1996-12-04 富士通株式会社 Method for manufacturing semiconductor device
JPS6453324A (en) * 1987-08-24 1989-03-01 Matsushita Electric Ind Co Ltd Magnetic recording medium
US4939610A (en) * 1987-10-05 1990-07-03 Hitachi, Ltd. Thin film magnetic head having magnetic core including a thin film of cobalt alloy
JP2501873B2 (en) * 1988-06-23 1996-05-29 シャープ株式会社 Method of manufacturing thin film magnetic head
US4853080A (en) 1988-12-14 1989-08-01 Hewlett-Packard Lift-off process for patterning shields in thin magnetic recording heads
US5037517A (en) 1989-02-17 1991-08-06 Vac-Tec Systems, Inc. Method of forming layered structure for adhering gold to a substrate
US5276763A (en) 1990-07-09 1994-01-04 Heraeus Quarzglas Gmbh Infrared radiator with protected reflective coating and method for manufacturing same
EP0575280A3 (en) 1992-06-18 1995-10-04 Ibm Cmos transistor with two-layer inverse-t tungsten gate structure
US5312674A (en) * 1992-07-31 1994-05-17 Hughes Aircraft Company Low-temperature-cofired-ceramic (LTCC) tape structures including cofired ferromagnetic elements, drop-in components and multi-layer transformer
US5587130A (en) * 1993-03-15 1996-12-24 Arizona Board Of Regents Selected area adhesion and surface passivation of metal films
US5667884A (en) * 1993-04-12 1997-09-16 Bolger; Justin C. Area bonding conductive adhesive preforms
JPH0766033A (en) * 1993-08-30 1995-03-10 Mitsubishi Electric Corp Magnetoresistance element, and magnetic thin film memory and magnetoresistance sensor using the magnetoresistance element
KR950012334A (en) * 1993-10-29 1995-05-16 윌리엄 티. 엘리스 How to protect the magnetoresistive head assembly and magnetoresistive head from electrostatic discharge
US5512818A (en) * 1994-03-31 1996-04-30 At&T Corp. Voltage proportional replication device using magnetoresistive sensing elements
EP0681319B1 (en) * 1994-04-15 2002-10-30 Kabushiki Kaisha Toshiba Semiconductor device and method of manufacturing the same
EP0689214B1 (en) * 1994-06-21 1999-09-22 Sumitomo Special Metals Co., Ltd. Process of producing a multi-layered printed-coil substrate
US5631509A (en) * 1994-07-27 1997-05-20 General Electric Company Motor having thermostatically controlled or limited space heater
EP0734075B1 (en) 1994-10-06 2009-06-17 Kanegafuchi Kagaku Kogyo Kabushiki Kaisha Thin film solar cell
US5635892A (en) * 1994-12-06 1997-06-03 Lucent Technologies Inc. High Q integrated inductor
JP3549294B2 (en) 1995-08-23 2004-08-04 新光電気工業株式会社 Semiconductor device and its mounting structure
DE19606101A1 (en) 1996-02-19 1997-08-21 Siemens Ag Semiconductor body with solder material layer
US5659462A (en) * 1996-04-12 1997-08-19 Lucent Technologies Inc. Encapsulated, integrated power magnetic device and method of manufacture therefor
US6057237A (en) 1997-04-29 2000-05-02 Applied Materials, Inc. Tantalum-containing barrier layers for copper
US6118351A (en) * 1997-06-10 2000-09-12 Lucent Technologies Inc. Micromagnetic device for power processing applications and method of manufacture therefor
US5925827A (en) * 1997-09-25 1999-07-20 Lucent Technologies Inc. System and method for empirically determining shrinkage stresses in a molded package and power module employing the same
US6055179A (en) * 1998-05-19 2000-04-25 Canon Kk Memory device utilizing giant magnetoresistance effect

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0618595A1 (en) * 1993-04-01 1994-10-05 General Electric Company Magnetic and electromagnetic circuit components having embedded magnetic material in a high density interconnect structure

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8178435B2 (en) 1998-12-21 2012-05-15 Megica Corporation High performance system-on-chip inductor using post passivation process
US8421158B2 (en) 1998-12-21 2013-04-16 Megica Corporation Chip structure with a passive device and method for forming the same

Also Published As

Publication number Publication date
US7021518B2 (en) 2006-04-04
SG64491A1 (en) 1999-04-27
CA2237819A1 (en) 1998-12-10
US6163234A (en) 2000-12-19
KR100305070B1 (en) 2001-11-02
US20030150898A1 (en) 2003-08-14
JPH1174126A (en) 1999-03-16
KR19990006843A (en) 1999-01-25
US6118351A (en) 2000-09-12
CA2237819C (en) 2001-02-13
EP0884783A2 (en) 1998-12-16
TW373196B (en) 1999-11-01
CN1203446A (en) 1998-12-30
US6160721A (en) 2000-12-12

Similar Documents

Publication Publication Date Title
EP0884783A3 (en) A micromagnetic device for power processing applications and method of manufacture therefor
EP0403992A3 (en) Chip carrier package and method of manufacture
EP1288975A3 (en) Magnetic device, method for manufacturing the same and power supply module equipped with the same
KR20010012977A (en) Semiconductor device and method for manufacturing the same, circuit substrate, and electronic device
HK1012521A1 (en) Method of assembling an adhesively bonded electronic device using a deformable substrate
AU2491597A (en) Method of wire bonding an integrated circuit to an ultraflexible substrate
EP1094329A3 (en) Magnetic element with improved field response and fabricative method thereof
EP0975072A3 (en) Apparatus with an optical functional device having a special wiring electrode and method for fabricating the same
TW358992B (en) Semiconductor device and method of fabricating the same
AU6000699A (en) Semiconductor device, method of manufacture thereof, and electronic device
EP1073071A3 (en) Magnetic multilayer
EP0810655A3 (en) A package for a semiconductor device
EP0773584A3 (en) Device having resin package and method of producing the same
AU7680498A (en) Integrated circuit, components thereof and manufacturing method
AU5495998A (en) Electronic component, semiconductor device, manufacturing method therefor, circuit board and electronic equipment
EP0821407A3 (en) Semiconductor devices having protruding contacts and method for making the same
AU7697998A (en) Scaffold-organized metal, alloy, semiconductor and/or magnetic clusters and electronic devices made using such clusters
EP0803907A3 (en) Ribbon, bonding wire and microwave circuit package
EP0818823A3 (en) Radio frequency module and method for fabricating the radio frequency module
EP2495732A3 (en) Conductive fine particles, method for plating fine particles, and substrate structure
EP2178112A3 (en) Solid-state imaging device and method of manufacturing the same
EP0863571A3 (en) A mobile image apparatus and an antenna apparatus used for the mobile image apparatus
EP0841700A3 (en) Semiconductor integrated circuit assembly with custom circuit mounted on standard IC
EP0814510A3 (en) TAB tape and semiconductor device using the TAB tape
EP0981157A3 (en) Circuitry and method of forming the same

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): DE ES FR GB

AX Request for extension of the european patent

Free format text: AL;LT;LV;MK;RO;SI

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

AK Designated contracting states

Kind code of ref document: A3

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

AX Request for extension of the european patent

Free format text: AL;LT;LV;MK;RO;SI

RIC1 Information provided on ipc code assigned before grant

Free format text: 6H 01L 27/01 A, 6H 01F 17/00 B, 6H 01F 41/04 B

17P Request for examination filed

Effective date: 20000207

AKX Designation fees paid

Free format text: DE ES FR GB

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20030102