Classifications

• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
  • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
  • C23C18/31—Coating with metals
  • C23C18/38—Coating with copper

Definitions

• the invention relates to a method for the currentless deposition of copper coatings on iron and iron alloy surfaces with the aid of solutions containing copper and hydrogen ions, and a solid concentrate for carrying out the method.
• the object of the invention is to provide a method for electroless deposition of copper coatings on iron and iron alloy surfaces, which does not have known, in particular the aforementioned disadvantages and is able to produce uniform and adherent coatings.
• the object is achieved in that the method of the type mentioned according to the invention is designed such that the surfaces are brought into contact with a solution which 5 to 30 g / l Cu as well 0.2 to 5 g / l Mg contains.
• a preferred embodiment of the invention provides for the surfaces to be brought into contact with a solution in which the weight ratio of Cu: Mg is in the range from (35 to 5): 1.
• a weight ratio in the above range leads to an optimal gloss of the coating produced.
• Another advantageous embodiment of the invention consists in bringing the iron or iron alloy surfaces into contact with a solution which additionally contains polyglycol and / or common salt.
• a solution which additionally contains polyglycol and / or common salt is additionally contained in a solution which additionally contains polyglycol and / or common salt.
• polyglycol makes it possible to improve the adhesive strength of the coating, by means of common salt to achieve a more uniform attack on the surface of the iron or iron alloy.
• the temperature of the solution should expediently be 20 to 65.degree.
• Part of the invention is a solid concentrate for preparing and supplementing the solution intended for carrying out the process, which is at least 85 wt .-% of CuSO4 ⁇ 5 H2O and MgSO4 (anhydrous) with a weight ratio of (35 to 5): 1 ( calculated as Cu: Mg).
• the solid concentrate additionally contains a maximum of 10% by weight of polyglycol and, according to a further advantageous embodiment, a maximum of 5% by weight of common salt.
• the iron or iron alloy surfaces are freed of impurities, in particular rust and scale. This is expediently done by pickling in mineral acid, preferably by pickling in hydrochloric acid or sulfuric acid. It is then rinsed with water.
• iron or iron alloy surfaces have additional dirt, it is advantageous to precede the pickling process with a cleaning stage.
• the copper coatings produced with the aid of the method according to the invention have considerable adhesive strength and have a high gloss.
• a further advantage of the process is that the iron rise in the copper plating solution is slowed down significantly, so that a larger throughput of iron or iron alloy surface is possible without influencing the iron concentration in the solution.
• the solid concentrate also forming part of the invention is characterized in that it itself long storage is easy to pour and therefore easy to handle.
• the effectiveness of the copper plating solution was kept at the aforementioned values by adding a solid concentrate which contained 90% by weight CuSO4 ⁇ 5 H2O, 8% by weight MgSO4 (anhydrous) and 2% by weight polyglycol, and by adding sulfuric acid .
• the steel wires treated by the process had a uniform, adhesive copper coating with a layer weight of 20 g / m2.
• the copper plating solution took up 18.5 g of iron per m2 of steel surface penetrated.
• the amount of iron dissolved was 22 g / m2. That is, without measures to reduce the iron content, the approximately 1.2 times the amount of steel wire could be provided with a copper coating without loss of quality when using the method according to the invention.
• the Cu: Mg weight ratio was 30.2: 1.
• the temperature of the solution was set to 60 ° C., the contact time was 30 seconds.
• the components of the solution were kept at the above-mentioned values by adding the above-mentioned concentrate and sulfuric acid.
• the steel wires were uniform Copper coating with very good adhesion and considerable gloss.
• the layer weight was 4 g / m2.
• the copper plating solution took up 3.7 g of iron per m2 of wire surface penetrated.
• the amount of iron dissolved in the solution was 4.4 g / m2.
• the process according to the invention therefore allowed an approximately 20% higher wire throughput without a deterioration in the quality of the copper coatings obtained.

Landscapes

• Chemical & Material Sciences (AREA)
• General Chemical & Material Sciences (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Engineering & Computer Science (AREA)
• Materials Engineering (AREA)
• Mechanical Engineering (AREA)
• Metallurgy (AREA)
• Organic Chemistry (AREA)
• Chemically Coating (AREA)
• Electroplating And Plating Baths Therefor (AREA)

Applications Claiming Priority (2)

Publications (2)

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Cited By (2)

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Citations (7)

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• 1994
  • 1994-11-11 DE DE4440299A patent/DE4440299A1/de not_active Withdrawn
• 1995
  • 1995-10-16 EP EP95116255A patent/EP0711848B1/fr not_active Expired - Lifetime
  • 1995-10-16 ES ES95116255T patent/ES2192567T3/es not_active Expired - Lifetime
  • 1995-10-16 AT AT95116255T patent/ATE232563T1/de not_active IP Right Cessation
  • 1995-10-16 DE DE59510554T patent/DE59510554D1/de not_active Expired - Lifetime
  • 1995-11-06 US US08/554,288 patent/US6261644B1/en not_active Expired - Lifetime
• 1997
  • 1997-02-18 US US08/802,029 patent/US5776231A/en not_active Expired - Lifetime

Patent Citations (7)

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