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EP0232197A1 - Herstellungsverfahren eines induktiven Chip-Bauteils - Google Patents

Herstellungsverfahren eines induktiven Chip-Bauteils Download PDF

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Publication number
EP0232197A1
EP0232197A1 EP87400098A EP87400098A EP0232197A1 EP 0232197 A1 EP0232197 A1 EP 0232197A1 EP 87400098 A EP87400098 A EP 87400098A EP 87400098 A EP87400098 A EP 87400098A EP 0232197 A1 EP0232197 A1 EP 0232197A1
Authority
EP
European Patent Office
Prior art keywords
strip
core
wire
component
fixing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP87400098A
Other languages
English (en)
French (fr)
Inventor
Jean-Luc Zattara
Gilles Bernard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Compagnie Europeenne de Composants Electroniques LCC CICE
Original Assignee
Compagnie Europeenne de Composants Electroniques LCC CICE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Compagnie Europeenne de Composants Electroniques LCC CICE filed Critical Compagnie Europeenne de Composants Electroniques LCC CICE
Publication of EP0232197A1 publication Critical patent/EP0232197A1/de
Ceased legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/29Terminals; Tapping arrangements for signal inductances
    • H01F27/292Surface mounted devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/10Connecting leads to windings
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/4902Electromagnet, transformer or inductor
    • Y10T29/49071Electromagnet, transformer or inductor by winding or coiling
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49169Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171Assembling electrical component directly to terminal or elongated conductor with encapsulating

Definitions

  • the present invention relates to a method of manufacturing an inductive component for flat transfer, more particularly an inductive component of the wire type wound around a core.
  • chip inductances obtained by screen printing or by a technique of metallization of a design on an insulating substrate or on insulating substrates stacked one on the other and provided with a conductive passage ensuring electrical continuity between each of the layers produced.
  • These chips are generally inexpensive and well suited to the needs of manufacturers of consumer equipment. However, they have inductance values between a few nanohenry and a few hundred microhenry. On the other hand, their overvoltage coefficient is quite poor and they do not tolerate operating currents greater than 100 milliamps.
  • chip inductors produced in the manner of a conventional inductor, by winding on a core of a magnetic material or not an insulated wire, generally of enameled copper. These components cover a large inductance range between a few nanohenry and a few millihenry and their quality coefficient is often high.
  • the methods of manufacturing such components have many disadvantages which result, among other things, from the small dimensions of the winding core, which makes it difficult to wind the wire.
  • another constraint is constituted by the welding of the ends of the winding to the output connections. This is made difficult because of the small dimensions of the core, the diameter of the wire and the presence of the enamel which covers it.
  • the object of the present invention is to remedy these drawbacks by proposing a method for manufacturing an inductive component for flat transfer of the wire wound type around an inexpensive and fully automatable core.
  • the core is fixed from the start on a connecting strip which will serve throughout the manufacturing cycle, first as a support for the core during the winding, and then as a parting line for molding the coating resin.
  • the fixing of the core on the strip can be carried out by gluing, by clipping or by any other equivalent means.
  • the cutting of the strip makes it possible to make the electrical connections of the inductive component and the sealing effected by this strip during molding makes it possible to avoid any risk of soiling on the final connections of the component by avoiding the tolerances.
  • the two ends of the wire being welded to the strip parts intended to form the electrical connections immediately after the winding of the wire around the core, there is no longer any risk of unwinding.
  • connection strip will be equipped with means enabling it to be driven. These means may for example be holes drilled on the lateral edges of the strip and intended to receive the teeth of a drive device.
  • the process of the present invention brings numerous advantages at the level of the product itself. Indeed, in this case, the electrical connections are distant from the coil. It is therefore possible to use harder baths because there is better thermal insulation. In addition, the electrical connections are made of solid metal, thus giving excellent weldability. High performance coating resins can also be used, which allows a professional climatic resistance.
  • the inductive component obtained by the method of the present invention is produced from a core made of a magnetic or non-magnetic material.
  • This core 1 essentially comprises a central part 2 of parallelepipedic or cylindrical shape and two perpendicular flanges 3 and 3 ′ so as to have a substantially H-shaped longitudinal section.
  • the core can be made of ferrite or obtained from plasto-ferrite powder, ferrite or iron powder, for example.
  • the core is made of a non-magnetic material, it can be ceramic or a thermoplastic or thermosetting material.
  • the core does not need to have a very precise shape or dimensions, therefore it can be machined directly from a plate of magnetic or non-magnetic material.
  • the core can also be produced in a conventional manner by pressing or injection or by spinning and cutting since the shape of the core is easily extrudable.
  • connection strip 4 which will be used throughout the manufacturing cycle. This first step can be carried out, for example, by placing the cores in a vibrating bowl or in any other distribution system which supplies a store placed above the connection strip.
  • the connection strip 4 comprises cutouts 5 which will be used to make the output connections or electrodes on either side of the body of the component as will be explained in more detail below.
  • the cores 1 are deposited on certain cutouts 5 constituted, in this embodiment, by rectangles, the other similar cutouts 5 ′ being used when making connections.
  • the cores 1 are bonded to this strip using a micro-bonding technique well known to those skilled in the art.
  • the cores can be clipped onto the strip or fixed by any other means.
  • the winding is achieved by keeping the core 1 fixed and by winding the wire 7 around the central part 2 using a device of known type called "flyer" in English.
  • the wire 7 is firstly fixed on a pad 8 positioned downstream of the core relative to the direction of travel of the machine, this pad being mounted on a strip 10 advancing at the same time as the connection strip 4. Then, the wire is wound around the part 2 of the core 1 and is fixed on another pad 9 upstream of the core 1. We are therefore in the position shown in B in Figure 1. Instead of pads 8 and 9, it is obvious to those skilled in the art that one could use lugs 11 cut and folded from the connecting strip 4. This would remove the following band.
  • welding can be carried out by any known welding method such as tin-lead soldering with a soldering iron or suitable tool, solder paste, hot gas jet soldering, electric soldering, induction soldering, soldering laser, cold welding with conductive glue. This operation is shown in C in Figure 1.
  • the conductive strip is brought to a coating station.
  • the strip 4 is used as a parting line.
  • the coating can be carried out according to various known techniques. It is possible, for example, to perform a liquid injection molding of a self-extinguishing resin, a powder transfer molding, a casting, etc.
  • One type of resin that can be used is a resin ensuring good thermal protection of the component during wave soldering.
  • the resin can also be uncharged with low thermal conductivity, charged or cellular in the form of foam.
  • a magnetic charge can be incorporated into this resin to close the magnetic circuit and thus increase the magnetic quality of the component.
  • the inductive component is in the form shown in D in Figure 1.
  • the component is then sent to a cutting and bending station to make the electrodes.
  • the connection strip is cut along the dotted lines 14. In the embodiment shown, these lines are provided between the cutouts 5-5 ′ of the connection strip.
  • the component shown in F in FIG. 1 is thus obtained.
  • the strip parts 12, 13 on each side of the component are then folded against the two lateral edges to form the electrodes.
  • the upper part is arched and folds down on the component to obtain good fixing of the electrodes.
  • the electrodes are made so that a minimum of connection enters the magnetic circuit, which ensures a maximum coefficient Q.
  • connection strip 4 used in the method of the present invention.
  • This connection strip is of the same type as the connection strip described in French patent application No. 85 07148 filed on May 10, 1985 in the name of the applicant and used more particularly for the manufacture of "chip" capacitors.
  • the strip 4 therefore consists of a flexible metal sheet made of a material of low thermal conductivity such as steel, bronze, etc.
  • Several types of cutouts are provided on this connection strip to facilitate the making of the connections. output or electrodes of the inductive component for flat transfer. It is therefore necessary that the parts of strips forming the connections or electrodes are not short-circuited. Consequently, the strip 4 has H-shaped cutouts 20 which have been made to have two metal tabs 21 and 22 which will serve as fixing lugs for the parts forming connections or electrodes on one of the flanges of the winding core. It is preferable that the cutting is carried out so that the attachment of the tabs to the rest of the sheet is carried out on flared surfaces as clearly shown in Figure 3. This will facilitate their folding and give better elasticity to the fixing lugs to maintain the core 1. Other cuts made on the strip 4 will determine the shape of the electrodes of the future components. These are the L-shaped cutouts as shown in FIG. 2 under the reference 23.
  • Each H cut corresponds to four L cuts that frame it.
  • each lateral edge of the strip is pierced with holes 6 which will be used for its drive by an appropriate device within the framework of an automated manufacturing of the inductive component.
  • the cutting of the electrodes will be carried out as shown by the dashed lines 25 and 24 in FIG. 3.
  • the dashed lines 25 connect each L-shaped cutout 23 with the cutout 20 and the dashed lines 24 connect the L 23 cuts between them.
  • the strip is preferably provided with pins 26 produced by cutting and folding a part of the strip itself. The pins 26 are positioned for example between each pair of L-shaped cutouts 23 and are used, during winding, to fix the winding wire before welding.
  • connection strip of FIG. 1 or the connection strip of FIGS. 2 and 3 has been given by way of example, in particular as regards the shape of the cutouts. Consequently, this strip may be provided with cutouts of different shapes as long as said cutouts can be used to make the electrodes or connections of a inductive component of the wound type for flat transfer.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
EP87400098A 1986-01-21 1987-01-16 Herstellungsverfahren eines induktiven Chip-Bauteils Ceased EP0232197A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8600801 1986-01-21
FR8600801A FR2593320B1 (fr) 1986-01-21 1986-01-21 Procede de fabrication d'un composant inductif pour report a plat

Publications (1)

Publication Number Publication Date
EP0232197A1 true EP0232197A1 (de) 1987-08-12

Family

ID=9331329

Family Applications (1)

Application Number Title Priority Date Filing Date
EP87400098A Ceased EP0232197A1 (de) 1986-01-21 1987-01-16 Herstellungsverfahren eines induktiven Chip-Bauteils

Country Status (4)

Country Link
US (1) US4785527A (de)
EP (1) EP0232197A1 (de)
JP (1) JPS62183104A (de)
FR (1) FR2593320B1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993009551A1 (de) * 1991-11-08 1993-05-13 Herbert Stowasser Transponder sowie verfahren und vorrichtung zur herstellung

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5261615A (en) * 1989-07-03 1993-11-16 Sokymat Sa Process for manufacturing electronic components comprising a fine-wire winding, and device for holding the winding wire permitting manufacture according to this process
CH684642A5 (fr) * 1991-02-25 1994-11-15 Ake Gustafson Pince de maintien d'un corps de bobine dans une machine de bobinage.
US5478517A (en) * 1994-02-28 1995-12-26 Gennum Corporation Method for molding IC chips
WO1998021730A1 (en) * 1995-05-12 1998-05-22 Metget Ab A coil manufacturing and attachment method and apparatus for carrying out the method
US7921546B2 (en) 1995-07-18 2011-04-12 Vishay Dale Electronics, Inc. Method for making a high current low profile inductor
CA2180992C (en) * 1995-07-18 1999-05-18 Timothy M. Shafer High current, low profile inductor and method for making same
US5706952A (en) * 1996-01-11 1998-01-13 Autosplice Systems Inc. Continuous carrier for electrical or mechanical components
US6202853B1 (en) 1996-01-11 2001-03-20 Autosplice Systems, Inc. Secondary processing for electrical or mechanical components molded to continuous carrier supports
US5867891A (en) * 1996-12-30 1999-02-09 Ericsson Inc. Continuous method of manufacturing wire wound inductors and wire wound inductors thereby
US5903207A (en) * 1996-12-30 1999-05-11 Ericsson Inc. Wire wound inductors
US5933949A (en) * 1997-03-06 1999-08-10 Ericsson Inc. Surface mount device terminal forming apparatus and method
DE19848009C2 (de) * 1998-10-19 2001-10-04 Ods Landis & Gyr Gmbh & Co Kg Verfahren zum Herstellen einer Leiterschleife mit angeschlossenem Chipmodul zur Verwendung in kontaktlosen Chipkarten sowie Trägervorrichtung zur Verwendung in dem Verfahren sowie kontaktlose Chipkarte
DE102004058452A1 (de) * 2004-12-03 2006-06-08 Vacuumschmelze Gmbh & Co. Kg Stromerfassungseinrichtung und Verfahren zum Herstellen einer solchen Stromerfassungseinrichtung
CN103208898A (zh) * 2013-04-16 2013-07-17 厦门新鸿洲精密科技有限公司 音圈马达组件的线圈支架结构

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2102632A (en) * 1981-07-09 1983-02-02 Tdk Electronics Co Ltd Electronic components e.g. inductors
US4553123A (en) * 1982-09-03 1985-11-12 Murata Manufacturing Co., Ltd. Miniature inductor

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5556617A (en) * 1978-10-23 1980-04-25 Toudai Musen Kk Preparation of resin mold coil
JPS5828820A (ja) * 1981-08-13 1983-02-19 Sony Corp チツプ型コイル装置の製法
JPS58127308A (ja) * 1982-01-23 1983-07-29 Mitsumi Electric Co Ltd コイルの製造方法
JPS58166713A (ja) * 1982-03-29 1983-10-01 Toko Inc 固定インダクタの製造方法
JPS58223306A (ja) * 1982-06-22 1983-12-24 Toko Inc リ−ドレス型固定インダクタの製造方法
JPS60224210A (ja) * 1984-04-20 1985-11-08 Matsushita Electric Ind Co Ltd 変成器の製造法
US4662066A (en) * 1985-10-28 1987-05-05 Herbert Toman Continuously operable tool for use in production line process

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2102632A (en) * 1981-07-09 1983-02-02 Tdk Electronics Co Ltd Electronic components e.g. inductors
US4553123A (en) * 1982-09-03 1985-11-12 Murata Manufacturing Co., Ltd. Miniature inductor

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN, vol. 1, no. 292 (E-219)[1437], 27 décembre 1983; & JP-A-58 166 713 (TOUKOU K.K.) 01-10-1983 *
PATENT ABSTRACTS OF JAPAN, vol. 8, no. 74 (E-236)[1511], 6 avril 1984; & JP-A-58 223 306 (TOUKOU K.K.) 24-12-1983 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993009551A1 (de) * 1991-11-08 1993-05-13 Herbert Stowasser Transponder sowie verfahren und vorrichtung zur herstellung

Also Published As

Publication number Publication date
FR2593320B1 (fr) 1988-03-04
US4785527A (en) 1988-11-22
FR2593320A1 (fr) 1987-07-24
JPS62183104A (ja) 1987-08-11

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